CN112967946B - Mass transfer device and mass transfer method - Google Patents

Mass transfer device and mass transfer method Download PDF

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Publication number
CN112967946B
CN112967946B CN202010468203.9A CN202010468203A CN112967946B CN 112967946 B CN112967946 B CN 112967946B CN 202010468203 A CN202010468203 A CN 202010468203A CN 112967946 B CN112967946 B CN 112967946B
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laser
transfer device
scanning signal
telescopic
focusing structure
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CN112967946A (en
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蒋光平
许时渊
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Chongqing Kangjia Optoelectronic Technology Co ltd
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Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention discloses a bulk transfer device and a bulk transfer method, wherein the bulk transfer device comprises a laser, a coupling unit, an optical fiber, a ceramic ferrule and a coaxial focusing structure which are sequentially connected, laser output by the laser is coupled into the optical fiber through the coupling unit, the coaxial focusing structure is fixed on the end head of the ceramic ferrule, and the end head of the optical fiber is inserted into the ceramic ferrule. According to the invention, the coaxial focusing structure is controlled through the motor and the telescopic slide rod, so that a spiral laser scanning track is realized, the movement track of laser scanning is controlled in a high-precision manner, and the transfer efficiency and the yield of Micro-LEDs are improved.

Description

Mass transfer device and mass transfer method
Technical Field
The present invention relates to the field of LED technologies, and in particular, to a bulk transfer apparatus and a bulk transfer method.
Background
Micro Light Emitting diodes (Micro-LEDs) are a new generation of display technology, and have higher brightness and better Light Emitting effect than the existing Organic Light-Emitting Diode (OLED) technology, but have lower power consumption. Micro-LED technology, i.e. LED Micro-scaling and matrixing technology, refers to a high-density Micro-scaled Micro-plate integrated on a chip, which reduces the pixel distance from millimeter level to micron level. However, in the Micro-LED technology, the miniaturized LED process includes firstly making the LED structure design thin-film, miniaturized and arrayed to have a size of about 1-250 um, then transferring the miniaturized red, green and blue LED Micro-components onto the circuit substrate in batch, then completing the protection layer and the upper electrode by using a physical deposition method, and finally performing the upper substrate encapsulation. The step of batch-wise transferring the LED micro-components onto the circuit substrate is particularly critical.
Currently, the Micro-LED bulk transfer is generally carried out by utilizing a laser lift-off technology. The LED assembly to be transferred includes a release layer, an adhesive layer, an LED chip, a first temporary substrate, and a second temporary substrate, and the release layer may be formed by using, for example, a fluorine coating layer, silicone resin, a water-soluble adhesive (e.g., PVA), polyimide, or the like. The laser selectively irradiates the release layer at the position of the LED to be transferred to lose viscosity or directly gasify the release layer, so that the LED to be transferred is peeled off from the first temporary substrate and is adhered to the second temporary substrate.
The existing laser lift-off technology used in Micro-LEDs is a galvanometer scanning mode, the position of a light spot is controlled by controlling reflectors of an X axis and a Y axis, and the laser lift-off technology is particularly sensitive to external vibration, stress and the precision of a motor, so that the track of the light spot is difficult to realize accurately.
Therefore, how to improve the accuracy of the spot control in the laser lift-off technology is a problem that needs to be solved at present.
Disclosure of Invention
The invention aims to provide a bulk transfer device and a bulk transfer method, wherein a coaxial focusing structure is controlled by a motor and a telescopic sliding rod, a spiral laser scanning track is realized, and the movement track of laser scanning is controlled in a high-precision mode, so that the transfer efficiency and the yield of Micro-LEDs are improved.
The technical purpose of the invention is realized by the following technical scheme:
in a first aspect, the present invention provides a bulk transfer device, which includes a laser, a coupling unit, an optical fiber, a ferrule, and a coaxial focusing structure, which are connected in sequence, wherein laser output by the laser is coupled into the optical fiber through the coupling unit, the coaxial focusing structure is fixed on an end of the ferrule, and the end of the optical fiber is inserted into the ferrule.
Further, the coupling unit includes: a lens assembly; the lens component is a component formed by a single lens or a plurality of lenses.
Further, the coaxial focusing structure is used for focusing the laser beam propagating in the optical fiber to a point on the substrate carrying the led to be stripped.
Further, the outside of coaxial focus structure is provided with mutually perpendicular's first bracing piece and second bracing piece, the end-to-end connection of second bracing piece has scalable slide bar, scalable slide bar one end with second bracing piece vertical fixation, the other end of scalable slide bar and the rotary rod vertical fixation of motor.
Further, the telescopic slide bar comprises: the telescopic driving component is used for adjusting the length of the telescopic sliding rod.
Further, the bulk transfer apparatus further includes: the laser, the telescopic sliding rod and the motor are respectively connected with the processor;
the processor is used for sending a first scanning signal to the motor so as to control the rotating speed of the motor through the first scanning signal;
the processor is further used for sending a second scanning signal to the telescopic slide bar so as to adjust the length of the telescopic slide bar through the second scanning signal, and therefore the radius of spiral rotation of the coaxial focusing structure is adjusted;
the processor is also used for sending a laser pulse signal to the laser so as to control the laser to emit laser through the laser pulse signal.
Further, the laser is an electrically controlled laser.
In a second aspect, the present invention further provides a bulk transfer method based on the bulk transfer apparatus, wherein the bulk transfer method includes the following steps:
sending a first scanning signal to a motor of a mass transfer device, and controlling the rotating speed of the motor through the first scanning signal;
sending a second scanning signal to a telescopic slide bar of the bulk transfer device, and adjusting the spiral rotation radius of a coaxial focusing structure in the bulk transfer device through the second scanning signal;
and sending a laser pulse signal to the laser of the mass transfer device in cooperation with the first scanning signal, and controlling the laser to emit laser through the laser pulse signal.
Further, the adjusting, by the second scan signal, a radius of a spiral rotation of a coaxial focusing structure in the macro transfer device specifically includes:
and controlling a telescopic driving assembly of the telescopic slide rod to perform telescopic motion through the second scanning signal, driving the telescopic slide rod to slide, and adjusting the spiral rotating radius of the coaxial focusing structure in the mass transfer device.
Further, the laser is controlled to emit laser by the laser pulse signal, and then the method further comprises the following steps:
coupling the laser through a coupling unit of the bulk transfer device, and transmitting the coupled laser into an optical fiber of the bulk transfer device;
and focusing the laser beam propagating in the optical fiber on the substrate carrying the led to be stripped through a coaxial focusing structure of the bulk transfer device.
The invention adopts the technical scheme and has the following beneficial effects:
according to the invention, the coaxial focusing structure is controlled through the motor and the telescopic slide rod, so that a spiral laser scanning track is realized, the movement track of laser scanning is controlled in a high-precision manner, and the transfer efficiency and the yield of Micro-LEDs are improved.
Drawings
FIG. 1 is a schematic diagram of prior art Micro-LED bulk transfer using laser lift-off technology.
FIG. 2 is a schematic diagram of the overall structure of a bulk transfer device in a preferred embodiment of the present invention.
FIG. 3 is a flow chart of a bulk transfer method in a preferred embodiment of the invention.
FIG. 4 is a schematic diagram of the laser scanning trace of the preferred embodiment of the present invention with gradually changing the length of the telescopic slide bar.
FIG. 5 is a schematic diagram showing the laser scanning trace when the length of the telescopic slide bar is changed intermittently in the preferred embodiment of the present invention.
In the figure: 1. a first substrate; 3. Micro-LED; 4. a second substrate; 5. a masking plate; 6. an adhesive layer; 8. a release layer; 9. laser; 100. a laser; 200. a coupling unit; 300. an optical fiber; 400. a ceramic ferrule; 500. a coaxial focusing structure; 510. a focusing lens; 610. a first support bar; 620. a second support bar; 700. a telescopic slide bar; 800. a motor; 810. a rotating shaft; 900. and (5) stripping the substrate.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the interconnection of two elements or through the interaction of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The first embodiment is as follows:
as shown in FIG. 1, in the conventional technique for bulk transfer of MICRO-LED by laser lift-off technology, the release layer 8 is a peelable layer formed by fluorine coating, silicone, water-soluble adhesive (e.g., PVA), polyimide, etc., and when it is desired to transfer the MICRO-LED on the first substrate 1, laser light 9 is selectively irradiated on the release layer 8 at the position of the MICRO-LED to be transferred, so that the release layer 8 loses its adhesiveness or is directly vaporized, thereby peeling the MICRO-LED to be transferred off the first substrate 1 and adhering it to the second substrate 4, thereby realizing bulk transfer of MICRO-LED.
At present, in the laser lift-off technology of Micro LEDs, the scanning mode usually adopted is a galvanometer scanning mode, and the position of a laser spot is controlled by controlling X Y two-axis scanning mirrors, wherein, the scanning mirror X and the scanning mirror Y are two mirrors, and the reflecting angles of the two mirrors are controlled by the galvanometer X and the galvanometer Y respectively, so as to control the angle of an incident beam to a field lens and change the position of a focus point on a marking piece; however, the galvanometer scanning method has high requirements on external vibration, stress and precision of a motor, so that it is difficult to realize precise control of the track of the laser spot.
As shown in fig. 2, in order to precisely control the track of the laser spot, the present embodiment provides a bulk transfer apparatus, which includes a laser 100, a coupling unit 200, an optical fiber 300, a ferrule 400, and a coaxial focusing structure 500, which are connected in sequence; wherein the coaxial focusing structure 500 is fixed to the tip of the ferrule 400, and the tip of the optical fiber 300 is inserted into the ferrule 400.
In this embodiment, the laser 100 is an electrically controlled laser transmitter, and the amount of beam energy output by the laser 100 can be controlled by corresponding electrical signals; the laser light output by the laser 100 enters the optical fiber 300 through the coupling effect of the coupling unit 200; then, the laser light is transmitted through the optical fiber 300 and enters the coaxial focusing structure 500, and the focusing effect of the coaxial focusing structure 500 is utilized to focus the laser light emitted by the laser 100 on the substrate 900 to be stripped carrying the MICRO-LED, so that the mass transfer of the MICRO-LED is realized by the laser light emitted by the laser 100.
Specifically, in the present embodiment, the coupling unit 200 includes: a lens assembly (not shown); the lens component can be a single spherical mirror or a component formed by a plurality of spherical mirrors; the lens component can also be a single aspheric mirror or a component consisting of a plurality of aspheric mirrors; the lens assembly and the composition thereof are prior art and are not described in detail.
Specifically, in the present embodiment, the coaxial focusing structure 500 includes: a focusing lens 510, the focusing lens 510 being operable to focus the laser beam propagating in the optical fiber 300 to a point on the substrate 900 to be peeled carrying the MICRO-LED, thereby transferring the MICRO-LED at a point on the substrate 900 to be peeled.
Specifically, in the present embodiment, a first support rod 610 and a second support rod 620 are disposed outside the coaxial focusing structure 500, and the first support rod 610 and the second support rod 620 are disposed perpendicular to each other; the end of the second support rod 620 is connected with a telescopic sliding rod 700; one end of the telescopic sliding bar 700 is vertically fixed to the second supporting bar 620, and the other end of the telescopic sliding bar 700 is vertically fixed to the rotating shaft 810 of the motor 800.
The motor 800 may be configured to drive the coaxial focusing structure 500 to perform a spiral rotation, and meanwhile, in the spiral rotation process of the coaxial focusing structure 500, the spiral rotation radius of the coaxial focusing structure 500 may be adjusted by adjusting the length of the telescopic sliding rod 700.
Specifically, in the present embodiment, the telescopic slide bar 700 includes: a telescopic driving assembly (not shown), which may be a telescopic motor; the telescopic motor is controlled to rotate to drive the telescopic slide bar 700 to perform telescopic motion, so that the length of the telescopic slide bar 700 is adjusted; in the case that the telescopic slide bar 700 performs a telescopic motion, the radius of the spiral rotation of the coaxial focusing structure 500 may be adjusted by using the telescopic slide bar 700.
In this embodiment, the bulk transfer apparatus further includes: a processor (not shown) to which the laser 100, the telescopic slide bar 700 and the motor 800 are respectively connected; wherein the processor is operable to send a first scanning signal to the motor 800 to control the rotation speed of the motor 800 by the first scanning signal, thereby controlling the speed of the helical rotation of the coaxial focusing structure 500.
In this embodiment, the processor is further configured to send a second scanning signal to a telescopic motor (i.e., a telescopic driving assembly) of the telescopic slide bar 700, so as to control the telescopic motor to rotate through the second scanning signal, and then drive the telescopic slide bar 700 to perform telescopic motion, and adjust the length of the telescopic slide bar 700, so that under the condition that the telescopic slide bar 700 performs telescopic motion, the telescopic slide bar 700 is utilized to adjust the radius of the spiral rotation of the coaxial focusing structure 500.
In this embodiment, the processor is further configured to send a laser pulse signal to the laser 100, so as to control the laser 100 to emit laser light through the laser pulse signal; and when the processor sends a first scanning signal, the processor outputs the laser pulse signal in cooperation with the first scanning signal.
When the laser track moves to the position of the MICRO-LED chip to be transferred, the laser 100 is controlled to light and emit a laser beam through the laser pulse signal, so that the MICRO-LED chip to be transferred is separated from the substrate; when the laser track moves to other positions of the MICRO-LED chip that do not need to be transferred, the laser pulse signal is stopped and the laser 100 is turned off so that the MICRO-LED chip that does not need to be transferred can continue to remain on the substrate.
In this embodiment, the position of the focal point of the laser output is determined only by the motor 800, and similarly, the positional accuracy of the laser output is determined by the accuracy of the motor 800, and the accuracy of the driving motor 800 normally satisfies the positional accuracy requirement for peeling the MICRO-LED chip.
The diameter of the output head of the coaxial focusing structure 500 is less than 5mm or less than 10mm, and when the spiral motion of the coaxial focusing structure 500 is controlled, the movement track of the coaxial focusing structure 500 is easier to control by the light weight.
In the embodiment, the optical fiber end is directly inserted into the ceramic ferrule, and the motion track of laser scanning can be accurately controlled by mechanically controlling the motion track of the output light spot of the ceramic ferrule; in addition, in the embodiment, the motor, the support rod, the lens and other components are used for realizing the convergence and the circular motion of the laser, and the telescopic slide rod is used for controlling the radius of the circular motion, so that the spiral track of the laser scanning is realized, and an ideal motion effect is achieved.
Example two:
as shown in fig. 3, the present embodiment provides a bulk transfer method based on the bulk transfer apparatus of the first embodiment, wherein the bulk transfer method includes the following steps:
step S100, sending a first scanning signal to a motor of a mass transfer device, and controlling the rotating speed of the motor through the first scanning signal;
step S200, sending a second scanning signal to a telescopic slide bar of the bulk transfer device, and adjusting the spiral rotating radius of a coaxial focusing structure in the bulk transfer device through the second scanning signal;
and step S300, sending a laser pulse signal to a laser of the mass transfer device in cooperation with the first scanning signal, and controlling the laser to emit laser through the laser pulse signal.
In this embodiment, when adjusting coaxial focus structure spiral pivoted radius, can with second scanning signal send to scalable slide bar's flexible drive assembly, through second scanning signal control scalable slide bar's flexible drive assembly carries out concertina movement, and then drives scalable slide bar slides (concertina movement), with the regulation the length of scalable slide bar, thereby adjusts coaxial focus structure spiral pivoted radius in the huge transfer device.
In this embodiment, the first scanning signal and the second scanning signal may be sent simultaneously, that is, when the rotation speed of the motor is controlled, the moving radius of the coaxial focusing structure may be adjusted simultaneously.
As shown in fig. 4, when the first scan signal is continuously outputted and the second scan signal is continuously outputted, the telescopic slide bar of the macro transfer device is gradually lengthened, and at this time, the movement locus of the laser spot on the substrate to be stripped of the MICRO-LED is a spiral-shaped movement locus.
In this embodiment, the first scanning signal and the second scanning signal may also be sent alternately, that is, after the rotation speed of the motor is controlled, the motor is stopped from being controlled to rotate, and the second scanning signal is output.
As shown in fig. 5, when the first scanning signal and the second scanning signal are alternately output, the first scanning signal is output first to control the motor to rotate, and when the motor completes a rotation period (i.e. the laser scanning track is a circular motion track), the output of the first scanning signal is stopped, and the second scanning signal is output to control the telescopic slide bar to change the length; at this time, the movement locus of the laser spot on the substrate to be stripped of the MICRO-LED is a circular movement locus.
In this embodiment, after the laser emits the laser light, the laser light may be coupled by a coupling unit of the bulk transfer device, and the coupled laser light is introduced into an optical fiber of the bulk transfer device; then, the laser beam propagating in the optical fiber is focused on the substrate carrying the MICRO-LED to be stripped by the coaxial focusing structure of the bulk transfer device.
When the laser track moves to the position of the MICRO-LED chip to be transferred, the laser is controlled to light and emit laser beams through the laser pulse signal, so that the MICRO-LED chip to be transferred is separated from the substrate; and when the laser track moves to other MICRO-LED chip positions which do not need to be transferred, stopping sending the laser pulse signal, and turning off the laser, so that the MICRO-LED chips which do not need to be transferred can be continuously remained on the substrate.
In conclusion, the coaxial focusing structure is controlled through the motor and the telescopic sliding rod, the spiral laser scanning track is realized, the movement track of laser scanning is controlled in a high-precision mode, and the transfer efficiency and the yield of Micro-LEDs are improved.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims (9)

1. A massive transfer device is characterized by comprising a laser, a coupling unit, an optical fiber, a ceramic ferrule and a coaxial focusing structure which are sequentially connected, wherein laser output by the laser is coupled into the optical fiber through the coupling unit, the coaxial focusing structure is fixed on the end head of the ceramic ferrule, and the end head of the optical fiber is inserted into the ceramic ferrule;
the outside of coaxial focus structure is provided with mutually perpendicular's first bracing piece and second bracing piece, the end-to-end connection of second bracing piece has scalable slide bar, scalable slide bar one end with second bracing piece vertical fixation, the other end of scalable slide bar and the rotary rod vertical fixation of motor.
2. The bulk transfer device of claim 1, wherein the coupling unit comprises: a lens assembly; the lens component is a component formed by a single lens or a plurality of lenses.
3. The bulk transfer device of claim 1, wherein the coaxial focusing structure is configured to focus a laser beam propagating in an optical fiber to a point on a substrate carrying the led to be stripped.
4. The bulk transfer device of claim 1, wherein the telescoping slide bar comprises: the telescopic driving component is used for adjusting the length of the telescopic sliding rod.
5. The mass transfer device of claim 1, further comprising: the laser, the telescopic sliding rod and the motor are respectively connected with the processor;
the processor is used for sending a first scanning signal to the motor so as to control the rotating speed of the motor through the first scanning signal;
the processor is further used for sending a second scanning signal to the telescopic slide bar so as to adjust the length of the telescopic slide bar through the second scanning signal, and therefore the radius of spiral rotation of the coaxial focusing structure is adjusted;
the processor is also used for sending a laser pulse signal to the laser so as to control the laser to emit laser through the laser pulse signal.
6. The bulk transfer device of claim 1, wherein the laser is an electronically controlled laser.
7. A mass transfer method based on the mass transfer apparatus according to any one of claims 1 to 6, wherein the mass transfer method comprises the steps of:
sending a first scanning signal to a motor of a mass transfer device, and controlling the rotating speed of the motor through the first scanning signal;
sending a second scanning signal to a telescopic slide bar of the bulk transfer device, and adjusting the spiral rotation radius of a coaxial focusing structure in the bulk transfer device through the second scanning signal;
and sending a laser pulse signal to the laser of the mass transfer device in cooperation with the first scanning signal, and controlling the laser to emit laser through the laser pulse signal.
8. The method for mass transfer according to claim 7, wherein said adjusting the radius of the spiral rotation of the coaxial focusing structure in the mass transfer device by the second scan signal comprises:
and controlling a telescopic driving assembly of the telescopic slide rod to perform telescopic motion through the second scanning signal, driving the telescopic slide rod to slide, and adjusting the spiral rotating radius of the coaxial focusing structure in the mass transfer device.
9. The mass transfer method according to claim 7, wherein said controlling said laser to emit laser light by said laser pulse signal further comprises the steps of:
coupling the laser through a coupling unit of the bulk transfer device, and transmitting the coupled laser into an optical fiber of the bulk transfer device;
and focusing the laser beam propagating in the optical fiber on the substrate carrying the led to be stripped through a coaxial focusing structure of the bulk transfer device.
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