CN111766965A

CN111766965A - Touch panel, preparation method thereof and touch panel assembly

Info

Publication number: CN111766965A
Application number: CN202010374122.2A
Authority: CN
Inventors: 胡冬生; 寨虎
Original assignee: Nanchang OFilm Display Technology Co Ltd
Current assignee: Jiangxi Zhuoxin Microelectronics Co ltd
Priority date: 2020-05-06
Filing date: 2020-05-06
Publication date: 2020-10-13

Abstract

The invention relates to a touch panel, a preparation method and a touch panel assembly, wherein the preparation method provides a mother board of the touch panel, the mother board comprises a substrate, two sides of the substrate are provided with a first lead area and a second lead area, a first lead of the first lead area and a second lead of the second lead area form a plurality of groups of leads, a groove is formed at a preset position of the edge of the substrate on the mother board, then a conductive layer is formed, and finally, after the conductive layer for communicating two adjacent groups of leads is cut off, the first lead and the second lead in the same group of leads can be conducted with each other by the conductive layer, and the two adjacent groups of leads are not conducted, so that the two-sided conductive traces can be conducted in a directional manner on the edge of the substrate.

Description

Touch panel, preparation method thereof and touch panel assembly

Technical Field

The invention relates to the technical field of touch control, in particular to a touch panel and a preparation method thereof, and further provides a touch panel assembly with the touch panel.

Background

A capacitive touch screen with a double-layer ITO (indium tin oxide) framework is characterized in that driving line (driving line) matrixes and sensing line (sensing line) matrixes are respectively formed on the surfaces of two sides of a transparent substrate, conductive traces are formed on the edge of the substrate and are used for being connected with a Flexible Printed Circuit (FPC). Traditional design scheme does, and the both sides surface of substrate sets up conducting trace respectively, connects through one or more FPC after, needs a plurality of nation decides the board to bind when such design nation is decided, and the design that the two sides were carried out the nation has increased the thickness of whole touch-control screen product.

In order to solve the above technical problems, the following improvements are proposed in the art: a conductive layer is sputtered on the edge of the substrate, and then the conductive traces which are communicated with each other and have two sides are formed in one step by using a yellow light process, so that the subsequent FPC bonding can be carried out by using the conductive trace on one side only, thereby realizing the one-step bonding and greatly reducing the number of process steps and the process cost. And, because only need bond on the one side of substrate, can greatly reduced whole touch-control screen's thickness, provide the direction of an ultra-thin touch-control screen of realization. However, the inventor finds that in the process of implementing the above improvement, how to realize the conduction of the conductive traces on the two sides, whether sputtering, electroplating or electroless copper plating, has no way to orient the edges of the substrate with small area or small size, that is, the conductive plating layer capable of conducting the conductive traces on the two sides can not be formed at the designated position.

Disclosure of Invention

Therefore, it is necessary to provide a method for manufacturing a touch panel, aiming at the problem that the double-sided conductive traces are difficult to realize directional conduction at the edge of the substrate. A touch panel with double-sided conductive traces for achieving good directional conduction at the edge of the substrate is also provided. A touch panel assembly having such a touch panel is also provided.

A preparation method of a touch panel comprises the following steps:

providing a mother board of a touch panel, wherein the mother board comprises a substrate, the substrate comprises a first surface, a second surface and a side surface, the first surface and the side surface are opposite, the side surface is connected with the first surface and the second surface, a first induction area and a first lead area connected with the first induction area are arranged on the first surface, the first lead area comprises a plurality of first leads which are arranged along a straight line, each first lead and the side surface are arranged at intervals to form a first non-conductive area, a second induction area and a second lead area connected with the second induction area are arranged on the second surface, the second lead area comprises a plurality of second leads which are arranged along a straight line, each second lead and the side surface are arranged at intervals to form a second non-conductive area, and the positions of the second leads and the first leads are in one-to-one correspondence to form a plurality of groups of leads;

forming a plurality of grooves through the first non-conductive region and the second non-conductive region on the side surface corresponding to the respective groups of leads;

plating conductive layers on the inner wall and the side face of the groove, wherein the conductive layers are communicated with the first lead and the second lead in the same group of leads, and the conductive layers are communicated with two adjacent groups of leads;

and performing disconnection treatment on the conductive layers for communicating the two adjacent groups of leads to ensure that the two adjacent groups of leads are not communicated with each other.

According to the preparation method of the touch panel, the groove is formed at the preset position of the edge of the substrate, then the conducting layer is formed, after the conducting layer which is communicated with the two adjacent groups of leads is cut off, the first lead and the second lead in the same group of leads can be conducted with each other through the conducting layer, and the two adjacent groups of leads are not conducted, so that the method is provided.

In one embodiment, the step of forming a plurality of grooves through the first and second non-conductive regions on the side surface corresponding to the respective sets of leads comprises: a plurality of said grooves are die cut into said side surfaces using a cutting die. Because the substrate is made of flexible materials, the cutting die can easily form the groove on the edge of the substrate, so that the groove can be easily prepared at a required position, and a foundation is laid for subsequent directional conduction.

In one embodiment, the plating of the conductive layer on the inner wall and the side surface of the groove, the conductive layer communicating the first lead and the second lead in the same group of leads, and the step of the conductive layer communicating the two adjacent groups of leads comprises: and forming the conductive layer by sputtering, electroplating or chemical plating. After the grooves are formed, the conductive layer can be formed at one time by sputtering, electroplating or chemical plating. In the process of forming the conducting layer, the arrangement of the groove does not need to be considered, the conducting layer communicated with the first lead and the second lead can be formed firstly, and the required conducting layer can be obtained easily by adopting the process of the mature method.

In one embodiment, the step of performing a disconnection process on the conductive layers for connecting the two adjacent groups of leads so that the two adjacent groups of leads are not connected with each other includes: and removing the conductive layers on the side face, the first surface and the second surface. By removing the unnecessary conductive layer, the conductive layer that connects the two adjacent lead lines is cut.

In one embodiment, the removing the conductive layers on the side surface, the first surface, and the second surface specifically includes: and punching a part of the substrate to remove the conductive layer on the side face, the first surface and the second surface. The purpose of conducting layer disconnection processing is achieved by adopting a direct cutting mode, implementation is convenient, and especially when the substrate is made of flexible materials, the edge of the substrate between the two grooves can be conveniently cut by using a new cutting die.

In one embodiment, the substrate is made of transparent polymer or glass. The substrate is made of flexible transparent polymer, so that the substrate can be conveniently punched in the punching step. When the substrate is made of a hard material, the substrate can be removed in a punching mode, and then the conducting layer is cut off.

In one embodiment, the edges of the first and second leads are aligned, and the step of forming a plurality of grooves through the first and second non-conductive regions on the side surface corresponding to the respective sets of leads includes: and punching the substrate from the side of the first surface along the edge of the first lead to form a groove penetrating through the first non-conductive area and the second non-conductive area. Through the mode, the upper edge and the lower edge of the bottom wall of the obtained groove are flush with the edge of the first lead and the edge of the second lead respectively. Thus, the formed conductive layer easily connects the first lead and the second lead; and the edge of the first lead and the edge of the second lead can be plated with conducting layers respectively, and the conducting layers serving as conducting media are large in contact area with the first lead and the second lead, so that the first lead and the second lead can be well conducted.

It is further proposed a touch panel comprising: the substrate comprises a first surface, a second surface and a side face, wherein the first surface and the second surface are opposite, the side face is connected with the first surface and the second surface, a first induction area and a first lead area connected with the first induction area are arranged on the first surface, a second induction area and a second lead area connected with the second induction area are arranged on the second surface, the second lead area comprises a plurality of second leads which are arranged along a straight line, the positions of the second leads and the positions of the first leads are in one-to-one correspondence to form a plurality of groups of leads, a plurality of grooves penetrating through the first surface and the second surface are formed in the side face, each groove corresponds to one group of the first leads and the second leads, and a conducting layer communicated with the first leads and the second leads is arranged on the inner wall of each groove. In the touch panel of the embodiment, the groove is formed at the predetermined position of the edge of the substrate, and the conductive layer communicating the first lead and the second lead of the same group is arranged on the inner wall of the groove, so that the first lead and the second lead can be directionally conducted. In addition, according to the structure of the touch panel, the groove can be formed at a preset position on the side surface during preparation, then the conductive layer is formed, after the conductive layer for communicating two adjacent groups of leads is cut off, the first lead and the second lead in the same group of leads can be conducted with each other through the conductive layer, and the two adjacent groups of leads are not conducted, so that compared with the prior art, the double-sided conductive trace can be conducted on the edge of the substrate in a directional mode.

A touch panel assembly is also provided, which includes a flexible circuit board and the touch panel, wherein the flexible circuit board is bonded to the second lead area. Because the second lead area is conducted with the second induction area through the conducting layer, the flexible circuit board is only bonded with the second lead area, so that single-side bonding is realized, the process steps are simplified, and the bonding efficiency is improved.

In one embodiment, the optical connector further comprises a protective cover plate, wherein the protective cover plate is bonded to the first surface through an optical cement. Because the flexible circuit board is bound on the second surface of the touch panel, the protective cover plate is arranged on the first surface of the substrate, the bound flexible circuit board is not arranged between the flexible circuit board and the substrate, and the thickness difference does not exist on the plane of the binding interface, so that when the protective cover plate is bound with the substrate, the thickness difference is eliminated without using a large amount of optical cement, bubbles are prevented from being generated, and the binding effect of the protective cover plate and the substrate is ensured. In addition, because the amount of the used optical cement is small, the thickness of the optical cement layer is relatively small, and the overall thickness of the touch panel assembly is small.

Drawings

Fig. 1 is a flowchart of a method for manufacturing a touch panel according to the present invention.

Fig. 2 is a schematic structural diagram of a motherboard of a touch panel according to an embodiment of the invention.

Fig. 3 is a schematic structural diagram of an edge of a motherboard after step 120 in the method for manufacturing a touch panel is completed.

Fig. 4 is a schematic structural diagram of an edge of a motherboard after step 130 in the method for manufacturing a touch panel is completed.

Fig. 5 is a sectional view taken along the line a-a in fig. 4.

Fig. 6 is a schematic structural diagram of an edge of a motherboard after step 140 in the method for manufacturing a touch panel is completed.

Fig. 7 is a sectional view taken along line B-B in fig. 6.

Fig. 8 is a schematic structural diagram of a touch panel assembly according to an embodiment of the invention.

The elements in the figure are labeled as follows:

100. a motherboard; 10. a substrate; 110. a first surface; 120. a second surface; 130. a side surface; 132. a groove; 140. a first sensing region; 150. a first lead region; 152. a first lead; 154. a first non-conductive region; 160. a second sensing region; 170. a second lead section; 172. a second lead; 174. a second non-conductive region; 20. a conductive layer; 30, of a nitrogen-containing gas; a flexible circuit board; 40. a protective cover plate; 50. and (3) optical cement.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the capacitive touch screen with the double-layer ITO structure, in order to realize single-side bonding, one method adopted in the field is to sputter a conductive layer on the edge of a substrate and then form two-sided conductive traces which are communicated with each other at one time by utilizing a yellow light process.

In view of the above problems, embodiments of the present invention provide a method for manufacturing a touch panel, which is described in detail below with reference to the accompanying drawings.

Fig. 1 is a flowchart of a method for manufacturing a touch panel according to an embodiment of the invention. As shown in fig. 1, the preparation method comprises the following steps:

s110, a mother board 100 for providing a touch panel is provided, as shown in fig. 2, the mother board 100 includes a substrate 10, the substrate 10 includes a first surface 110, a second surface 120 and a side surface 130 connecting the first surface 110 and the second surface 120, which are opposite to each other, and a first sensing area 140 and a first lead area 150 connected to the first sensing area 140 are disposed on the first surface 110. As shown in fig. 3, the first lead region 150 includes a plurality of first leads 152 arranged along a straight line, each first lead 152 is spaced apart from the side surface 130, the second surface 120 is provided with a second sensing region 160 and a second lead region 170 connected to the second sensing region 160, the second lead region 170 includes a plurality of second leads 172 arranged along a straight line, each second lead 172 is spaced apart from the side surface 130, and the positions of the second leads 172 and the first leads 152 correspond to each other one by one to form a plurality of sets of leads.

In this step, both side surfaces of the substrate 10 of the motherboard 100 have been provided with a sensing area and a lead area for realizing the function of touch position detection. The touch position detection function can be realized through mutual capacitance type touch control and self-capacitance type touch control. The form of the sensing regions and the lead regions is not limited. For example, the sensing and lead pads can be formed by Indium Tin Oxide (ITO) coating etching. For another example, a grid-shaped trench may be stamped on the substrate 10, and then the trench is filled with a conductive material to form the sensing region and the lead region at one time, where the conductive material may be a metal, a conductive polymer, a carbon nanotube, or the like. In addition, the above-mentioned grid structure is not limited to be obtained by using an imprinting process, and may be obtained by providing a metal nano-scale plating film on the surface of the substrate 10 and then forming a metal grid by exposure-development-etching.

The substrate 10 is made of a transparent and flexible material. In specific implementation, the substrate 10 may be made of a transparent polymer, such as PET (polyethylene terephthalate), which can meet the requirement of light transmittance and facilitate the removal of the edge of the substrate 10 in the subsequent steps.

In the motherboard 100, the plurality of first leads 152 and the plurality of second leads 172 are provided in pairs, both having a gap from the side surface 130. If the area where all the first leads 152 are located is defined as a first conductive area and the area where all the second leads 172 are located is defined as a second conductive area, as shown in fig. 1, the first non-conductive area 154 and the second non-conductive area 174 are respectively disposed at both sides of the edge of the substrate 10. The conductive area is used for bonding with the flexible wiring board 30. In specific implementation, on the premise of ensuring that the two sides of the edge of the substrate 10 are provided with the non-conductive areas, the first conductive area and the second conductive area can be completely consistent in shape and size and are completely opposite in position; or the shapes and the sizes are completely consistent, but the positions are slightly staggered; it is also possible that the shapes, sizes, positions, etc. do not correspond or coincide exactly.

S110, a plurality of grooves 132 are formed on the side surface 130 to penetrate the first non-conductive region 154 and the second non-conductive region 174 corresponding to the respective sets of leads.

As shown in fig. 3, a plurality of grooves 132 are formed along the arrangement direction of the first leads 152 on the side surface 130 of the substrate 10. The number of grooves 132 corresponds to the number of lead groups. The groove 132 extends through the first and second

non-conductive regions

154 and 174. Thus, when viewed from the first surface 110, the first non-conductive region 154 has a plurality of grooves 132 penetrating the substrate 10 along the arrangement direction of the first leads 152. When viewed from the second surface 120 side, the second non-conductive region 174 is seen to have a plurality of grooves 132 extending through the substrate 10 along the arrangement direction of the second leads 172.

Preferably, the widths of the first and

second leads

152 and 172 are the same, and the width of the groove 132 is set to be the same as described above. However, the width of the groove 132 may be slightly smaller or slightly larger than the widths of the first and

second leads

152 and 172. The width of the groove 132 refers to the dimension of the groove 132 in the arrangement direction along each of the first leads 152 or the second leads 172.

S130, plating a conductive layer 20 on the inner wall and the side surface 130 of the groove 132, wherein the conductive layer 20 is communicated with the first lead 152 and the second lead 172 in the same group of leads, and the conductive layer 20 is communicated with the two adjacent groups of leads.

As shown in fig. 4, the inner wall of the groove 132 and the remaining side 130 not opened with the groove 132 are plated with the conductive layer 20. The interior walls of the recess 132 include two side walls perpendicular to the side 130 and a bottom wall parallel to the side 130. In practice, the conductive layer 20 may be formed by sputtering, electroplating or chemical plating. After the conductive layer 20 is formed, the conductive layer 20 connects the first lead 152 and the second lead 172. Viewed from the side 130 of the substrate 10, a surface exhibiting irregularities is coated with a continuous conductive layer 20. The continuous conductive layer 20 connects two adjacent sets of leads in addition to conducting the first and

second leads

152 and 172 of the same set of leads to each other.

And S140, conducting disconnection treatment on the conducting layers 20 for communicating the two adjacent groups of leads to ensure that the two adjacent groups of leads are not communicated with each other.

Specifically, as shown in fig. 5, in order to make only the first lead 152 and the second lead 172 in the same group of leads conduct with each other, but not conduct between two adjacent groups of leads, in this step, the conductive layer 20 communicating two adjacent groups of leads is subjected to a breaking process, so that no conducting medium exists between the two adjacent groups of leads, and thus only the first lead 152 and the second lead 172 in the same group of leads conduct directionally by means of the conductive layer 20.

The method of subjecting the conductive layer 20 communicating the adjacent two sets of leads to the disconnection process is not limited. For example, the portion of the conductive layer 20 may be completely removed, or the portion of the conductive layer 20 may be only partially broken.

In the method for manufacturing the touch panel, the groove 132 is formed at a predetermined position on the edge of the substrate 10, and then the conductive layer 20 is formed, after the conductive layer 20 for connecting two adjacent groups of leads is cut off, the first lead 152 and the second lead 172 in the same group of leads can be conducted with each other through the conductive layer 20, but the two adjacent groups of leads are not conducted, so that a method is provided, which can directionally conduct the conductive traces on the two sides on the edge of the substrate 10 compared with the conventional technology. Specifically to the above fabrication method, the double-sided conductive traces are referred to as the first lead 152 and the second lead 172.

In some embodiments, the substrate 10 is made of a flexible material, wherein the step of forming a plurality of grooves 132 on the side surface 130 corresponding to the sets of leads and penetrating through the first non-conductive region 154 and the second non-conductive region 174 includes: a plurality of grooves 132 are die cut into the side 130 using a cutting die. Since the substrate 10 is made of a flexible material, the cutting die can easily form the groove 132 on the edge of the substrate 10, so that the groove 132 can be easily prepared at a desired position. In particular, the die cutting may be performed from the side of the upper first surface 110 or the side of the second surface 120, so as to obtain the effect after die cutting as shown in fig. 3.

After the grooves 132 are formed, the conductive layer 20 may be formed at a time by sputtering, electroplating or electroless plating. In the process of forming the conductive layer 20, the conductive layer 20 communicating the first lead 152 and the second lead 172 may be formed first without considering the arrangement of the groove 132, and the desired conductive layer 20 may be obtained more easily by adopting the process of the above-described mature method.

There are various methods of performing the disconnection process on the conductive layer 20 that connects the adjacent two sets of leads. In particular, the disconnection process is performed by removing the conductive layer 20 on the side 130, the first surface 110, and the second surface 120. When the conductive layer 20 is plated, some of the conductive layer 20 is also plated on the remaining first non-conductive area 154 on the first surface 110 and the remaining second non-conductive area 174 on the second surface 120, so that when the disconnection process is performed, in addition to removing the conductive layer 20 on the side surface 130, the conductive layer 20 on the remaining first non-conductive area 154 on the first surface 110 and the remaining second non-conductive area 174 on the second surface 120 is also removed to ensure that the disconnection process is performed. It is understood that, in the process of forming the conductive layer 20, if the conductive layer 20 is not plated on the first non-conductive area remaining on the first surface 110 and the second non-conductive area remaining on the second surface 120, the action of removing the conductive layer 20 is not required on the first surface 110 and the second surface 120. By removing the unnecessary conductive layer 20, the conductive layer 20 that communicates between the two adjacent lead groups is cut.

In a specific implementation, the removing the conductive layer 20 on the side surface 130, the first surface 110, and the second surface 120 specifically includes: the removed portions of the substrate 10 are die cut such that the conductive layer 20 on the side 130, the first surface 110, and the second surface 120 is removed. The substrate 10 is directly cut, specifically, the edge of the substrate 10 between two adjacent grooves 132 is cut, and fig. 6 illustrates the structure after the edge of the substrate 10 is cut. It can be seen that the conductive layer 20 on the side 130, the first surface 110 and the second surface 120 in fig. 5 has been removed. The purpose of the breaking process of the conductive layer 20 is achieved by direct cutting, which is convenient to implement, and especially when the substrate 10 is made of flexible material, a new cutting die can be used to cut the edge of the substrate 10 between the two grooves 132. In other embodiments, the conductive layer 20 is removed, or the excess conductive layer 20 is scraped or etched away, to achieve a complete or partial disconnection.

Preferably, the substrate 10 is made of a flexible transparent polymer, which facilitates die cutting of the substrate 10 during the die cutting step. However, the substrate 10 may be made of a hard material such as glass. When a hard material is used, the substrate 10 may be removed by punching, so as to break the conductive layer 20.

In some embodiments, the edge of first lead 152 and the edge of second lead 172 are aligned, i.e., the edge of first lead 152 near first non-conductive region 154 and the edge of second lead 172 near second non-conductive region 174 remain aligned in a direction through first non-conductive region 154 and second non-conductive region 174, i.e., in the thickness direction of substrate 10.

The step of forming a plurality of grooves 132 through first non-conductive region 154 and second non-conductive region 174 on side 130 corresponding to each group of leads is specifically: the substrate 10 is die cut from the side of the first surface 110 along the edges of the first leads 152 to form the recess 132 extending through the first and second

non-conductive regions

154 and 174. The edge of the first lead 152 is aligned with the edge of the second lead 172. In this manner, the bottom wall of the resulting recess 132 has upper and lower edges that are flush with the edges of the first and

second leads

152 and 172, respectively. Thus, the formed conductive layer 20 easily connects the first lead 152 and the second lead 172; the edge of the first lead 152 and the edge of the second lead 172 may be plated with the conductive layer 20, respectively, and the conductive layer 20 as a conductive medium has a large contact area with the first lead 152 and the second lead 172, so that the first lead 152 and the second lead 172 can be well conducted.

An embodiment of the invention further provides a touch panel. As shown in fig. 6, referring to fig. 1 in combination, the touch panel includes a substrate 10, wherein the substrate 10 includes a first surface 110, a second surface 120 and a side surface 130 connecting the first surface 110 and the second surface 120, the first surface 110 is provided with a first sensing region 140 and a first lead region 150 connected to the first sensing region 140, the second surface 120 is provided with a second sensing region 160 and a second lead region 170 connected to the second sensing region 160, the second lead region 170 includes a plurality of second leads 172 arranged along a straight line, and the positions of the second leads 172 and the first leads 152 correspond to each other one by one to form a plurality of sets of leads.

The side 130 of the substrate 10 is provided with a plurality of grooves 132 penetrating through the first surface 110 and the second surface 120, each groove 132 corresponds to a group of the first leads 152 and the second leads 172, and the inner wall of the groove 132 is provided with a conductive layer 20 communicating the first leads 152 and the second leads 172.

In the touch panel of the above embodiment, the groove 132 is formed at a predetermined position on the side surface 130 of the substrate 10, and the conductive layer 20 communicating the first lead 152 and the second lead 172 of the same group is disposed on the inner wall of the groove 132, so that the first lead 152 and the second lead 172 can be directionally conducted. In addition, according to the above-mentioned structure of the touch panel, the groove 132 may be formed at a predetermined position on the side surface 130 of the substrate 10 during the preparation, and then the conductive layer 20 is formed, after the conductive layer 20 connecting two adjacent sets of leads is cut off, the first lead 152 and the second lead 172 in the same set of leads may be conducted with each other through the conductive layer 20, but the two adjacent sets of leads are not conducted, so that compared with the conventional technology, the directional conduction of the conductive traces on both sides can be realized at the edge of the substrate 10.

An embodiment of the present invention further provides a touch panel assembly, which includes the touch panel of the foregoing embodiment, and further includes a flexible circuit board 30, wherein the flexible circuit board 30 is bonded to the second lead area 170. Because the second lead area 170 is conducted with the second lead area 170 through the conductive layer 20, the flexible circuit board 30 is only bonded with the second lead area 170, so that single-side bonding is realized, the process steps are simplified, and the bonding efficiency is improved.

Further, the touch panel assembly further includes a protective cover 40, and the protective cover 40 is adhered to the first surface 110 by an optical adhesive. The material of the protective cover 40 is not limited, and may be a glass cover or a rigid plastic cover. In this embodiment, since the flexible circuit board 30 is bonded to the second surface 120 of the touch panel, the protective cover 40 is disposed on the first surface 110 of the substrate 10, the flexible circuit board 30 is not bonded therebetween, and the bonding interface is a plane without thickness difference, when the protective cover 40 is bonded to the substrate 10, a large amount of optical glue is not needed to eliminate the thickness difference, so as to avoid bubbles, thereby ensuring the bonding effect between the protective cover 40 and the substrate 10. In addition, because the amount of the used optical cement is small, the thickness of the optical cement layer is relatively small, and the overall thickness of the touch panel assembly is small.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A preparation method of a touch panel is characterized by comprising the following steps:

2. The method of claim 1, wherein the step of forming a plurality of grooves through the first and second non-conductive regions on the side surface corresponding to the sets of leads comprises: a plurality of said grooves are die cut into said side surfaces using a cutting die.

3. The method of claim 1 or 2, wherein the step of plating a conductive layer on the inner wall and the side surface of the groove, the conductive layer connecting the first lead and the second lead in the same group of leads, and the conductive layer connecting two adjacent groups of leads comprises: and forming the conductive layer by sputtering, electroplating or chemical plating.

4. The method for manufacturing a touch panel according to claim 1 or 2, wherein the step of disconnecting the conductive layer for connecting the two adjacent lead wires so that the two adjacent lead wires are not connected to each other includes: and removing the conductive layers on the side face, the first surface and the second surface.

5. The method for manufacturing a touch panel according to claim 4, wherein the removing the conductive layers on the side surface, the first surface, and the second surface specifically comprises: and punching a part of the substrate to remove the conductive layer on the side face, the first surface and the second surface.

6. The method of manufacturing a touch panel according to any one of claims 1, 2, and 5, wherein the substrate is made of a transparent polymer or glass.

7. The method for manufacturing a touch panel according to any one of claims 1, 2, and 5, wherein edges of the first lead lines and edges of the second lead lines are aligned, and in the step of forming a plurality of grooves that penetrate the first non-conductive region and the second non-conductive region on the side surface corresponding to the respective groups of lead lines: and punching the substrate from the side of the first surface along the edge of the first lead to form a groove penetrating through the first non-conductive area and the second non-conductive area.

8. A touch panel, comprising: the substrate comprises a first surface, a second surface and a side face, wherein the first surface and the second surface are opposite, the side face is connected with the first surface and the second surface, a first induction area and a first lead area connected with the first induction area are arranged on the first surface, a second induction area and a second lead area connected with the second induction area are arranged on the second surface, the second lead area comprises a plurality of second leads which are arranged along a straight line, the positions of the second leads and the positions of the first leads are in one-to-one correspondence to form a plurality of groups of leads, a plurality of grooves penetrating through the first surface and the second surface are formed in the side face, each groove corresponds to one group of the first leads and the second leads, and a conducting layer communicated with the first leads and the second leads is arranged on the inner wall of each groove.

9. A touch panel assembly comprising a flexible wiring board, and the touch panel of claim 8, wherein the flexible wiring board is bonded to the second lead pad.

10. The touch panel assembly of claim 9, further comprising a protective cover, wherein the protective cover is bonded to the first surface by an optical adhesive.