CN111613625A - Flexible substrate and mechanical peeling method thereof - Google Patents
Flexible substrate and mechanical peeling method thereof Download PDFInfo
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- CN111613625A CN111613625A CN202010454635.4A CN202010454635A CN111613625A CN 111613625 A CN111613625 A CN 111613625A CN 202010454635 A CN202010454635 A CN 202010454635A CN 111613625 A CN111613625 A CN 111613625A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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Abstract
The invention discloses a flexible substrate and a mechanical stripping method thereof, wherein the flexible substrate comprises: a rigid substrate; the flexible base material is bonded on the rigid substrate and comprises an active area and a non-active area surrounding the active area, the active area comprises a product arrangement area used for arranging flexible devices and an initial stripping edge located on one side of the product arrangement area, and a lining sheet used for placing and stripping the flexible substrate is arranged between the initial stripping edge and the rigid substrate. According to the scheme of the invention, the initial stripping edge of the flexible substrate can be fixed on the roller, the flexible substrate is stripped through the rotation of the roller, automatic control can be realized in the stripping process of the flexible substrate, and the technical problems of device circuit breakage, function failure and the like caused by incapability of controlling the stripping angle and the stripping speed in the mechanical manual stripping process of the flexible substrate can be effectively solved.
Description
Technical Field
The invention relates to the technical field of flexible device manufacturing, in particular to a flexible substrate and a mechanical stripping method thereof.
Background
With the rise of flexible substrates, various flexible electronic devices (such as flexible AM-OLED, flexible TFT-LCD, flexible touch devices, etc.) based on flexible substrates have entered the sunrise and the infancy stage. The vigorous development of the electronic folding chair inevitably detonates the market of electronic consumer goods and leads the high-end electronic consumer goods to a brand-new flexible foldable era.
At present, various electronic devices are manufactured on a flexible substrate of a flexible substrate by different processes, and then the flexible substrate is peeled from the surface of a rigid substrate of the flexible substrate in a Laser Lift-Off (LLO) manner without damage. Based on the structure of the current flexible substrate, two methods, namely laser peeling and manual peeling, are mainly adopted. Although the laser approach is relatively mature, in the face of high equipment price and high post-maintenance cost, technicians have to turn to relatively inexpensive Mechanical Lift-Off (MLO) methods to attempt to make flexible devices by manual Lift-Off. However, manual peeling cannot effectively control the peeling angle and peeling speed, which easily results in device scrap and cannot realize mass production.
Therefore, due to the limitation of the flexible substrate structure, there is only a suitable peelable method, and even if a flexible substrate is used, the development of industries related to foldable products is severely limited because mass production cannot be realized.
Disclosure of Invention
The invention discloses a flexible substrate and a mechanical stripping method thereof, which are used for solving the problem that the development of industries related to foldable products is seriously limited because the mass production of the flexible substrate cannot be realized due to the limitation of the structure of the flexible substrate in the prior art.
In order to solve the problems, the invention adopts the following technical scheme:
provided is a flexible substrate including:
a rigid substrate;
the flexible substrate is bonded on the rigid substrate and comprises an active area and a non-active area surrounding the active area, the active area comprises a product arrangement area used for arranging flexible devices and an initial stripping edge located on one side of the product arrangement area, and a lining sheet used for stripping the flexible substrate is placed between the initial stripping edge and the rigid substrate.
Optionally, the effective area includes at least two product arrangement areas arranged in sequence and the initial peeling edge corresponding to each product arrangement area, where each product arrangement area is provided with at least one complete product.
Optionally, each of the initial peeling edges is located at the same side of the corresponding product arrangement region.
Optionally, the width of the initial peeling edge is 15-20 mm, wherein the width of the initial peeling edge is the dimension from the initial peeling edge to the product arrangement region.
Optionally, the adhesion force of the flexible base material and the rigid substrate in the non-active area is greater than the adhesion force in the active area.
Optionally, a buffer layer with a set surface energy is disposed between the flexible substrate and the rigid substrate, and the buffer layer is located in the active region.
Optionally, the adhesion force between the flexible base material and the rigid substrate in the active area is 5-10 g/cm, and the adhesion force in the inactive area is greater than 50 g/cm.
Optionally, the width of the flexible substrate is greater than or equal to 200mm, and the length of the flexible substrate is greater than or equal to 200mm, where the length of the flexible substrate is a dimension from the initial peeling edge to the product arrangement region, and the width of the flexible substrate is a dimension perpendicular to the length.
There is also provided a method of mechanical peeling of a flexible substrate according to the above, comprising the steps of:
step S00, dividing the active area and the inactive area of the flexible substrate;
step S10, peeling the initial peeling edge of the flexible base material by a blade to separate the initial peeling edge from the rigid substrate;
a step S20 of inserting a spacer sheet between the initial peeling edge and the rigid substrate;
step S30, moving a roller to the initial peeling edge, and fixing the initial peeling edge on the roller through the liner sheet and a fixing piece arranged on the roller;
step S40, moving the roller or the flexible substrate along the peeling direction, rotating the roller simultaneously, peeling the flexible substrate from the rigid substrate, and vacuum-absorbing the peeled flexible substrate on the roller;
and step S50, removing the rigid substrate, reversely rotating the roller, unloading the flexible base material, and finishing the peeling of the flexible substrate.
Optionally, the step between the step S00 and the step S10 further includes the steps of:
and cutting the flexible substrate of the effective area into a plurality of flexible substrate units, wherein each flexible substrate unit comprises one product arrangement area and the corresponding initial stripping edge.
The technical scheme adopted by the invention can achieve the following beneficial effects:
the flexible base material is provided with an initial stripping edge, and during stripping, a liner sheet can be embedded between the initial stripping edge of the flexible base material and the rigid substrate so as to fix the flexible base material on the roller and strip the flexible base material by the roller. Therefore, automatic control can be realized in the process of stripping the flexible base material, and the technical problems of device line breakage, functional failure and the like caused by incapability of controlling the stripping angle and the stripping speed in the mechanical manual stripping process of the flexible substrate can be effectively solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof illustrate the present invention and do not constitute a limitation of the present invention. In the drawings:
fig. 1 is a schematic top view of a flexible substrate according to an embodiment of the disclosure;
FIG. 2 is a schematic side view of a flexible substrate according to an embodiment of the disclosure;
FIG. 3 is a schematic top view of a flexible substrate cut into a plurality of flexible substrate units according to an embodiment of the present invention;
FIG. 4 is a schematic view of a general structure of a mechanical stripping apparatus according to an embodiment of the present invention;
FIG. 5 is a schematic view of a first structure of a mechanical peeling apparatus for removing a control mechanism according to an embodiment of the disclosure;
FIG. 6 is a schematic diagram of a second structure of the mechanical peeling apparatus for removing the control mechanism according to the embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a blade mechanism according to an embodiment of the disclosure;
FIG. 8 is a schematic top view of a flexible substrate with a liner sheet disposed thereon according to an embodiment of the present invention;
FIG. 9 is a schematic bottom view of a roller with a tape as a fastener according to an embodiment of the present invention;
FIG. 10 is a schematic side view of a roller with a tape as a fastener according to an embodiment of the present invention;
FIG. 11 is a schematic front view of a roller with mechanical clamping members as a fixing member according to an embodiment of the present invention;
FIG. 12 is a schematic side view of a roller with mechanical clamping elements according to an embodiment of the present invention;
FIG. 13 is a schematic side view of a wedge of the present disclosure;
FIG. 14 is a schematic front view of a wedge of the present disclosure;
FIG. 15 is a schematic structural view of a support mechanism when the support plate is not extended according to an embodiment of the disclosure;
fig. 16 is a schematic structural view of the supporting mechanism when the supporting sheet is extended according to the embodiment of the disclosure;
FIG. 17 is an exploded view of a support mechanism according to an embodiment of the present invention;
fig. 18-a to g are schematic structural diagrams illustrating a flexible substrate peeling process according to an embodiment of the disclosure.
Wherein the following reference numerals are specifically included in figures 1-18:
a flexible substrate-1; a base-2; a blade mechanism-3; a roller mechanism-4; a contraposition mechanism-5; control means-6; a fixing piece-7; a support mechanism-8; a gasket sheet-9; a rigid substrate-11; a flexible substrate-12; an active area-121; non-active area-122; initial peel edge-123; a flexible substrate unit-124; a buffer layer-13; -14; a support film-15; bracket-31; a blade-32; a first drive assembly-33; a servomotor-331; a screw rod-332; a roller-41; a shaft-42; adhesive tape-71; a mechanical clamp-72; wedge-shaped piece-721, connecting rod-722, L-shaped folding piece-723, cylinder-724 and compression spring-725; a support sheet-81; a fifth drive assembly-82; and fixing the rod-83.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, the mechanical peeling method and apparatus of the present invention are used to peel off the flexible substrate 1. The flexible substrate 1 may be applied to a display device, a touch device, a Micro-LED backplane, a solar cell device, or the like. The flexible substrate 1 can be two layers, namely a rigid substrate 11 and a flexible base material 12 bonded to the rigid substrate 11; the flexible substrate 1 may have three or more layers, that is, the uppermost layer may be the flexible base material 12, the lowermost layer may be the rigid substrate 11, and the intermediate layer may be one or more buffer layers 13. The rigid substrate 11 may be a glass substrate. The flexible substrate 12 may be a PI (Polyimide) material with excellent chemical resistance and high temperature resistance, and is transparent or translucent, and the thickness is 5 to 100 μm, or may be other organic transparent polymer materials capable of resisting high temperature, but the resistance is required to be good (capable of resisting common organic acid-base solvents), and the optical retardation is less than 70 nm. The buffer layer 13 is a material having a certain surface energy and high temperature resistance, and is disposed in the effective region 121 in the middle of the rigid substrate 11 to control the adhesion (i.e., adhesion) between the flexible base material 12 and the rigid substrate 11 within a suitable range, such as 5 to 10 g/cm. In the inactive areas of the uncoated buffer layer 13, a relatively large adhesion, e.g., > 50g/cm, is formed between the flexible base 12 and the rigid substrate 11 to ensure that the flexible base 12 does not lift or peel during the fabrication of the device 14.
The middle of the flexible substrate 1 is an active area 121, and a non-active area surrounding the active area 121 is not easy to peel off. As shown in fig. 3, when the length (in the peeling direction) of the flexible substrate 1 is long, it is necessary to divide the flexible substrate 1 into a plurality of flexible base material units 124, arrange at least one complete product in each flexible base material unit 124, and peel off each flexible base material unit 124 individually when peeling off the flexible base material 12. For example, as shown in the following table, when the size of the flexible substrate 1 is 1300 (width) × 1500 (length), the flexible substrate 1 is not divided; the flexible substrate 1 has a size of 1500 (width) × 1850 (length) mm, and can be divided into two flexible substrate units 124; the flexible substrate 1 may be divided into at least three flexible substrate units 124 when the size is 2160 (width) × 2460 (length) or 2880 (width) × 3100 (length).
Therefore, when the length of the flexible substrate 12 is long and it needs to be peeled off at least twice, the effective area 121 of the flexible substrate 12 is further divided into a laser cutting area, a product arrangement area of the array arrangement flexible devices 14, and an initial peeling edge 123 located between the laser cutting area and the product arrangement, the same side of each product arrangement area is provided with the initial peeling edge 123, and the width of each initial peeling edge 123 can be 15-20 mm, so as to be peeled off by the blade 32. The product layout area may be further divided into a product active area 121 and a product inactive area. The product active area 121 may be further divided into a display area and a non-display area.
The basic peeling process of the flexible substrate 1 is as follows: cutting the support film 15 → cleaning the support film 15 → attaching the support film 15 → defoaming → laser trimming → peeling the substrate → OCA (or protective film) attaching the substrate → defoaming → nine single-particle cutting → functional testing of the red & green & blue tooth. The manufacturing of devices on the surface of the flexible substrate is related to the type of products, and the related manufacturing processes are the same as or similar to those of the rigid substrate, and are all technologies disclosed in the industry, and are not described herein again.
Wherein, the supporting film 15 is an organic polymer transparent material with a full-wave band transmittance of not less than 75%, and the thickness is not more than 0.2mm, so as to ensure that the flexible base material 12 is not excessively stretched due to the influence of the thickness of the supporting film 15 during the rotation process of the roller 41, and further avoid damaging the electrical connection circuit of the device 14. The protective film is an organic polymer transparent material with the full-wave-band transmittance of more than or equal to 75 percent.
As shown in fig. 4-6, the mechanical peeling device includes a base 2, a blade mechanism 3, a roller mechanism 4, a vacuum generating device, a third driving assembly, a fourth driving assembly, a positioning mechanism 5 and a control mechanism 6.
The base 2 may be substantially rectangular for placing the flexible substrate 1. The base 2 may be a vacuum adsorption platform provided with vacuum holes, and is communicated with a vacuum pump through a second pipeline to adsorb the flexible base material 12 unloaded from the roller 41. The surface roughness of the base 2 is less than 20 μm to release the flexible substrate 12 smoothly to the surface of the base 2.
The blade mechanism 3 includes a holder 31, a blade 32, and a first drive assembly 33. As shown in fig. 7, the first driving assembly 33 may specifically include a servo motor 331 fixed on the fixing frame 31 and a screw rod 332 fixedly connected to the servo motor 331. The blade 32 includes a blade holder, a telescopic cylinder connected to the blade holder, a rotary cylinder connected to the telescopic cylinder, and a blade body connected to the rotary cylinder. When the blade body is not used, the telescopic cylinder retracts, and when the blade body is used, the telescopic cylinder extends out. The blade body is provided with one blade, the front end of the blade body is in a semicircular arc shape, metal or organic polymer materials can be selected, and the thickness of the blade edge is less than or equal to 0.1 mm. The tool holder is movably disposed on the screw 332, and is moved in the width (perpendicular to the peeling direction) direction of the flexible base material 12, so that the blade body peels off the peeling start edge 123 of the flexible base material 12 to place the spacer sheet 9 between the peeling start edge 123 and the rigid base plate 11 (as shown in fig. 8). And the blade body is intermittently driven by the rotary cylinder to do circumferential small-angle reciprocating rotation while moving along the width direction, so that the blade body can smoothly, continuously and nondestructively lift the initial stripping edge 123 of the flexible base material 12. The length of the blade body inserted into the flexible base material 12 is 5-10 mm, and the initial peeling edge 123 can be completely lifted after the blade body rotates, even if the initial peeling area of the flexible base material 12 is extended to a length of 10-15 mm.
The liner sheet 9 is a non-viscous sheet which can be deformed under pressure, specifically a colored translucent or colorless transparent organic polymer material, has a certain stiffness and flexibility, can select PI, PET, PS, PP or PVC, and the like, and preferably has antistatic or electrostatic dissipation performance. The size setting requirements are as follows: the thickness is 30-200 μm; the length (dimension along the peeling direction) is 15-20 mm, and one side far away from the flexible base material 12 is exposed to the initial peeling edge 123; the width (dimension perpendicular to the peeling direction) is 20mm or more larger than the width of the peeling start edge 123 and smaller than the effective width of the base 2.
With such an arrangement, when the gasket sheet 9 is inserted between the initial peeling edge 123 and the rigid substrate 11, it can be partially pressed on the non-effective area 122 of the flexible base material 12 (the side facing away from the rigid substrate 11), so that the initial peeling edge 123 is in a flat and upturned state, which is convenient for the fixing member 7 of the roller mechanism 4 to stably pick up the initial peeling edge 123 of the flexible base material 12; since the pad sheet 9 having a certain thickness is used and both ends are pressed in the non-effective area 122, the height of the initial peeling edge 123 of the flexible base material 12 in the horizontal direction exceeds the other effective areas 121 of the flexible base material 12, and the height of the roller 41 which is lowered when the roller 41 presses down to fix the initial peeling edge 123 and the pad sheet 9 is the lowest point of the roller 41 which is lowered during the peeling process, so that the device 14 fabricated on the flexible base material 1 is not damaged.
The roller mechanism 4 includes a roller 41, a second driving assembly connected to the roller 41 through a rotating shaft 42, and a fixing member 7 provided on the roller 41. The roller 41 is made of stainless steel or alloy materials, and is also provided with vacuum holes on the surface, wherein the diameter of each vacuum hole is 0.5-0.8 mm, and the vacuum holes are used for nondestructively adsorbing the stripped flexible base material 12 on the roller 41. The roller 41 has a minimum diameter (i.e., outer diameter) of 100mm and an effective circumference greater than or equal to the length of the flexible base substrate 12 (and the flexible base substrate unit 124 when the flexible base substrate unit 124 is cut), and an effective width greater than or equal to the width of the active area 121 of the flexible base substrate 12. The diameter of the roller 41 can be specifically set according to requirements.
The second drive assembly may be a servo motor for driving the roller 41 in rotation. The fixing member 7 fixes the peeling start edge 123 to the roller 41 through the spacer sheet 9. As shown in fig. 9 and 10, the fixing member 7 may be a double-sided adhesive tape 71, and the adhesive tape 71 continuously extends from one side of the roller 41 to the other side of the roller 41. The tape 71 may have a length (dimension along the circumferential direction of the roller 41) of 20 to 25mm and a width (dimension along the axial direction of the roller 41) set to be about 10 to 15mm larger than the width of the initial peeling edge 123 to simultaneously bond the initial peeling edge 123 and the portion of the liner sheet 9 exposed to the initial peeling edge 123. The thickness of the tape 71 is set as: the tape 71 needs to have a compression of about 0.1-0.3 mm during the pressing process to ensure that the adhesive surface is in full contact with the liner sheet 9 and the initial peeling edge 123 during the attachment process.
As shown in fig. 11-14, the fixing member 7 may also be a mechanical clamping member 72. At this time, the bottom end of the roller 41 is provided with an accommodating groove extending in the axial direction, and the cross section of the accommodating groove (the cross section perpendicular to the axial direction of the roller 41) is triangular or trapezoidal. Mechanical clamp 72 includes a wedge 721, a connecting rod 722, an L-shaped flap 723, a cylinder 724, and a compression spring 725. The wedge 721 is preferably made of a rigid metal material, such as magnesium aluminum alloy, organic polymer, metal-organic polymer composite, SUS304 or SUS316L, to reduce weight and reduce damage to the flexible substrate 12 while maintaining hardness. The wedge 721 is disposed in the receiving groove and extends along the axial direction of the roller 41, and the cross section of the wedge 721 is triangular, so as to ensure that the wedge will not contact the surface of the flexible substrate 1 during the process of lowering the roller 41 and clamping the pad sheet 9 and the initial peeling edge 123, thereby avoiding the flexible device 14 from being damaged. The width (along roller 41 circumference size) of wedge piece 721 sets up to 25 ~ 50mm, and the thicker side thickness of wedge piece 721 is 5~10 mm, and the thinner one side edge of wedge piece 721 is smooth, and thickness is 0.1 ~ 0.3mm to can be smooth insert the below of gasket piece 9.
The connecting rod 722 comprises two vertical rods respectively positioned at the two ends of the roller 41 and a cross rod which penetrates through the wedge-shaped piece 721 and extends along the axial direction of the roller 41, so that the connecting rod 722 is rotatably connected with the thicker side of the wedge-shaped piece 721. A compression spring 725 is provided in the middle of the wedge 721 and connected to the roller 41 to restore the wedge 721. Two L-shaped folding pieces 723 and two air cylinders 724 are arranged and are respectively positioned at two ends of the roller 41, and each L-shaped folding piece 723 is driven by one air cylinder 724. L-shaped flap 723 is located on the thinner side of wedge 721, so that air cylinder 724 drives wedge 721 to rotate through L-shaped flap 723, and wedge 721 lifts pad sheet 9 from below pad sheet 9, thereby cooperating with roller 41 to press pad sheet 9 against roller 41.
The vacuum generating device comprises a vacuum pump and a first pipeline which is communicated with the vacuum pump and the roller 41. The roll 41 is vacuum sucked onto the roll 41 by a vacuum pump to cause the roll 41 to vacuum-adsorb the peeled flexible substrate 12.
The third driving assembly may comprise a motor, a slide rail, etc. for driving the roller mechanism 4 to move in the direction perpendicular to the base 2.
The fourth driving component can also be a motor, a slide rail, etc., and drives the roller mechanism 4 or the base 2 to move along the peeling direction.
The alignment mechanism 5 is arranged on the base 2 and positioned on the initial peeling edge 123, so that the alignment confirmation of the roller 41 and the initial peeling edge 123 is realized. The alignment mechanism 5 may specifically include a CCD and an image transmission member mounted on the bottom of the base 2. At least two sets of alignment mechanisms 5 may be provided on the base 2 at intervals along the peeling direction, and each alignment mechanism 5 corresponds to the initial peeling edge 123 of a different flexible base material unit 124.
The control mechanism 6 is electrically connected with the first driving assembly 33, the second driving assembly, the third driving assembly, the fourth driving assembly and the aligning mechanism 5, and controls the first driving assembly 33, the second driving assembly, the third driving assembly, the fourth driving assembly and the aligning mechanism 5. The control mechanism 6 may specifically comprise a controller and a display device.
As shown in fig. 15-17, the mechanical stripping means may further comprise a support mechanism 8. The support mechanism 8 includes a plurality of support pieces 81 that are extended to pick up the initial peeling edge 123 and a fifth driving assembly 82 that drives the respective support pieces 81 to extend and retract. The support sheet 81 is a resilient sheet made of stainless steel or organic polymer material and having a certain rigidity. The thickness of the cutter is 0.3-1.0 mm, the width (the size along the moving direction of the cutter) is 15-25 mm, the front end of the cutter is semicircular, and the edge of the cutter is smooth. The fifth driving assembly 82 may be a telescopic cylinder, which is fixed on the fixing frame 31 of the blade mechanism 3 through a fixing rod 83 (shown in fig. 7), and a plurality of supporting mechanisms 8 are arranged on the fixing rod 83 at intervals.
The principle of providing the support mechanism 8 and the spacer sheet 9 is based on: since flexible substrate 12 is flexible (soft, non-rigid) and the polymer material has a certain toughness, after flexible substrate 12 is lifted, if supporting sheet 81 and blade 32 at the lifted position are removed, the lifted portion will naturally sag (i.e., droop) under the action of gravity and the toughness of flexible substrate 12 itself, so that a lifted pre-peeling edge cannot be obtained, and therefore supporting sheet 81 is used. When the adsorption stripping of the roller 41 is started, the supporting mechanism 8 needs to be moved to a non-stripping operation area to reduce the interference to the roller 41, so that a pad sheet 9 needs to be additionally inserted, and then the supporting sheet 81 needs to be removed.
A method of peeling off the flexible substrate 1 using a mechanical peeling apparatus, as shown in fig. 18-a to g, includes the steps of:
step S00: dividing the active area 121 and the inactive area 122 of the flexible base material 12 by a laser or a cutter to strip the active area 121 of the flexible base material 12, so as to prevent the active area 121 from being damaged when the inactive area 122 is stripped;
step S10, moving the roller mechanism 4 to the distal end of the initial peeling edge 123, peeling the initial peeling edge 123 of the flexible base material 12 with the blade 32, and separating the initial peeling edge 123 from the rigid substrate 11;
step S20, manually or automatically inserting the spacer sheet 9 between the initial peeling edge 123 and the rigid substrate 11, and moving the blade mechanism 3 to a position away from the base 2;
step S30, moving the roller 41 to the initial peeling edge 123, and fixing the initial peeling edge 123 on the roller 41 through the liner sheet 9 and the fixing piece 7 arranged on the roller 41;
step S40, moving the roller 41 or the base 2 in the peeling direction, and rotating the roller 41 simultaneously, peeling the flexible base material 12 from the rigid board 11, and vacuum-adsorbing the peeled flexible base material 12 to the roller 41;
step S50, removing the rigid substrate 11, setting the end of the peeling process of the flexible base 12 to be in contact with the base 2 with priority and without pressure, and then setting the vacuum of the roller 41 and the base 2 to be broken and opened in sections in the process of gradually releasing the roller 41 rotating in reverse direction so as to prevent the flexible base 12 from randomly displacing on the surfaces of the roller 41 and the base 2, and completing the unloading of the flexible base 12, thereby completing the peeling of the flexible substrate 1.
Between the step S10 and the step S20, the method further includes the steps of: during the peeling of the flexible base material 12 by the blade 32, the supporting sheet 81 is inserted between the peeled initial peeling edge 123 and the rigid board 11, and the peeled initial peeling edge 123 is picked up by the supporting sheet 81. Specifically, when the initial peeling edge 123 is peeled by the blade 32 by a certain width, the first supporting sheet 81 is inserted into the initial peeling edge 123, and the flexible base material 12 is picked up (i.e., supported), and the depth of the insertion into the initial peeling edge 123 is two thirds of the length of the initial peeling edge 123, so as to ensure the stability of clamping and reduce the damage to the non-peeled area of the flexible base material 12. While the stripping width is gradually increased along with the continuous transverse movement of the blade 32, a sufficient number of support sheets 81 are extended in time to lift the stripped initial stripping edge 123 by about 30-60 degrees, and the number of the support sheets 81 ensures that the height between the edge of the whole stripped initial stripping edge 123 and the rigid substrate 11 is kept at 4-10 mm, so that the gasket sheet 9 can be inserted smoothly.
When the spacer sheet 9 is embedded, the spacer sheet 9 is embedded between the effective region 121 and the rigid substrate 11, and both ends of the spacer sheet 9 are pressed on the front surface of the non-effective region 122. And the side of the liner sheet 9 remote from the flexible substrate 12 is exposed to the initial peeling edge 123 in the peeling direction. When the embedding action of the liner sheet 9 is completed, the blade mechanism 3 and the supporting mechanism 8 automatically move to the far end outside the action range of the roller 41.
When the fixing member 7 is the double-sided tape 71, the step S30 specifically includes: moving the roller 41 to the initial peeling edge 123, aligning the edge of the adhesive tape 71 with the edge of the exposed long side of the liner sheet 9 by CCD alignment, making the adhesive surface of the double-sided adhesive tape 71 in the axial direction of the roller 41 and not beyond the two short sides of the liner sheet 9, lowering the roller 41 at the moment, completely pressing the adhesive surface against the liner sheet 9 and the initial peeling edge 123, staying for 5-10 seconds to make the adhesive surface fully adhered to the liner sheet 9 and the initial peeling edge 123, and then performing step S40. And in step S50, the adhered initial peeling edge 123 is cut off, and the unnecessary liner sheet 9 and the initial peeling edge 123 are removed from the roll 41 in a peeling manner.
When the fixing member 7 is the mechanical clamping member 72, step S30 specifically includes: the roller 41 is vertically moved to the bottom end of the pad sheet 9, and then the roller 41 is slowly moved in the horizontal direction so that the wedge 721 is inserted into the bottom of the pad sheet 9 to a position where the wedge 721 holds the pad sheet 9 by about two thirds of the width, the air cylinder 724 is actuated to clamp the pad sheet 9 and the initial peeling edge 123 by the wedge 721 and the roller 41, and then the step S40 is performed. Wherein the wedge 721 holds the pad sheet 9 in a position of about two-thirds width based on the stability of the holding and the reduction of damage to the non-peeled area of the flexible base material 12.
When the fixing member 7 is the mechanical clamping member 72, in step S50, after the flexible base material 12 is unloaded onto the base 2, the flexible base material 12 can be released and adsorbed on the unloading platform by releasing the wedge 721.
In addition, the flexible substrate 1 of the specification of G6 or more is peeled off only once in the prior art. However, the diameter of the roll 41 is relatively large, which leads to a problem that the rigidity of the entire mechanical structure of the peeling apparatus is lowered and the accuracy and stability of the apparatus are lowered. Therefore, in the present invention, the size of the peeling roller 41 is set to 320 to 500mm, and a multi-peeling method is adopted.
In terms of product layout design of the flexible substrate 1, optimization is needed, and layout of the flexible substrate 1 in the longitudinal direction is also divided into several product layout areas (i.e. flexible substrate units 124) with equal width or unequal width according to the effective circumference of the roller 41, and an ineffective area 122 is left between two adjacent layout areas, which is not designed and is used for arranging effective products, and is only used as an initial position (i.e. an initial peeling edge 123) of the nth peeling adhered in the peeling process of the roller 41, and the width range of the ineffective area 122 area: 15-30 mm. Aiming at different product arrangement areas, after the first product arrangement area is completed in sequence, the pre-stripping device pre-strips the second product arrangement area, and a liner sheet 9 is arranged to correspondingly strip for the second time, so that the substrate stripping of the rest product arrangement areas is completed.
It should be noted that, after the first product arrangement region is peeled off, the peeled product arrangement region needs to be unloaded first, then the plate peeling of the second product arrangement region is performed, and so on, and the peeling of the remaining product arrangement regions is completed. Before the flexible substrate 12 is peeled, each product layout area needs to be completely cut out using a laser or a cutting tool according to the multi-area efficient layout design.
Of course, in other embodiments, the initial peeling edge may not be supported by the support mechanism, but a liner sheet or the like may be directly inserted in the blade peeling direction.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A flexible substrate, comprising:
a rigid substrate;
the flexible substrate is bonded on the rigid substrate and comprises an active area and a non-active area surrounding the active area, the active area comprises a product arrangement area used for arranging flexible devices and an initial stripping edge located on one side of the product arrangement area, and a lining sheet used for stripping the flexible substrate is placed between the initial stripping edge and the rigid substrate.
2. The flexible substrate of claim 1, wherein the active area comprises at least two product layout areas arranged in sequence and the initial peeling edge corresponding to each product layout area, wherein each product layout area is configured with at least one complete product.
3. The flexible substrate of claim 2, wherein each of the peel initiation edges is located on a same side of the corresponding product placement region.
4. The flexible substrate according to claim 1, wherein the width of the initial peeling edge is 15-20 mm, and the width of the initial peeling edge is the dimension from the initial peeling edge to the product arrangement region.
5. The flexible substrate of claim 1, wherein the flexible base material has a greater adhesion to the rigid substrate in the inactive area than in the active area.
6. The flexible substrate of any one of claims 1-6, wherein a buffer layer having a set surface energy is disposed between the flexible substrate and the rigid substrate, the buffer layer being located in the active region.
7. The flexible substrate of claim 6, wherein the adhesion between the flexible substrate and the rigid substrate is 5-10 g/cm in the active area and greater than 50g/cm in the inactive area.
8. The flexible substrate according to any one of claims 1 to 6, wherein the width of the flexible substrate is greater than or equal to 200mm, and the length of the flexible substrate is greater than or equal to 200mm, wherein the length of the flexible substrate is a dimension from the initial peeling edge to the product arrangement region, and the width of the flexible substrate is a dimension perpendicular to the length.
9. A method of mechanical peeling of a flexible substrate according to any of claims 1-8, comprising the steps of:
step S00, dividing the active area and the inactive area of the flexible substrate;
step S10, peeling the initial peeling edge of the flexible base material by a blade to separate the initial peeling edge from the rigid substrate;
a step S20 of inserting a spacer sheet between the initial peeling edge and the rigid substrate;
step S30, moving a roller to the initial peeling edge, and fixing the initial peeling edge on the roller through the liner sheet and a fixing piece arranged on the roller;
step S40, moving the roller or the flexible substrate along the peeling direction, rotating the roller simultaneously, peeling the flexible substrate from the rigid substrate, and vacuum-absorbing the peeled flexible substrate on the roller;
and step S50, removing the rigid substrate, reversely rotating the roller, unloading the flexible base material, and finishing the peeling of the flexible substrate.
10. The mechanical peeling method as claimed in claim 9, further comprising, between step S00 and step S10, the steps of:
and cutting the flexible substrate of the effective area into a plurality of flexible substrate units, wherein each flexible substrate unit comprises one product arrangement area and the corresponding initial stripping edge.
Priority Applications (2)
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| CN202010454635.4A CN111613625A (en) | 2020-05-26 | 2020-05-26 | Flexible substrate and mechanical peeling method thereof |
| PCT/CN2020/125022 WO2021238060A1 (en) | 2020-05-26 | 2020-10-30 | Flexible substrate and mechanical stripping method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010454635.4A CN111613625A (en) | 2020-05-26 | 2020-05-26 | Flexible substrate and mechanical peeling method thereof |
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| WO2021238060A1 (en) * | 2020-05-26 | 2021-12-02 | 信利半导体有限公司 | Flexible substrate and mechanical stripping method therefor |
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| US20130133839A1 (en) * | 2011-11-30 | 2013-05-30 | Lg Display Co., Ltd. | Apparatus and method for peeling protective film and method for fabricating stereoscopic image display device |
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| CN109755420A (en) * | 2019-01-18 | 2019-05-14 | 昆山国显光电有限公司 | The preparation method of flexible display panels |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111613625A (en) * | 2020-05-26 | 2020-09-01 | 信利半导体有限公司 | Flexible substrate and mechanical peeling method thereof |
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2020
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- 2020-10-30 WO PCT/CN2020/125022 patent/WO2021238060A1/en active Application Filing
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| CN105206566A (en) * | 2006-09-29 | 2015-12-30 | 株式会社半导体能源研究所 | Method for manufacturing semiconductor device |
| US20130133839A1 (en) * | 2011-11-30 | 2013-05-30 | Lg Display Co., Ltd. | Apparatus and method for peeling protective film and method for fabricating stereoscopic image display device |
| CN104347449A (en) * | 2013-07-24 | 2015-02-11 | 上海和辉光电有限公司 | Peeling apparatus and peeling method |
| CN203503634U (en) * | 2013-09-29 | 2014-03-26 | 京东方科技集团股份有限公司 | Separating device and flexible-substrate separating equipment |
| CN208767272U (en) * | 2018-10-31 | 2019-04-19 | 合肥鑫晟光电科技有限公司 | A kind of flexible parent metal removes system |
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| WO2021238060A1 (en) * | 2020-05-26 | 2021-12-02 | 信利半导体有限公司 | Flexible substrate and mechanical stripping method therefor |
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| WO2021238060A1 (en) | 2021-12-02 |
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