CN111601457A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN111601457A CN111601457A CN202010589017.0A CN202010589017A CN111601457A CN 111601457 A CN111601457 A CN 111601457A CN 202010589017 A CN202010589017 A CN 202010589017A CN 111601457 A CN111601457 A CN 111601457A
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- Prior art keywords
- circuit board
- board portion
- connecting point
- glue
- light source
- Prior art date
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Links
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 239000004020 conductor Substances 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000004093 laser heating Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board and a preparation method thereof, wherein the circuit board comprises a first circuit board part with a plurality of first connecting points and a second circuit board part with a plurality of second connecting points, and the first connecting points and the second connecting points are electrically connected through conductors; a connecting portion for connecting the first circuit board portion and the second circuit board portion is provided between the first circuit board portion and the second circuit board portion; both ends of the connecting portion are in contact with the first circuit board portion and the second circuit board portion, respectively. The present invention enables the second circuit board portion to be positioned at different step planes, horizontal planes and/or angles with respect to the first circuit board portion, thereby having an extremely high space adaptability while having a high fixing strength.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a matrix headlamp circuit board and a method.
Background
With the continuous development of the LED in the automobile lighting industry, the demand of many consumers for the diversification of the automobile lamps is satisfied, and the diversified lighting of the automobile lamps becomes a mainstream trend. Automobile headlamps undergo the transition from halogen lamps, xenon lamps to LED lamps, and the brightness of automobile lamps is greatly improved, but new risks are brought. Therefore, matrix headlamps are produced. The matrix headlight adopts the theory of illumination area block control, can effectively improve the degree of distinguishing of things in the illumination area, also can reduce the light interference for the other side's vehicle, can send functions such as warning signal even.
At present, the automobile headlamp mostly adopts an LED headlamp, and a circuit board of a matrix headlamp also consists of a group of LED arrays and a driving circuit. And the LED array requires a substrate with ultra-high heat dissipation capability. Meanwhile, in order to achieve the purpose of individually controlling each LED, the number of traces on the circuit board usually needs to be hundreds or even thousands. The circuit board capable of meeting the two requirements has the disadvantages of complex circuit wiring and difficult manufacturing, so that the manufacturing cost of the automobile headlamp is high.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a matrix headlamp circuit board and a method for manufacturing the matrix headlamp circuit board.
In order to achieve the purpose, the invention adopts the technical scheme that:
a circuit board, comprising:
the circuit board comprises a first circuit board part with a plurality of first connecting points and a second circuit board part with a plurality of second connecting points, wherein the first connecting points and the second connecting points are electrically connected through conductors;
a connecting portion for connecting the first circuit board portion and the second circuit board portion is provided between the first circuit board portion and the second circuit board portion;
both ends of the connecting portion are in contact with the first circuit board portion and the second circuit board portion, respectively.
In the above circuit board, the connection portion is made of uv glue.
The circuit board comprises a plurality of connecting parts, wherein at least a part of the connecting parts of the plurality of connecting parts covers or at least partially covers the conductor.
In the above circuit board, the first circuit board portion is a driving circuit board, and the second circuit board portion is a light source circuit board.
In the above circuit board, the first circuit board portion is provided with a through groove, and the second circuit board portion is disposed in the through groove.
The above circuit board, wherein a gap is provided between the first circuit board portion and the second circuit board portion.
The circuit board of the present invention, wherein the first circuit board portion and the second circuit board portion are disposed in parallel or have an included angle therebetween.
The circuit board of the above, wherein the first circuit board part and the second circuit board part are in the same plane or in different planes.
In the above circuit board, each of the first connection points and the corresponding second connection point are disposed on two non-parallel step surfaces.
In the above circuit board, each of the first connection points and the corresponding second connection point are disposed on the same horizontal plane.
The circuit board is characterized in that the driving circuit board and the light source circuit board are electrically connected through ultrasonic bonding and/or laser welding and/or hot-press welding.
In the above circuit board, the conductor is made of gold wire, aluminum wire, silver alloy wire, gold alloy wire, aluminum alloy wire, copper alloy wire, aluminum strip, copper strip, tin sheet, or other materials.
In the above circuit board, the surfaces of the first connection point and the corresponding second connection point are provided with a nickel-gold plating layer, a nickel-palladium-gold plating layer, a nickel-silver plating layer or a nickel plating layer.
In the above circuit board, the surfaces of the first connection points and the corresponding second connection points are plated with gold or silver or by electroplating or vapor deposition.
In the above circuit board, the light source circuit board and the driving circuit board are made of a ceramic substrate, a metal substrate, a flexible circuit board or an FR4 board.
In the above circuit board, the light source circuit board and the driving circuit board may be made of the same material or different materials.
In the above circuit board, the electrical connection between the driving circuit board and the light source circuit board is realized by a flexible circuit board through reflow soldering.
In the circuit board, the electrical connection between the driving circuit board and the light source circuit board is realized by a wire harness through wave soldering.
A method of making a circuit board, comprising:
step S1: providing a first circuit board section having first connection points and a second circuit board section having second connection points;
step S2: fixing the first circuit board part and the second circuit board part relatively, and fixing the whole formed by fixing the first circuit board part and the second circuit board part relatively on a clamp arranged at the tail end of a manipulator;
step S3: adjusting one of the first connecting point and the second connecting point to be welded to enable the plane of the first connecting point and the second connecting point to be perpendicular to the working direction of the wire bonding head and to be located below the wire bonding head;
step S4: the laser heating head instantaneously heats one of the first connecting point and the second connecting point, and the routing welding head works to weld to form a conductor connecting the first connecting point and the second connecting point;
meanwhile, the manipulator follows up to adjust the other one of the first connecting point and the second connecting point to enable the plane where the manipulator is located to be perpendicular to the working direction of the wire bonding head;
step S5: providing an ultraviolet light source, guiding ultraviolet light of the ultraviolet light source to a dispensing head through a light guide, and simultaneously ensuring that the ultraviolet light cannot irradiate the end part of a dispensing needle of the dispensing head;
step S6.1: the end part of the dispensing needle transfers ultraviolet glue to a position between the first circuit board part and the second circuit board part;
step S6.2: the end part of the dispensing needle stops transferring the ultraviolet glue, and the ultraviolet light source is turned on to cure the ultraviolet glue;
step S7: and repeating the steps S6.1 to S6.2 until the glue dispensing amount is met.
In the above method for manufacturing a circuit board, in step S7, steps S6.1 to S6.2 are repeated until the conductor is covered or at least partially covered by the ultraviolet glue.
Due to the adoption of the technology, compared with the prior art, the invention has the following positive effects:
(1) the present invention enables the second circuit board portion to be positioned at different step planes, horizontal planes and/or angles with respect to the first circuit board portion, thereby having an extremely high space adaptability while having a high fixing strength.
(2) The first circuit board part and the second circuit board part can respectively and independently dissipate heat, so that the driving part with lower heat dissipation requirement can be separated from the LED part with higher heat dissipation performance, and different heat dissipation requirements can be distinguished.
(3) The first circuit board part and the second circuit board part can be made of different materials, so that the using amount of the substrate with higher cost and high heat dissipation capacity can be reduced according to actual needs, and the preparation cost is saved.
Drawings
Fig. 1 is a schematic structural diagram of a matrix headlamp circuit board according to the present invention.
In the drawings: 1. a first circuit board section; 2. a conductor; 3. an array of LEDs; 41. a second connection point; 42. a first connection point; 5. a second circuit board section; 6. and a driving chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
Fig. 1 is a schematic structural diagram of a matrix headlamp circuit board according to the present invention, please refer to fig. 1, which shows a matrix headlamp circuit board according to a preferred embodiment, including: a first circuit board part 1 with a number of first connection points 42 and a second circuit board part 5 with a number of second connection points 41, the first connection points 42 and the second connection points 41 being electrically connected by means of conductors 2.
Further, as a preferred embodiment, a connecting portion (not shown in the drawings) for connecting the first circuit board part 1 and the second circuit board part 5 is provided between the first circuit board part 1 and the second circuit board part 5.
Further, as a preferred embodiment, both ends of the connecting portion are in contact with the first circuit board part 1 and the second circuit board part 5, respectively. The connecting portion provides support to the first circuit board portion 1 and the second circuit board portion 5 to maintain the relative positional relationship between the first circuit board portion 1 and the second circuit board portion 5.
Further, as a preferred embodiment, the connecting portion is substantially spherical or substantially ellipsoidal.
Further, as a preferred embodiment, the connection portion is an ultraviolet glue. The uv glue cures upon irradiation with uv light to connect the first circuit board part 1 and the second circuit board part 5.
Further, as a preferred embodiment, the connector includes a plurality of connecting portions, and at least a portion of the connecting portions of the plurality of connecting portions covers or at least partially covers the conductor 2. The connecting portion also has a function of protecting the conductor 2 while maintaining the relative positional relationship between the first circuit board part 1 and the second circuit board part 5.
Further, as a preferred embodiment, the first circuit board portion 1 is a driving circuit board, and the second circuit board portion 5 is a light source circuit board. Preferably, the driving circuit board adopts a multi-layer board to realize control of a complex driving circuit, and the light source circuit board adopts a substrate with good heat dissipation performance and is electrically connected through a wire bonding process. The separation of the driving circuit board and the light source circuit board enables the heat dissipation of the driving circuit board to be separated from the heat dissipation of the light source circuit board. The driving circuit board can independently dissipate heat by adopting a substrate which has lower heat dissipation performance and can accommodate a complex driving circuit, and the heat generated by the light source circuit board does not influence the heat dissipation of the driving circuit board.
Further, as a preferred embodiment, the first circuit board portion 1 is provided with a through groove, and the second circuit board portion 5 is provided in the through groove.
Further, as a preferred embodiment, there is a gap between the first circuit board section 1 and the second circuit board section 5.
Further, as a preferred embodiment, the first circuit board section 1 is provided with a driving chip 6. Preferably, the driving chip 6 is mounted on the first circuit board part 1 by a die bonding process.
Further, as a preferred embodiment, the second circuit board portion 5 is provided with the LED array 3. Preferably, the LED array 3 is mounted on the second circuit board portion 5 by a chip mounting process.
Further, as a preferred embodiment, the second circuit board portion 5 (i.e. the light source circuit board) may be a planar matrix, a curved matrix, or a polyhedral matrix according to the optical design requirement.
Further, as a preferred embodiment, the first circuit board section 1 (i.e., the drive circuit board) may be a general FR4 circuit board.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope and the implementation manner of the present invention.
The present invention also has the following embodiments in addition to the above:
in a further embodiment of the invention the first circuit board section 1 and the second circuit board section 5 are arranged in parallel or with an angle between them.
In a further embodiment of the invention the first circuit board section 1 and the second circuit board section 5 are in the same plane or in different planes.
In a further embodiment of the present invention, there is also provided a method for manufacturing a circuit board, including:
step S1: providing a first circuit board section 1 with first connection points 42 and a second circuit board section 5 with second connection points 41;
step S2: fixing the first circuit board part 1 and the second circuit board part 5 relatively, and fixing the whole formed by fixing the first circuit board part 1 and the second circuit board part 5 relatively on a clamp arranged at the tail end of a manipulator;
step S3: adjusting one of the first connection point 42 and the second connection point 41 to be welded to enable the plane of the first connection point to be perpendicular to the working direction of the wire bonding joint and to be located below the wire bonding joint;
step S4: the laser heating head instantaneously heats one of the first connection point 42 and the second connection point 41, and the wire bonding head works to weld to form a conductor 2 connecting the first connection point 42 and the second connection point 41;
meanwhile, the manipulator follows up to adjust the other one of the first connection point 42 and the second connection point 41, so that the plane where the other one is located is perpendicular to the working direction of the wire bonding head;
step S5: providing an ultraviolet light source, guiding ultraviolet light of the ultraviolet light source to the dispensing head through a light guide, and simultaneously ensuring that the ultraviolet light cannot irradiate the end part of a dispensing needle of the dispensing head;
step S6.1: the end of the dispensing needle transfers the ultraviolet glue to a position between the first circuit board part 1 and the second circuit board part 5;
step S6.2: stopping transferring the ultraviolet glue at the end part of the glue dispensing needle, and opening an ultraviolet light source to cure the ultraviolet glue;
step S7: and repeating the steps S6.1 to S6.2 until the glue dispensing amount is met.
In a further embodiment of the present invention, in step S2, first circuit board section 1 and second circuit board section 5 are relatively fixed by means of positioning pins/holes or tolerance matching.
In a further embodiment of the present invention, in step S2, the robot is a four-axis or more robot.
In a further embodiment of the present invention, in step S4, the laser heating head selects a heating temperature according to the material of the conductor 2(wire), the material of the first connection point 42, and the material of the second connection point 41 (i.e., the material of the pad).
In a further embodiment of the present invention, in step S4, the wire bonding head only moves perpendicularly to the first connection point 42 or the second connection point 41 (i.e., the bonding pad).
In a further embodiment of the present invention, in step S4, the wire bonding head is protected by an inert gas during operation, wherein the inert gas may be nitrogen, argon, helium, or the like.
In a further embodiment of the present invention, in step S4, the arc shape and the arc length of the conductor 2(wire) are controlled by controlling the distance of movement of the manipulator and the angle of the manipulator.
In a further embodiment of the invention, in step S7, steps S6.1 to S6.2 are repeated until the uv-glue coats or at least partially coats the conductor 2.
In a further embodiment of the present invention, in step S7, uv glue is applied to a location between the first circuit board portion 1 and the second circuit board portion 5 by means of dispensing or spraying.
In a further embodiment of the present invention, first connection points 42 and second connection points 41 are formed on first circuit board portion 1 and second circuit board portion 5 by a physical vapor deposition plating process prior to step S1.
In a further embodiment of the present invention, the physical vapor deposition coating process comprises:
step A1: cleaning the surfaces of the first circuit board section 1 and the second circuit board section 2 using plasma;
step A2: a steel mesh pair is used to protect the first non-bonding area of the first circuit board portion 1 and the second non-bonding area of the second circuit board portion 5, and physical vapor deposition is performed.
In a further embodiment of the present invention, in step a2, the first non-bonding area is a portion of the first circuit board portion 1 other than the first connection point 42.
In a further embodiment of the present invention, in step a2, the second non-bonding area is a portion of the second circuit board portion 5 other than the second connection point 41.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A circuit board, comprising:
the circuit board comprises a first circuit board part with a plurality of first connecting points and a second circuit board part with a plurality of second connecting points, wherein the first connecting points and the second connecting points are electrically connected through conductors;
a connecting portion for connecting the first circuit board portion and the second circuit board portion is provided between the first circuit board portion and the second circuit board portion;
both ends of the connecting portion are in contact with the first circuit board portion and the second circuit board portion, respectively.
2. The circuit board of claim 1, wherein the connection portion is an ultraviolet glue.
3. The circuit board of claim 1, comprising a plurality of the connecting portions, wherein at least a portion of the connecting portions of the plurality of connecting portions cover or at least partially cover the conductor.
4. The circuit board of claim 1, wherein the first circuit board portion is a driving circuit board and the second circuit board portion is a light source circuit board.
5. The circuit board of claim 1, wherein the first circuit board portion defines a through slot, and the second circuit board portion is disposed within the through slot.
6. The circuit board of claim 1, wherein there is a gap between the first circuit board portion and the second circuit board portion.
7. The circuit board of claim 1, wherein the first circuit board portion and the second circuit board portion are disposed in parallel or have an included angle therebetween.
8. The circuit board of claim 1, wherein the first circuit board portion and the second circuit board portion are in the same plane or in different planes.
9. A method for manufacturing a circuit board, comprising:
step S1: providing a first circuit board section having first connection points and a second circuit board section having second connection points;
step S2: fixing the first circuit board part and the second circuit board part relatively, and fixing the whole formed by fixing the first circuit board part and the second circuit board part relatively on a clamp arranged at the tail end of a manipulator;
step S3: adjusting one of the first connecting point and the second connecting point to be welded to enable the plane of the first connecting point and the second connecting point to be perpendicular to the working direction of the wire bonding head and to be located below the wire bonding head;
step S4: the laser heating head instantaneously heats one of the first connecting point and the second connecting point, and the routing welding head works to weld to form a conductor connecting the first connecting point and the second connecting point;
meanwhile, the manipulator follows up to adjust the other one of the first connecting point and the second connecting point to enable the plane where the manipulator is located to be perpendicular to the working direction of the wire bonding head;
step S5: providing an ultraviolet light source, guiding ultraviolet light of the ultraviolet light source to a dispensing head through a light guide, and simultaneously ensuring that the ultraviolet light cannot irradiate the end part of a dispensing needle of the dispensing head;
step S6.1: the end part of the dispensing needle transfers ultraviolet glue to a position between the first circuit board part and the second circuit board part;
step S6.2: the end part of the dispensing needle stops transferring the ultraviolet glue, and the ultraviolet light source is turned on to cure the ultraviolet glue;
step S7: and repeating the steps S6.1 to S6.2 until the glue dispensing amount is met.
10. The method of claim 9, wherein in step S7, steps S6.1-S6.2 are repeated until the conductor is covered or at least partially covered by the uv glue.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020522899 | 2020-04-10 | ||
| CN2020205228994 | 2020-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111601457A true CN111601457A (en) | 2020-08-28 |
Family
ID=72192573
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010589017.0A Pending CN111601457A (en) | 2020-04-10 | 2020-06-24 | Circuit board and preparation method thereof |
| CN202021196174.7U Active CN212486876U (en) | 2020-04-10 | 2020-06-24 | Circuit board |
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| CN202021196174.7U Active CN212486876U (en) | 2020-04-10 | 2020-06-24 | Circuit board |
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| CN2456441Y (en) * | 2000-11-24 | 2001-10-24 | 豪佳电子股份有限公司 | Chip connector |
| CN101406112A (en) * | 2006-03-20 | 2009-04-08 | 住友电木株式会社 | Circuit board and connection substrate |
| US20090288762A1 (en) * | 2005-01-24 | 2009-11-26 | Markus Wolfel | Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method |
| CN203632965U (en) * | 2013-11-07 | 2014-06-04 | 沈李豪 | Circuit board and LED lamp thereof |
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| CN108449869A (en) * | 2017-02-16 | 2018-08-24 | 福特全球技术公司 | Bending method for printed circuit board |
| CN110164321A (en) * | 2019-05-17 | 2019-08-23 | 深德彩智能科技(东莞)有限公司 | A kind of LED display module and LED display |
| CN212486876U (en) * | 2020-04-10 | 2021-02-05 | 上海信耀电子有限公司 | Circuit board |
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2020
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- 2020-06-24 CN CN202021196174.7U patent/CN212486876U/en active Active
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| CN85107932A (en) * | 1984-10-04 | 1986-06-10 | Amp公司 | Electrical interconnecting means |
| CN2456441Y (en) * | 2000-11-24 | 2001-10-24 | 豪佳电子股份有限公司 | Chip connector |
| US20090288762A1 (en) * | 2005-01-24 | 2009-11-26 | Markus Wolfel | Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method |
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| CN108449869A (en) * | 2017-02-16 | 2018-08-24 | 福特全球技术公司 | Bending method for printed circuit board |
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| CN212486876U (en) * | 2020-04-10 | 2021-02-05 | 上海信耀电子有限公司 | Circuit board |
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| CN212486876U (en) | 2021-02-05 |
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