CN111465131A - Temperature measurement feedback electromagnetic induction heating body based on thick film technology - Google Patents
Temperature measurement feedback electromagnetic induction heating body based on thick film technology Download PDFInfo
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- CN111465131A CN111465131A CN202010429921.5A CN202010429921A CN111465131A CN 111465131 A CN111465131 A CN 111465131A CN 202010429921 A CN202010429921 A CN 202010429921A CN 111465131 A CN111465131 A CN 111465131A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 70
- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 24
- 230000005674 electromagnetic induction Effects 0.000 title claims abstract description 23
- 238000005516 engineering process Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 40
- 230000008878 coupling Effects 0.000 claims abstract description 35
- 238000010168 coupling process Methods 0.000 claims abstract description 35
- 238000005859 coupling reaction Methods 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims description 83
- 239000011241 protective layer Substances 0.000 claims description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000001035 drying Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Electromagnetism (AREA)
- Induction Heating Cooking Devices (AREA)
Abstract
The invention discloses a temperature measurement feedback electromagnetic induction heating body based on a thick film technology, which comprises an eddy current heating body base material, wherein the eddy current heating body base material generates heat through the changed current in an electromagnetic coil; the surface of the eddy current heating body substrate is provided with an insulating coupling material layer, the surface of the insulating coupling material layer is provided with a thermistor wire layer, and the thermistor wire layer and the eddy current heating body substrate are relatively insulated and isolated by the insulating coupling material layer, so that a better adhesion effect is generated; the thermistor line layer is positioned on a loop of the sensor circuit, the resistance value of the thermistor line layer changes along with the temperature, and the sensor circuit detects the temperature according to the resistance value change of the thermistor line layer; because the thermistor line layer directly detects the temperature of the eddy current heating element substrate, the temperature can be accurately detected in real time, and the detection is more direct compared with the detection of the temperature of a heating object.
Description
Technical Field
The invention relates to the technical field of electromagnetic induction heating, in particular to a temperature measurement feedback electromagnetic induction heating body based on a thick film technology.
Background
The electromagnetic induction heating device in the market at present comprises an electromagnetic coil and an eddy current heating body, wherein the eddy current heating body of a columnar coil is arranged in the middle of the coil, and the eddy current heating body of a planar coil is arranged on the upper part or the lower part of the coil. Alternating current generated by the induction heating power supply passes through the electromagnetic coil) to generate an alternating magnetic field, the eddy current heating body is arranged in the magnetic field range to cut alternating magnetic lines, and alternating current (namely eddy current) is generated in the eddy current heating body to heat the object contacted with the eddy current heating body.
In the heating process, the temperature of the heated object needs to be monitored, and the temperature is controlled by adjusting the magnetic field intensity or output time of the electromagnetic coil through a signal fed back by a thermocouple installed in the heated object, as shown in fig. 1, which is a schematic view of a conventional thermocouple temperature measurement structure, the current change of the coil 01 causes the eddy current heating body 02 to generate heat, the eddy current heating body 02 heats an object placed inside, the thermocouple 03 is inserted into the heated object to measure the temperature, and the current feedback adjustment of the coil 01 is performed through a detection signal of the thermocouple 03.
The temperature control mode belongs to indirect measurement, has the problems of long reaction time and large measurement error, and is difficult to accurately realize temperature feedback; meanwhile, the thermocouple is generally made of metal materials, is easily influenced by the magnetic field of the electromagnetic coil, and is low in reliability, and the phenomenon of uneven temperature distribution cannot be effectively identified due to the fact that the temperature measurement mode is single-point temperature measurement.
For those skilled in the art, how to measure temperature accurately in real time is a technical problem to be solved at present.
Disclosure of Invention
The invention provides a temperature measurement feedback electromagnetic induction heating body based on a thick film technology, which directly measures the temperature of a substrate of an eddy current heating body and can realize real-time accurate temperature measurement, and the specific scheme is as follows:
a temperature measurement feedback electromagnetic induction heating element based on thick film technology comprises an eddy current heating element substrate, wherein the eddy current heating element substrate generates heat through an electromagnetic coil;
the surface of the eddy current heating body substrate is provided with an insulating coupling material layer, the surface of the insulating coupling material layer is provided with a thermistor wire layer, and the thermistor wire layer is positioned on a loop of a sensor circuit; the resistance value of the thermistor line layer changes with the temperature.
Optionally, a covering protection layer is arranged on the surface of the insulating coupling material layer, and the thermistor wire layer is wrapped in the covering protection layer; the electromagnetic coil is attached to the surface of the covering protective layer;
the thermistor wire layer is connected with a pad circuit, and the pad circuit extends to the edge of the covering protective layer and is connected with a lead.
Optionally, the thickness of the insulating coupling material layer is 10 to 200 micrometers, the thickness of the thermistor line layer is 5 to 20 micrometers, the thickness of the pad circuit is 5 to 20 micrometers, and the thickness of the protective cover layer is 10 to 100 micrometers.
Optionally, the insulating coupling material layer, the thermistor wire layer, the pad circuit, and the protective cover layer are processed by screen printing.
Optionally, the thermistor wire layer is embodied as a negative temperature coefficient sensor, or a positive temperature coefficient sensor, or a platinum resistance sensor.
Optionally, the insulating coupling material layer is microcrystalline glass.
The invention provides a temperature measurement feedback electromagnetic induction heating body based on a thick film technology, which comprises an eddy current heating body base material, wherein the eddy current heating body base material generates heat through the changed current in an electromagnetic coil; the surface of the eddy current heating body substrate is provided with an insulating coupling material layer, the surface of the insulating coupling material layer is provided with a thermistor wire layer, and the thermistor wire layer and the eddy current heating body substrate are relatively insulated and isolated by the insulating coupling material layer, so that a better adhesion effect is generated; the thermistor line layer is positioned on a loop of the sensor circuit, the resistance value of the thermistor line layer changes along with the temperature, and the sensor circuit detects the temperature according to the resistance value change of the thermistor line layer; because the thermistor line layer directly detects the temperature of the eddy current heating element substrate, the temperature can be accurately detected in real time, and the detection is more direct compared with the detection of the temperature of a heating object.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional thermocouple temperature measurement structure;
fig. 2 is a structural diagram of a temperature measurement feedback electromagnetic induction heating unit based on a thick film technology according to a specific embodiment of the present invention.
The figure includes:
the eddy current heating element comprises an eddy current heating element substrate 1, an insulating coupling material layer 2, a thermistor wire layer 3, a pad circuit 4, a covering protective layer 5, an electromagnetic coil 6 and a lead 7.
Detailed Description
The core of the invention is to provide a temperature measurement feedback electromagnetic induction heating element based on the thick film technology, which directly measures the temperature of the substrate of the eddy current heating element and can realize real-time and accurate temperature measurement.
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the temperature measurement feedback electromagnetic induction heating unit based on thick film technology in detail with reference to the accompanying drawings and the specific embodiments.
As shown in fig. 2, a structure diagram of a temperature measurement feedback electromagnetic induction heating unit based on thick film technology is provided for a specific embodiment of the temperature measurement feedback electromagnetic induction heating unit provided by the present invention, wherein the structure includes an eddy current heating unit substrate 1, an insulating coupling material layer 2, a thermistor wire layer 3, an electromagnetic coil 6, and the like, the eddy current heating unit substrate 1 generates heat through the electromagnetic coil 6, the electromagnetic coil 6 is connected with an induction heating power supply, when heating, the power supply provides an alternating current for the coil, the alternating current flowing through the coil generates an alternating magnetic field passing through a workpiece, the eddy current heating unit substrate 1 cuts alternating magnetic lines of force, so that alternating current is generated inside, the eddy current causes atoms inside an object to move irregularly at high speed, the atoms collide with each other and rub to generate heat energy, thereby heating the object, that is.
The eddy current heating body substrate 1 can adopt a barrel shape or a flat plate shape, and the thermistor wire layer 3 can be made into different shapes according to different heating objects; thermistor line layer 3 can be as required in the different shapes of surperficial bending type one-tenth, realizes the design of large tracts of land face on vortex heat-generating body substrate 1, and thermistor line layer 3 covers bigger area, realizes temperature measurement on a large scale.
An insulating coupling material layer 2 is arranged on the surface of the eddy current heating body substrate 1, and a thermistor wire layer 3 is arranged on the surface of the insulating coupling material layer 2; the insulating coupling material layer 2 relatively insulates the eddy current heating element substrate 1 and the thermistor wire layer 3, and meanwhile, the insulating coupling material layer 2 has good adhesion capability, so that the eddy current heating element substrate 1 and the thermistor wire layer 3 can be combined more tightly; meanwhile, the insulating coupling material layer 2 has a good heat conduction effect, so that the heat of the eddy current heating element substrate 1 is rapidly transferred to the thermistor wire layer 3.
The thermistor line layer 3 is located on a loop of the sensor circuit, the resistance of the thermistor line layer 3 changes with the temperature, and the sensor circuit detects the resistance change of the thermistor line layer 3 and correspondingly obtains the corresponding temperature according to the resistance change.
The temperature measurement feedback electromagnetic induction heating body based on the thick film technology is designed based on a thick film circuit, the thick film circuit is one kind of integrated circuit, and a circuit unit with certain functions is manufactured on a substrate by using structures such as a resistor, an inductor, a capacitor, a semiconductor element, an interconnection wire and the like. The thick film circuit referred to herein mainly refers to the thermistor wire layer 3 of the temperature sensor circuit provided on the insulating coupling material layer 2.
The temperature measurement feedback electromagnetic induction heating body based on the thick film technology uses a magnetic conductivity substrate as the eddy current heating body substrate 1, a thermistor line layer 3 of a temperature sensor circuit is prepared on the surface of the temperature measurement feedback electromagnetic induction heating body, and the thermistor line layer 3 is tightly connected with the eddy current heating body substrate 1 through an insulating coupling material layer 2 to realize good thermal coupling. The heat that the during operation vortex heat-generating body produced thereby realizes accurate direct temperature measurement through insulating coupling material direct transfer to the temperature sensor circuit of zonulae occludens with it, and thick film circuit is nonmagnetic material simultaneously, can not influenced by solenoid's magnetic field. Due to the high integration characteristic of the thick film circuit, the thickness of the thick film functional layer of the heater is only dozens to hundreds of microns, so the whole component is light, thin and small, and is easy to be combined with other components to realize the high integration, light weight and portability of the assembly equipment and reduce the energy consumption.
On the basis of the scheme, the surface of the insulating coupling material layer 2 is provided with the covering and protecting layer 5, the covering and protecting layer 5 is coupled with the insulating coupling material layer 2, and the thermistor wire layer 3 is wrapped in the covering and protecting layer 5 to protect the thermistor wire layer 3.
The electromagnetic coil 6 is attached to the surface of the covering protective layer 5; the thermistor wire layer 3 is connected to the pad circuit 4, and the pad circuit 4 extends to the edge of the cover protective layer 5. The width of the pad circuit 4 is larger than that of the thermistor wire layer 3, one part of the pad circuit 4 is covered by the covering protective layer 5 and the other part is exposed at the edge of the covering protective layer 5, and the exposed part of the pad circuit 4 is connected with the lead 7 and is connected with the other part of the temperature sensor circuit through the lead 7.
Preferably, the thickness of the insulating coupling material layer 2 of the present invention is 10 to 200 micrometers, the thickness of the thermistor wire layer 3 is 5 to 20 micrometers, the thickness of the pad circuit 4 is 5 to 20 micrometers, and the thickness of the protective cover layer 5 is 10 to 100 micrometers, and the appropriate thickness is selected according to the voltage and power levels used.
The insulating coupling material layer 2, the thermistor wire layer 3, the pad circuit 4, and the cover coat layer are processed by screen printing. The specific process comprises the following steps: insulating coupling paste → screen printing → drying → high temperature sintering → sensor circuit paste → screen printing → drying → high temperature sintering → pad conductor paste → screen printing → drying → high temperature sintering → covering protection paste → screen printing → drying → high temperature sintering → lead welding → finished product.
Preferably, the thermistor wire layer 3 in the present invention is one of a negative temperature coefficient sensor, a positive temperature coefficient sensor, or a platinum resistance sensor. The negative temperature coefficient temperature sensor is one of thermistors, and the resistance value rapidly decreases along with the temperature rise; it is usually composed of two or three kinds of metal oxides, and is calcined in a high temperature furnace to form dense sintered ceramics, and the actual size is very flexible. The ptc sensor is a kind of thermistor, and the resistance value of the ptc sensor shows a stepwise increase with the rise of temperature, and the higher the temperature is, the larger the resistance value is. The platinum resistance sensor is formed by adding metal platinum into a resistor, the resistance value of the resistor is different due to temperature change, and the physical or chemical change caused by high and low temperature is avoided due to the stable property of the platinum.
The insulating coupling material layer 2 in the invention is preferably made of microcrystalline glass, has good insulating property and heat conduction effect, and can be well coupled with the eddy current heating element substrate 1, the thermistor wire layer 3 and the pad circuit 4.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A temperature measurement feedback electromagnetic induction heating body based on a thick film technology is characterized by comprising an eddy current heating body base material (1), wherein the eddy current heating body base material (1) generates heat through an electromagnetic coil (6);
an insulating coupling material layer (2) is arranged on the surface of the eddy current heating body substrate (1), a thermistor wire layer (3) is arranged on the surface of the insulating coupling material layer (2), and the thermistor wire layer (3) is positioned on a loop of a sensor circuit; the resistance value of the thermistor line layer (3) changes along with the temperature.
2. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 1, characterized in that the surface of the insulating coupling material layer (2) is provided with a covering protective layer (5), and the thermistor wire layer (3) is wrapped in the covering protective layer (5); the electromagnetic coil (6) is attached to the surface of the covering protective layer (5);
the thermistor wire layer (3) is connected with a pad circuit (4), and the pad circuit (4) extends to the edge of the covering protective layer (5) and is connected with a lead (7).
3. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 2, characterized in that the thickness of said insulating coupling material layer (2) is 10-200 microns, the thickness of said thermistor wire layer (3) is 5-20 microns, the thickness of said pad circuit (4) is 5-20 microns, and the thickness of said covering protective layer (5) is 10-100 microns.
4. The thermometric feedback electromagnetic induction heating body based on the thick film technology according to claim 3, characterized in that the insulating coupling material layer (2), the thermistor wire layer (3), the pad circuit (4), the covering protective layer are processed by screen printing.
5. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 3, characterized in that said thermistor wire layer (3) is specifically a negative temperature coefficient sensor, or a positive temperature coefficient sensor, or a platinum resistance sensor.
6. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 3, characterized in that said insulating coupling material layer (2) is microcrystalline glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010429921.5A CN111465131A (en) | 2020-05-20 | 2020-05-20 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010429921.5A CN111465131A (en) | 2020-05-20 | 2020-05-20 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
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| CN111465131A true CN111465131A (en) | 2020-07-28 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112261745A (en) * | 2020-11-19 | 2021-01-22 | 长春兆丰博瑞科技有限公司 | Electric heating device |
| CN112393818A (en) * | 2020-11-13 | 2021-02-23 | 湖南大学 | Power module, temperature measurement system and method of power module |
| CN112826151A (en) * | 2021-02-26 | 2021-05-25 | 深圳市吉迩科技有限公司 | Vortex heating element and aerosol generating device |
| CN113475780A (en) * | 2021-07-07 | 2021-10-08 | 株洲利德英可电子科技有限公司 | Electronic cigarette heating sheet, manufacturing method thereof and electronic cigarette |
| WO2023011554A1 (en) * | 2021-08-04 | 2023-02-09 | 深圳市合元科技有限公司 | Aerosol generating apparatus, heater for aerosol generating apparatus, and preparation method |
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| CN211982174U (en) * | 2020-05-20 | 2020-11-20 | 株洲利德英可电子科技有限公司 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
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2020
- 2020-05-20 CN CN202010429921.5A patent/CN111465131A/en active Pending
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| WO2023011554A1 (en) * | 2021-08-04 | 2023-02-09 | 深圳市合元科技有限公司 | Aerosol generating apparatus, heater for aerosol generating apparatus, and preparation method |
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