CN111463230A - Repairing device for Micro L ED array substrate and repairing method for Micro L ED array substrate - Google Patents

Repairing device for Micro L ED array substrate and repairing method for Micro L ED array substrate Download PDF

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Publication number
CN111463230A
CN111463230A CN202010283787.2A CN202010283787A CN111463230A CN 111463230 A CN111463230 A CN 111463230A CN 202010283787 A CN202010283787 A CN 202010283787A CN 111463230 A CN111463230 A CN 111463230A
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micro
array substrate
electrically connected
test head
repairing
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樊勇
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

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  • Manufacturing & Machinery (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

A repairing device of a Micro L ED array substrate and a repairing method of a Micro L ED array substrate are provided, the repairing device of the Micro L0 ED array substrate comprises a Micro L1 ED array substrate, a test circuit, an optical measurement probe and a laser transfer head, the test circuit comprises an insulating boss layer arranged on one side of the Micro L2 ED array substrate, two test head electrodes which are respectively arranged on two sides of the insulating boss layer and electrically connected with the Micro L ED array substrate, and a Micro L ED LED arranged on one side, away from the insulating boss, of the two test head electrodes, the two test head electrodes are respectively and electrically connected with a positive electrode and a negative electrode of a Micro L ED LED, and the repairing device has the advantages that whether a Micro L ED LED with defects exists on the Micro L ED array substrate is detected firstly, if the Micro L ED LED with defects exists, the laser transfer head is adopted to soften the peripheral photosensitive adhesive and then replace the peripheral adhesive with a normal Micro L LED, time cost is saved, and the Micro L ED array substrate efficiency and the Micro L ED yield are improved.

Description

Repairing device for Micro L ED array substrate and repairing method for Micro L ED array substrate
Technical Field
The present disclosure relates to the field of display, and more particularly, to a repairing apparatus for a micro L ED array substrate and a repairing method for a micro L ED array substrate.
Background
The Micro L ED display device is applied to a large-size display panel, a L ED sapphire substrate or a GaAs substrate needs to be removed, then Micro L ED is transferred to a stretch-resistant organic substrate through a mass transfer method, rapid mass selective transfer needs to be carried out, a traditional structural transfer head is complex to manufacture, the existing structural transfer head can only transfer a Micro L ED array substrate at a fixed position, the position of a Micro L ED light emitting diode is inaccurate when a defect actually exists in the Micro L ED array substrate after detection, and how to position, pull and re-supplement the defect existing in the Micro L ED array substrate after mass transfer is the key for realizing final yield improvement and cost reduction at present.
Therefore, in the prior art of the Micro L ED array substrate, a conventional Micro L ED substrate transfer method is generally adopted in the manufacturing process of the Micro L ED array substrate, but before the transfer, it cannot be guaranteed that all the Micro L ED light emitting diodes on the Micro L ED array substrate are normal and free of defects, the detection of the positions of the Micro L ED light emitting diodes with defects is not accurate enough, and therefore, the problems of positioning, removing and re-repairing the positions of the Micro L ED light emitting diodes with defects after the Micro L ED array substrate is transferred in a huge amount are urgently needed to be improved.
Disclosure of Invention
The application relates to a repairing device of a Micro L ED array substrate and a repairing method of a Micro L ED array substrate, which are used for solving the problems that in the prior art, a traditional Micro L ED substrate transferring method is generally adopted in the manufacturing process of a Micro L ED array substrate, but the normal and defect-free operation of all Micro L ED light emitting diodes on the Micro L ED array substrate cannot be guaranteed before transferring, the position of the Micro L ED light emitting diodes with defects cannot be accurately detected, and therefore the positions of the Micro L ED light emitting diodes with defects after the Micro L ED array substrate is transferred in a large amount are positioned, pulled out and re-repaired.
In order to solve the above problems, the technical solution provided by the present application is as follows:
the repairing device of the Micro L ED array substrate comprises a Micro L ED array substrate, a test circuit, an optical measurement probe and a laser transfer head;
the test circuit comprises an insulating boss layer arranged on one side of the Micro L ED array substrate, two test head electrodes which are respectively arranged on two sides of the insulating boss layer and electrically connected with the Micro L ED array substrate, and a Micro L ED light-emitting diode arranged on one side, away from the insulating boss layer, of the two test head electrodes, wherein the two test head electrodes are respectively and electrically connected with a positive electrode and a negative electrode of the Micro L ED light-emitting diode.
According to an embodiment provided by the application, the test head electrode is divided into a first test head electrode and a second test head electrode, one end of the first test head electrode is electrically connected with a positive electrode of the Micro L ED light-emitting diode, the other end of the first test head electrode is electrically connected with an output end of the first metal layer, one end of the second test head electrode is electrically connected with a negative electrode of the Micro L ED light-emitting diode, and the other end of the second test head electrode is electrically connected with a common electrode layer of the Micro L ED array substrate.
According to an embodiment provided by the application, the control end of the Micro L ED LED is electrically connected with a capacitor, the output end of the Micro L ED LED is electrically connected with the other end of the capacitor, and the common electrode of the array substrate.
According to an embodiment that the application provides, switch transistor's control end electric connection scanning line, switch transistor's input electric connection data line, switch tube's output electric connection Micro L ED emitting diode's control end.
In accordance with an embodiment of the present application, the optical measurement probe is a ccd optical measurement probe.
According to an embodiment of the present application, the repairing apparatus for the Micro L ED array substrate further includes a back plate.
According to an embodiment provided by the present application, one side of the back plate is provided with a coordinate value, and one side of the back plate is provided with a coordinate value.
According to an embodiment provided by the present application, a side of the back plate containing the coordinate values is disposed away from a side of the Micro L ED LEDs.
According to an embodiment provided by the application, the length and the width of the back plate are greater than or equal to those of the Micro L ED array substrate.
The application provides a repairing method of a Micro L ED array substrate, which adopts the repairing device of the Micro L ED array substrate of any one of the first nine items, and the method comprises the following steps:
s10, providing a Micro L ED array substrate, an optical measurement probe and a back plate;
s20, electrically connecting the electrode of the optical measurement probe with the first test head electrode and the second test head electrode of the Micro L ED array substrate;
s30, the back plate is parallel to one side of the Micro L ED array substrate close to the Micro L ED light emitting diodes;
s40, turning on the optical measurement probe, projecting all the Micro L ED light-emitting diodes onto the back plate, and if the Micro L ED light-emitting diodes are normal, lightening the corresponding positions of the back plate, and if the Micro L ED light-emitting diodes have defects, lightening the corresponding positions of the back plate;
s50, if the Micro L ED light emitting diode has defects and the coordinate value of the Micro L ED light emitting diode with defects is displayed on the back plate, softening the photosensitive adhesive around the Micro L ED light emitting diode with defects by adopting a laser transfer head, and taking out the Micro L ED light emitting diode with defects to replace the Micro L ED light emitting diode with normal.
Compared with the prior art, the repairing device of the micro L ED array substrate and the repairing method of the micro L ED array substrate have the following beneficial effects:
1. firstly, the Micro L ED array substrate provided by the application comprises a Micro L ED substrate and a test circuit, wherein the test circuit comprises an insulating boss layer arranged on one side of the Micro L ED substrate, two test head electrodes which are respectively arranged on two sides of the insulating boss layer and electrically connected with the Micro L ED substrate, and a Micro L ED light-emitting diode arranged on one side, which is opposite to the insulating boss layer, of the two test head electrodes, the two test head electrodes are respectively and electrically connected with a positive electrode and a negative electrode of the Micro L ED light-emitting diode, when in detection, the input end of the Micro L ED light-emitting diode is respectively and electrically connected with a power supply input end, the control end of the Micro 387 5ED light-emitting diode is electrically connected with the output end of a switch transistor, and the output end of the Micro L ED light-emitting diode is grounded, so that whether each Micro L ED light-emitting diode on the Micro L ED array substrate has defects or not can be detected, the manufacturing process is simple, and the cost is also saved;
2. secondly, the repairing method of the Micro L ED array substrate, the display panel and the Micro L ED array substrate provided by the application is matched with a charge coupled device for use during detection, a plurality of Micro L ED light emitting diodes on the whole Micro L ED array substrate can be detected at one time, the coordinate positions of the Micro L ED light emitting diodes with defects are found, and the positions of the Micro L ED light emitting diodes with defects are found more efficiently, accurately and conveniently;
3. further, after the accurate position of the Micro L ED LED with the defect is found, the photosensitive adhesive around the Micro L ED LED with the defect is softened by adopting a laser transfer head, and then the Micro L ED LED with the defect is replaced by the normal Micro L ED LED, namely the Micro L ED LED with the defect in the Micro L ED array substrate is simply and efficiently repaired, so that the repairing efficiency and the yield of the Micro L ED array substrate are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of a first structure of a repairing apparatus for a Micro L ED array substrate according to an embodiment of the present disclosure.
FIG. 2 is a diagram of a test circuit on a Micro L ED array substrate according to an embodiment of the present disclosure.
Fig. 3 is a schematic diagram of a second structure of a repairing apparatus for a Micro L ED array substrate according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of the back plate after detection provided in the embodiment of the present application.
FIG. 5 is a schematic diagram of a third structure of a repairing apparatus for a Micro L ED array substrate according to an embodiment of the present disclosure.
Fig. 6 is a schematic structural diagram of the repaired backplane according to the embodiment of the present application.
Fig. 7 is a schematic flowchart of a repairing method for a Micro L ED array substrate according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The present application provides a repairing apparatus for a micro L ED array substrate and a repairing method for a micro L ED array substrate, which refer to fig. 1-7.
The conventional Micro L ED array substrate manufacturing process generally adopts a conventional Micro L ED substrate transferring method, but before transferring, it cannot be guaranteed that all Micro L ED LEDs on the Micro L ED array substrate are normal and have no defects, and the conventional structural transferring head can only transfer a Micro L ED array substrate with a fixed position, and the detection on the position of the Micro L ED array substrate with defects is inaccurate, so that the problem of how to position, pull out and re-supplement the position of the Micro L ED LEDs with defects after the Micro L ED array substrate is transferred in a huge amount is urgently needed to be improved.
Referring to fig. 1, fig. 3 and fig. 5, the repairing device for the Micro L ED array substrate provided by the present application includes a Micro L ED array substrate 1, a test circuit 2, an optical measurement probe 3 and a laser transfer head 4;
the test circuit 2 comprises an insulating boss layer 223 arranged on one side of the Micro L ED array substrate, two test head electrodes which are respectively arranged on two sides of the insulating boss layer 223 and electrically connected with the Micro L ED array substrate, and a Micro L ED light emitting diode 21 arranged on one side of the two test head electrodes, which is far away from the insulating boss 223, wherein the two test head electrodes are respectively and electrically connected with a positive electrode 211 and a negative electrode 212 of the Micro L ED light emitting diode 21 so as to be connected with the optical measurement probe 3 for detection.
In an embodiment of the present application, the test head electrode is divided into a first test head electrode 221 and a second test head electrode 222, one end of the first test head electrode 221 is electrically connected to the positive electrode of the Micro L ED led 21, the other end of the first test head electrode 221 is electrically connected to the output end of the first metal layer 14, one end of the second test head electrode 222 is electrically connected to the negative electrode 212 of the Micro L ED led 21, and the other end of the second test head electrode 222 is electrically connected to the common electrode layer 183 of the Micro L ED array substrate.
Referring to fig. 2, in an embodiment of the present application, a control terminal of the Micro L ED led 21 is electrically connected to a capacitor C, an output terminal of the Micro L ED led 21 is electrically connected to the other terminal of the capacitor C, and the common electrode 183 of the Micro L ED array substrate, further, the capacitor C is a storage capacitor, when the switching transistor T1 is turned on by an ac voltage, the capacitor C starts to charge, the Micro L ED led 21 is also turned on, and when the switching transistor T1 is turned off or is turned on by a dc voltage, the capacitor C starts to discharge and supplies the power to the Micro L ED led 21, so that the Micro L ED led continues to be turned on.
In an embodiment of the present application, the control terminal of the switching transistor T1 is electrically connected to the scan line, the input terminal of the switching transistor T1 is electrically connected to the data line, and the output terminal of the switching transistor T1 is electrically connected to the control terminal of the Micro L ED light emitting diode 21.
In one embodiment of the present application, the optical measurement probe 3 of the repairing apparatus for the Micro L ED array substrate is used to capture all the Micro L ED LEDs 21 on the entire Micro L ED array substrate and observe whether there are any defective Micro L ED LEDs 21.
In an embodiment of the present application, the optical measurement probe 3 is a charge-coupled device (CCD) optical measurement probe, the CCD is a silicon chip for detecting light, and the change of the semiconductor potential well is generated and controlled by the clock pulse voltage to realize a solid-state electronic device for storing and transferring charge information, here, the Micro L ED leds 21 that can normally emit light on the whole Micro L ED array substrate can be detected more accurately by using the CCD optical measurement probe, so that the defective Micro L ED leds 21 can be found.
In an embodiment of the present application, the repairing apparatus for the Micro L ED array substrate further includes a back plate 5, further, one side of the back plate 5 is provided with coordinate values, and one side of the back plate 5 containing the coordinate values is disposed away from the side of the Micro L ED leds 21. the back plate 5 is used in cooperation with the ccd optical measurement probe 3, so that an inspector can directly read the coordinate values of the Micro L ED leds 21 with defects from the back plate 5 for repairing.
In an embodiment of the present application, the length and width of the back plate 5 are greater than or equal to the length and width of the Micro L ED array substrate, and only when the length and width of the back plate 5 are greater than or equal to the length and width of the Micro L ED array substrate, all the coordinate values of the Micro L ED leds 21 on the Micro L ED array substrate can be completely covered on the back plate 5, so that the laser transfer head 4 can be positioned when removing the defective Micro L ED leds 21.
Further, the back plate 5 is made of a glass material with high light transmittance, that is, a transparent material, so as to ensure that when the voltage is low and the light emitted by the Micro L ED leds of the Micro L ED array substrate is weak, the Micro L ED leds 21 lit on the whole Micro L ED array substrate can still be clearly seen, referring to fig. 4, the coordinates 52 of the Micro L ED leds 21 with defects and the coordinates 51 of the normal Micro L ED leds 21 with defects on the back plate 5 are detected.
Further, referring to fig. 5, the biggest difference between the laser transfer head 4 and a general structural transfer head is that the laser transfer head 4 includes laser, before the laser transfer head 4 is removed, the laser is used for irradiating, so as to soften the photosensitive adhesive 23 around the Micro L ED light emitting diode 21 with defects, and then the Micro L ED light emitting diode 21 with defects is removed, so that the Micro L ED light emitting diode 21 with defects can be more conveniently taken out, the cost is saved, and the yield of the Micro L ED array substrate is also improved.
Further, the Micro L ED array substrate further comprises a substrate 11, a first insulating layer 12, a shading layer 13, a first metal layer 14, a second insulating layer 15, a third via hole 151, a gate insulating layer 16, a second metal layer 17, a third insulating layer 18, a first via hole 181, a second via hole 182 and a common electrode layer 183, wherein the first via hole, the second via hole 182 and the common electrode layer 183 are arranged on the third insulating layer 18, and the substrate 11 can be a glass substrate or a resin substrate.
Referring to fig. 7, the present application provides a repairing method for a Micro L ED array substrate, which uses the repairing apparatus for a Micro L ED array substrate, the method includes:
s10, providing a Micro L ED array substrate 1 provided with an optical test circuit, an optical measurement probe 3 and a laser transfer head 4, and a repairing device for forming a complete Micro L ED array substrate, wherein the repairing device can detect the coordinate position of a Micro L ED light-emitting diode 21 with a defect on the Micro L ED array substrate, and can soften the photosensitive adhesive 23 around the Micro L ED light-emitting diode 21 with the defect on the Micro L ED array substrate firstly and then take out the Micro L ED light-emitting diode 21 with the defect to replace the Micro L ED light-emitting diode 21 with the normal one;
s20, electrically connecting the electrode of the optical measurement probe 3 with the first test head electrode 221 and the second test head electrode 222 of the Micro L ED array substrate, establishing a circuit relation between the optical measurement probe 3 and the Micro L ED array substrate, and conveniently searching whether the Micro L ED light emitting diode 21 with defects exists or not when all the Micro L ED light emitting diodes 21 on the Micro L ED array substrate are conducted;
s30, the back plate 5 is parallel to one side of the Micro L ED array substrate close to the Micro L ED light emitting diodes 21, so that an inspector can visually observe whether the Micro L ED light emitting diodes 21 with defects and the coordinate values of the Micro L ED light emitting diodes 21 with defects exist on the back plate 5;
s40, turning on the optical measurement probe 3, projecting all the Micro L ED light-emitting diodes 21 onto the back plate 5, if the Micro L ED light-emitting diodes 21 are normal, lighting the corresponding positions of the back plate 5, if the Micro L ED light-emitting diodes 21 have defects, lighting the corresponding positions of the back plate 5, turning on the optical measurement probe 3, communicating the optical measurement probe 3 with all the Micro L ED light-emitting diodes 21, and determining whether the Micro L ED light-emitting diodes 21 have defects according to whether the Micro L ED light-emitting diodes 21 can be lighted;
s50, if the Micro L ED light emitting diode 21 has defects and the coordinate value of the Micro L ED light emitting diode 21 with defects is displayed on the back plate, the laser transfer head 4 is adopted to firstly soften the photosensitive adhesive 23 around the Micro L ED light emitting diode 21 with defects, then the Micro L ED light emitting diode 21 with defects is taken out and replaced by the normal Micro L ED light emitting diode 21, and the laser is adopted to soften the photosensitive adhesive 23 around the Micro L ED light emitting diode 21 with defects, so that the difficulty of taking out the Micro L ED light emitting diode 21 with defects is greatly reduced, the operation time and the cost are also saved, and the repair yield of the Micro L ED array substrate is improved.
Further, the switch transistor T1 may be a thin film transistor or a field effect transistor, the control terminal of the switch transistor T1 is a gate, in one embodiment, the input terminal of the switch transistor T1 is a source, and the output terminal of the switch transistor T1 is a drain; in another embodiment, the input terminal of the switching transistor T1 is a drain, and the output terminal of the switching transistor T1 is a source. When the control terminal is given a high level, the source and the drain are connected through the semiconductor layer, and the switching transistor T1 is in an on state.
Therefore, the repairing device of the Micro L ED array substrate and the repairing method of the Micro L ED array substrate have the advantages that firstly, the Micro 460 ED array substrate provided by the invention comprises a Micro L ED substrate and a test circuit, the test circuit comprises insulating boss layers arranged on one side of the Micro L ED substrate, two test head electrodes respectively arranged on two sides of the insulating boss layers and electrically connected with the Micro L ED substrate, the test head electrodes are arranged on one side, away from the insulating boss layers, of the Micro L LED, the two test head electrodes are respectively and electrically connected with a positive electrode and a negative electrode of the Micro L ED LED, when detecting, input ends of the Micro L ED LED are respectively and electrically connected with a power supply input end, control ends of the Micro L LED are respectively and electrically connected with an output end of a switch transistor, the Micro 639 LED is respectively connected with an input end of the Micro 637 ED LED, when detecting, input ends of the Micro L LED are respectively and input ends of the Micro 637 ED substrate are respectively and when detecting, the Micro 369 defect, the Micro 863 ED substrate is repaired, the Micro 8672, the defect 367 ED substrate is further, the defect detection process of the Micro 367 ED substrate is carried out, the detection, the defect detection is carried out, the Micro 367 is carried out, the detection, the defect detection is carried out, the detection is carried out, the detection that the Micro 367 is carried out, the Micro 367 is carried out, the Micro 367 is carried out, the Micro 368672, the Micro 367 is carried out, the defect detection that the Micro 367 is carried out, the Micro-based on the Micro 367 LED repairing process, the Micro-diode repairing process of the Micro-based on the Micro-diode is more conveniently, the Micro-based on the Micro-diode array substrate, the Micro-diode repairing process, the Micro-diode.
The micro L ED array substrate detection apparatus and the micro L ED array substrate detection method provided in the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments is only used to help understand the technical solutions and the core ideas of the present application, and it should be understood by those skilled in the art that the present application can still make modifications to the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features, and these modifications or substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A repairing device for a Micro L ED array substrate is characterized by comprising a Micro L ED array substrate, a test circuit, an optical measurement probe and a laser transfer head;
the test circuit comprises an insulating boss layer arranged on one side of the Micro L ED array substrate, two test head electrodes which are respectively arranged on two sides of the insulating boss layer and electrically connected with the Micro L ED array substrate, and a Micro L ED light-emitting diode arranged on one side, away from the insulating boss layer, of the two test head electrodes, wherein the two test head electrodes are respectively and electrically connected with a positive electrode and a negative electrode of the Micro L ED light-emitting diode.
2. The repairing device for the Micro L ED array substrate of claim 1, wherein the test head electrodes are divided into a first test head electrode and a second test head electrode, one end of the first test head electrode is electrically connected to the positive electrode of the Micro L ED LED, the other end of the first test head electrode is electrically connected to the output end of the first metal layer, one end of the second test head electrode is electrically connected to the negative electrode of the Micro L ED LED, and the other end of the second test head electrode is electrically connected to the common electrode layer of the Micro L ED array substrate.
3. The repairing device for the Micro L ED array substrate as set forth in claim 1, wherein the control terminal of the Micro L ED LED is electrically connected to a capacitor, the output terminal of the Micro L ED LED is electrically connected to the other terminal of the capacitor, the common electrode of the array substrate.
4. The repairing device for the Micro L ED array substrate as set forth in claim 1, wherein the control terminal of the switch transistor is electrically connected to the scan line, the input terminal of the switch transistor is electrically connected to the data line, and the output terminal of the switch transistor is electrically connected to the control terminal of the Micro L ED LED.
5. The repair apparatus for a Micro L ED array substrate as set forth in claim 1, wherein the optical measurement probe is a CCD optical measurement probe.
6. The repairing method of the Micro L ED array substrate as set forth in claim 1, wherein the repairing apparatus of the Micro L ED array substrate further comprises a back plate.
7. The repairing method of the Micro L ED array substrate as set forth in claim 6, wherein one side of the back plate is provided with coordinate values.
8. The method of repairing a Micro L ED array substrate of claim 6, wherein a side of the backplane containing coordinate values is disposed away from a side of the Micro L ED LEDs.
9. The repairing method for the Micro L ED array substrate of claim 6, wherein the length and width of the back plate are equal to or larger than those of the Micro L ED array substrate.
10. A method for repairing a Micro L ED array substrate, the method comprising the steps of using the repairing apparatus for a Micro L ED array substrate as claimed in any one of claims 1 to 9:
s10, providing a Micro L ED array substrate, an optical measurement probe and a back plate;
s20, electrically connecting the electrode of the optical measurement probe with the first test head electrode and the second test head electrode of the Micro L ED array substrate;
s30, aligning one side of the back plate without coordinate values to one side of the Micro L ED array substrate close to the Micro L ED light emitting diodes;
s40, turning on the optical measurement probe, projecting all the Micro L ED light-emitting diodes onto the back plate, and if the Micro L ED light-emitting diodes are normal, lightening the corresponding coordinate positions of the back plate, and if the Micro L ED light-emitting diodes have defects, lightening the corresponding coordinate positions of the back plate;
s50, if the Micro L ED light emitting diode has defects and the coordinate value of the Micro L ED light emitting diode with defects is displayed on the back plate, softening the photosensitive adhesive around the Micro L ED light emitting diode with defects by adopting a laser transfer head, and taking out the Micro L ED light emitting diode with defects to replace the Micro L ED light emitting diode with normal.
CN202010283787.2A 2020-04-13 2020-04-13 Repairing device for Micro L ED array substrate and repairing method for Micro L ED array substrate Pending CN111463230A (en)

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Application publication date: 20200728