CN111391243A - Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof - Google Patents

Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof Download PDF

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Publication number
CN111391243A
CN111391243A CN202010214214.4A CN202010214214A CN111391243A CN 111391243 A CN111391243 A CN 111391243A CN 202010214214 A CN202010214214 A CN 202010214214A CN 111391243 A CN111391243 A CN 111391243A
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China
Prior art keywords
cavity
double
sided
mold
plastic package
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CN202010214214.4A
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Chinese (zh)
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CN111391243B (en
Inventor
罗伯特·加西亚
蔡世涛
黄林芸
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Universal Global Technology Shanghai Co Ltd
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Universal Global Technology Shanghai Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a plastic package mold based on a one-time double-sided plastic package technology and a plastic package method thereof, wherein the double-sided plastic package mold comprises an upper mold and a lower mold which are matched relatively, and the upper mold and the lower mold are matched to form a feeding groove, a first glue dividing channel, a second glue dividing channel, a cavity and a flow channel; the feeding grooves are uniformly arranged along the longitudinal axis of the die, and the adjacent feeding grooves are communicated through the first glue dividing channel; a group of cavities are respectively arranged on the left side and the right side of the feeding groove, the feeding groove is communicated with the most adjacent cavity on the left side and the right side of the feeding groove through a second glue dividing channel, and the adjacent cavities are communicated through a flow channel; the first glue dividing channel and the second glue dividing channel are vertical in the same plane; the double-sided PCB board is composed of a plurality of PCB units which are arranged in an array mode, an upper die and a lower die of the die are pressed on the edge of each PCB unit, and the die cavity is used for accommodating the plastic packaging area of each PCB unit. The double-sided PCB packaging method can complete one-time double-sided plastic packaging of the double-sided PCB, reduces plastic packaging steps, shortens plastic packaging time, reduces deformation of the double-sided PCB after plastic packaging, and simultaneously avoids influence of a secondary plastic packaging process on the double-sided PCB.

Description

Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof
Technical Field
The invention relates to the field of electronic module plastic package, in particular to a plastic package mold based on a one-time double-sided plastic package technology and a plastic package method thereof.
Background
On the development line of SIP products, the double-sided SIP module has wide market prospect due to the characteristics of high integration and microminiaturization. The existing double-sided SIP module needs to perform two plastic package actions, namely, the loading and the plastic package of one side are finished firstly, and then the loading and the plastic package of the other side are finished. Such lengthy process procedures reduce production efficiency, increase the risk of handling problems on the assembly line by the operator, and also increase labor costs. Meanwhile, the SIP module is subjected to high temperature repeatedly in production through two plastic packaging actions, so that the performance of electronic components on the SIP module is influenced. Therefore, it is an urgent need to solve the technical problem of designing a double-sided plastic package mold based on a one-time double-sided plastic package technology and a plastic package method thereof.
Disclosure of Invention
The invention aims to solve the technical problems in the prior art and provides a plastic package mold based on a one-time double-sided plastic package technology and a plastic package method thereof.
The technical scheme provided by the invention is as follows:
the utility model provides a plastic envelope mould based on once two-sided plastic envelope technique for carry out once two-sided plastic envelope to two-sided PCB board, its characterized in that: the feeding device comprises an upper die and a lower die which are matched relatively, wherein the upper die and the lower die are matched to form a feeding groove, a first glue dividing channel, a second glue dividing channel, a cavity and a flow channel;
the feeding grooves are uniformly arranged along the longitudinal axis of the die, and the adjacent feeding grooves are communicated through the first glue dividing channel;
a group of cavities are respectively arranged on the left side and the right side of the feeding groove, the feeding groove is communicated with the most adjacent cavity on the left side and the right side of the feeding groove through a second glue dividing channel, and the adjacent cavities are communicated through a flow channel formed at the joint of the adjacent cavities; the first glue dividing channel and the second glue dividing channel are vertical in the same plane;
the double-sided PCB board is composed of a plurality of PCB units which are arranged in an array mode, an upper die and a lower die of the die are pressed on the edge of each PCB unit, and the die cavity is used for accommodating the plastic packaging area of each PCB unit.
In this technical scheme, set up a set of die cavity respectively in the left and right both sides of feed tank, can realize two at least two-sided PCB boards plastic envelope simultaneously, promoted plastic envelope efficiency.
Preferably, each cavity is divided into an upper cavity and a lower cavity by the double-sided PCB, and the runner is divided into a first runner and a second runner; the upper cavities adjacent to each other in the same group are communicated through the first flow channel, and the lower cavities adjacent to each other in the same group are communicated through the second flow channel.
In the technical scheme, the adjacent upper cavity is communicated by arranging the first flow channel, and the adjacent lower cavity is communicated by arranging the second flow channel, so that the mold flow can smoothly circulate in the upper cavity and the lower cavity respectively.
Preferably, one end of the second glue dividing channel is provided with a glue injection port, and the second glue dividing channel is communicated with the upper cavity and the lower cavity of the cavity, which are closest to the feeding groove, through the glue injection port.
In the technical scheme, through the design of the glue injection port, the plastic package glue in the feeding groove is directly led into the upper cavity and the lower cavity of the cavity nearest to the feeding groove, so that the mold flow is divided, and the synchronization of the mold flow in the upper cavity and the lower cavity is ensured.
Preferably, in the same set of cavities,
a blocking block is arranged on a first runner between the adjacent upper cavities so as to adjust the flow rate of the molding compound passing through the first runner;
and/or;
and a blocking block is arranged on a second runner between the adjacent lower cavities so as to adjust the flow rate of the molding compound passing through the second runner.
In the technical scheme, the blocking block is arranged on the first runner between the adjacent upper cavities and/or the second runner between the adjacent lower cavities, so that the mold flow speed of the molding compound between the two adjacent upper cavities and/or the lower cavities is adjusted.
In practical implementation, the blocking block can be arranged on only the first flow channel between the adjacent upper cavities or only the second flow channel between the adjacent lower cavities, or simultaneously the blocking blocks are arranged on the first flow channel between the adjacent upper cavities and the second flow channel between the adjacent lower cavities, so as to adjust the mold flow velocities of the upper mold and the lower mold, so as to realize mold flow balance of the upper mold and the lower mold, balance the pressure of the upper surface and the lower surface of the PCB, and avoid deformation of the double-sided PCB.
Preferably, a gap is reserved at the pressing part of the upper die and the lower die to form an exhaust channel;
the upper die is provided with a first exhaust groove, one end of the first exhaust groove is communicated with the upper die cavity or a first flow channel between the upper die cavities, and the other end of the first exhaust groove is communicated to the exhaust channel;
and a second exhaust groove is formed in the lower die, one end of the second exhaust groove is communicated with the lower cavity or a second flow passage between the lower cavities, and the other end of the second exhaust groove is communicated to the exhaust passage.
The first exhaust groove and the second exhaust groove are matched in position and spliced to form the exhaust groove.
In this technical scheme, through seting up first exhaust groove on last mould to and set up the second exhaust groove on the lower mould, make the gaseous overflow of last die cavity to first exhaust inslot in the plastic envelope, gaseous overflow to the second exhaust groove in the die cavity down, then spill over outside the mould through exhaust passage, thereby guarantee that the gaseous ability in upper and lower die cavity in time discharges, reduce the deformation of two-sided PCB board, improve the quality of the back product of plastic envelope.
Preferably, a mold flow hole is provided between the adjacent PCB board units, and the mold flow hole communicates the first flow channel and the second flow channel partitioned by the PCB board units.
In the technical scheme, the mold flow holes are formed between the adjacent PCB units, so that the first flow channel and the second flow channel are communicated, the molding compound can pass through the mold flow holes to freely flow in the upper cavity and the lower cavity, the flow rate of the mold flow of the upper plate and the lower plate of the PCB is further adjusted, and the quality of a product after the molding compound is improved.
Preferably, the upper die or the lower die is provided with a supporting part which is attached to the non-plastic-sealed area of the PCB, the supporting part is provided with a plurality of vacuum holes, and the vacuum holes penetrate through the die wall of the upper die or the lower die where the supporting part is located.
In the technical scheme, the supporting part is arranged on the upper die or the lower die to be attached to the non-plastic packaging area of the PCB, the supporting part is provided with a plurality of vacuum holes, and the vacuum holes are vacuumized before plastic packaging so that the non-plastic packaging area of the PCB is further attached to the supporting part.
The invention also provides a one-time double-sided plastic package method for carrying out one-time double-sided plastic package on the double-sided PCB, which comprises the following steps:
s10, providing a double-sided plastic package mold, wherein an upper mold and a lower mold of the mold are matched to form a feeding groove, a first glue dividing channel, a second glue dividing channel, a cavity and a flow channel, the feeding grooves are uniformly arranged along the longitudinal axis of the mold, and the adjacent feeding grooves are communicated through the first glue dividing channel;
a group of cavities are respectively arranged on the left side and the right side of the feeding groove, the feeding groove is communicated with the most adjacent cavity on the left side and the right side of the feeding groove through a second glue dividing channel, and the adjacent cavities are communicated through a flow channel; the first glue dividing channel and the second glue dividing channel are vertical in the same plane;
s20, preparing a plurality of double-sided PCB boards, wherein each double-sided PCB board is composed of PCB units arranged in an array;
s30, placing the double-sided PCB boards in the mould, enabling an upper mould and a lower mould of the mould to be pressed on the edge of each PCB unit, and accommodating the plastic package area of each PCB unit by the mould cavity;
the double-sided PCB divides each cavity into an upper cavity and a lower cavity, and divides the runner into a first runner and a second runner; the upper cavities adjacent to the same group are communicated through the first flow channel, and the lower cavities adjacent to the same group are communicated through the second flow channel;
one end of the second glue dividing channel is provided with a glue injection port, and the second glue dividing channel is communicated with an upper cavity and a lower cavity of the cavity which are closest to the feeding groove through the glue injection port;
s40, injecting plastic package glue into a first glue dividing channel of the mold, wherein the plastic package glue sequentially flows through a plurality of feeding grooves through the first glue dividing channel, the feeding grooves respectively supply the plastic package glue to an upper cavity and a lower cavity of the nearest cavity on the left side and the right side of the feeding grooves through a glue injection port at one end of a second glue dividing channel, and then the plastic package glue sequentially flows to other upper cavities and other lower cavities in the same group through a first runner and a second runner so that the plastic package glue can complete double-sided plastic package of all double-sided PCB boards;
and S50, removing the upper die and the lower die.
Further, in step S20:
a blocking block is arranged on a first flow channel between the adjacent upper cavities of the same group so as to adjust the flow rate of the plastic package colloid;
and/or;
and a blocking block is arranged on a communicating flow channel between the adjacent lower cavities in the same group so as to adjust the flow rate of the plastic package colloid.
Further, in step S20, a mold flow hole is provided on the double-sided PCB, and the molding compound flows between the upper cavity and the lower cavity through the mold flow hole;
and/or;
in step S10, a gap is left at the press-fit position of the upper die and the lower die to form an exhaust passage;
in step S40, the gas in the cavity may be exhausted out of the mold through a first exhaust groove formed in the upper mold, a second exhaust groove formed in the lower mold, and an exhaust passage.
Compared with the prior art, the double-sided plastic package mold and the plastic package method thereof provided by the invention have the following beneficial effects:
1. according to the invention, by designing the glue injection port, the plastic package colloid in the feeding cavity can simultaneously flow into the upper cavity and the lower cavity through the glue injection port in the glue dividing channel, and the upper cavity and the lower cavity are communicated with each other, so that the mold flow and the pressure at two sides of the PCB are balanced, gas can be discharged in time, the local pressure is prevented from being overlarge, and the deformation of the double-sided PCB after plastic package is reduced.
2. According to the invention, through the design of the glue injection port and the runner in the plastic package mold, the double-sided PCB can be subjected to primary double-sided plastic package, the steps of plastic package are reduced, the time of plastic package is shortened, and the influence on the double-sided PCB subjected to primary plastic package in the process of secondary plastic package is avoided.
Drawings
The above features, technical features, advantages and implementation manners of the double-sided plastic package mold and the plastic package method thereof will be further described in the following detailed description of preferred embodiments in a clearly understandable manner with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of a plastic package mold of the present invention;
FIG. 2.1 is a schematic diagram of an upper mold structure of the plastic package mold of the invention;
FIG. 2.2 is a schematic view of a lower mold structure of the plastic package mold of the present invention;
FIG. 3 is a schematic structural diagram of one embodiment of a plastic mold of the present invention;
fig. 4 is a schematic structural diagram of another embodiment of the plastic mold of the invention;
FIG. 5 is a side partial cross-sectional schematic view of FIG. 1;
fig. 6 is a schematic cross-sectional view of another portion of fig. 1.
The reference numbers illustrate:
a mould 10, a feed groove 20, a cavity 30, a runner 40, an exhaust groove 50,
The device comprises an upper die 101, a first feeding groove 201, an upper cavity 301, a first flow channel 401 and a first exhaust groove 501;
the lower mold 102, the first supply groove 202, the lower mold cavity 302, the second flow channel 402, the second exhaust groove 502,
Vacuum holes 103; a thimble 104; an exhaust passage 105; a glue injection port 203; a first glue dividing passage 2041; a second glue dividing passage 2042;
the double-sided PCB 60, the PCB unit 601 and the mold flow hole 602;
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
According to an embodiment of the present invention, as shown in fig. 1-3, a double-sided plastic package mold 10 based on a one-time double-sided plastic package technology is used for performing one-time double-sided plastic package on a double-sided PCB 60, the double-sided PCB 60 is composed of a plurality of PCB units 601 arranged in a matrix, the mold 10 is pressed on the edge of each PCB unit 601, and a cavity 30 is formed inside each PCB unit 601.
The mold 10 includes an upper mold 101 and a lower mold 102, which are matched, and the upper mold 101 and the lower mold 102 cooperate to form the feeding groove 20, the first glue dividing passage 2041, the second glue dividing passage 2042, the cavity 30 and the runner 40. A plurality of feed slots 20 are uniformly arranged along the longitudinal axis of the die 10, and adjacent feed slots 20 are communicated through a first glue dividing passage 2041. A set of cavities 30 is respectively disposed on the left and right sides of the feeding groove 20, and the feeding groove 20 is communicated with the most adjacent cavity 30 on the left and right sides of the feeding groove 20 through a second glue dividing passage 2042. The first glue dividing channel 2041 and the second glue dividing channel 2042 are perpendicular to each other in the same plane.
A cavity group is composed of a plurality of cavities 30, the cavities 30 are supplied by the same supply groove 20, and a runner 40 is arranged on the side wall of the joint of the adjacent cavities 30 to enable the adjacent cavities 30 to be communicated, so that plastic package glue can flow through the cavities 30 of the same cavity group.
The double-sided PCB 60 is placed on the lower mold 102, after the upper mold 101 is closed, the plastic sealing glue is injected into the first glue dividing channel 2041 of the mold 10, the plastic sealing glue sequentially flows through the plurality of material supply grooves 20 through the first glue dividing channel 2041, and when the plastic sealing glue is filled in each material supply groove 20, the material supply grooves 20 start to respectively supply the plastic sealing glue to the most adjacent cavities 30 on the left side and the right side of the material supply groove 20 through the second glue dividing channel 2042. The molding compound then flows from the first cavity 30 nearest the feed trough 20 to the other cavities 30 of the same set.
The double-sided PCB 60 divides the cavity 30 and the runner 40 into an upper part and a lower part respectively: an upper cavity 301 located above the double-sided PCB board 60, a first flow channel 401, and a lower cavity 302 located below the double-sided PCB board 60, a second flow channel 402. The adjacent upper cavities 301 in the same group are communicated with each other through a first flow passage 401, and the adjacent lower cavities 302 in the same group are communicated with each other through a second flow passage 402. One end of the second glue dividing passage 2042 is provided with a glue injection port 203, and the second glue dividing passage 2042 is communicated with the upper cavity 301 and the lower cavity 302 of the cavity 30 nearest to the feed groove 20 through the glue injection port 203.
As shown in fig. 1 and 2, the supply groove 20 is composed of a first supply groove 201 at the upper die 101 and a second supply groove 202 at the lower die 102. The first and second feed tanks 201, 202 may be symmetrical or asymmetrical in shape.
When the double-sided PCB 60 is placed on the lower mold 102 and the upper mold 101 is closed, the supply groove 20 starts to supply molding compound to the upper mold cavity 301 and the lower mold cavity 302 of the nearest mold cavity 30 located at the left side and the right side of the supply groove 20 through the second glue dividing channel 2042, respectively. The adjacent upper mold cavities 301 in the same group of mold cavities 30 are communicated through a first flow passage 401, and the adjacent lower mold cavities 302 in the same group of mold cavities 30 are communicated through a second flow passage 402. During plastic packaging, the mold flow circulates among the upper cavities 301 in the same group through the first flow channel 401, and the mold flow circulates among the lower cavities 302 in the same group through the second flow channel 402, so that the cavities 30 in the same group are filled with the molding compound, and primary double-sided plastic packaging of the double-sided PCB 60 is realized.
In practical application, by arranging one cavity group on each side of one feeding groove 20, more cavities 30 are arranged in the same cavity group to be connected, so as to accommodate more double-sided PCB units 601, and the production efficiency is increased. However, the number of the cavities 30 in the same cavity group is set, and the yield of the product after plastic encapsulation is ensured by considering the feeding capacity of the feeding groove 20 and the flow rate of the plastic encapsulation in the cavity group.
In another embodiment of the present invention, a blocking block is disposed on the first runner 401 communicating between the adjacent upper cavities 301 in the same set of cavities 30 to adjust the flow rate of the molding compound. Similarly, a stopper is disposed on the second runner 402 communicating between the adjacent lower cavities 302 to adjust the flow rate of the molding compound. In specific implementation, the blocking blocks may be disposed on both the first flow channel 401 and the second flow channel 402, or only the first flow channel 401 or the second flow channel 402 is disposed with the blocking blocks for adjusting flow rates (not shown in the figure) of the flows in the upper cavity 301 and the lower cavity 302, and the specific arrangement of the blocking blocks should be set according to actual requirements. For example, the areas of the regions to be plastic-encapsulated on the upper and lower board surfaces of the double-sided PCB 60 are the same, and no extra large electronic component blocks the mold flow in the regions to be plastic-encapsulated on the upper and lower board surfaces, then the blocking blocks are symmetrically arranged on the first flow channel 401 and the second flow channel 402; when the areas of the upper and lower surfaces of the double-sided PCB 60 to be plastic-sealed are different, that is, one of the upper and lower surfaces of the double-sided PCB 60 has a non-plastic-sealed area, the first flow channel 401 and the second flow channel 402 are asymmetrically provided with the blocking blocks. Since one side of the double-sided PCB 60 has a non-plastic-sealed region and the resistance of the mold flow of the side is relatively large, the number of the blocking blocks should be reduced or no blocking block should be provided on the corresponding runner 40. The blocking block can be fixed or movable, so that the die flow of the upper die cavity 301 and the lower die cavity 302 and the pressure difference between the upper die cavity and the lower die cavity can be adjusted at any time according to specific working conditions, and the deformation of the double-sided PCB 60 caused by the pressure difference during plastic packaging is reduced.
In another embodiment of the present invention, as shown in fig. 1 to 6, placing holes for placing the thimble 104 are respectively opened on the first runner 401 of the upper mold 101 and the second runner 402 of the lower mold 102, so as to facilitate mold opening after the plastic packaging process.
In another embodiment of the present invention, as shown in fig. 5 and 6, a gap, i.e., an air vent passage 105, is left at the nip of the upper mold 101 and the lower mold 102. A first exhaust groove 501 is formed in the upper die 101, one end of the first exhaust groove 501 is communicated with the upper cavity 301 or a first flow channel 401 between the upper cavity 301, and the other end of the first exhaust groove 501 is communicated with the exhaust channel 105; the lower die 102 is provided with a second exhaust groove 502, one end of the second exhaust groove 502 is communicated with the lower die cavity 302 or a second flow passage 402 between the lower die cavity 302, the other end of the second exhaust groove 502 is communicated to the exhaust passage 105, after the upper die 101 and the lower die 102 are assembled, the first exhaust groove 501 and the second exhaust groove 502 form an exhaust groove 50, the first exhaust groove 501 is arranged on the upper die 101 and used for exhausting gas in the upper die cavity 301 during plastic packaging, and similarly, the second exhaust groove 502 arranged on the lower die 102 is convenient for exhausting gas in the lower die cavity 302, so that the local air pressure in the die cavity 30 is prevented from being too large, and the deformation of the double-sided PCB 60 is reduced.
Preferably, the first venting grooves 501 and the second venting grooves 502 are matched in position, so that the gas in the cavity 30 can be vented through the same venting channel 105. the venting channel 105 is arranged around the joint of the upper die 101 and the lower die 102, so as to accelerate the gas in the cavity 30 to escape from the venting channel 105 out of the mold 10 (as shown in fig. 5 and 6).
In another embodiment of the present invention, as shown in fig. 3, in addition to the first runner 401 disposed between the adjacent upper cavities 301 and the second runner 402 disposed between the adjacent lower cavities 302, a mold flow hole 602 is disposed between the adjacent double-sided PCB board units 601 to accelerate the plastic molding compound in the upper cavities 301 to flow into the lower cavities 302.
In another embodiment of the present invention, as shown in fig. 4, a non-molding region is disposed on a surface of the double-sided PCB board unit 601 facing the lower mold 102, so that the molding regions on the upper and lower surfaces of the PCB board unit 601 are not equal in area, thereby forming an asymmetric molding. In this case, a first runner 401 is disposed between the adjacent upper cavities 301, a second runner 402 is not disposed between the adjacent lower cavities 302, but a support portion attached to the non-plastic-sealed region of the PCB board unit 601 is disposed on the inner wall of the lower cavity 302, and a plurality of vacuum holes 103 are disposed on the support portion. And a mold flow hole 602 is provided between adjacent PCB board units 601. During plastic packaging, the vacuum holes 103 are used for vacuumizing, and the non-plastic packaging area of the double-sided PCB board unit 601 is adsorbed on the supporting part of the inner wall of the lower cavity 302, so that the problem of board surface bending caused in an asymmetric plastic packaging process is solved, and the non-plastic packaging area of the double-sided PCB board unit 601 is ensured not to be subjected to plastic packaging.
The invention also discloses an embodiment of a one-time double-sided plastic package method, which comprises the following steps:
s10, providing a double-sided plastic package mold 10, wherein an upper mold 101 and a lower mold 102 of the mold 10 cooperate to form a feeding groove 20, a first glue dividing channel 2041, a second glue dividing channel 2042, a cavity 30, and a runner 40, wherein a plurality of feeding grooves 20 are uniformly arranged along a longitudinal axis of the mold 10, and adjacent feeding grooves 20 are communicated through the first glue dividing channel 2041;
a group of cavities 30 are respectively arranged on the left side and the right side of the feeding groove 20, the feeding groove 20 is communicated with the most adjacent cavity 30 on the left side and the right side of the feeding groove 20 through a second glue dividing channel 2042, and the adjacent cavities 30 in the same group are communicated through a flow channel 40; the first glue dividing channel 2041 and the second glue dividing channel 2042 are vertical in the same plane;
s20, preparing a plurality of double-sided PCB boards 60, wherein the double-sided PCB boards 60 are composed of PCB units 601 arranged in an array;
s30, placing the double-sided PCB boards 60 in the mold 10, so that the upper mold 101 and the lower mold 102 of the mold 10 are pressed on the edge of each PCB unit 601, and the mold cavity 30 accommodates the plastic-encapsulated area of each PCB unit 601;
the double-sided PCB 60 divides each cavity 30 into an upper cavity 301 and a lower cavity 302, and divides the flow channel 40 into a first flow channel 401 and a second flow channel 402; the upper cavities 301 adjacent to each other in the same group are communicated through a first flow passage 401, and the lower cavities 302 adjacent to each other in the same group are communicated through a second flow passage 402;
one end of the second glue dividing passage 2042 is provided with a glue injection port 203, and the second glue dividing passage 2042 is communicated with an upper cavity 301 and a lower cavity 302 of the cavity 30 nearest to the feed tank 20 through the glue injection port 203;
s40, injecting molding compound into the first glue dividing channel 2041 of the mold 10, the molding compound sequentially flowing through the first glue dividing channel 2041 through the plurality of material supply grooves 20, the material supply grooves 20 respectively supplying the molding compound to the upper cavity 301 and the lower cavity 302 of the most adjacent one of the cavities 30 located on the left side and the right side of the material supply groove 20 through the glue injection port 203 at one end of the second glue dividing channel 2042, and then the molding compound sequentially flowing through the first flow channel 401 and the second flow channel 402 to the other upper cavity 301 and the lower cavity 302 of the same group, so that the molding compound completes the double-sided plastic package of all the double-sided PCB board units 601;
and S50, removing the upper die 101 and the lower die 102.
Specifically, in step S20: a blocking block is arranged on a first flow channel 401 between adjacent upper cavities 301 in the same group to adjust the flow rate of the plastic package colloid; and/or; a stopper is provided on the second runner 402 between adjacent lower cavities 302 of the same group to adjust the flow rate of the molding compound.
Specifically, in step S20, a mold flow hole 602 is opened on the double-sided PCB 60, and the molding compound flows between the upper cavity 301 and the lower cavity 302 through the mold flow hole 602. For the double-sided PCB board 60 applied here, the die flow holes 602 may be opened inside the dicing streets or PCB board units 601.
In addition, in step S10, a gap is left at the nip of the upper die 101 and the lower die 102 to form the exhaust passage 105. In step S40, the gas in the cavity 30 can be exhausted to the outside of the mold 10 through the first exhaust groove 501 provided in the upper mold 101, the second exhaust groove 502 provided in the lower mold 102, and the exhaust duct 105.
It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. The utility model provides a plastic envelope mould based on once two-sided plastic envelope technique for carry out once two-sided plastic envelope to two-sided PCB board, its characterized in that: the feeding device comprises an upper die and a lower die which are matched relatively, wherein the upper die and the lower die are matched to form a feeding groove, a first glue dividing channel, a second glue dividing channel, a cavity and a flow channel;
the feeding grooves are uniformly arranged along the longitudinal axis of the die, and the adjacent feeding grooves are communicated through the first glue dividing channel;
a group of cavities are respectively arranged on the left side and the right side of the feeding groove, the feeding groove is communicated with the most adjacent cavity on the left side and the right side of the feeding groove through a second glue dividing channel, and the adjacent cavities are communicated through a flow channel formed at the joint of the adjacent cavities; the first glue dividing channel and the second glue dividing channel are vertical in the same plane;
the double-sided PCB board is composed of a plurality of PCB units which are arranged in an array mode, an upper die and a lower die of the die are pressed on the edge of each PCB unit, and the die cavity is used for accommodating the plastic packaging area of each PCB unit.
2. The plastic package mold based on the one-time double-sided plastic package technology as claimed in claim 1, wherein: the double-sided PCB divides each cavity into an upper cavity and a lower cavity, and divides the runner into a first runner and a second runner; the upper cavities adjacent to each other in the same group are communicated through the first flow channel, and the lower cavities adjacent to each other in the same group are communicated through the second flow channel.
3. The plastic package mold based on the one-time double-sided plastic package technology as claimed in claim 2, wherein: one end of the second glue dividing channel is provided with a glue injection port, and the second glue dividing channel is communicated with the upper cavity and the lower cavity of the cavity, which are closest to the feeding groove, through the glue injection port.
4. The double-sided plastic package mold based on the one-time double-sided plastic package technology according to claim 2, characterized in that: in the same-group cavity, the cavity is provided with a plurality of cavities,
a blocking block is arranged on a first runner between the adjacent upper cavities so as to adjust the flow rate of the molding compound passing through the first runner;
and/or;
and a blocking block is arranged on a second runner between the adjacent lower cavities so as to adjust the flow rate of the molding compound passing through the second runner.
5. The double-sided plastic package mold based on the one-time double-sided plastic package technology according to claim 2, characterized in that: a gap is reserved at the pressing part of the upper die and the lower die to form an exhaust channel;
the upper die is provided with a first exhaust groove, one end of the first exhaust groove is communicated with the upper die cavity or a first flow channel between the upper die cavities, and the other end of the first exhaust groove is communicated to the exhaust channel;
and a second exhaust groove is formed in the lower die, one end of the second exhaust groove is communicated with the lower cavity or a second flow passage between the lower cavities, and the other end of the second exhaust groove is communicated to the exhaust passage.
The first exhaust groove and the second exhaust groove are matched in position and spliced to form the exhaust groove.
6. The double-sided plastic package mold based on the one-time double-sided plastic package technology according to claim 2, characterized in that: and a mold flow hole is arranged between the adjacent PCB board units and is communicated with the first flow passage and the second flow passage which are separated by the PCB board units.
7. The double-sided plastic package mold according to any one of claims 1, characterized in that: the PCB board unit is provided with a non-plastic packaging area, the inner wall of the cavity is provided with a supporting part which is attached to the non-plastic packaging area of the PCB board unit, a plurality of vacuum holes are formed in the supporting part, and the vacuum holes penetrate through the wall of an upper die or a lower die where the supporting part is located.
8. A one-time double-sided plastic package method is used for carrying out one-time double-sided plastic package on a double-sided PCB and is characterized by comprising the following steps:
s10, providing a double-sided plastic package mold, wherein an upper mold and a lower mold of the mold are matched to form a feeding groove, a first glue dividing channel, a second glue dividing channel, a cavity and a flow channel, the feeding grooves are uniformly arranged along the longitudinal axis of the mold, and the adjacent feeding grooves are communicated through the first glue dividing channel;
a group of cavities are respectively arranged on the left side and the right side of the feeding groove, the feeding groove is communicated with the most adjacent cavity on the left side and the right side of the feeding groove through a second glue dividing channel, and the adjacent cavities are communicated through a flow channel; the first glue dividing channel and the second glue dividing channel are vertical in the same plane;
s20, preparing a plurality of double-sided PCB boards, wherein each double-sided PCB board is composed of PCB units arranged in an array;
s30, placing the double-sided PCB boards in the mould, enabling an upper mould and a lower mould of the mould to be pressed on the edge of each PCB unit, and accommodating the plastic package area of each PCB unit by the mould cavity;
the double-sided PCB divides each cavity into an upper cavity and a lower cavity, and divides the runner into a first runner and a second runner; the upper cavities adjacent to the same group are communicated through the first flow channel, and the lower cavities adjacent to the same group are communicated through the second flow channel;
one end of the second glue dividing channel is provided with a glue injection port, and the second glue dividing channel is communicated with an upper cavity and a lower cavity of the cavity which are closest to the feeding groove through the glue injection port;
s40, injecting plastic package glue into a first glue dividing channel of the mold, wherein the plastic package glue sequentially flows through a plurality of feeding grooves through the first glue dividing channel, the feeding grooves respectively supply the plastic package glue to an upper cavity and a lower cavity of the nearest cavity on the left side and the right side of the feeding grooves through a glue injection port at one end of a second glue dividing channel, and then the plastic package glue sequentially flows to other upper cavities and other lower cavities in the same group through a first runner and a second runner so that the plastic package glue can complete double-sided plastic package of all double-sided PCB boards;
and S50, removing the upper die and the lower die.
9. The one-time double-sided plastic package method according to claim 8, characterized in that: in step S20:
a blocking block is arranged on a first flow channel between the adjacent upper cavities of the same group so as to adjust the flow rate of the plastic package colloid;
and/or;
and a blocking block is arranged on a communicating flow channel between the adjacent lower cavities in the same group so as to adjust the flow rate of the plastic package colloid.
10. The one-time double-sided plastic package method according to claim 9, characterized in that:
in step S20, a mold flow hole is provided on the double-sided PCB, and the molding compound flows between the upper cavity and the lower cavity through the mold flow hole;
and/or;
in step S10, a gap is left at the press-fit position of the upper die and the lower die to form an exhaust passage;
in step S40, the gas in the cavity may be exhausted out of the mold through a first exhaust groove formed in the upper mold and the lower mold.
CN202010214214.4A 2020-03-24 2020-03-24 Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof Active CN111391243B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294825B1 (en) * 1999-02-22 2001-09-25 Micron Technology, Inc. Asymmetrical mold of multiple-part matrixes
US20020052063A1 (en) * 2000-06-16 2002-05-02 Bolken Todd O. Method and apparatus for packaging a microelectronic die
CN203210622U (en) * 2013-04-28 2013-09-25 四川明泰电子科技有限公司 Plastic packaging mold box
CN205326154U (en) * 2016-01-27 2016-06-22 环维电子(上海)有限公司 Plastic package mold

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294825B1 (en) * 1999-02-22 2001-09-25 Micron Technology, Inc. Asymmetrical mold of multiple-part matrixes
US20020052063A1 (en) * 2000-06-16 2002-05-02 Bolken Todd O. Method and apparatus for packaging a microelectronic die
CN203210622U (en) * 2013-04-28 2013-09-25 四川明泰电子科技有限公司 Plastic packaging mold box
CN205326154U (en) * 2016-01-27 2016-06-22 环维电子(上海)有限公司 Plastic package mold

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