CN111376183A - Method for treating grinding disc - Google Patents
Method for treating grinding disc Download PDFInfo
- Publication number
- CN111376183A CN111376183A CN201811609537.2A CN201811609537A CN111376183A CN 111376183 A CN111376183 A CN 111376183A CN 201811609537 A CN201811609537 A CN 201811609537A CN 111376183 A CN111376183 A CN 111376183A
- Authority
- CN
- China
- Prior art keywords
- grinding disc
- base material
- grinding
- diamond
- treating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 35
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 22
- 239000010432 diamond Substances 0.000 claims abstract description 22
- 238000005498 polishing Methods 0.000 claims abstract description 15
- 238000011282 treatment Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 238000007790 scraping Methods 0.000 claims abstract description 7
- 239000012530 fluid Substances 0.000 claims abstract description 6
- 239000002344 surface layer Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The method for processing the grinding disc comprises the following steps: providing a grinding disc base material; pressing the grinding disc base material; scraping the grinding disc base material; carrying out preheating treatment on the base material of the grinding disc; and embedding a diamond abrasive liquid on a predetermined surface of the polishing disk base material to form a surface layer. The method of the invention can improve the embedding force between the diamond grinding fluid and the base material of the grinding disc, and improve the hardness of the grinding disc, thereby prolonging the service life of the grinding disc and improving the grinding effect.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a processing method of a grinding disc for grinding semiconductors.
Background
With the development of technology, higher and higher requirements are put on microelectronic semiconductor technology, and the semiconductor polishing technology needs to be more and more precise.
In the grinding process, the surface of a semiconductor wafer is contacted with the surface of a grinding disc, then the original uneven surface of the wafer is flattened through the friction between the surface of the wafer and the grinding disc, the grinding disc has the function of keeping roughness all the time in the grinding process so as to keep the stability of the grinding rate, and the grinding disc used at present is prepared by a method of adhering fine diamond particles on a stainless steel plate. In order to obtain a better polishing roughness, a finer and smaller diamond powder is required to prepare a polishing liquid, however, the diamond particles having a smaller size are less likely to be embedded in a polishing disk, and easily fall off from a polishing disk substrate, and the cutting rate is rapidly decreased, so that the lifetime of the polishing disk is decreased, and the productivity is decreased.
Therefore, it is desired to provide an improved method for treating a polishing pad, which can better fit with the polishing slurry, thereby increasing the lifetime of the polishing pad and improving the polishing effect.
Disclosure of Invention
The invention aims to provide a method for processing a grinding disc, which can improve the embedding force between diamond grinding fluid and a grinding disc base material, improve the hardness of the grinding disc, prolong the service life of the grinding disc and improve the grinding effect.
To achieve the above object, a method for treating an abrasive disk, comprising the steps of:
providing a grinding disc base material;
pressing the grinding disc base material;
scraping the grinding disc base material;
carrying out preheating treatment on the base material of the grinding disc; and
a diamond abrasive liquid is embedded on a predetermined surface of the polishing disk base material to form a surface layer.
Compared with the prior art, the processing method of the grinding disc preheats the base material of the grinding disc before the diamond grinding fluid is embedded, the crystal structure of the preheated base material disc surface of the grinding disc is subjected to allotropic change and is recrystallized, so that the small-sized diamond can be firmly embedded in the crystal surface, the cutting rate reduction speed is reduced, and the service life of the grinding disc is prolonged; and the hardness of the grinding disc is improved, and the grinding effect is improved.
Preferably, the preheating treatment comprises: and (3) placing the grinding disc base material in a heating chamber, controlling the heating temperature to be 35-50 ℃, and heating for 0.5-2 hours.
More preferably, the heating temperature is controlled to be 35 ℃ and the heating time is 0.5 to 1 hour.
Preferably, the step of embedding the diamond grinding fluid is followed by the steps of: and cleaning the grinding disc base material.
Preferably, the abrasive disk substrate comprises tin.
Detailed Description
The method for treating the abrasive disk according to the present invention will be further described with reference to the following examples, but the present invention is not limited thereto.
One embodiment of the method of treating an abrasive disk of the present invention comprises the steps of:
providing a grinding disc base material;
pressing the grinding disc base material;
scraping the grinding disc base material;
carrying out preheating treatment on the base material of the grinding disc;
a diamond abrasive liquid is embedded on a predetermined surface of the polishing disk base material to form a surface layer.
In particular, the substrate is a metal or stainless steel material, preferably a tin plate. After the pressing and scraping processes, the surface of the grinding disc substrate is flattened and flattened, and the surface and the edge position are scraped clean, so that the subsequent processes are facilitated. It is to be noted that both the pressing and the scraping processes are carried out in the conventional prior art method.
As a modification of the invention, preheating of the grinding disc base material is also included after the pressing and scraping process. Specifically, the grinding disc base material is placed in a heating chamber, such as an oven, for preheating, the heating temperature is controlled to be 35-50 ℃, and the heating time is 0.5-2 hours. The surface of the grinding disc base material after the preheating treatment is subjected to homomorphic change, the surface layer of the grinding disc base material becomes hard, and the diamond is embedded more firmly in the subsequent diamond embedding step. Preferably, the heating temperature is controlled to be 35 ℃, the heating time is 0.5-1 hour, the effect is better, and the specific expression is that the service life of the grinding disc is longer, and the grinding effect is more ideal.
The following is a comparative table of pre-heat treatments of abrasive disk substrates under different conditions:
TABLE 1
| Preheating temperature | Preheating time (hours) | Flatness of the grinding disk (μm) | Of abrasive discsService life (rows) |
| 35 | 2 | 1.3 | 70 |
| 35 | 1 | 1.08 | 80 |
| 35 | 0.5 | 1.05 | 80 |
| 30 | 1 | 1.02 | 60 |
Therefore, under the conditions that the preheating temperature is 35 ℃ and the heating time is 0.5 hour or 1 hour, the obtained grinding disc has better flatness and longer service life. Preheating at lower temperatures, such as 30 c, has not been effective. The pre-heating at a higher temperature of more than 50 ℃ can greatly reduce the flatness of the grinding disc, and the bonding glue becomes soft, so that the bonding glue becomes loose and even falls off, and the expected effect cannot be obtained. Therefore, tests show that the preheating condition of the grinding disc can prolong the service life of the grinding disc, and the grinding flatness is better, so that the grinding effect is improved.
After the preheating treatment of the present invention, a diamond abrasive liquid is embedded on a predetermined surface of the abrasive disk substrate to form a surface layer. Specifically, the size of diamond in the diamond abrasive liquid can be set smaller to obtain better abrasive roughness. The crystal structure of the preheated tin plate surface is changed and recrystallized, so that small-sized diamond can be firmly embedded into the crystal surface, the cutting rate reduction speed is reduced, and the service life of the grinding plate is prolonged.
Preferably, after the diamond is embedded, the polishing pad base is cleaned, so that a subsequent polishing process of the semiconductor product can be performed.
Compared with the prior art, the processing method of the grinding disc preheats the base material of the grinding disc before the diamond grinding fluid is embedded, the crystal structure of the preheated base material disc surface of the grinding disc is subjected to allotropic change and is recrystallized, so that the small-sized diamond can be firmly embedded in the crystal surface, the cutting rate reduction speed is reduced, and the service life of the grinding disc is prolonged; and the hardness of the grinding disc is improved, and the grinding effect is improved.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the invention is not limited by the scope of the appended claims.
Claims (5)
1. A method of treating an abrasive disk, comprising the steps of:
providing a grinding disc base material;
pressing the grinding disc base material;
scraping the grinding disc base material;
carrying out preheating treatment on the base material of the grinding disc; and
a diamond abrasive liquid is embedded on a predetermined surface of the polishing disk base material to form a surface layer.
2. The method for treating an abrasive disk according to claim 1, wherein: the preheating treatment comprises the following steps: and (3) placing the grinding disc base material in a heating chamber, controlling the heating temperature to be 35-50 ℃, and heating for 0.5-2 hours.
3. The method for treating an abrasive disk according to claim 2, wherein: the heating temperature is controlled to be 35 ℃, and the heating time is 0.5-1 hour.
4. The method for treating an abrasive disk according to claim 1, wherein: the step of embedding the diamond grinding fluid is followed by the following steps: and cleaning the grinding disc base material.
5. The method for treating an abrasive disk according to claim 1, wherein: the abrasive disk substrate comprises tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811609537.2A CN111376183A (en) | 2018-12-27 | 2018-12-27 | Method for treating grinding disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811609537.2A CN111376183A (en) | 2018-12-27 | 2018-12-27 | Method for treating grinding disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111376183A true CN111376183A (en) | 2020-07-07 |
Family
ID=71219335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811609537.2A Pending CN111376183A (en) | 2018-12-27 | 2018-12-27 | Method for treating grinding disc |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111376183A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1597219A (en) * | 2004-09-08 | 2005-03-23 | 华侨大学 | Preparation method of single layer soldering diamond tool |
| CN1718371A (en) * | 2004-07-08 | 2006-01-11 | 应用材料有限公司 | Polishing pad conditioner and methods of manufacture and recycling |
| CN101362318A (en) * | 2008-09-28 | 2009-02-11 | 北京市粉末冶金研究所有限责任公司 | Method for preparing mono-layer diamond tool |
| CN101657554A (en) * | 2007-02-23 | 2010-02-24 | 贝克休斯公司 | The multi-layer diamond sand grains coating that uses in the earth-boring bits |
| CN203887685U (en) * | 2014-05-12 | 2014-10-22 | 中芯国际集成电路制造(北京)有限公司 | Conditioning plate, grinding pad conditioner and grinding device |
| CN104907941A (en) * | 2015-05-19 | 2015-09-16 | 山东广益达研磨科技有限公司 | Large-diameter diamond grinding wheel special for coarse grinding of silicon nitride ceramic ball and manufacturing method thereof |
| CN106378700A (en) * | 2016-11-28 | 2017-02-08 | 华侨大学 | Resin concretion diamond micro-powder phyllotaxy grinding disc and manufacturing method |
-
2018
- 2018-12-27 CN CN201811609537.2A patent/CN111376183A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1718371A (en) * | 2004-07-08 | 2006-01-11 | 应用材料有限公司 | Polishing pad conditioner and methods of manufacture and recycling |
| CN1597219A (en) * | 2004-09-08 | 2005-03-23 | 华侨大学 | Preparation method of single layer soldering diamond tool |
| CN101657554A (en) * | 2007-02-23 | 2010-02-24 | 贝克休斯公司 | The multi-layer diamond sand grains coating that uses in the earth-boring bits |
| CN101362318A (en) * | 2008-09-28 | 2009-02-11 | 北京市粉末冶金研究所有限责任公司 | Method for preparing mono-layer diamond tool |
| CN203887685U (en) * | 2014-05-12 | 2014-10-22 | 中芯国际集成电路制造(北京)有限公司 | Conditioning plate, grinding pad conditioner and grinding device |
| CN104907941A (en) * | 2015-05-19 | 2015-09-16 | 山东广益达研磨科技有限公司 | Large-diameter diamond grinding wheel special for coarse grinding of silicon nitride ceramic ball and manufacturing method thereof |
| CN106378700A (en) * | 2016-11-28 | 2017-02-08 | 华侨大学 | Resin concretion diamond micro-powder phyllotaxy grinding disc and manufacturing method |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200707 |