CN111326942A - Gas laser device and laser oscillation method - Google Patents
Gas laser device and laser oscillation method Download PDFInfo
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- CN111326942A CN111326942A CN201911087506.XA CN201911087506A CN111326942A CN 111326942 A CN111326942 A CN 111326942A CN 201911087506 A CN201911087506 A CN 201911087506A CN 111326942 A CN111326942 A CN 111326942A
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- 230000010355 oscillation Effects 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 9
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 description 38
- 238000012545 processing Methods 0.000 description 17
- 238000006073 displacement reaction Methods 0.000 description 13
- 238000005192 partition Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 4
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/041—Arrangements for thermal management for gas lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention provides a gas laser device capable of improving the position accuracy of a beam spot and suppressing the reduction of efficiency. The gas laser apparatus outputs a laser beam by generating a discharge in a part (i.e., a discharge region) of a circulation flow path through which a laser gas circulates. The heat exchanger cools the laser gas circulating in the circulation flow path. The temperature sensor measures the temperature of the laser gas flowing from the heat exchanger to the discharge region. The control device controls the cooling capacity of the heat exchanger based on the temperature measured by the temperature sensor so that the measured value of the temperature sensor becomes a target temperature of 30 ℃ or lower.
Description
The present application claims priority based on japanese patent application No. 2018-235276, applied 12/17/2018. The entire contents of this Japanese application are incorporated by reference into this specification.
Technical Field
The present invention relates to a gas laser device and a laser oscillation method.
Background
A gas laser device that controls the temperature of a laser gas to be constant is known (for example, patent document 1). In the gas laser device described in patent document 1, the laser gas whose temperature rises due to the discharge is cooled by a heat exchanger. Then, the temperature of the laser gas is measured, and the temperature of the cooling water flowing through the heat exchanger is controlled so that the temperature of the laser gas becomes constant. By controlling the temperature of the laser gas to be constant, the stability of the laser output power can be improved.
Patent document 1: japanese laid-open patent publication No. 61-154188
The present applicant has found that it is difficult to ensure sufficient positional accuracy in a conventional method for performing laser processing by controlling the position of a beam spot of a laser beam with high accuracy. Further, it was found that the efficiency of the laser oscillator may be reduced in the conventional method.
Disclosure of Invention
An object of the present invention is to provide a gas laser apparatus and a laser oscillation method that can improve the positional accuracy of a beam spot and suppress a decrease in efficiency.
According to an aspect of the present invention, there is provided a gas laser apparatus that outputs a laser beam by generating a discharge in a discharge region that is a part of a circulation flow path through which a laser gas circulates,
the gas laser device includes:
a heat exchanger that cools the laser gas circulating in the circulation flow path;
a temperature sensor that measures a temperature of the laser gas flowing from the heat exchanger to the discharge region; and
and a control device for controlling the cooling capacity of the heat exchanger based on the temperature measured by the temperature sensor so that the measured value of the temperature sensor becomes a target temperature of 30 ℃ or lower.
According to another aspect of the present invention, there is provided a laser oscillation method for adjusting a temperature of the laser gas so that the temperature of the laser gas flowing into a discharge region is 30 ℃ or lower while laser oscillation is performed by generating discharge in the discharge region while circulating the laser gas through the discharge region.
By controlling the temperature of the laser gas within a range of 30 ℃ or less, it is possible to suppress a decrease in efficiency and to reduce variations in the position of the beam spot.
Drawings
Fig. 1 is a cross-sectional view including an optical axis of a gas laser apparatus according to an embodiment.
Fig. 2 is a cross-sectional view of the gas laser apparatus according to the present embodiment, the cross-sectional view being perpendicular to the optical axis.
Fig. 3 is a graph showing the measurement results of the relationship among the pre-discharge temperature, the discharge current, and the efficiency of the laser gas.
Fig. 4 is a graph showing a relationship between a pre-discharge temperature of a laser gas and a deviation of a beam spot position.
Fig. 5 is a graph showing a relationship between the pre-discharge temperature of the laser gas and the displacement amount of the average position of the beam spot.
Fig. 6 is a schematic block diagram showing a laser processing apparatus according to another embodiment.
Fig. 7 is a flowchart showing a procedure for performing laser processing by operating the laser processing apparatus according to the embodiment.
In the figure: 10-chamber, 11-optical chamber, 12-blower chamber, 13-upper and lower partitions, 13A, 13B-opening, 14-bottom plate, 15-partition, 16-chamber support member, 21-discharge electrode, 22, 23-discharge electrode support member, 24-discharge region, 25-resonator mirror, 26-common support member, 27-optical resonator support member, 28-light transmission window, 30-blower, 40-control device, 41-input-output device, 51-1 st gas flow path, 52-2 nd gas flow path, 55-temperature sensor, 56-heat exchanger, 57-cooler, 58-outflow hole, 59-filter, 70-laser oscillator, 71-beam shaping scanning optical system, 72-table, 75-object to be processed.
Detailed Description
A gas laser apparatus according to an embodiment will be described with reference to fig. 1 and 2.
Fig. 1 is a cross-sectional view including an optical axis of a gas laser apparatus according to an embodiment. The laser gas is contained within the chamber 10. The internal space of the chamber 10 is divided into an optical chamber 11 located on the upper side and a blower chamber 12 located on the lower side. The optical chamber 11 and the blower chamber 12 are partitioned by an upper partition plate 13 and a lower partition plate 13. The upper and lower partition plates 13 are provided with openings through which laser gas flows between the optical chamber 11 and the blower chamber 12. The bottom plate 14 of the optical chamber 11 protrudes from the side wall of the blower chamber 12 in the optical axis direction, and the length of the optical chamber 11 in the optical axis direction is longer than the length of the blower chamber 12 in the optical axis direction. The chamber 10 is supported on the optical base by a chamber support member 16 at the bottom plate 14 of the optical chamber 11.
A pair of discharge electrodes 21 and a pair of resonator mirrors 25 are arranged in the optical chamber 11. The pair of discharge electrodes 21 are supported on the base plate 14 via discharge electrode supporting members 22 and 23, respectively. The pair of discharge electrodes 21 are arranged with a gap therebetween in the vertical direction, and define a discharge region 24 therebetween. The discharge electrode 21 generates a discharge in the discharge region 24, thereby exciting the laser gas. As will be described later with reference to fig. 2, the laser gas flows through the discharge region 24 in a direction perpendicular to the paper surface of fig. 1.
A pair of resonator mirrors 25 are fixed to a common support member 26 disposed in the optical chamber 11. The common support member 26 is supported by the base plate 14 via a pair of optical resonator support members 27. The resonator mirror 25 constitutes an optical resonator having an optical axis passing through the discharge region 24. A light transmission window 28 through which a laser beam passes is attached to a portion where an extension line extending the optical axis of the optical resonator in one direction (left direction in fig. 1) intersects a wall surface of the optical chamber 11. The laser beam excited in the optical resonator is radiated toward the outside through the light transmitting window 28.
The blower 30 is disposed in the blower chamber 12. The blower 30 circulates the laser gas between the optical chamber 11 and the blower chamber 12.
Fig. 2 is a cross-sectional view of the gas laser apparatus according to the present embodiment, the cross-sectional view being perpendicular to the optical axis. The internal space of the chamber 10 is partitioned into an upper optical chamber 11 and a lower blower chamber 12 by an upper partition plate 13 and a lower partition plate 13. A pair of discharge electrodes 21 and a common support member 26 for supporting the optical resonator are disposed in the optical chamber 11. A discharge region 24 is defined between the discharge electrodes 21.
A partition 15 is disposed in the optical chamber 11. The separators 15 define a 1 st gas flow path 51 from the opening 13A provided in the upper and lower separators 13 to the discharge region 24, and a 2 nd gas flow path 52 from the discharge region 24 to the other opening 13B provided in the upper and lower separators 13. The laser gas flows through the discharge region 24 in a direction orthogonal to the optical axis. The discharge direction is orthogonal to both the laser gas flow direction and the optical axis direction. The blower chamber 12, the 1 st gas passage 51, the discharge region 24, and the 2 nd gas passage 52 constitute a circulation passage through which the laser gas circulates. The blower 30 generates a laser gas flow to circulate the laser gas in the circulation flow path.
A heat exchanger 56 is accommodated in the circulation flow path in the blower chamber 12. A cooling medium such as cooling water is supplied from the cooler 57 to the heat exchanger 56, and the cooling medium is recovered from the heat exchanger 56 to the cooler 57. The laser gas heated in the discharge region 24 is cooled by the heat exchanger 56, and the cooled laser gas is supplied to the discharge region 24 again.
The upper and lower partition plates 13 are provided with outflow holes 58 through which the laser gas flows from the blower chamber 12 to the optical chamber 11. A part of the laser gas flowing through the blower 30 to the 1 st gas passage 51 flows through the outflow hole 58 to the optical chamber 11. A filter 59 for removing particulates is provided at the outlet port 58. For example, the filter 59 closes the outflow hole 58, and the laser gas flowing from the blower chamber 12 to the optical chamber 11 is filtered by the filter 59.
A temperature sensor 55 is disposed in the 1 st gas flow path 51. The temperature sensor 55 measures the temperature of the laser gas flowing from the heat exchanger 56 to the discharge region 24. As the temperature sensor 55, for example, a temperature measuring resistance element can be used. The measurement result of the temperature sensor 55 is input to the control device 40. The control device 40 controls the cooling capacity of the heat exchanger 56 so that the measurement value of the temperature sensor 55 becomes the target temperature. For example, the control device 40 changes the temperature of the cooling medium supplied from the cooler 57 to the heat exchanger 56. This can maintain the temperature of the laser gas flowing into the discharge region 24 at the target temperature.
Next, a preferred temperature of the laser gas will be described with reference to fig. 3 to 5. Evaluation experiments were performed by changing the temperature of the laser gas while keeping the output power and the gap ratio (CR value) of the gas laser apparatus constant.
Fig. 3 is a graph showing the measurement results of the relationship among the pre-discharge temperature, the discharge current, and the efficiency of the laser gas. The horizontal axis represents the pre-discharge temperature of the laser gas in units of "° c", the left vertical axis represents the efficiency in units of "J/a", and the right vertical axis represents the discharge current in units of "a". The circular marks in the graph of fig. 3 indicate the measured values of the discharge current, and the triangular marks indicate the efficiencies. The pre-discharge temperature of the laser gas is equal to the measured value of the temperature sensor 55 (fig. 2).
A carbon dioxide laser device was used as the gas laser device, and the laser output power was adjusted to 240W. More specifically, the pulse frequency was set to 3kHz, and the energy per 1 pulse was set to 80 mJ. The CR value of the laser gas was set to about 1.7. The CR value is defined by the following formula.
CR＝v/(W×f)
Here, v denotes a flow velocity of the laser gas, W denotes a discharge width in the gas flow direction, and f denotes a repetition frequency of the pulse.
As the pre-discharge temperature of the laser gas becomes higher, the discharge current becomes larger. In particular, in the range where the pre-discharge temperature of the laser gas is higher than 30 ℃, the ratio of the increase in the discharge current to the increase in the pre-discharge temperature of the laser gas becomes larger than in the range of 30 ℃ or lower. In addition, the efficiency varies slightly in a range where the pre-discharge temperature of the laser gas is 30 ℃ or lower, but in a range higher than 30 ℃, the efficiency decreases conversely as the pre-discharge temperature of the laser gas increases.
In order to suppress the decrease in efficiency, it is preferable to perform temperature control so that the pre-discharge temperature of the laser gas becomes 30 ℃ or lower.
Fig. 4 is a graph showing a relationship between a pre-discharge temperature of a laser gas and a deviation of a beam spot position. The horizontal axis represents the pre-discharge temperature of the laser gas in units of "deg.c", and the vertical axis represents the index 6 σ of deviation of the beam spot position in units of "mm". The position of the beam spot was measured at a position 5m in the optical path length from the gas laser apparatus. A concave mirror is disposed on an optical path from the gas laser device to a position measurement portion of the beam spot. The diameter of the beam spot on the face where the position of the beam spot is measured is about 7 mm. The circle mark and the triangle mark in the graph of fig. 4 indicate deviations of the positions of the beam spots in the x direction and the y direction, respectively, which are orthogonal to each other. The output power and CR value of the gas laser apparatus were the same as those in the evaluation experiment shown in fig. 3.
As is clear from fig. 4, when the pre-discharge temperature of the laser gas is higher than 30 ℃, the deviation of the beam spot position becomes larger than the range of 30 ℃ or lower. In order to reduce the deviation of the spot position of the beam, it is preferable to perform temperature control so that the pre-discharge temperature of the laser gas becomes 30 ℃ or lower.
Fig. 5 is a graph showing the relationship between the pre-discharge temperature of the laser gas and the displacement amount of the average beam spot position, which was obtained in the evaluation experiment. The horizontal axis represents the pre-discharge temperature of the laser gas in units of "° c", and the vertical axis represents the displacement amount of the average position of the beam spot in units of "mm". Here, the average position of the beam spot when the pre-discharge temperature of the laser gas was 22.5 ℃ was used as a reference position. The circular mark and the triangular mark in the graph of fig. 5 indicate the displacement amounts of the average position of the beam spot in the x direction and the y direction, respectively, which are orthogonal to each other. The output power and CR value of the gas laser apparatus were the same as those in the evaluation experiment shown in fig. 3.
As is clear from the results of the evaluation experiment shown in fig. 5, the displacement amount of the position in the y direction is the largest in the range where the pre-discharge temperature of the laser gas is 26 to 30 ℃. In the range where the displacement amount of the position in the y direction is the largest, if the gas temperature changes by about 4 ℃, the position of the beam spot changes by about 0.3 mm. For example, when a gas laser apparatus is used for drilling a printed circuit board, it is empirically known that the displacement amount of the beam spot at a portion where the beam spot position is measured in an evaluation experiment is preferably 0.2mm or less. In the results of the evaluation experiment shown in fig. 5, even in a range in which the displacement amount of the average position of the beam spot with respect to the change in the gas temperature is the largest, as long as the variation width of the gas temperature is ± 1 ℃ or less, the displacement amount of the average position of the beam spot becomes about 0.15 mm. In this case, the target of the displacement amount of 0.2mm or less is satisfied. Therefore, in order to set the displacement amount of the beam spot to 0.2mm or less, it is preferable to control the pre-discharge temperature of the laser gas within a range of ± 1 ℃ or less around the target temperature.
In addition, the slope of the graph shown in fig. 5 is gentle in the range where the temperature of the laser gas is 26 ℃. This means that even if a temperature change of the laser gas occurs, the displacement amount of the average position of the beam spot is small. Therefore, in order to stabilize the average position of the beam spot, it is more preferable to control the temperature of the laser gas to 26 ℃ or lower.
Next, the excellent effects of the above-described embodiments will be described.
In the above-described embodiment, the temperature control was performed so that the pre-discharge temperature of the laser gas was 30 ℃. As a result, the gas laser apparatus can be operated efficiently (see fig. 3). Further, the deviation of the beam spot position can be suppressed (refer to fig. 4). Further, in the above-described embodiment, the temperature control was performed so that the pre-discharge temperature of the laser gas falls within the range of ± 1 ℃ with the target temperature as the center. As a result, the displacement amount of the average position of the beam spot can be controlled within a certain allowable range.
Next, a laser processing apparatus according to another embodiment will be described with reference to fig. 6 and 7. The laser processing apparatus according to the present embodiment is used for drilling a printed circuit board, for example.
Fig. 6 is a schematic block diagram of a laser processing apparatus according to the present embodiment. The pulsed laser beam output from the laser oscillator 70 is incident on a processing object 75 such as a printed circuit board via a beam shaping scanning optical system 71. The object 75 is held on a table 72 such as an XY table. The beam shaping and scanning optical system 71 adjusts the shape and size of the beam cross section and scans the laser beam in two dimensions. The table 72 moves the object 75 in two directions parallel to the surface to be processed.
The control device 40 and the laser oscillator 70 correspond to the gas laser device according to the embodiment shown in fig. 1 and 2. The control device 40 controls the laser oscillator 70 according to the set oscillation condition. Then, the controller 40 controls the temperature of the laser gas in the laser oscillator 70 based on the set target temperature.
The input/output device 41 has a function of displaying an image and a function of inputting a command from an operator, and also functions as an input device and an output device. For example, a touch panel or the like can be used as the input/output device 41. In addition, a display may be used as an output device, and a pointing device or a keyboard may be used as an input device.
Next, a method of setting the oscillation condition and the temperature control condition will be described.
The control device 40 displays an input screen for allowing the operator to input the oscillation condition and the temperature control condition on the input/output device 41. The oscillation conditions include, for example, the repetition frequency of the pulse, the pulse width, and the like. The temperature control conditions include a target temperature, a feedback period, a feedback gain, and the like. Then, the controller 40 displays the current temperature of the laser gas on the input/output device 41.
The feedback cycle and the feedback gain of the temperature control are set in advance to appropriate values so that the temperature of the laser gas falls within a range of ± 1 ℃ with the target temperature as the center. Regarding the values of the feedback period and the feedback gain, a general operator cannot perform correction, and only a user having authority of an administrator can perform correction. The operator may select from a pull-down menu to complete the input regarding frequency, pulse width, and target temperature, for example.
Fig. 7 is a flowchart showing a procedure for performing laser processing by operating the laser processing apparatus according to the present embodiment.
The operator operates the input/output device 41 to input the target temperature (step S1). Next, the frequency and the pulse width are input (step S2). The control device 40 performs the tuning operation of the laser oscillator 70 in accordance with the input conditions (step S3). At this time, the pulse laser beam output from the laser oscillator 70 is made incident on a beam stop or the like and is not made incident on the object 75. During the adjustment operation, the control device 40 displays the measured temperature value of the laser gas as the current temperature on the input/output device 41.
Next, the adjustment operation is continued until the current temperature of the laser gas falls within the allowable range (step S4). The operator can determine whether the current temperature of the laser gas is within the allowable range based on the current temperature of the laser gas displayed in the input/output device 41. If the current temperature of the laser gas is within the allowable range, laser processing is actually performed (step S5).
When the laser processing operation is ended, the operator operates the laser processing apparatus according to the ending sequence (step S6). When the machining operation needs to be continued and the oscillation condition is not changed, the laser machining of step S5 is executed again (no in step S7). When the machining operation is continued after the oscillation condition needs to be changed, the processing of the input frequency and the pulse width at step S2 is executed again (yes at step S7).
Next, the excellent effects of the present embodiment will be described.
In the present embodiment, the laser oscillator 70 can be operated with less deviation of the beam spot position and high efficiency by inputting an appropriate target temperature of the laser gas by the operator.
As shown in fig. 5, in order to stabilize the average position of the beam spot, it is preferable to lower the temperature of the laser gas. However, if the temperature of the laser gas is too low, condensation is likely to occur. In order to prevent dew condensation, the target temperature of the laser gas is preferably set to be equal to or higher than the dew point of the environment in which the laser oscillator 70 is installed. The operator can determine the dew point from the humidity of the environment and set a desired target temperature within a range in which dew condensation does not occur.
Generally, the recommended environment of a laser processing apparatus is mostly about 50% humidity and 25 ℃. In this recommended environment, the dew point is approximately 14 ℃. Therefore, the target temperature of the laser gas is preferably set to 14 ℃ or higher.
In the present embodiment, the values of the feedback period and the feedback gain, which require a skilled skill to set the optimum values, are set in advance, and the operator does not need to input these values. Therefore, even an operator with low skill can operate the laser processing apparatus, and laser processing can be performed under preferable conditions.
The above embodiments are merely examples, and it is needless to say that structures shown in different embodiments may be partially replaced or combined. The same operational effects of the same structure in the plurality of embodiments are not described one by one in each embodiment. The present invention is not limited to the above-described embodiments. For example, it will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made to the present invention.
Claims (5)
1. A gas laser device which outputs a laser beam by generating discharge in a discharge region which is a part of a circulation flow path through which a laser gas circulates,
the gas laser device is characterized by comprising:
a heat exchanger that cools the laser gas circulating in the circulation flow path;
a temperature sensor that measures a temperature of the laser gas flowing from the heat exchanger to the discharge region; and
and a control device for controlling the cooling capacity of the heat exchanger based on the temperature measured by the temperature sensor so that the measured value of the temperature sensor becomes a target temperature of 30 ℃ or lower.
2. The gas laser apparatus according to claim 1,
the target temperature is 14 ℃ or higher.
3. The gas laser apparatus according to claim 1 or 2,
the control device controls the cooling capacity of the heat exchanger so that the measurement value of the temperature sensor falls within a range of ± 1 ℃ centered on the target temperature.
4. The gas laser apparatus according to any one of claims 1 to 3,
and an input device for inputting the value of the target temperature,
the control means controls the cooling capacity of the heat exchanger in accordance with the value of the target temperature input to the input means.
5. A laser oscillation method is characterized in that,
the temperature of the laser gas is adjusted so that the temperature of the laser gas flowing into the discharge region is 30 ℃ or lower while the laser gas is circulated through the discharge region and discharge is generated in the discharge region to oscillate laser light.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-235276 | 2018-12-17 | ||
| JP2018235276A JP2020098812A (en) | 2018-12-17 | 2018-12-17 | Gas laser device and laser oscillation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111326942A true CN111326942A (en) | 2020-06-23 |
Family
ID=71106137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911087506.XA Pending CN111326942A (en) | 2018-12-17 | 2019-11-08 | Gas laser device and laser oscillation method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2020098812A (en) |
| KR (1) | KR20200074851A (en) |
| CN (1) | CN111326942A (en) |
| TW (1) | TW202038523A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117791288A (en) * | 2024-02-27 | 2024-03-29 | 深圳市智鼎自动化技术有限公司 | Method for stabilizing energy and direction of laser light path |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115377777A (en) | 2021-05-20 | 2022-11-22 | 上海名古屋精密工具股份有限公司 | Laser temperature control method and machining equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61229383A (en) * | 1985-04-04 | 1986-10-13 | Mitsubishi Electric Corp | Gas fluid laser oscillator |
| JPS63172481A (en) * | 1987-01-10 | 1988-07-16 | Hitachi Ltd | Laser generator |
| JPH0369262U (en) * | 1989-11-10 | 1991-07-09 | ||
| CN105932524A (en) * | 2015-02-27 | 2016-09-07 | 发那科株式会社 | Temperature controllable gas laser oscillator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154188A (en) * | 1984-12-27 | 1986-07-12 | Toshiba Corp | Gas laser device |
| US5065405A (en) * | 1990-01-24 | 1991-11-12 | Synrad, Incorporated | Sealed-off, RF-excited gas lasers and method for their manufacture |
| JP3102322B2 (en) * | 1995-10-31 | 2000-10-23 | 日立電線株式会社 | Substrate processing method and apparatus using carbon dioxide laser light |
| JP2005251855A (en) * | 2004-03-02 | 2005-09-15 | Fanuc Ltd | Laser device |
-
2018
- 2018-12-17 JP JP2018235276A patent/JP2020098812A/en active Pending
-
2019
- 2019-11-05 KR KR1020190140158A patent/KR20200074851A/en not_active Application Discontinuation
- 2019-11-06 TW TW108140194A patent/TW202038523A/en unknown
- 2019-11-08 CN CN201911087506.XA patent/CN111326942A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61229383A (en) * | 1985-04-04 | 1986-10-13 | Mitsubishi Electric Corp | Gas fluid laser oscillator |
| JPS63172481A (en) * | 1987-01-10 | 1988-07-16 | Hitachi Ltd | Laser generator |
| JPH0369262U (en) * | 1989-11-10 | 1991-07-09 | ||
| CN105932524A (en) * | 2015-02-27 | 2016-09-07 | 发那科株式会社 | Temperature controllable gas laser oscillator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117791288A (en) * | 2024-02-27 | 2024-03-29 | 深圳市智鼎自动化技术有限公司 | Method for stabilizing energy and direction of laser light path |
| CN117791288B (en) * | 2024-02-27 | 2024-05-07 | 深圳市智鼎自动化技术有限公司 | Method for stabilizing energy and direction of laser light path |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020098812A (en) | 2020-06-25 |
| TW202038523A (en) | 2020-10-16 |
| KR20200074851A (en) | 2020-06-25 |
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Application publication date: 20200623 |
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| RJ01 | Rejection of invention patent application after publication |