Drawings
FIG. 1 is a schematic diagram of a conference call of an embodiment.
Fig. 2 is a partial exploded view of the conference phone of fig. 1.
Fig. 3 is a cross-sectional view of the conference phone of fig. 1 along the line X-X.
Fig. 4 is an enlarged view of circle a in fig. 3.
Fig. 5 is a schematic view of an alternative perspective of the upper housing of the device housing base of fig. 2.
Fig. 6 is a cross-sectional view of the conference phone of fig. 1 along the line Y-Y.
Fig. 7 is a schematic view of an alternative view of the upper cover of the device housing of fig. 2.
Description of the symbols:
1 conference telephone
12a sound outlet
12b acoustic hole
12c loudspeaker chamber
12d microphone accommodating chamber
122 upper cover
122a keycap
124 base
124a mounting port
124b bottom surface
1242 Upper casing
1244 lower casing
1259 Sound-absorbing Material
1260 bubble cotton pad
1262 annular winding groove
1262b side wall
1264 rubber pad
14 system mainboard
142 switch
16 loudspeaker
18 microphone
182 circuit board
184 sound receiving unit
186 rubber sleeve
186a hole
20. 21 spacer ring
22 dust screen
23 cover net
24. 28 electric connection wire
26 push-button switch
34 annular foot pad
Opening directions of D1 and D2
Detailed Description
Please refer to fig. 1 and fig. 3. A conference phone 1 according to one embodiment includes a device housing 12 and a system motherboard 14 housed within the device housing 12, a speaker 16 (shown in single entity to simplify the drawing), and a plurality of microphones 18 (including but not limited to two). The device housing 12 has a sound outlet 12a and a plurality of sound emission holes 12b (including but not limited to two), wherein the sound outlet 12a is disposed upward, the sound emission holes 12b are disposed laterally and inclined upward, or the sound emission holes 12a are disposed vertically, and the sound emission holes 12b are disposed horizontally and inclined upward. The speaker 16 is disposed in the device housing 12 aligned upward with the sound outlet 12a such that the speaker 16 can generate sound to be transmitted through the sound outlet 12 a. The microphones 18 are disposed in the device case 12 toward the sound-receiving holes 12b, respectively, so that each microphone 18 can receive external sound through the corresponding sound-receiving hole 12 b. The system motherboard 14 is electrically connected to the speaker 16 and the microphone 18 to control the speaker 16 to generate sound and receive sound signals through the microphone 18. In the embodiment, the system motherboard 14 substantially includes a circuit board, required electronic components disposed thereon, and connectors electrically connected to other components, wherein the circuit board is configured to match the speaker 16 to avoid structural interference, but the implementation is not limited thereto.
In the present embodiment, the opening direction D1 of the sound outlet hole 12a is upward, so that the sound generated by the speaker 16 is transmitted through the sound outlet hole 12a in the opening direction D1. The opening direction D2 of the sound receiving hole 12b is horizontal and slightly inclined upward, so that the sound receiving range (shown in fig. 3 by the hatched area) of the microphone 18 is also slightly upward, which can increase the efficiency of the microphone 18 for receiving the user's voice; for example, the conference phone 1 is placed on a table (shown in fig. 3 by chain lines) and a user (not shown) sits around the table. In practice, the angle between the opening direction D1 and the opening direction D2 may be designed to be between 80 degrees and 90 degrees, so as to satisfy both the requirement of echo suppression or cancellation and the efficiency of receiving the user's voice. In addition, in the embodiment, the acoustic opening 12b (or the microphone 18) is located at two opposite sides of the device housing 12, so as to implement suppression or cancellation of echo, which can be implemented by using the existing algorithm and is not described in detail herein. In practice, the conference phone 1 may have more sound emission holes 12b (and corresponding microphones 18), and the sound emission holes 12b (and corresponding microphones 18) are disposed at an angle with respect to the center such as the hole opening direction of the sound emission hole 12 a.
In addition, in the present embodiment, the device housing 12 includes a speaker accommodating chamber 12c and a plurality of microphone accommodating chambers 12d (including but not limited to two). Each microphone accommodating chamber 12d is correspondingly communicated with one sound receiving hole 12b, and the microphone 18 is correspondingly accommodated in the microphone accommodating chamber 12 d. The speaker 16 is accommodated in the speaker accommodating chamber 12 c. In practice, the speaker housing chamber 12c and the plurality of microphone housing chambers 12d are airtight, so that the sound generated by the speaker 16 can be prevented or eliminated from being transmitted to the microphone housing chamber 12d through the inside of the device case 12, and the influence of the vibration generated when the speaker 16 operates on the device case 12 can be prevented or eliminated. In the present embodiment, the device housing 12 includes a top cover 122 and a base 124 engaged with the top cover 122. The system board 14 is fixed on the base 124 and located between the upper cover 122 and the base 124, the sound outlet 12a is formed on the upper cover 122, and the sound outlet 12b, the speaker accommodating chamber 12c, and the microphone accommodating chamber 12d are formed on the base 124. The base 124 includes a mounting opening 124a communicating with the speaker accommodating chamber 12c and aligned with the sound hole 12a, and the speaker 16 is exposed from the base 124 through the mounting opening 124 a. The outer edge of the diaphragm of the speaker 16 (for example, the outer ring supporting the diaphragm) is tightly fitted to the sound outlet hole 12 a; in the present embodiment, the speaker 16 is sealed to the sound outlet 12a by a spacer ring 20 (including but not limited to foam). Similarly, the outer edge of the diaphragm of the speaker 16 is also sealed with the mounting opening 124 a; in this embodiment, the speaker 16 is sealed to the mounting opening 124a by a spacer ring 21 (including but not limited to one made of foam). In addition, in the embodiment, the conference phone 1 further includes a dust screen 22 (including but not limited to a fabric or a sponge) and a cover 23 (including but not limited to a metal mesh or a metal mesh with a plastic frame) disposed on the upper cover 122.
Please refer to fig. 4 to fig. 6. In the embodiment, the base 124 includes an upper case 1242 and a lower case 1244, the mounting opening 124a is formed in the upper case 1242, the upper case 1242 and the lower case 1244 are connected to form the speaker accommodating chamber 12c and the plurality of microphone accommodating chambers 12d, and the system board 14 is fixed to the upper case 1242. The upper housing 1242 includes an upper wall 1242a, an outer annular wall 1242b and an upper partition 1242C, the outer annular wall 1242b is connected to the periphery of the upper wall 1242a, and the upper partition 1242C is substantially C-shaped and connected to the upper wall 1242a and the outer annular wall 1242 b. The lower housing 1244 includes a lower wall 1244a, an outer annular wall 1244b and a lower partition 1244C, the outer annular wall 1244b is connected to the periphery of the lower wall 1244a, and the lower partition 1244C is substantially a C-shaped structure and is connected to the lower wall 1244a and the outer annular wall 1244 b. The outer annular wall 1242b is connected to the outer annular wall 1244b, and the upper and lower bulkheads 1242c, 1244c are aligned and sealed together by a sound absorbing material (including but not limited to a foam pad 1246) to form a microphone chamber 12d and to make the microphone chamber 12d and the speaker chamber 12c airtight with each other.
In addition, the microphone 18 includes a circuit board 182 and a sound receiving unit 184 disposed on the front side 182a of the circuit board 182, wherein the sound receiving unit 184 faces the corresponding sound receiving hole 12 b. Disposed within the microphone receiving chamber 12d are an upper sound absorbing pad 1248, a lower sound absorbing pad 1250, a rear sound absorbing pad 1252, a left sound absorbing pad 1254 and a right sound absorbing pad 1256, which may be made of, but not limited to, foam. The upper side 182b of the circuit board 182 abuts the upper sound absorbing pad 1248, the lower side 182c of the circuit board 182 abuts the lower sound absorbing pad 1250, the back side 182d of the circuit board 182 abuts the rear sound absorbing pad 1252, the left side 182e of the circuit board 182 abuts the left sound absorbing pad 1254, and the right side 182f of the circuit board 182 abuts the right sound absorbing pad 1256. Therefore, the noise or vibration in the device case 12 can be further suppressed or eliminated from interfering with the sound receiving unit 184. In addition, in the present embodiment, the microphone 18 further includes a rubber sleeve 186 covering the sound receiving unit 184. The hole 186a of the rubber sleeve 186 also helps to suppress the noise from interfering with the sound receiving unit 184, and the rubber sleeve 186 itself also has the effect of suppressing or eliminating the vibration inside the device housing 12 from affecting the sound receiving unit 184. In addition, in practice, a dust screen 1258 (including but not limited to a fabric or sponge) is disposed in front of the sound receiving unit 184, which also has the effect of suppressing or eliminating noise outside the device housing 12. In addition, the microphone 18 is electrically connected to the system motherboard 14 through an electrical connection wire 24 (including but not limited to a flexible flat cable), and the electrical connection wire 24 is fixed along the upper housing 1242 and the system motherboard 14 (including but not limited to being implemented through a double-sided tape and an adhesive tape). Thus, vibrations (and possibly noise) that may be generated by the electrical connection wires 24 during operation of the speaker 16 may be suppressed or eliminated.
In addition, in practice, sound absorbing material (including but not limited to foam) may be disposed in the speaker accommodating chamber 12c to inhibit or eliminate the propagation of the speaker 16 in the device housing 12; for example, sound absorbing material 1259 is positioned around speaker 16 (shown in fig. 3 as a dashed cloud). In addition, in the present embodiment, a foam pad 1260 (including but not limited to foam) is also disposed under the speaker 16, which also helps to suppress or eliminate vibration (and noise) that may be generated during operation of the speaker 16.
In addition, as shown in fig. 1 and fig. 2, in the embodiment, the conference phone 1 further includes a button switch 26 disposed on the upper cover 122 and electrically connected to the system main board 14 through an electrical connection wire 28 (including but not limited to a flexible flat cable). The electrical connection wires 28 are located inside the upper cover 122 and fixed along the support of the upper cover 122 (including but not limited to, by double-sided adhesive or viscose). Thus, vibrations (and possibly noise) that may be generated by the electrical connection 28 during operation of the speaker 16 may be suppressed or eliminated. Referring to fig. 7, the top cover 122 includes a plurality of key caps 122a (including but not limited to volume up keys, volume down keys, talk off keys, bluetooth keys, power keys, etc.) disposed around the top cover 122 in an inclined manner. The system main board 14 includes a plurality of switches 142 correspondingly located under the plurality of key caps 122a, and the user presses the key caps 122a to trigger the corresponding switches 142. Each key cap 122a is a cantilever structure, and the upper cover 122 can be integrally formed (for example, by plastic injection) during the implementation. Thus, vibrations (and possibly noise) that may be generated by the key caps 122a during operation of the speaker 16 may be suppressed or eliminated.
In addition, as shown in fig. 1 to 3, the conference phone 1 further includes an external connection cable 30 (only shown in fig. 1 and 2 for simplicity), and a connector 32 (such as a USB connector) connected to an end of the external connection cable 30. The conference phone 1 can be connected to an external electronic device (e.g., a computer) through the connector 32, and can also be supplied with power through the connector 32. The base 124 of the device housing 12 includes an annular wire take-up groove 1262, and the annular wire take-up groove 1262 includes an enlarged receiving area 1262 a. Outer connecting cable 30 extends from enlarged receiving area 1262a out of base 124 and can be wound in annular winding groove 1262 so that connector 32 can be received in enlarged receiving area 1262 a. In addition, the base 124 includes a rubber pad 1264 disposed on a side wall 1262b of the annular winding groove 1262 to help wind and secure the external connection cable 30. In addition, as shown in fig. 1 to 3, the conference phone 1 further includes a ring-shaped foot pad 34 (including but not limited to rubber) fixed on the bottom surface 124b of the base 124. The annular pad 34 not only increases the friction between the conference phone 1 and the desk surface to facilitate the placement of the conference phone 1, but also has the effect of suppressing vibration.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.