CN111163610B

CN111163610B - Cooling device

Info

Publication number: CN111163610B
Application number: CN201811319111.3A
Authority: CN
Inventors: 童凯炀; 林茂青
Original assignee: Inventec Pudong Technology Corp; Inventec Corp
Current assignee: Inventec Pudong Technology Corp; Inventec Corp
Priority date: 2018-11-07
Filing date: 2018-11-07
Publication date: 2021-08-10
Anticipated expiration: 2038-11-07
Also published as: CN111163610A

Abstract

The invention discloses a cooling device, which comprises a tank body, a pipe body, a first liquid, a second liquid and a heating assembly. The groove body is provided with a groove-shaped space. The tube body has a tube body space. The tube body comprises a first end connected to the groove body and a second end. The first liquid is arranged in the groove-shaped space and the pipe body space, wherein the first liquid forms a first liquid level in the pipe body space. The second liquid is arranged in the tube space and on the first liquid level, wherein the second liquid forms a second liquid level in the tube space. The heating component is arranged in the groove-shaped space and soaked in the first liquid, so that heat energy is dissipated from the heating component to the first liquid. The first liquid level is lower than the second liquid level. The invention has lower manufacturing difficulty and engineering cost and better sealing effect.

Description

Cooling device

Technical Field

The present invention relates to a cooling device, and more particularly, to a cooling device for immersion cooling and capable of being sealed.

Background

In the conventional immersion cooling system, components such as servers, etc. in the heat sink must exchange power and signals with the outside through the connection lines, and therefore, an opening is formed in the housing of the heat sink so that the connection lines can be disposed through the opening.

In order to avoid a large escape of the vapour of the cooling liquid through the opening, a specially made connector is often provided at the opening. The connector must have a sealing function to support the passage of the connecting wires and to match the shape of the housing opening to facilitate sealing.

However, it has been found in practice that it is an engineering challenge to achieve a desired sealing effect for the connector. In addition, since the connector having a sealing effect and allowing the connection wire to pass therethrough is difficult to manufacture and install, the engineering cost caused by the connector is not easy to reduce in the related art.

Disclosure of Invention

The invention aims to provide a cooling device to solve the problems in the prior art.

The cooling device of the present invention includes:

a tank body containing a tank-shaped space;

a pipe body, which comprises a pipe body space and a first end connected with the groove body and a second end;

the first liquid is arranged in the groove-shaped space and the pipe body space, and the first liquid forms a first liquid level in the pipe body space;

the second liquid is arranged in the tube space and on the first liquid level, wherein the second liquid forms a second liquid level in the tube space; and

a heating component which is arranged in the groove-shaped space and soaked in the first liquid so as to radiate heat energy from the heating component to the first liquid;

wherein the first liquid level is lower than the second liquid level.

By adopting the technical scheme, the cooling device capable of supporting normal-pressure immersion cooling is low in manufacturing difficulty and engineering cost and good in sealing effect, so that the cooling device is helpful for improving the engineering problem in the field.

Drawings

FIG. 1 is a schematic diagram of a cooling apparatus according to an embodiment.

FIG. 2 is a schematic view of a cooling apparatus according to another embodiment.

In the drawings

100. 200 cooling device

110 trough body

110S groove space

120 tube body

120S pipe space

1201 first end

1202 second end

L1 first liquid

L11 vapor

L2 second liquid

S1 first liquid level

S2 second liquid level

Liquid level in SS tank

155 heating assembly

120A U type pipe fitting

120B horizontal pipe component

120V vertical pipe component

Theta Angle

120A1 first U-shaped pipe joint

120B1 first horizontal pipe interface

120A2 second U-shaped pipe joint

120B2 second horizontal pipe interface

120V2 first vertical pipe interface

120V2 second vertical pipe interface

33 external system

195 connecting wire

Detailed Description

In the embodiment of fig. 1, a schematic view of a cooling device 100 is shown. The cooling device 100 includes a tank 110, a tube 120, a first liquid L1, a second liquid L2, and a heat generating component 155. The groove body 110 has a groove-like space 110S. The tube 120 has a tube space 120S. The tube 120 includes a first end 1201 connected to the housing 110 and a second end 1202. The first liquid L1 is placed in the gutter-like space 110S and the tube space 120S, and the first liquid L1 forms a first liquid surface S1 in the tube space 120S. The second liquid L2 is disposed on the tube space 120S and the first liquid level S1, and the second liquid L2 forms a second liquid level S2 in the tube space 120S. The heat generating component 155 is disposed in the groove-shaped space 110S and is immersed in the first liquid L1, so that heat energy can be dissipated from the heat generating component 155 to the first liquid L1. As shown in fig. 1, the first liquid level S1 is lower than the second liquid level S2.

As shown in fig. 1, the pipe body 120 may include a U-shaped pipe member 120A and a horizontal pipe member 120B. The U-tube assembly 120A may include a first U-tube interface 120A1 and a second U-tube interface 120A2, wherein the second U-tube interface 120A2 may be located at the second end 1202 of the tube body 120. The horizontal tube member 120B may include a first horizontal tube interface 120B1 and a second horizontal tube interface 120B2, wherein the first horizontal tube interface 120B1 may be located at the first end 1201 of the tube body 120 and the second horizontal tube interface 120B2 may be connected to the first U-shaped tube interface 120a 1. The first liquid level S1 may be located in the U-tube section. The first liquid L1 forms a trough-like liquid surface SS in the trough-like space 110S. The height of the first liquid level S1 may be determined by the height of the tank liquid level SS, for example, due to the communicating tube principle, the height of the first liquid level S1 may be substantially equal to the height of the tank liquid level SS. In another embodiment, the first level S1 may be at a height that is substantially slightly above or slightly below the level SS in the tank, based on hydraulic pressure, etc. The size and degree of curvature of the bottom of the U-tube section 120A can be adjusted according to engineering requirements. U-shaped tube member 120A may also be modified to ㄩ type as desired. According to the embodiment, the height of the first liquid level S1 may not be higher than the height of the liquid level SS in the tank, and the height of the liquid level SS in the tank may be higher than the heat generating component 155.

Fig. 2 is a schematic diagram of a cooling device 200 according to another embodiment. The cooling device 200 may be similar to the cooling device 100, but the tube 120 of fig. 2 may be different from the tube 120 of fig. 1. In the embodiment of fig. 2, the tube 120 may include a vertical tube 120V and a horizontal tube 120B. The vertical tube member 120V may include a first vertical tube interface 120V1 and a second vertical tube interface 120V2, the second vertical tube interface 120V2 may be located at the second end 1202 of the tube body 120. The horizontal tube assembly 120B may be similar to that shown in fig. 1, and includes a first horizontal tube interface 120B1 and a second horizontal tube interface 120B2, wherein the first horizontal tube interface 120B1 may be located at the first end 1201 of the tube body 120, and the second horizontal tube interface 120B2 may be connected to the first vertical tube interface 120V 1. In the example of fig. 2, the first liquid level S1 can be located at the vertical pipe member 120V, the first liquid L1 can form a tank liquid level SS at the trough-like space 110S, and the height of the first liquid level S1 can be determined by the height of the tank liquid level SS, e.g., the height of the first liquid level S1 can be substantially equal to, slightly above, or slightly below the height of the tank liquid level SS. The vertical tube member 120V and the horizontal tube member 120B can be substantially perpendicular to each other or can be connected to each other at an angle theta, depending on engineering requirements. In fig. 2, portions similar to those of fig. 1 are not repeated.

According to an embodiment, the specific gravity (density) of the first liquid L1 may be greater than the specific gravity of the second liquid L2. The heat generating component 155 may have a plurality of heat dissipating plates to improve heat dissipation. As shown in fig. 1 and 2, the

cooling device

100 or 200 may further include a connection line 195 for transmitting power and/or at least one signal between the external system 33 and the heat generating component 155. The connection line 195 may include a first end coupled to the heat generating element 155 and a second end coupled to the external system 33, wherein the connection line 195 may be disposed through the tube space 120S. The connection lines 195 shown in fig. 1 and 2 are only examples, and in the embodiment, the connection lines 195 may correspond to a plurality of connection lines, or may correspond to various connection lines, such as power lines and signal lines. In fig. 1 and 2, the pipe diameter of the tube 120, the size and material of the groove 110 and the tube 120 can be adjusted according to the engineering requirement and the measurement result.

According to an embodiment, the heat generating component 155 may include, for example but not limited to, a server, a processor, an operating circuit, a motor, a fan, a system chip, a transformer, and/or any device that requires heat dissipation for operation. The external system 33 may be a system that is functionally interconnected with the heat generating component 155, such as an external circuit, an external server or a power supply system. The tank 110 may have a substantially closed structure except for the connection with the pipe 120, so that the vapor L11 of the first liquid L1 may evaporate into the space above the liquid level SS in the tank 110S, condense and drip back, and thus may not escape.

According to an embodiment, the first liquid L1 may be a non-conductive dielectric liquid and the second liquid L2 may be a low volatility liquid, for example, the second liquid L2 may be (but is not limited to) an oily liquid. To avoid affecting the transmission of power and signals, the second liquid L2 may be a non-conductive liquid. As shown in fig. 1 and 2, the second liquid L2 can substantially form a sealing layer in the tube 120 to prevent the first liquid L1 from evaporating through the tube 120. Since the second liquid L2 is injected into the tube space 120S with lower engineering difficulty and cost, and the sealing effect is better, the disadvantages caused by the prior connector can be avoided. In order to improve the heat dissipation effect, the first liquid L1 may use a low specific heat liquid.

In summary, the embodiment provides a cooling device capable of supporting normal-pressure immersion cooling, which has low manufacturing difficulty and engineering cost and better sealing effect, and thus is helpful for improving the engineering difficulty in the field.

The above-mentioned embodiments are merely preferred embodiments of the present invention, and all equivalent changes and modifications made by the claims of the present invention should be covered by the scope of the present invention.

Claims

1. A cooling apparatus, comprising:

a tank body containing a tank-shaped space;

wherein the first liquid level is lower than the second liquid level;

wherein the specific gravity of the first liquid is greater than the specific gravity of the second liquid.

2. The cooling apparatus of claim 1, wherein the tube further comprises:

a U-shaped pipe member including a first U-shaped pipe interface and a second U-shaped pipe interface at the second end of the pipe body; and

a horizontal pipe component, which comprises a first horizontal pipe interface positioned at the first end of the pipe body and a second horizontal pipe interface connected with the first U-shaped pipe interface;

the first liquid level is positioned on the U-shaped pipe part, and the first liquid forms a tank liquid level in the tank-shaped space.

3. The cooling apparatus of claim 1, wherein the tube further comprises:

a vertical pipe member including a first vertical pipe interface and a second vertical pipe interface at the second end of the pipe body; and

a horizontal pipe component, which comprises a first horizontal pipe interface positioned at the first end of the pipe body and a second interface connected with the first vertical pipe interface;

wherein the first liquid level is positioned on the vertical pipe part, and the first liquid forms a tank liquid level in the tank-shaped space.

4. The cooling device as claimed in claim 1, wherein the heat generating component has a plurality of heat dissipating plates.

5. The cooling apparatus of claim 1, further comprising:

the connecting wire is used for transmitting electric power and comprises a first wire end coupled to the heating assembly and a second wire end coupled to an external system, wherein the connecting wire is arranged through the space of the tube body.

6. The cooling apparatus of claim 1, further comprising:

the connecting wire is used for transmitting at least one signal and comprises a first wire end coupled to the heating component and a second wire end coupled to an external system, wherein the connecting wire is arranged through the space of the tube body.

7. A cooling device according to any one of claims 1 to 6, wherein the first liquid is a non-conductive dielectric liquid.

8. A cooling device according to any one of claims 1 to 6, wherein the second liquid is an oily liquid.