CN111162067A

CN111162067A - Optical coupling structure for forming laminated pattern on wafer

Info

Publication number: CN111162067A
Application number: CN201811324410.6A
Authority: CN
Inventors: 梁伟成; 张平
Original assignee: Wisetop Technology Co Ltd
Current assignee: Wisetop Technology Co Ltd
Priority date: 2018-11-08
Filing date: 2018-11-08
Publication date: 2020-05-15

Abstract

The invention discloses an optical coupling structure for forming a lamination pattern on a wafer, which comprises the wafer, a plurality of insulating layers and a plurality of light emitters, wherein the wafer has a plurality of light receivers, and a light receiving area is disposed on one side of each light receiver, in addition, each insulating layer will cover one side of each light receiver, and the transparent area on the insulating layer can at least correspond to the local light receiving area, furthermore, each light emitter is located on each insulating layer and can pass through the corresponding transparent area, and the light is projected towards the corresponding light receiving area, so that the worker in the field only needs to manufacture a plurality of light receivers, insulating layers and semi-finished products of the optical couplers formed by the light emitters on the wafer, the optical coupler semi-finished products on the wafer can be directly tested, so that the problem that the bad optical coupler semi-finished products are manufactured into the optical coupler is avoided.

Description

Optical coupling structure for forming laminated pattern on wafer

Technical Field

The invention relates to a front structure of an optical coupler, in particular to an optical coupler structure which can directly form an optical coupler semi-finished product on a wafer so as to be used for workers in the field to directly perform a good and bad test.

Background

Generally, an optical coupler (or photocoupler, optoisolator, or optoisolator) is a photoelectric conversion component that transmits electrical signals through light (e.g., visible light or infrared light) as a medium, and is generally formed by packaging a light receiver and a light emitter together, and there is no electrical or physical connection between the light receiver and the light emitter except for light.

Currently, the optical coupler is generally divided into a "left-right structure" and a "top-bottom structure", and briefly described as follows, please refer to the "left-right structure" shown in fig. 1, in which the light emitter 11 and the light receiver 12 belong to left-right relative positions in the optical coupler 1, wherein the light emitter 11 and the light receiver 12 are respectively disposed on

different brackets

13A, 13B, and the two

brackets

13A, 13B are separated from each other by a distance and do not touch each other, so that the light emitter 11 can project light toward the light receiver 12.

In addition, referring to the "up-down structure" shown in fig. 2, the light emitter 21 and the light receiver 22 belong to the upper and lower relative positions in the optical coupler 2, wherein the light emitter 21 and the light receiver 22 are also respectively disposed on

different brackets

23A, 23B, and the two

brackets

23A, 23B are separated by a distance and do not touch each other, so that the light emitter 21 can project light toward the light receiver 22. However, the optical couplers 1 and 2, whether they are of the "left-right" or "top-bottom" structure, generally suffer from the problems of too long distance between the

light emitters

11 and 21 and the light receivers 12 and 22, difficult alignment, and poor yield due to package alignment.

In addition to the above problems, since the optical coupler mainly comprises an actuating element, which is a light emitter and a light receiver, and the coupling effect between the light emitter and the light receiver is affected by the relative position error, however, the quality of the coupling effect is determined only after the optical coupler is manufactured, and therefore, most of the existing optical couplers are packaged as independent products, and the optical coupler can be detected by workers in the field, and at this time, if the coupling effect is not good, the packaging cost is wasted, and even the problem is pity.

In summary, the optical couplers of the conventional "left-right structure" and "top-bottom structure" have their drawbacks, and can be tested only after being manufactured as independent products, so how to design a new structure to effectively solve the above problems becomes an important issue to be solved by the present invention.

Disclosure of Invention

In view of the fact that the conventional optical coupler is still imperfect in terms of production and structure, the inventors finally developed and designed an optical coupler structure of the present invention in a stacked manner on a wafer through long-term research and experiments, and hopefully, the above problems could be effectively solved by the present invention.

An object of the present invention is to provide an optical coupler structure for forming a laminated pattern on a wafer, the wafer having a plurality of light receivers, a plurality of insulating layers and a plurality of light emitters, wherein one side of each light receiver has a light receiving area, and each insulating layer covers one side of each light receiver, and has a light transmitting area, each light transmitting area at least corresponds to a local light receiving area, and each light emitter is located on each insulating layer, and projects light toward the corresponding light receiving area through the corresponding light transmitting area, so as to form an optical coupler semi-finished product, and thus, since the optical coupler semi-finished product is directly located on the wafer, workers in the field can test the optical coupler semi-finished product before cutting the wafer, so as to eliminate the bad optical coupler semi-finished product, and further improve the production yield of the optical coupler manufactured by the optical coupler semi-finished product subsequently.

Drawings

For the purpose of further understanding and appreciation of the objects, technical features and effects of the invention, the embodiments will now be described in detail with reference to the accompanying drawings, in which:

FIG. 1 is a schematic view of an optical coupler of a known side-to-side configuration;

FIG. 2 is a schematic diagram of a known optocoupler of the top-bottom configuration;

FIG. 3 is a schematic view of a wafer according to the present invention;

FIG. 4 is a schematic diagram of a semi-finished optocoupler of the present invention;

FIG. 5 is a schematic view of an optical coupler of the present invention; and

FIG. 6 is a schematic view of two photosensitive assemblies according to the present invention.

In the figure:

it is known that:

optocoupler 1, 2

light emitter

11, 21

Light receiver 12, 22

holders

13A, 13B, 23A, 23B

The invention comprises the following steps:

wafer 3 optical coupler semi-finished product 3A optical receiver 31

Second connecting pins 312 of light receiving regions 311 of the

photosensitive cells

313A and 313B

First connecting pin 351 of light emitter 35 of insulating layer 33 and cutting channel 37

Holders

38A, 38B

Detailed Description

The present invention is an optical coupling structure formed on a wafer in a stacked manner, and please refer to fig. 3, in an embodiment, a wafer 3 has a plurality of optical receivers 31, and a technical means for forming a multilayer circuit and a module on a silicon wafer is a known technique, and therefore, will not be described herein, as long as the wafer 3 can form a circuit related to each optical receiver 31. In addition, the wafer 3 referred to in the present invention also includes a partial wafer pattern that is not completely singulated, that is, the wafer 3 of the present invention is the one as long as a plurality of light receivers 31 can be formed on a silicon wafer.

Referring to fig. 3, a light receiving area 311 is disposed on one side of each light receiver 31 to receive light from the outside, a plurality of insulating layers 33 are covered on one side of each light receiver 31, and each insulating layer 33 is disposed with a light transmitting area corresponding to a local light receiving area 311, which will be described in brief:

(1) the insulating layer 33 is made of a light-transmitting material (e.g., glass, plastic, insulating oil, MICA (MICA), silicon carbide (SiC), and silicon nitride (Si)₃N₄) Etc.) to naturally form the light-transmitting region;

(2) the insulating layer 33 is made of opaque material, and has a hollow hole corresponding to the position of all or part of the light receiving region 311 to form the light transmitting region;

(3) the insulating layer 33 is made of a light-transmitting material and covered with a light-impermeable film layer corresponding to the position outside the whole or partial light-receiving region 311;

(4) the insulating layer 33 is formed by combining opaque material and transparent material, and the transparent material is located at the position corresponding to all or part of the light receiving region 311 to form the transparent region.

Referring to fig. 3, a plurality of light emitters 35 (e.g., LEDs) are respectively disposed on the insulating layers 33, in order to achieve a good insulating effect, the area of the light emitters 35 is not larger than that of the insulating layers 33, and in this embodiment, the light emitters 35 can be fixed on the insulating layers 33 by a transparent adhesive, but in other embodiments of the present invention, this is not limited thereto, and workers in the field can adopt other fixing manners according to the product requirements. The light emitter 35 can project light toward the corresponding light receiving area 311 through the corresponding light transmitting area, that is, as long as the light generated by the light emitter 35 can penetrate through the insulating layer 33 and be received by the corresponding light receiver 31, the light emitting ranges of the light receiving area 311, the light transmitting area and the light emitter 35 can be adjusted according to actual product requirements, which is also described herein. In addition, when the light emitter 35 is fixed to the insulating layer 33 by a transparent adhesive, the refractive index of the transparent adhesive is between the refractive index of the substrate (e.g., LED substrate) of the light emitter 35 and the refractive index of the insulating layer 33, so that the light receiver 31, the insulating layer 33 and the light emitter 35 can form a semi-finished optical coupler 3A, as shown in fig. 4 and 5, a worker in the art can obtain a plurality of semi-finished optical couplers 3A (as shown in fig. 4) by cutting the wafer 3, and then perform subsequent processing on each semi-finished optical coupler 3A to form the optical coupler (as shown in fig. 5).

Referring to fig. 3, in the embodiment, a cutting street 37 is disposed between two adjacent light receivers 31 on the wafer 3, and a worker in the art only needs to cut each cutting street 37 to avoid damaging the light receivers 31, but in other embodiments of the invention, the wafer 3 may not be provided with the cutting street 37 as long as the formed optical coupling semi-finished product 3A has the expected efficacy after the wafer 3 is cut. In addition, the light emitter 35 can be provided with at least one first connection pin 351, the first connection pin 351 can be used for electrically connecting the light emitter 35 with a corresponding circuit on one bracket 38A (as shown in fig. 5) when the optical coupler is subsequently produced, and the light receiver 31 can also be provided with at least one second connection pin 312, and the second connection pin 312 can be used for electrically connecting the light receiver 31 with a corresponding circuit on the other bracket 38B (as shown in fig. 5) when the optical coupler is subsequently produced.

Further, referring to fig. 3 and fig. 6, in the embodiment, the light receiver 31 can have two

light sensing units

313A and 313B, and the

light sensing units

313A and 313B can form the light receiving region 311, wherein the light sensing unit 313A can be used as a receiving element, that is, the light sensing unit 313A is mainly used for receiving the light of the light emitter 35, and the other light sensing unit 313B is used as a reference element, and the reference element is disposed around the receiving element (as shown in fig. 6) to improve the operation accuracy and sensitivity of the optical coupler. In addition, in order to improve the light receiving efficiency of the light receiver 31, the insulating layer 33 may be provided with a scattering structure, for example, a groove, an inclined plane, or the like is provided on the insulating layer 33, or particles are embedded in the insulating layer 33, or a reflective layer is provided at a position of the insulating layer 33 or the light receiver 31 not corresponding to the light transmitting region, so as to reflect or refract the light emitted by the light emitter 35.

In summary, through the integral structure of the present invention, the staff in the art can directly form the stacked opto-coupler semi-finished products 3A on the wafer 3, and directly test each opto-coupler semi-finished product 3A before the wafer 3 is cut to check whether the light receiver 31 and the light emitter 35 can normally operate, so that the convenience of the test can be improved, and the bad opto-coupler semi-finished products 3A can be eliminated without performing the subsequent related packaging process of the opto-coupler, so as to avoid consuming other materials required for producing the opto-coupler. In addition, because the optical receiver 31 and the light emitter 35 are separated by the insulating layer 33, in the design, for the optical coupler with the known left-right structure or the known up-down structure, workers in the field can effectively reduce the whole volume of the optical coupler only by controlling the thickness of the insulating layer 33, and the alignment of the optical receiver 31 and the light emitter 35 is easier and more accurate than the suspended alignment of the optical coupler with the up-down structure, so that the optical coupler semi-finished product 3A has better production yield when being manufactured into the optical coupler subsequently.

The above description is only for the preferred embodiment of the present invention, but the scope of the claims of the present invention is not limited thereto, and those skilled in the art can easily conceive equivalent changes based on the disclosure of the present invention without departing from the protection scope of the present invention.

Claims

1. A light coupling structure forming a laminate pattern on a wafer, comprising:

a wafer, on which a plurality of light receivers are arranged, one side of each light receiver is respectively provided with a light receiving area;

a plurality of insulating layers respectively covering one side surface of each light receiver and respectively provided with a light-transmitting area, wherein each light-transmitting area at least can respectively correspond to a local light-receiving area of each light receiver; and

and multiple light emitters respectively disposed on the insulating layers and capable of projecting light toward the corresponding light receiving regions through the corresponding light transmitting regions.

2. The optical coupler structure of claim 1, wherein the insulating layer is made of a light-transmitting material as a whole.

3. The optical coupler structure of claim 1, wherein the insulating layer is made of opaque material, and a hollow hole is formed in the insulating layer, and the hollow hole is used as a light transmission area of the insulating layer.

4. The optical coupler structure of claim 1, wherein the insulating layer is made of a light-transmitting material, and a light-impermeable film is coated on the non-light-transmitting area.

5. The optical coupler structure of claim 1, wherein the insulating layer is formed by combining an opaque material and a transparent material, and the transparent material is used as a transparent area of the insulating layer.

6. A light coupling structure according to any one of claims 1 to 5, wherein the light emitter is provided with at least one first connection pin.

7. The light coupling structure of claim 6, wherein the light emitter is fixed to the insulating layer by a light transmissive adhesive having a refractive index between a substrate refractive index of the light emitter and a refractive index of the insulating layer.

8. The light coupling structure of claim 7, wherein a cut is provided between two adjacent light receivers on the wafer.

9. The light coupling structure according to claim 8, wherein the light receiver has two light sensing units, one of which serves as a receiving assembly and the other of which serves as a reference assembly, and the reference assembly is disposed around the receiving assembly.

10. The light coupling structure of claim 2 or 4, wherein a reflective layer is disposed on the insulating layer at a position not corresponding to the light transmitting region.