CN110836567A

CN110836567A - Refrigeration heat preservation collection device

Info

Publication number: CN110836567A
Application number: CN201911023273.7A
Authority: CN
Inventors: 欧先金; 李雪梅
Original assignee: Institute of Biophysics of CAS
Current assignee: Institute of Biophysics of CAS
Priority date: 2019-10-25
Filing date: 2019-10-25
Publication date: 2020-02-25

Abstract

The invention discloses a refrigeration heat-preservation collecting device. The refrigeration heat preservation collection device comprises an inner metal heat conduction inner container, an outer heat insulation layer and a refrigeration unit, wherein the cold end of the refrigeration unit is connected with the inner metal heat conduction inner container, the hot end of the refrigeration unit is located on the outer side of the heat insulation layer, more than one object placing hole is formed in the top end of the inner metal heat conduction inner container, a condensate water channel is formed in the lower portion of the inner metal heat conduction inner container, and the lower portion of the object placing hole is communicated with the condensate water channel. The metal heat conduction inner container, the heat insulation layer and the external cooling unit are matched to form the refrigeration and heat insulation collecting device, so that the temperature of the metal heat conduction inner container can be rapidly reduced, and a sample can be rapidly cooled.

Description

Refrigeration heat preservation collection device

Technical Field

The invention relates to a cooling device, in particular to a refrigeration heat-preservation collecting device.

Background

In many industries such as biology, medicine, food, fermentation engineering and chemical engineering, especially in the links of scientific research and development and optimization of process parameters, a target liquid system to be researched needs to be tracked and analyzed in real time, for example, fermentation liquor in fermentation engineering needs to be continuously tracked and analyzed for dozens of hours, the change conditions of the concentrations (raw materials and products) of various component substances in the fermentation liquor are analyzed, the best process control parameters are found, and further, the production cost is reduced. However, manual sampling cannot guarantee sampling and analysis at any time, for example, a certain sampling time period is night, the sample is not convenient to take out and analyze at once, the sample needs to be refrigerated (the low temperature can avoid the sample liquid from continuing to react), and the analysis operation is performed next day. Other industries such as chemical engineering have many similar needs for sample refrigeration.

When manual sampling cannot be analyzed in time, the traditional solution is to refrigerate the sample by a refrigerator, take a certain volume of sample liquid from a target system at a preset time point, and refrigerate the sample liquid in the refrigerator for analysis the next day. The advantage of this method is that it can be realized without additional investment in equipment, and the disadvantage is also obvious, the refrigeration speed of the sample in the refrigerator is slow, usually it takes several hours to reduce to 4 degree centigrade (during the cooling period, the sample liquid will continue to react and further affect the analysis value of the component).

Currently, there are also devices that automatically remove sample fluid from a target container into a collection tray that is similar to a tube rack structure, and that are refrigerated by placing the entire collection tray in a closed, low temperature space, via an air bath. The air bath refrigeration is generally refrigeration, the minimum temperature is about 4 ℃, the sample refrigeration speed is not fast enough, and the freezing effect cannot be achieved. The subsequent sample analysis value does not correctly reflect the true component ratio of the sample liquid at the sampling time point.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: on one hand, the cooling speed of cooling equipment such as a refrigerator is low, and the cooling time is long; on the other hand, the heat conduction rate of the target container placed on the test tube rack is low, and the cooling time is further prolonged.

The invention utilizes the combination of fast heat conduction of internal metal and slow heat conduction of the external heat-insulating layer to design the collecting device, and then combines with an external refrigerating unit, so that the whole collecting device can rapidly reach a very low temperature state.

Specifically, the invention provides the following technical scheme:

the invention provides a refrigeration and heat preservation collecting device which comprises a metal heat conduction inner container on an inner layer, a heat insulation layer on an outer layer and a refrigeration unit, wherein the cold end of the refrigeration unit is connected with the metal heat conduction inner container, the hot end of the refrigeration unit is positioned on the outer side of the heat insulation layer, more than one object placing hole is formed in the top end of the metal heat conduction inner container, a condensate water channel is formed in the lower part of the metal heat conduction inner container, and the lower part of the object placing hole is communicated with the condensate water channel.

Preferably, in the refrigeration, insulation and collection device, the refrigeration unit is selected from one or more of a semiconductor refrigeration unit, a compression refrigeration unit and an absorption refrigeration unit.

Preferably, in the refrigeration, heat preservation and collection device, the refrigeration unit includes a semiconductor refrigeration unit, and the semiconductor refrigeration unit includes a semiconductor refrigeration sheet;

preferably, the cold end of the semiconductor refrigeration piece is tightly attached to the outer side of the metal heat conduction inner container, and more preferably, the hot end of the semiconductor refrigeration piece is connected with the cold end of a compression refrigeration unit or an absorption refrigeration unit;

more preferably, the cold end of the semiconductor refrigeration piece is tightly attached to the bottom surface of the metal heat-conducting inner container; more preferably, the cold end of the semiconductor refrigeration piece is tightly attached to a raised platform arranged on the bottom surface of the metal heat-conducting inner container; more preferably, the raised platform and the metal heat-conducting inner container are of an integrated structure.

Preferably, in the refrigeration, heat preservation and collection device, the refrigeration unit includes a cooling water circulation system, the cooling water circulation system includes a heat exchanger, and the hot end of the semiconductor refrigeration sheet is connected to the heat exchanger;

preferably, the cooling water circulation system includes a heat exchanger, a circulation pump, a radiator, and a cooling water collection tank.

Preferably, in the refrigeration, insulation and collection device, the condensed water channel includes a first condensed water channel and a second condensed water channel, wherein the first condensed water channel is communicated with the storage hole and the second condensed water channel;

preferably, the second condensed water channel is positioned below the first condensed water channel and penetrates through the metal heat-conducting inner container;

more preferably, the second condensate water channel penetrates through the first side wall of the metal heat conduction inner container, and does not penetrate through the side wall opposite to the first side wall of the metal heat conduction inner container.

Preferably, in the refrigeration, insulation and collection device, the condensate passage includes a transverse third condensate passage, and the third condensate passage communicates the first condensate passage and the second condensate passage; preferably, the third condensed water channel is communicated with all the second condensed water channels;

more preferably, the third condensed water channel penetrates through the metal heat-conducting inner container;

more preferably, the third condensed water channel penetrates through the second side wall of the metal heat-conducting liner, but does not penetrate through the opposite side wall of the second side wall of the metal heat-conducting liner;

more preferably, there is only one of the third condensate channels.

Preferably, in the refrigeration, insulation and collection apparatus, the metal heat-conducting inner container is provided with a sealing element for sealing a hole formed by the second condensed water channel penetrating through the metal heat-conducting inner container, and preferably, the sealing element is selected from a cover and/or a plug.

Preferably, in the refrigeration, heat preservation and collection device, the metal heat conduction inner container is provided with a thermometer hole.

Preferably, in the refrigeration and heat preservation collecting device, the metal is selected from copper, aluminum or stainless steel; preferably, the metal is selected from aluminium.

Preferably, in the refrigeration, heat preservation and collection device, the outer heat preservation layer wraps the side wall of the metal heat conduction inner container, preferably, the outer heat preservation layer wraps the outer wall of the metal heat conduction inner container, the outer heat preservation layer leaves an opening of the storage hole 1, more preferably, the outer heat preservation layer is selected from heat preservation felt, heat preservation cotton and/or heat preservation resin, preferably acrylonitrile-butadiene-styrene engineering plastic.

The beneficial effects of the invention include:

1. the metal heat-conducting inner container and the external cooling unit are matched to form the refrigeration, heat-preservation and collection device, so that the temperature of the metal heat-conducting inner container can be rapidly reduced, and a sample can be rapidly cooled.

2. The metal heat conduction inner container is provided with the object placing hole and the condensed water channel, the object placing hole increases the contact area between the sample container and the metal heat conduction inner container, and the condensed water channel prevents the sample container from being pushed out of the object placing hole due to the increase of the volume after the condensed water is frozen when the temperature is too low.

Drawings

Fig. 1 is a top view of the metal heat-conducting liner in embodiment 1, in which 10 is the metal heat-conducting liner, 1 is a storage hole, 2 is a first condensed water channel, 3 is a second condensed water channel, 4 is a third condensed water channel, 5 is a condensed water discharge port, and 6 is a threaded hole.

Fig. 2 is a cross-sectional view of the metal heat-conducting inner container in example 1, where 10 is the metal heat-conducting inner container, 1 is a storage hole, 2 is a first condensed water channel, 3 is a second condensed water channel, 5 is a condensed water discharge port, 6 is a threaded hole, 7 is a thermometer hole, 8 is a plug, and 9 is a heat-conducting platform.

Fig. 3 is an installation schematic diagram of the metal heat-conducting inner container and the heat-insulating layer in embodiment 1, in which 10 is the metal heat-conducting inner container, 1 is a storage hole, 2 is a first condensed water channel, 3 is a second condensed water channel, 7 is a thermometer hole, 8 is a plug, 9 is a heat-conducting platform, and 16 is the heat-insulating layer.

Fig. 4 is a refrigeration, heat preservation and collection device in application example 1, in which 10 is a metal heat conduction inner container, 11 is a semiconductor refrigeration sheet, 12 is a water-cooling heat exchanger, 13 is a circulation pump, 14 is a radiator, and 15 is a cooling water collection tank.

Fig. 5 is a cooling temperature curve of the metal heat-conducting inner container in application example 1.

Fig. 6 is a cooling temperature profile of the sample in application example 1.

Detailed Description

The technical scheme of the invention is clearly and completely described in the following with reference to the accompanying drawings. Obviously, all other embodiments obtained by a person skilled in the art without making creative efforts based on the specific embodiments of the present invention belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Unless otherwise specified, the terms "center," "top," "bottom," "upper," "lower," "left," "right," "vertical," "horizontal," "longitudinal," "lateral," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in FIG. 2, merely for convenience in describing and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

The terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as being of relative importance.

The term "cold side" or "cold side" refers to the heat sink side and "hot side" or "hot side" refers to the heat sink side.

In the preferred technical scheme of the invention, the collecting device comprises a collecting module formed by combining the metal heat-conducting inner container on the inner layer and the heat-insulating layer on the outer layer. According to specific sample requirements, collecting holes with different numbers are designed on the upward surfaces of the metal heat conduction inner container and the heat insulation layer of the collecting module and are used for placing collecting pipes/collecting bottles for collecting liquid. The bottom surface of the collecting device is provided with a heat exchange surface matched with the external refrigeration unit. In addition, the collecting device is provided with a condensed water discharge pipeline design for discharging the condensed water generated in use at any time.

The inner layer of the collection module is made of a metal material with high heat conduction speed, and the metal material with a high specific heat value can increase thermal inertia and improve the refrigeration effect. Meanwhile, the difficulty of processing is considered, and metal aluminum is preferably adopted as an inner layer material of the collecting tray.

The heat insulating layer with a certain thickness is designed outside the core metal heat conducting inner container, and various polymer plastics can be selected by considering the comprehensive factors of heat insulating performance, processing difficulty, high cost, appearance and the like.

When the collecting device is used, the metal heat-conducting inner container is connected with an external refrigeration circulation system (a semiconductor refrigeration system or a cooling water circulation system) through the bottom, the refrigeration system is started, the metal heat-conducting inner container in the collecting tray containing the collecting pipe/collecting bottle is rapidly refrigerated until a preset cooling temperature is reached, such as zero centigrade, and the temperature of the collecting pipe/collecting bottle is also zero centigrade at the moment. The corresponding heat-insulating layer design is arranged around the metal heat-conducting inner container, so that the whole system can be placed in a room temperature environment for long-term use, and the metal heat-conducting inner container can also be kept in a low-temperature state for a long time.

With conventional automatic sampling equipment, a small sample (typically 5-10 ml) is withdrawn at a predetermined point in time and collected in a predetermined, cooled collection tube/bottle in a collection tray, and the sample is cooled to a set low temperature within 2-3 minutes.

The rapid refrigeration and insulation device of the present invention is illustrated by the following specific examples.

Example 1

Fig. 4 shows the rapid refrigeration and heat preservation device in embodiment 1, which includes an inner metal heat-conducting inner container 10, an outer heat-insulating layer 16, and a refrigeration unit, where the refrigeration unit includes a semiconductor refrigeration sheet and a cooling water circulation system, and a cold end of the semiconductor refrigeration sheet is connected to the bottom heat-conducting platform 9 of the metal heat-conducting inner container 10.

Fig. 1 and 2 are schematic diagrams of a metal heat conduction inner container 10, wherein an object hole 1 is arranged at the top end of the metal heat conduction inner container 10, a condensed water channel is arranged at the lower part of the metal heat conduction inner container 10, and the condensed water channel is communicated with the lower part of the object hole 1.

Fig. 3 is an installation schematic diagram of the metal heat-conducting inner container 10 and the outer heat-insulating layer 16, the outer heat-insulating layer 16 wraps the outer side of the metal heat-conducting inner container 10, an opening corresponding to the heat-conducting platform 9 is reserved at the bottom of the outer heat-insulating layer 16, and an opening corresponding to the storage hole 1 is reserved at the top of the outer heat-insulating layer 16.

The metal heat conduction inner container 10 is made of a metal aluminum material, the specific size is as shown in fig. 1, the peripheral size of the metal heat conduction inner container 10 is 120 × 56mm (mm, the same below), and 4 × 16 collecting holes 1 are designed to be uniformly arranged for placing collecting bottles, the hole center spacing is 30mm, and the inner diameter of each collecting hole 1 is 23mm and the depth is 32 mm. And a semi-through hole with the inner diameter of 6mm and the depth of 16mm is drilled downwards at the bottom of each collecting hole 1 to form a first condensate water channel 2.

At the left side of metal heat conduction inner bag 10 and upper surface 45mm department down, and aim at the collection hole center, beat the half through-hole that the degree of depth is about 108mm to the right again, the downthehole diameter 6mm of hole. A total of 4 half-through holes form the second condensate channel 3, as indicated by the 4 transverse thin dashed lines in fig. 1. Then, 4 openings (plugs 8 in fig. 2) on the left side of the metal block in fig. 1 are plugged by cylinders with the outer diameter of 6mm and the length of 10mm, and the holes are arranged at the corresponding positions on the back side in the metal heat-conducting inner container 10: the upper surface is 45mm downward, is aligned with the centers of the leftmost columns of the collecting holes, and is downwards drilled with a half through hole with the depth of about 108mm to form a third condensate water channel 4 with the inner diameter of 6mm, and the half through hole connects the 4 through holes with the depth of 108mm, so that the bottoms of the 16 collecting holes are completely connected, and only one discharge port is provided, such as a condensate water discharge port 5 in figure 1.

The upper surface (shown in figure 1) of the metal heat-conducting inner container 10 is provided with 3M 4 internal thread holes 6 (delta-shaped) for fixing the corresponding heat-insulating layer 16 outside. The 4 side surfaces are also provided with 3 similar M4 internal thread holes 6 respectively, which are used for fixing the corresponding external heat insulation layer 16.

The bottom of the metal heat conducting inner container 10 is provided with a heat conducting platform 9 (fig. 2) with 70 × 6mm, which is used as a heat exchange surface and is tightly installed in an external refrigeration system, such as a cold surface of a semiconductor refrigeration sheet, and when the heat conducting platform 9 and the cold surface of the semiconductor refrigeration sheet 11 are installed, heat conducting paste is usually used for tightly attaching the heat conducting platform 9 and the cold surface to increase heat transfer efficiency.

The periphery of the metal heat-conducting inner container 10 is wrapped by an ABS material (acrylonitrile (a) -butadiene (B) -styrene (S), ABS for short, the same below) heat-insulating layer 16 with a thickness of 15mm, as shown in fig. 3.

Application example 1

An assembled metal heat conduction inner container 10 and a heat insulation layer (the heat insulation layer is not shown) are connected with an external semiconductor refrigeration system according to the structure shown in figure 4, a semiconductor refrigeration piece 11 adopts 24v direct current voltage, a circuit is 15 amperes, the area is 55mm, the cold surface of the semiconductor refrigeration piece 11 is in compression contact with a heat exchange platform at the bottom of the metal heat conduction inner container 10 through heat conduction silica gel, and the hot surface of the refrigeration piece is in compression contact with a water-cooling heat exchanger 12 through the heat conduction silica gel. The liquid (water) in the external cooling system is circulated in the system by a circulation pump 13. After the starting-up operation, the heat of the metal heat conducting inner container 10 in the collecting device is quickly transferred from the cold surface (the upper side surface of the semiconductor) to the hot surface (the lower side surface of the semiconductor) by the semiconductor refrigerating sheet 11, and then the heat is taken away by the water passing through the heat exchanger 12. The circulating water after the temperature rise flows through the pipeline and the radiator 14, the heat is taken away to reduce the temperature, and then the circulating water passes through the heat exchanger 12 again to perform the next temperature reduction cycle. The temperature of the metal heat conduction inner container 10 is lower and lower until the heat taken away by the refrigeration heat preservation collecting device is equal to the heat absorbed by the refrigeration heat preservation collecting device, and then the temperature of the metal heat conduction inner container 10 is kept unchanged at a certain low temperature state.

The experimental result is that the temperature of the metal heat-conducting inner container is reduced to minus 15 ℃ in an environment with the room temperature of 24 ℃, which takes about 1 hour, as shown in fig. 5.

The temperature of the metal heat conduction inner container is set to be 0 ℃ constantly, then 10 milliliters of the sample is automatically sampled from a 37-DEG C fermentation tank, the sample temperature is reduced at a speed shown in figure 6, the temperature of the sample can be reduced to be 0 ℃ within 2 minutes, and the cooling speed of the refrigerator is fast compared with that of manual sampling (the refrigeration of the refrigerator takes several hours).

As can be seen from the application example, the temperature of the collecting device reaches at least minus 15 ℃ in a room temperature environment, and the sample liquid can be rapidly cooled to the set temperature within a few minutes.

Claims

1. The utility model provides a refrigeration heat preservation collection device, its characterized in that, collection device includes metal heat conduction inner bag (10) of inlayer, outer thermal-insulated heat preservation (16) and refrigerating unit, wherein, refrigerating unit's cold junction connection metal heat conduction inner bag (10), the top of metal heat conduction inner bag (10) sets up more than one and puts thing hole (1), metal heat conduction inner bag (10) lower part sets up the comdenstion water passageway, put thing hole (1) below intercommunication comdenstion water passageway, preferably, refrigerating unit's hot junction is located thermal-insulated heat preservation (16) outside.

2. The refrigeration heat preservation collecting device of claim 1, wherein the refrigeration unit is selected from one or more of a semiconductor refrigeration unit, a compression refrigeration unit, and an absorption refrigeration unit.

3. The refrigerated insulation collection device of claim 2 wherein the refrigeration unit comprises a semiconductor refrigeration unit comprising a semiconductor refrigeration plate (11);

preferably, the cold end of the semiconductor refrigeration piece is tightly attached to the outer side of the metal heat conduction inner container, and more preferably, the hot end of the semiconductor refrigeration piece (11) is connected with the cold end of a compression refrigeration unit or an absorption refrigeration unit;

more preferably, the cold end of the semiconductor refrigeration piece is tightly attached to the bottom surface of the metal heat-conducting inner container; more preferably, the cold end of the semiconductor refrigeration sheet (11) is tightly attached to a raised platform (9) arranged on the bottom surface of the metal heat conduction inner container (10); more preferably, the raised platform (9) and the metal heat-conducting inner container (10) are of an integrated structure.

4. The refrigeration insulation collecting device according to claim 3, wherein the refrigeration unit comprises a cooling water circulation system, the cooling water circulation system comprises a heat exchanger (12), and the hot end of the semiconductor refrigeration sheet (11) is connected with the heat exchanger (12);

preferably, the cooling water circulation system includes a heat exchanger (12), a circulation pump (13), a radiator (14), and a cooling water collection tank (15).

5. The refrigerated insulation collection device according to any of claims 1-4 wherein the condensate passage comprises a first longitudinal condensate passage (2) and a second transverse condensate passage (3), wherein the first condensate passage (2) communicates with the deposit hole (1) and the second condensate passage (3);

preferably, the second condensate water channel (3) is positioned below the first condensate water channel (2) and penetrates through the metal heat conduction inner container (10);

more preferably, the second condensate water channel (3) penetrates through a first side wall of the metal heat-conducting liner (10) and does not penetrate through an opposite side wall of the first side wall of the metal heat-conducting liner (10).

6. The refrigerated insulation collection device of claim 5 wherein the condensate passage comprises a transverse third condensate passage (4), the third condensate passage (4) communicating the first condensate passage (2) and the second condensate passage (3); preferably, the third condensate passage (4) communicates with all the second condensate passages (3);

more preferably, the third condensed water channel (4) penetrates through the metal heat conduction inner container (10);

more preferably, the third condensed water channel (4) penetrates through the second side wall of the metal heat-conducting liner (10) and does not penetrate through the side wall opposite to the second side wall of the metal heat-conducting liner (10);

more preferably, there is only one of said third condensate channels (4).

7. The collecting device of claim 5 or 6, wherein the metallic heat-conducting inner container (10) is fitted with a closure element closing the hole formed by the second condensate passage (3) through the metallic heat-conducting inner container, preferably the closure element is selected from a lid and/or a plug (8).

8. Refrigeration insulation collecting device according to any of the claims 1-7, wherein the metal heat conducting inner container (10) is provided with a thermometer hole (7).

9. The refrigerated insulation collection device of any of claims 1 to 8, wherein the metal is selected from copper, aluminum or stainless steel; preferably, the metal is selected from aluminium.

10. The refrigerated thermal insulation collection device according to any one of claims 1 to 9, wherein the outer layer of thermal insulation (16) wraps the side wall of the metal thermal conductive liner (10), preferably the outer layer of thermal insulation (16) wraps the outer wall of the metal thermal conductive liner (10), the outer layer of thermal insulation (16) leaves an opening for the storage hole (1), more preferably the outer layer of thermal insulation (16) is selected from thermal insulation felt, thermal insulation cotton and/or thermal insulation resin, preferably acrylonitrile-butadiene-styrene engineering plastic.