CN110828513B - OLED display panel, manufacturing method thereof and OLED display device - Google Patents

OLED display panel, manufacturing method thereof and OLED display device Download PDF

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CN110828513B
CN110828513B CN201911013776.6A CN201911013776A CN110828513B CN 110828513 B CN110828513 B CN 110828513B CN 201911013776 A CN201911013776 A CN 201911013776A CN 110828513 B CN110828513 B CN 110828513B
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layer
electro
oled display
display panel
deformation
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CN110828513A (en
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孙佳佳
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application provides an OLED display panel, includes: a first flexible substrate; the first barrier layer is arranged on the first flexible substrate; the electro-deformation layer is arranged on the first barrier layer, a circuit pattern is arranged on the electro-deformation layer, and the circuit pattern is connected with the chip; the array section film layer is arranged on the electrorheological layer; the electroluminescent layer is arranged on the array section film layer; the thin film packaging layer is arranged on the electroluminescent layer; when the chip transmits a stimulation signal to the circuit pattern, the electro-deformation layer deforms, so that the OLED display panel deforms. The electro-deformation layer provided with the circuit patterns is additionally arranged, the circuit patterns are connected with the chip, different stimulation signals are transmitted to the circuit patterns through the chip, the electro-deformation layer is enabled to generate different deformations, and then various deformation modes of the OLED display panel are achieved.

Description

OLED display panel, manufacturing method thereof and OLED display device
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to an OLED display panel, a manufacturing method thereof, and an OLED display device.
Background
An Organic Light-Emitting Diode (OLED) display panel is a display panel made of Organic Light-Emitting diodes, and has the advantages of self-Emitting Organic electroluminescent diodes, no need of a backlight source, high contrast, thin thickness, wide viewing angle, fast response speed, applicability to flexible panels, wide application temperature range, simple structure and process, and the like, so the OLED display panel is considered as a new application technology of a next generation flat panel display, particularly the characteristic that the OLED display panel can be bent, and is a great advantage of the OLED display panel.
At present, the OLED display panel is widely applied to high-end mobile phones, and many mobile phone manufacturers release novel foldable mobile phones, however, the folding mode of the current OLED display panel needs to be folded and unfolded by applying external force, and the deformation mode is single, so that the application of the foldable display device is limited.
Disclosure of Invention
The application provides an OLED display panel, a manufacturing method thereof and a display device, and aims to solve the problems that an external force needs to be applied to fold and unfold in a folding mode of the current OLED display panel and a deformation mode is single.
In order to solve the above problem, an embodiment of the present application provides an OLED display panel, including:
a first flexible substrate;
the first barrier layer is arranged on the first flexible substrate;
the electro-deformation layer is arranged on the first barrier layer, a circuit pattern is arranged on the electro-deformation layer, and the circuit pattern is connected with a chip;
an array segment film layer disposed on the electro-deformable layer;
the electroluminescent layer is arranged on the array segment film layer;
the thin film packaging layer is arranged on the electroluminescent layer;
when the chip transmits a stimulation signal to the circuit pattern, the electro-deformation layer deforms, so that the OLED display panel deforms.
In the OLED display panel of the present application, the material of the electro-deformable layer includes a polypyrrole/polylactic acid cellulose film.
In the OLED display panel of the present application, the deformation mode of the electro-deformable layer includes U-shaped deformation, S-shaped deformation, or curl deformation.
In the OLED display panel, the thin film encapsulation layer comprises a first inorganic layer, an organic buffer layer and a second inorganic layer which are sequentially stacked.
In the OLED display panel of the present application, the OLED display panel further includes a second blocking layer disposed between the electro-deformable layer and the array segment film layer.
In the OLED display panel of the present application, the OLED display panel further includes a second flexible substrate disposed between the first blocking layer and the electro-deformable layer.
In order to solve the above problem, an embodiment of the present application further provides a method for manufacturing an OLED display panel, including:
providing a first flexible substrate;
forming a first barrier layer on the first flexible substrate;
forming an electro-deformation layer on the first barrier layer, wherein a circuit pattern is arranged on the electro-deformation layer and connected with a chip;
forming an array segment film layer on the electro-deformable layer;
forming an electroluminescent layer on the array segment film layer;
forming a thin film encapsulation layer on the electroluminescent layer;
when the chip transmits a stimulation signal to the circuit pattern, the electro-deformation layer deforms, so that the OLED display panel deforms.
In the method of manufacturing an OLED display panel of the present application, the step of forming an electro-deformable layer on the first barrier layer includes:
forming a polypyrrole/polylactic acid cellulose film on the first barrier layer;
and patterning the polypyrrole/polylactic acid cellulose film to form an electro-deformation layer.
In the method of manufacturing an OLED display panel of the present application, after forming an electro-deformable layer on the first barrier layer, the method further includes: forming a second barrier layer on the electro-deformable layer;
the step of forming an array segment film layer on the electro-deformable layer comprises: and forming an array section film layer on the second barrier layer.
In order to solve the above problem, an embodiment of the present application further provides an OLED display device, including a chip and any one of the above OLED display panels, where the chip provides a driving voltage to the OLED display panel.
The beneficial effect of this application does: be different from prior art, the OLED display panel that this application provided is provided with the electro-deformation layer of circuit pattern through increasing to be connected circuit pattern and chip, thereby transmit different stimulus signal through the chip to circuit pattern, make the electro-deformation layer produce different deformations, and then realize OLED display panel's multiple deformation mode.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic front view of an OLED display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic front view illustrating an OLED display panel according to an embodiment of the present disclosure;
fig. 3 is a schematic top view of an electro-deformable layer provided with a circuit pattern according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram illustrating a deformation mode of an electro-deformable layer according to an embodiment of the present application;
fig. 5 is a schematic flowchart of a method for manufacturing an OLED display panel according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of an OLED display device according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.
Directional phrases used in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., refer only to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals.
It should be noted that the thicknesses and shapes of the respective layers in the drawings of the present invention do not reflect actual proportions, and are merely illustrative of the contents of the embodiments of the present application.
At present, the OLED display panel is widely applied to high-end mobile phones, and many mobile phone manufacturers release novel foldable mobile phones, however, the folding mode of the current OLED display panel needs to be folded and unfolded by applying external force, and the deformation mode is single, so that the application of the foldable display device is limited. In order to solve the above technical problem, the present application provides an OLED display panel.
Referring to fig. 1, fig. 1 is a schematic front view structure diagram of an OLED display panel according to an embodiment of the present disclosure. As shown in fig. 1, the OLED display panel 10 includes a first flexible substrate 11, a first barrier layer 12, an electro-deformable layer 13, an array segment film layer 14, an electro-luminescent layer 15, and a thin film encapsulation layer 16.
Wherein the first barrier layer 12 is disposed on the first flexible substrate 11, the electro-deformable layer 13 is disposed on the first barrier layer 12, and the electro-deformable layer 13 is disposed with a circuit pattern, and the circuit pattern is connected to a chip (not shown). The array section film layer 14 is disposed on the electro-deformable layer 13, the electroluminescent layer 15 is disposed on the array section film layer 14, and the thin film encapsulation layer 16 is disposed on the electroluminescent layer 15. The thin film encapsulation layer 16 includes a first inorganic layer 161, an organic buffer layer 162, and a second inorganic layer 163, which are sequentially stacked.
The material of the first inorganic layer 161 includes one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride, and at least includes one of silicon nitride and silicon oxynitride, the material of the second inorganic layer 163 includes one or more of silicon oxide, aluminum oxide, and silicon oxynitride, and at least includes one of aluminum oxide and silicon oxynitride, and the material of the organic buffer layer 162 includes one or more of epoxy resin, acryl resin, polyimide resin, polyethylene naphthalate, and polyethylene terephthalate. The first inorganic layer 161, the organic buffer layer 162 and the second inorganic layer 163 on the electroluminescent layer 15 together form the thin film encapsulation layer 16, so as to protect the electroluminescent layer 15 from being corroded by water and oxygen, thereby improving the stability of the OLED display panel 10 and prolonging the service life of the OLED display panel 10.
In some embodiments, a multilayer structure in which inorganic encapsulation layers and organic encapsulation layers are alternately disposed may also be added between the electroluminescent layer 15 and the first inorganic layer 161 or on the second inorganic layer 163 to more effectively block water and oxygen from invading into the electroluminescent layer 15. In a specific embodiment, the encapsulation layer closest to the electroluminescent layer 15 and the encapsulation layer farthest from the electroluminescent layer are both inorganic encapsulation layers.
In this embodiment, the material of the electro-deformable layer 13 includes polypyrrole or polylactic acid cellulose film, and the material can complete deformation and recovery in a short time under a small voltage, and is low in cost, simple in preparation process, and has large-scale application conditions.
In this embodiment, the OLED display panel 10 may further include a second blocking layer 17, as shown in fig. 2, fig. 2 is another schematic front view structure diagram of the OLED display panel provided in this embodiment, and the second blocking layer 17 is disposed between the electro-deformable layer 13 and the array segment film layer 14. The second barrier layer 17 may function together with the first barrier layer 12 to block the permeation of moisture and oxygen, thereby better protecting the OLED display panel. In particular, the length of the electro-deformable layer 13 may be less than the length of the second barrier layer 17 so that the second barrier layer 17 completely surrounds the electro-deformable layer 13 to provide the best barrier function of the second barrier layer 17.
In this embodiment, the OLED display panel 10 may further include a second flexible substrate (not shown) disposed between the first barrier layer 12 and the electro-deformable layer 13.
In this embodiment, when the chip transmits different stimulation signals to the circuit patterns, the electro-deformable layer 13 deforms differently, so that the OLED display panel 10 deforms correspondingly. As shown in fig. 3, fig. 3 is a schematic top view of the electro-deformable layer 13 provided with a circuit pattern according to an embodiment of the present disclosure, in which the electrical circuit pattern of the electro-deformable layer 13 includes a plurality of vertical lines and horizontal lines that are parallel to each other, and are electrically connected at overlapping positions, and finally gathered together and connected to a chip. As shown in fig. 4, fig. 4 is a schematic structural diagram of deformation modes of the electro-deformable layer 13 provided in the embodiment of the present application, where the deformation modes of the electro-deformable layer 13 include U-shaped deformation (a), S-shaped deformation (b), and curl deformation (c). The OLED display panel can well combine the practicability of a large panel and the portability of a small panel, the abundant deformation modes can meet the requirements of users in different modes, and the users can obtain brand-new experience in different application scenes.
Being different from prior art, the OLED display panel in this embodiment is provided with the electro-deformation layer of circuit pattern through increasing to be connected circuit pattern and chip, thereby transmit different stimulus signal through the chip to circuit pattern, make the electro-deformation layer produce different deformations, and then realize OLED display panel's multiple deformation mode.
Referring to fig. 5, fig. 5 is a schematic flow chart illustrating a manufacturing method of an OLED display panel according to an embodiment of the present disclosure. The manufacturing method of the OLED display panel comprises the following steps:
s51: a first flexible substrate is provided.
The first flexible substrate may be made of polyimide, polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate, polyethersulfone, or polyetherimide.
S52: a first barrier layer is formed on the first flexible substrate.
The first barrier layer may be made of silicon nitride, silicon carbide, silicon oxynitride, silicon oxide, or the like. The materials can prevent external water vapor and oxygen from diffusing upwards from the first flexible substrate.
S53: and forming an electro-deformation layer on the first barrier layer, wherein a circuit pattern is arranged on the electro-deformation layer and is connected with the chip.
Specifically, S53 may include the following sub-steps:
1-1: forming a polypyrrole/polylactic acid cellulose film on the first barrier layer;
1-2: the polypyrrole/polylactic acid cellulose film was subjected to patterning treatment to form an electro-deformable layer.
S54: and forming an array section film layer on the electro-deformation layer.
S55: and forming an electroluminescent layer on the array segment film layer.
S56: and forming a thin film packaging layer on the electroluminescent layer.
Specifically, the thin film encapsulation layer includes a first inorganic layer, an organic buffer layer, and a second inorganic layer, which are sequentially stacked. S56 may include the following sub-steps:
2-1: a first inorganic layer is formed on the electroluminescent layer.
The material of the first inorganic layer comprises one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride and silicon oxynitride, and at least comprises one of silicon nitride and silicon oxynitride.
A silicon nitride layer is deposited over the electroluminescent layer, for example by atomic layer deposition or chemical vapor deposition processes.
2-2: an organic buffer layer is formed on the first inorganic layer.
The organic layer may be made of one of epoxy resin, polymethyl methacrylate, acryl resin, polyimide resin, polyethylene naphthalate, and polyethylene terephthalate.
For example, a polymethyl methacrylate film is formed on the first inorganic layer by ink-jet printing.
2-3: a second inorganic layer is formed on the organic buffer layer.
The material of the second inorganic layer 163 includes one or more of silicon oxide, aluminum oxide, and silicon oxynitride, and at least one of aluminum oxide and silicon oxynitride.
A silicon nitride layer is deposited on the organic buffer layer, for example, by an atomic layer deposition or chemical vapor deposition process.
In a specific embodiment, after S53, the method may further include: forming a second barrier layer on the electro-type deformation layer, and then S54 includes: and forming an array section film layer on the second barrier layer.
Different from the prior art, in the manufacturing method of the OLED display panel in this embodiment, the electro-deformable layer provided with the circuit pattern is added, and the circuit pattern is connected with the chip, so that different stimulation signals are transmitted to the circuit pattern through the chip, the electro-deformable layer is deformed differently, and thus various deformation modes of the OLED display panel are realized.
Referring to fig. 6, an OLED display device 60 according to an embodiment of the present application further includes a chip and any one of the display panels 61, where the chip is used for providing a driving voltage to the display panel 61.
The display panel 61 includes a first flexible substrate, a first barrier layer, an electro-deformable layer, an array segment film layer, an electro-luminescent layer, and a thin film encapsulation layer. The first blocking layer is arranged on the first flexible substrate, the electro-deformation layer is arranged on the first blocking layer, a circuit pattern is arranged on the electro-deformation layer, and the circuit pattern is connected with the chip. The array section film layer is arranged on the electro-deformation layer, the electroluminescent layer is arranged on the array section film layer, and the thin film packaging layer is arranged on the electroluminescent layer. The thin film packaging layer comprises a first inorganic layer, an organic buffer layer and a second inorganic layer which are sequentially stacked.
Being different from prior art, the OLED display device in this embodiment is provided with the electro-deformation layer of circuit pattern through increasing to be connected circuit pattern and chip, thereby transmit different stimulus signal through the chip to circuit pattern, make the electro-deformation layer produce different deformations, and then realize OLED display panel's multiple deformation mode.
In addition to the above embodiments, other embodiments are also possible. All technical solutions formed by using equivalents or equivalent substitutions fall within the protection scope of the claims of the present application.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.

Claims (9)

1. An OLED display panel, comprising:
a first flexible substrate;
the first barrier layer is arranged on the first flexible substrate;
the electro-deformation layer is arranged on the first barrier layer, and is a polypyrrole/polylactic acid cellulose film;
the circuit pattern is arranged on the electro-deformation layer and comprises a plurality of vertical wires and a plurality of horizontal wires, wherein the vertical wires and the horizontal wires are electrically connected at the overlapped part, and are finally gathered together and connected with a chip;
an array segment film layer covering the circuit pattern and the electro-deformable layer;
the electroluminescent layer is arranged on the array segment film layer; and
the thin film packaging layer is arranged on the electroluminescent layer;
when the chip transmits a stimulation signal to the circuit pattern, the electro-deformation layer deforms, so that the OLED display panel deforms.
2. The OLED display panel of claim 1, wherein the electro-deformable layer deforms in a manner including a U-shape deformation, an S-shape deformation, or a curl deformation.
3. The OLED display panel of claim 1, wherein the thin film encapsulation layer includes a first inorganic layer, an organic buffer layer, and a second inorganic layer sequentially stacked.
4. The OLED display panel of claim 1, further comprising a second barrier layer covering the circuit pattern and the electro-deformable layer, wherein the array segment film layer is disposed on the second barrier layer.
5. The OLED display panel of claim 1, further comprising a second flexible substrate disposed between the first barrier layer and the electro-deformable layer.
6. A method of manufacturing an OLED display panel, the method comprising:
providing a first flexible substrate;
forming a first barrier layer on the first flexible substrate;
forming an electro-deformable layer on the first barrier layer, wherein the electro-deformable layer is a polypyrrole/polylactic acid cellulose film;
arranging a circuit pattern on the electro-deformation layer, wherein the circuit pattern comprises a plurality of vertical wires and a plurality of horizontal wires, and the vertical wires and the horizontal wires are electrically connected at the overlapped part, finally gathered together and connected with a chip;
forming an array segment film layer covering the circuit pattern and the electro-deformable layer;
forming an electroluminescent layer on the array segment film layer; and
forming a thin film encapsulation layer on the electroluminescent layer;
when the chip transmits a stimulation signal to the circuit pattern, the electro-deformation layer deforms, so that the OLED display panel deforms.
7. The method of claim 6, wherein the electro-deformable layer deforms in a manner comprising a U-shape deformation, an S-shape deformation, or a curl deformation.
8. The method of manufacturing an OLED display panel according to claim 6, wherein the thin film encapsulation layer includes a first inorganic layer, an organic buffer layer, and a second inorganic layer sequentially stacked.
9. An OLED display device comprising a chip and the OLED display panel of any one of claims 1-5, wherein the chip provides a driving voltage to the OLED display panel.
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CN114420724A (en) * 2021-12-16 2022-04-29 深圳市华星光电半导体显示技术有限公司 Flexible OLED display panel, manufacturing method and terminal equipment

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