CN110725001B - Conductive brush for tin stripping equipment and tin stripping equipment comprising conductive brush - Google Patents
Conductive brush for tin stripping equipment and tin stripping equipment comprising conductive brush Download PDFInfo
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- CN110725001B CN110725001B CN201911044919.XA CN201911044919A CN110725001B CN 110725001 B CN110725001 B CN 110725001B CN 201911044919 A CN201911044919 A CN 201911044919A CN 110725001 B CN110725001 B CN 110725001B
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- brush
- handle
- conductive
- stripping
- filaments
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 238000000034 method Methods 0.000 claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims description 75
- 239000007788 liquid Substances 0.000 claims description 42
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 12
- 239000004917 carbon fiber Substances 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 12
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 230000000694 effects Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000002848 electrochemical method Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F5/00—Electrolytic stripping of metallic layers or coatings
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Disclosed are a conductive brush for a tin stripping apparatus and a tin stripping apparatus including the same, which may include a cathode plate and a conductive brush contacting a PCB during a tin stripping process to apply a voltage to the PCB. The conductive brush may include: a brush handle electrically connected to an external power source; a brush wire fixed and electrically connected to the brush handle; a supporting member overlapped with the brush filaments and fixed to the handle together with the brush filaments to support the brush filaments; and a fixing member including a cover plate covering a portion of the brush filaments and the supporting member and coupled to the handle to fix the brush filaments and the supporting member between the handle and the fixing member. Tin stripping equipment adopting the conductive brush can accelerate tin stripping speed and improve tin stripping effect.
Description
Technical Field
The invention relates to the technical field of stripping of metal coatings, in particular to a conductive brush for tin stripping equipment and tin stripping equipment comprising the conductive brush.
Background
A printed circuit board (Printed Circuit Board, PCB) is one of the important components of the electronics industry, being a support for electronic components. In general, in a process of manufacturing a printed circuit board, after forming a circuit pattern using a screen printing or photochemical method, it is necessary to plate tin on a conductive pattern to form a resist metal protection layer protecting the circuit pattern, and thus the circuit pattern may be protected from corrosion damage in a subsequent alkaline etching process. After the alkaline etching is completed, the tin protective layer formed on the surface of the circuit pattern and the copper-tin alloy formed at the interface between the tin protective layer and the base material Cu need to be removed for subsequent processing.
In the stripping step, a specific stripping solution (or referred to as stripping solution) is generally used to dissolve the tin plating layer. For a stripping solution used to dissolve tin plating, it is often required to react with the tin plating without damaging the substrate of the PCB or at a much slower rate than the tin plating. Specifically, in the actual production process, the tin stripping solution is sprayed on the PCB surface by a nozzle under a certain pressure to strip tin, or the PCB containing the tin plating layer can be soaked in the tin stripping solution and simultaneously combined with mechanical action to realize the purpose of tin stripping. However, in the above tin stripping method, there are often problems that the PCB substrate is easily over-corroded, tin is easily oxidized, and/or the tin stripping efficiency is low.
Disclosure of Invention
An object of the present invention is to provide a tin stripping apparatus.
The object of the present invention is to provide a tin stripping device capable of solving at least one of the above problems.
The invention provides a conductive brush for a tin stripping apparatus, which may include a cathode plate and a conductive brush that contacts a PCB board during a tin stripping process to apply a voltage to the PCB board. The conductive brush may include: a brush handle electrically connected to an external power source; a brush wire fixed and electrically connected to the brush handle; a supporting member overlapped with the brush filaments and fixed to the handle together with the brush filaments to support the brush filaments; and a fixing member including a cover plate covering a portion of the brush filaments and the supporting member and coupled to the handle to fix the brush filaments and the supporting member between the handle and the fixing member.
In an embodiment according to the present invention, the brush filaments may include: a first brush wire secured and electrically connected to a first surface of the handle; and a second wire is secured and electrically connected to a second surface of the handle opposite the first surface. The support member may include: a first support member overlapping the first brush filaments and being fixed to a first surface of the handle together with the first brush filaments; and a second support member overlapping the second brush filaments and being secured to a second surface of the handle with the second brush filaments, wherein the second support member is located between the first brush filaments and the second brush filaments. The cover plate may include: a first cover plate covering the first brush filaments and the first support member and coupled to the first surface of the handle to fix the first brush filaments and the first support member between the first surface of the handle and the first cover plate; and a second cover plate covering the second brush filaments and the second support member and coupled to the second surface of the handle to fix the second brush filaments and the second support member between the second surface of the handle and the second cover plate.
In an embodiment according to the present invention, the cover plate and the handle may include a plurality of holes corresponding to each other, respectively, and the cover plate is fixed to the handle by screws and nuts via the plurality of holes corresponding to each other.
In an embodiment according to the present invention, the cover plate and the handle may be coupled to each other by conductive paste. The conductive paste may be a silver-based conductive paste, a copper-based conductive paste, or a graphite-based conductive paste.
In an embodiment according to the invention, the brush filaments may be carbon fiber filaments, carbon fiber cloth, conductive cloth or titanium foil.
In an embodiment according to the invention, the filaments may comprise a first portion between the cover plate and the handle and a second portion extending from the first portion beyond the edge of the handle. The first portion may be a carbon fiber cloth or a conductive cloth and the second portion may be carbon fiber filaments or conductive filaments extending from the first portion.
In an embodiment according to the present invention, both ends of the handle may include protrusions. The protruding portions may be inserted into the fixing grooves on the side walls of the solder ejection groove facing each other, respectively.
In an embodiment according to the invention, the support member may be a silicone sheet, a PVC sheet or a hot melt film. The handle may be a titanium plate or a copper plate. The cover plate can be a titanium plate, a copper plate, a stainless steel plate or an aluminum plate.
In an embodiment according to the invention, the conductive brush may further comprise a sealing portion at least partially covering the handle and the cover plate to isolate the handle and the cover plate from the stripping liquid during the stripping process.
The invention also provides a tin stripping device, which can comprise a tin stripping groove component. The tin-stripping assembly may include: a tin stripping tank for accommodating tin stripping liquid; an electrode part arranged in the tin stripping groove and comprising a cathode plate and the conductive brush; and the conveying part is arranged in the tin stripping groove and comprises a plurality of thin-row roller groups. The conductive brushes may be alternately arranged with the thin-row roller group and extend in a direction parallel to an extending direction of the thin-row roller group.
By adopting the conductive brush according to the embodiment of the invention, the tin stripping rate can be increased, and the tin stripping effect can be improved. In addition, the tin stripping device adopting the conductive brush can easily realize stripping of tin layers with different thicknesses, and reduce tin contact with air during the tin stripping process so as to prevent Sn 2+ Oxidized by oxygen in air to Sn 4+ The simple electrochemical tin stripping equipment is provided, pollution caused during tin stripping is avoided or reduced, and/or tin stripping liquid is easily recycled, so that the cost is saved.
Drawings
These and/or other aspects will become apparent and more readily appreciated from the following description of the exemplary embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a perspective view of a tin stripping apparatus according to an exemplary embodiment of the inventive concept;
fig. 2 is a cross-sectional view of a tin stripping apparatus taken along line I-I' of fig. 1 according to an exemplary embodiment of the inventive concept;
fig. 3 is a cross-sectional view of a tin stripping apparatus taken along line II-II' of fig. 1 according to an exemplary embodiment of the inventive concept;
FIG. 4 is a cross-sectional view of a conductive brush according to an exemplary embodiment of the present invention; and
fig. 5 is a schematic view of a handle and cover plate of a conductive brush according to an exemplary embodiment of the present invention.
Detailed Description
The principles of the present invention are described in further detail below with reference to the drawings and exemplary embodiments to make the technical solutions of the present invention more clear.
Fig. 1 is a perspective view of a tin stripping apparatus according to an exemplary embodiment of the inventive concept. In the drawings, the X-axis, the Y-axis, and the Z-axis are not limited to three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.
Referring to fig. 1, a tin stripping apparatus 1000 according to an exemplary embodiment of the inventive concept may include a tin stripping assembly 1100 and a solution tank 1200.
As shown in fig. 1, the solder reflow assembly 1100 may at least partially overlap the solution tank 1200 in the Z-direction and may be disposed above the solution tank 1200. The ejector assembly 1100 may include fluid inlets 1171 and 1172 disposed at a sidewall thereof. The stripping assembly 1100 may be an assembly including an electrolytic bath (or stripping bath) for performing a stripping process. During the execution of the tin stripping process, a tin stripping solution is injected into the tin stripping assembly 1100 through the liquid inlets 1171 and 1172, and the PCB board to be stripped is provided into the tin stripping assembly, and then the tin plating layer and the copper-tin alloy layer on the PCB board are stripped by an electrochemical method using the tin stripping solution. The specific structure of the solder reflow assembly 1100 will be described in detail later with reference to fig. 2 and 3.
As shown in fig. 1, the solution tank 1200 may be provided at a lower portion of the detinning tank assembly 1100, and the solution tank 1200 may include a liquid inlet 1221 and a liquid outlet 1222 provided at sidewalls thereof. The solution tank 1200 may be used to hold a stripping solution for stripping tin and tin-copper alloy layers from a PCB board.
In an embodiment according to the present invention, the detinning bath assembly 1100 and the solution bath 1200 may be disposed in fluid communication with each other. Specifically, the detritus assembly 1100 and the solution tank 1200 may be separate components or may be integrally formed with each other, respectively, and the detritus assembly 1100 and the solution tank 1200 may be in fluid communication with each other through a predetermined fluid passage. For example, the fluid pathway may be a flow channel disposed at the interface between the detinning assembly 1100 and the solution tank 1200, or may be a fluid transfer line for connecting the detinning assembly 1100 and the solution tank 1200.
According to an exemplary embodiment of the present invention, during the execution of the tin stripping process, the tin stripping liquid is first transferred into the solution tank 1200 through the liquid inlet 1221 provided on the sidewall of the solution tank 1200, and then transferred into the interior of the tin stripping assembly 1100 through the liquid inlets 1171 and 1172 provided on the sidewall of the tin stripping assembly 1100 by the circulation pump 1300. Next, the solder stripping liquid after a predetermined solder stripping time in the solder stripping assembly 1100 may be transferred to the solution tank 1200 located below the solder stripping assembly 1100. Next, the stripping solution transferred into the solution tank 1200 may be transferred again into the stripping tank assembly 1100 by a circulation pump 1300 provided on the solution tank 1200 and spaced apart from the stripping tank assembly 1100, so that the stripping solution is circulated for a predetermined time. In this case, the stripping liquid can be sufficiently used to reduce the consumption of the stripping liquid, while achieving the purpose of reducing the cost. Then, the solder stripping liquid, which is circulated for a predetermined time in the solution tank 1200, may be discharged through a liquid outlet 1222 provided at a sidewall thereof for a subsequent process.
As shown in fig. 1, the tin stripping apparatus 1000 according to an exemplary embodiment of the inventive concept may further include a filter 1400. The filter 1400 may be disposed on the solution tank 1200 and spaced apart from the detrack assembly 1100. The stripping liquid may be delivered to the stripping bath 1110 after passing through the filter 1400. The filter 1400 may be used to filter impurities (e.g., brushes (see fig. 2 and 3) in the solder stripping solution, etc.) to prevent the impurities from entering the solder stripping solution into the solder stripping assembly 1100 along with the solder stripping solution and causing damage or contamination to the PCB board.
Although the tin stripping apparatus 1000 according to the embodiment of the present invention has been described in detail by referring to fig. 1, the embodiment according to the present invention is not limited thereto. For example, the tin stripping apparatus 1000 may not include the solution tank 1200. In this case, the solder stripping liquid may be transferred into the solder stripping assembly 1100 through a liquid inlet provided on the solder stripping assembly 1100, and after a predetermined solder stripping time, the solder stripping liquid may be discharged out of the solder stripping assembly 1100 through a liquid outlet provided on the solder stripping assembly 1100.
Next, a specific structure of the tin stripping apparatus 1000 according to an embodiment of the present invention will be described in more detail with reference to fig. 2 and 3.
Fig. 2 is a cross-sectional view of the tin stripping apparatus taken along line I-I' of fig. 1 according to an exemplary embodiment of the inventive concept. Fig. 3 is a cross-sectional view of the tin stripping apparatus taken along line II-II' of fig. 1 according to an exemplary embodiment of the inventive concept.
Referring to fig. 2 and 3, the solder reflow assembly 1100 may include a solder reflow 1110, a housing 1120, a transfer portion 1130, and an electrode portion 1140.
The solder stripper 1110 may be disposed in a housing 1120. In other words, the case 1120 may be disposed around the solder reflow 1110 to isolate the solder reflow 1110 from the outside. In addition, at least one of the sidewalls of the solder stripper bath 1110 may be spaced apart from the corresponding inner surface of the housing 1120 by a predetermined distance. The solder resist accommodating recess 1110 may have a "U" shape (as shown in FIG. 3) when viewed in cross-section parallel to the plane defined by the Y-direction and the Z-direction. Specifically, the solder stripping bath 1110 may have a bottom plate and a sidewall protruding from an edge of the bottom plate and extending in a direction perpendicular to the bottom plate, and may have an opening at the top. Wherein the bottom plate of the detritus 1110 may be integrally formed with the bottom of the detritus assembly 1100, or may be in contact with the bottom of the detritus assembly 1100. In addition, as shown in fig. 2, a pair of opposite side walls of the solder reflow bath 1110 and a corresponding pair of opposite side walls of the housing 1120 are provided with openings as a feed port and a discharge port of the solder reflow bath assembly 1100, respectively, to supply the PCB board to be solder-reflow into the solder reflow bath assembly 1100 through the feed port and to transfer the solder-reflow-plated PCB board to the outside of the solder reflow bath assembly 1100 through the discharge port. However, embodiments according to the present invention are not limited thereto, and for example, the solder stripping bath 1110 may further include a top plate, and the top plate includes a plurality of holes for overflowing the solder stripping liquid.
As shown in fig. 2, the transfer portion 1130 may include a thin row roller (or referred to as a transfer runner) 1131 and a water stop roller 1132. The transfer portion 1130 may be used to transfer (e.g., in the X-direction) a PCB board to be solder backed from a feed port of the solder ball withdrawal assembly 1100 to a discharge port of the solder ball withdrawal assembly 1100 via the solder ball withdrawal 1110. In other words, the transfer part 1130 may provide a supporting force for the PCB board and a driving force for movement of the PCB board during the solder stripping process.
Specifically, the thin row rollers 1131 may be disposed at the feed port and the discharge port of the solder reflow assembly 1100 to transfer the PCB board to be solder reflow from the feed port into the solder reflow 1110 and to discharge the solder reflow PCB board from the discharge port. The thin row rollers 1131 may also be disposed in the solder stripper 1110 to support the PCB and move the PCB toward the outfeed. Each thin row roller 1131 may include a thin row roller shaft (or referred to as a conveyor runner shaft, a row runner shaft) and at least one roller (or referred to as a roller blade, a row runner blade) that fits over the thin row roller shaft. Both ends of the thin-row rollers 1131 may be respectively connected to a pair of sidewalls facing each other, which are not provided with openings, of the tin-stripping bath 1110. In addition, the time consumed by the PCB passing through the tin stripping groove can be adjusted by controlling the rotation speed of the thin-row rollers 1131, so that the tin stripping treatment time of the PCB can be adjusted. In this case, different PCB travel speeds may be provided by the spread rollers 1131 according to the tin layer thickness of the PCB, etc.
In addition, as shown in fig. 2, the lean roller 1131 may be divided into a plurality of lean roller groups, each of which may include an upper lean roller and a lower lean roller that are disposed symmetrically to each other with respect to the traveling direction of the PCB board. The number of the thin row roller groups can be set according to actual needs, and is not particularly limited. The plurality of thin-row roller groups may be disposed spaced apart from each other by a predetermined distance in a traveling direction of the PCB board. In the tin stripping process, the upper surface and the lower surface of the PCB are respectively contacted with the upper thin row roller and the lower thin row roller. Thus, the PCB board can be more stably supported and transferred. In addition, the material forming the bank roller 1131 is not particularly limited. In an embodiment according to the present invention, it is preferable that the roller shaft of the thin row roller 1131 may be made of, for example, a metal material having a relatively high density so as not to be affected by resistance caused by the solder stripping liquid.
In addition, the conveying portion 1130 may further include a water blocking roller 1132. Water stop rollers 1132 may be provided at the outlet and inlet of the solder reflow assembly 1100, respectively, to prevent or reduce solder reflow. Preferably, the water blocking rollers 1132 may be provided at openings of the side wall of the tin stripping tank 1110 corresponding to the discharge port and the feed port, respectively, and may be provided at the inner surface of the side wall of the tin stripping tank 1110. Similar to the thin-row rollers 1131, the water-blocking rollers 1132 may be divided into a plurality of water-blocking roller groups, and each water-blocking roller group may include an upper water-blocking roller and a lower water-blocking roller that are symmetrically disposed with respect to the traveling direction of the PCB. In this case, a water blocking roller group may be provided at the inlet and outlet of the tin-stripping assembly 1100, respectively. Besides supporting the PCB and making the PCB travel toward the outlet, the water blocking roller 1132 can also prevent or reduce leakage of the solder stripping solution in the solder stripping tank to ensure stability of the liquid level in the solder stripping tank and smooth progress of the solder stripping process. In this case, when the tin stripping process is performed, the PCB is immersed in the tin stripping solution, so that contact between tin and air can be reduced during the tin stripping process, thereby avoiding the problem of oxidation of tin. In addition, embodiments according to the inventive concept are not limited thereto, and for example, at least one water blocking roller group may be further provided in the tin stripping tank 1110, specifically, between openings of the tin stripping tank 1110 corresponding to a feed port and a discharge port of the tin stripping apparatus (for example, at an intermediate position of the tin stripping tank 1110). In this case, since the water blocking roller has a relatively large weight, the PCB may be prevented from being adversely affected by buoyancy during the traveling process, and thus may be stably transferred.
In addition, although not shown in fig. 1 to 3, the conveying portion 1130 may further include a driver that provides driving force to the lean roller 1131 and the water blocking roller 1132.
Referring to fig. 2 and 3, the electrode portion 1140 may include a cathode plate 1141 and a conductive brush 1142.
Specifically, the stripping bath 1110 may define a space in which the stripping process is actually performed. As shown in fig. 2 and 3, a portion of the conveying portion 1130, the cathode plate 1141, and the conductive brush 1142 may be disposed in the solder stripping bath 1110. During the stripping process, the stripping solution and the PCB board may also be located within the stripping bath 1110.
The cathode plate 1141 may be disposed at least one of the bottom and the top of the tin stripping bath 1110. The cathode plate 1141 may extend parallel to the PCB board travel direction (e.g., X-direction), and the length and/or width of the cathode plate 1141 is less than the length and/or width of the solder tail 1110. In other words, the cathode plate 1141 may be spaced apart from the inner surface of at least one sidewall of the tin stripping bath 1110 by a predetermined distance.
In an embodiment according to the present invention, since the PCB board generally employs double-sided wiring, the cathode plate 1141 may be disposed at the bottom and top of the solder stripping bath 1110 and include an upper cathode plate 1141a and a lower cathode plate 1141b. The upper cathode plate 1141a and the lower cathode plate 1141b may face each other and be disposed at the bottom and the top of the tin stripping groove 1110, respectively, parallel to the traveling direction of the PCB board, and the conveying part 1130 may be located between the upper cathode plate 1141a and the lower cathode plate 1141b facing each other. In other words, the conveying portion 1130 may be disposed parallel to the cathode plate 1141. However, the embodiment according to the present invention is not limited thereto, and for example, the cathode plate 1141 may include only the upper cathode plate 1141a disposed at the top of the tin stripping bath 1110.
The cathode plate 1141 may be fixed at the top and bottom of the tin stripping bath 1110 by a cathode plate fixing rod 1143. Although it is shown in fig. 2 and 3 that the upper cathode plate 1141a and the lower cathode plate 1141b are respectively fixed at the top and bottom of the tin stripping bath 1110 by three cathode plate fixing bars 1143, the embodiment according to the present invention is not limited thereto. For example, the upper cathode plate 1141a may be fixed at the top of the stripping bath 1110 by a cathode plate fixing rod 1143, and the lower cathode plate 1141b may be directly connected to the bottom plate of the stripping bath 1110 by a cathode pin 1145 to be described below without using the cathode plate fixing rod 1143. For another example, when the stripping tank 1110 includes a top plate, both the upper cathode plate 1141a and the lower cathode plate 1141b may be directly fixed to the bottom plate and the top plate of the stripping tank 1110 by the cathode bolts 1145.
Specifically, as shown in fig. 2 and 3, one end of the cathode plate fixing rod 1143 may be connected to one side wall of the tin stripping bath 1110, and the other end of the cathode plate fixing rod 1143 may be connected to the other side wall of the tin stripping bath 1110 facing the one side wall. The cathode plate 1141 may be connected to the cathode plate fixing rod 1143 by the cathode bolt 1145, for example, portions of the cathode plate fixing rod 1143 near both ends may be connected to the cathode plate 1141 by the cathode bolts 1145, respectively.
In addition, in addition to being used to connect the cathode plate 1141 and the cathode plate mounting bar 1143, the cathode peg 1145 may also be used to adjust the distance between the cathode plate and the anode plate (in embodiments of the present invention, the PCB plate is used as the anode in the de-soldering process). In other words, the cathode plate 1141 (e.g., the upper cathode plate 1141a and/or the lower cathode plate 1141 b) can be moved toward and/or away from the anode plate (or the conveyor 1130) by the cathode pins 1145 to achieve adjustment of the pole pitch, which in turn can control the solder stripping rate. When the pole pitch is reduced, the tin stripping rate can be increased and the power consumption can be reduced, but too small a pole pitch can lead to uneven tin stripping and increased risk of short circuits. As the pole pitch increases, the tin stripping rate is slowed and the energy consumption is increased. In an embodiment according to the invention, the pole pitch may be about 5cm to about 15cm.
The cathode plate 1141 may be made of a conductive metallic material or a non-metallic material. For example, the cathode plate 1141 may be a metal titanium plate, a metal titanium mesh, a graphite plate, or the like. When the cathode plate 1141 is in the shape of a plate made of an electrically conductive material, the cathode plate 1141 may include a plurality of holes so that the solder stripping liquid filled in the solder stripping bath 1110 can further overflow from the plurality of holes.
Referring again to fig. 2 and 3, the conductive brush 1142 may be disposed adjacent to the conveying portion 1130 and between the upper cathode plate 1141a and the lower cathode plate 1141b. However, when the cathode plate 1141 includes only the upper cathode plate 1141a, the conductive brush 1142 may be located between the upper cathode plate 1141a and the bottom plate of the stripping tank 1110.
As shown in fig. 2 and 3, the conductive brushes 1142 may be alternately arranged with the lean rollers 1131 in the PCB travel direction. In other words, the conductive brushes 1142 may be disposed between the thin row rollers 1131 (or thin row roller sets), respectively. The conductive brushes 1142 may be disposed spaced apart from each other at predetermined intervals in a traveling direction (e.g., an X direction) of the PCB board, and may extend in a direction (e.g., a Y direction) parallel to an extending direction of the thin-row rollers 1131 (or thin-row roller groups). In other words, both ends of the conductive brush 1142 may be respectively connected to a pair of sidewalls facing each other (as shown in fig. 3) of the solder stripping bath 1110 where no opening is provided.
During the solder stripping process, the conductive brush 1142 may contact the PCB to apply a voltage to the PCB, thereby taking the PCB as an anode, thereby implementing electrochemical solder stripping.
In addition, the conductive brush 1142 may include a handle (e.g., 1142a-1 and 1142b-1 shown in FIG. 3) and filaments (e.g., 1142a-2 and 1142b-2 shown in FIG. 3). The brush handle and the brush filaments can be electrically connected with each other.
As shown in fig. 2 and 3, the conductive brush 1142 may be divided into a plurality of conductive brush groups. Each conductive brush group may include an upper conductive brush 1142a and a lower conductive brush 1142b, and the upper conductive brush 1142a and the lower conductive brush 1142b may be respectively in contact with an upper surface and a lower surface of the PCB board. Each conductive brush group may be alternately arranged with each thin row roller group in the traveling direction of the PCB board. The upper conductive brush 1142a and the lower conductive brush 1142b in each conductive brush group may partially overlap each other when viewed in a plan view, in other words, the upper conductive brush 1142a and the lower conductive brush 1142b may be offset from each other by a predetermined distance (e.g., the width of the non-overlapping portion of the upper conductive brush 1142a and the lower conductive brush 1142b is about 3mm-5 mm). In this case, the traveling resistance of the PCB board can be reduced. Further, the upper conductive brush 1142a and the lower conductive brush 1142b may be partially overlapped, and in particular, the brush filaments 1142a-2 of the upper conductive brush 1142a and the brush filaments 1142b-2 of the lower conductive brush 1142b may be partially overlapped (for example, overlapped length is 5 mm) when viewed in a cross-sectional view. Therefore, the conductive brush can be ensured to be fully contacted with the PCB, and simultaneously, the conductive brush and the PCB can be mechanically acted in the tin stripping process so as to accelerate the tin stripping rate.
The conductive brush 1142 will be described in detail with reference to fig. 4 and 5.
As shown in fig. 4, the conductive brush 1142 may include a handle 1142-1, brush filaments 1142-2, a support member 1142-3, and a securing member.
The handle 1142-1 may be connected to an external power source to receive a predetermined voltage from the external power source. The handle 1142-1 may apply a received voltage to the PCB board through the brush filaments 1142-2. Thus, handle 1142-1 may be made of a conductive material such as titanium, copper, aluminum, or alloys thereof. For example, in an embodiment according to the present invention, the handle 1142-1 may be a titanium plate or a copper plate.
The brush filaments 1142-2 may be secured to the handle 1142-1 and electrically connected to the handle 1142-1. Specifically, one end of the brush wire 1142-2 may be directly connected to the brush handle 1142-1, and the other end may be in contact with the PCB board. Because the brush wire 1142-2 is in direct contact with the PCB, the brush wire 1142-2 may be made of a conductive and flexible material (such as carbon fiber wire, carbon fiber cloth, conductive cloth, titanium foil, etc.), thereby avoiding damage to the PCB by the conductive brush 1142.
Support member 1142-3 may overlie brush filaments 1142-2 and be secured to handle 1142-1 with brush filaments 1142-2. Because the brush filaments 1142-2 are flexible, the support members 1142-3 may be used to support the brush filaments 1142-2 to ensure that the brush filaments 1142-2 may be in stable contact with the PCB board. In addition, the support members 1142-3 may be made of an insulating material (such as a silicone sheet, a PVC sheet, a hot melt adhesive film, or the like). In this case, since the support member 1142-3 may function as a shield for the brush wire 1142-2, the brush wire 1142-2 may be prevented (or slowed down) from being oxidized without the brush wire 1142-2 contacting the PCB, and thus the service life and the use effect of the brush wire 1142-2 may be improved.
The securing member may be used to secure the brush filaments 1142-2 and the support member 1142-3 to the handle 1142-1 and includes a cover plate 1142-4. A cover plate 1142-4 may cover a portion of the brush filaments 1142-2 and support members 1142-3 and be coupled to the handle 1142-1 to secure the brush filaments 1142-2 and support members 1142-3 between the handle 1142-1 and the cover plate 1142-4. In an embodiment according to the present invention, the cover plate 1142-4 may be made of a conductive metal material, for example, may be a titanium plate, a copper plate, a stainless steel plate, or an aluminum plate.
Specifically, in an embodiment in accordance with the present invention, as shown in FIG. 4, the brush filaments 1142-2 may include a first brush filament 1142-2a and a second brush filament 1142-2b disposed on opposite surfaces of the handle 1142-1, respectively.
Likewise, the support members 1142-3 may also include first and second support members 1142-3a and 1142-3b corresponding to the first and second brush filaments 1142-2a and 1142-2b, respectively. In detail, the first support parts 1142-3a may be overlapped with the first brush wires 1142-2a each other and fixed to one surface of the brush handle 1142-1 together with the first brush wires 1142-2 a. The second support members 1142-3b may be stacked on each other with the second wires 1142-2b and fixed to the other surface of the handle 1142-1 opposite to the one surface together with the second wires 1142-2b. In addition, a second support member 1142-3b may be positioned between the first brush filaments 1142-2a and the second brush filaments 1142-2b.
The cover 1142-4 may include a first cover 1142-4a and a second cover 1142-4b disposed corresponding to the first brush filaments 1142-2a and the second brush filaments 1142-2b, respectively. The first cover plate 1142-4a may cover the first brush wire 1142-2a and the first support part 1142-3a and be coupled to one surface of the handle 1142-1 to fix the first brush wire 1142-2a and the first support part 1142-3a between the one surface of the handle 1142-1 and the first cover plate 1142-4 a. The second cover plate 1142-4b may cover the second brush wire 1142-2b and the second support part 1142-3b and be coupled to the other surface of the handle 1142-1 opposite to the one surface to fix the second brush wire 1142-2b and the second support part 1142-3b between the other surface of the handle 1142-1 and the second cover plate 1142-4b.
As shown in fig. 5, the handle 1142-1 may have protrusions at both ends in the length direction thereof. The protrusions may be inserted into fixing grooves on the sidewalls of the solder stripping groove 1110 facing each other, respectively, thereby fixing the conductive brush 1142 into the solder stripping groove 1110.
The cover plate 1142-4 and the handle 1142-1 may each include a plurality of apertures corresponding to one another. In this case, the cover plate 1142-4 may be fixed to the handle 1142-1 through the plurality of holes corresponding to each other by screws and nuts (refer to 1142-5 in fig. 4). However, embodiments according to the present invention are not limited thereto, and for example, the cover plate 1142-4 and the brush handle 1142-1 may be coupled to each other by conductive paste. For example, the conductive paste may be a silver-based conductive paste, a copper-based conductive paste, or a graphite-based conductive paste.
When the cover plate 1142-4 and the handle 1142-1 may be coupled to each other by screws and nuts through the plurality of holes corresponding to each other, a portion of the brush wire 1142-2 between the cover plate 1142-4 and the handle 1142-1 may be a carbon fiber cloth or a conductive cloth, and another portion of the brush wire 1142-2 extending from the portion beyond the edge of the handle may be a carbon fiber wire or a conductive wire extending from the portion. Thus, the brush wire 1142-2 is prevented from loosening and falling off. However, when the cover plate 1142-4 and the brush holder 1142-1 may be coupled to each other by conductive paste, the arrangement of the brush filaments 1142-2 is not particularly limited. In addition, the length of the other portion of the brush filaments 1142-2 extending from the portion beyond the edge of the handle may be set as desired, too short a length may prevent the brush filaments from stably contacting the PCB, and too long a length may increase the resistance.
In addition, since the entire conductive brush 1142 is immersed in the stripping liquid during the stripping process, a sealing portion (not shown) may be provided outside the conductive brush in order to prevent the metal conductor of the conductive brush from being corroded by the stripping liquid. The seal may at least partially cover the handle 1142-1 and the cover plate 1142-4 of the conductive brush 1142 to isolate the handle 1142-1 and the cover plate 1142-4 from the stripping liquid during the stripping process. However, embodiments in accordance with the present invention are not limited thereto, for example, when both the handle 1142-1 and the cover plate 1142-4 are formed of metallic titanium, the sealing portion may be omitted since titanium is not easily corroded by the stripping tin solution.
In addition, the conductive brush 1142 may further include an electrical connection 1142-6 electrically connecting the handle 1142-1 to an external power source. However, in another embodiment according to the present invention, the electrical connections 1142-6 may be omitted.
In the embodiment of the invention, the contact between tin and air is reduced in the tin stripping process by immersing the PCB in the tin stripping liquid, so that the problem that the tin is oxidized is avoided. However, stripping by dipping reduces the stripping rate. Therefore, in the embodiment of the invention, the tin stripping device with the conductive brush can further utilize an electrochemical method to accelerate the reaction rate, and the conductive brush and the PCB can generate mechanical action to further accelerate the tin stripping rate, so that the problem of reduced reaction rate of soaking tin stripping is solved.
In addition, the solder reflow assembly 1100 may further include a liquid inlet tube 1150 disposed at the bottom of the solder reflow 1110. The stripping liquid is injected into the interior of the stripping bath 1110 (as indicated by the arrows in fig. 2) from liquid inlets 1171 and 1172 on the side wall of the stripping bath 1110 via liquid inlet tube 1150. Then, the solder stripping liquid injected into the solder stripping tank 1110 gradually fills the space inside the solder stripping tank 1110, so that the electrode portion 1140 and the transfer portion 1130 in the solder stripping tank 1110 are immersed in the solder stripping liquid. As shown by the arrows in fig. 2 and 3, after a predetermined time of the solder stripping process, the solder stripping liquid overflows to a gap between the sidewall of the solder stripping tank 1110 and the inner surface of the housing 1120 through an opening at the top of the solder stripping tank 1110, and then flows into the solution tank 1200 through the gap via a fluid path between the solder stripping tank assembly 1100 and the solution tank 1200. In addition, the stripping liquid flowing into the solution tank 1200 may be re-injected into the interior of the stripping tank 1110 by the circulation pump 1300, thereby allowing the stripping liquid to be circulated for more full use of the stripping liquid. After a predetermined cycle time, the stripping solution may be drained from the solution tank 1200.
In addition, referring to fig. 3, the solution tank 1200 may also have an inclined bottom surface. Specifically, the level of the portion of the bottom surface of the solution tank 1200 overlapping the solder resist withdrawal assembly 1100 is higher than the level of the portion of the bottom surface thereof overlapping the circulation pump 1300. In this way, the level of the stripping liquid at the portion of the solution tank 1200 overlapping the circulation pump 1300 can be ensured, and thus the stripping liquid circulation can be stably performed.
In addition, the tin stripping apparatus according to the embodiment of the present invention may further include a power supply device (not shown), a support assembly 1500, a condensing device (not shown), a heating apparatus (not shown), and the like.
In particular, the power supply means may be disposed outside the tin stripping apparatus and may supply voltages of respective polarities to the cathode plate 1141 and the conductive brush 1142, respectively, during the tin stripping process. During the tin stripping process, the supply current can be regulated by the power supply device, so that the stripping of tin layers with different thicknesses is realized.
A condensing device (not shown) and a heating apparatus (not shown) may also be included in the solution tank 1200 to achieve temperature control of the stripping solution for improving the stripping efficiency.
According to the embodiment of the invention, by adopting the conductive brush, the tin stripping rate can be further accelerated through the mechanical action of the conductive brush and the PCB, so that the problem of reduced reaction rate of soaking tin stripping is solved. In addition, the tin stripping device adopting the conductive brush can realize at least one of the following effects: the stripping of tin layers with different thicknesses is easily achieved; reducing tin contact with air during the tin stripping process, thereby preventing Sn 2+ Oxidized by oxygen in air to Sn 4+ The method comprises the steps of carrying out a first treatment on the surface of the A simple electrochemical tin stripping device is provided; avoiding or reducing pollution caused by tin stripping; the recycling of the tin stripping liquid is easily realized, the cost is saved, the energy consumption is reduced, and the tin recovery efficiency is also improved.
Although the tin stripping apparatus according to the exemplary embodiments of the inventive concept is described above with reference to the accompanying drawings, the present invention is not limited thereto. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the inventive concept.
Claims (9)
1. A conductive brush for a de-soldering apparatus, the de-soldering apparatus comprising a cathode plate and a conductive brush that contacts a PCB board during a de-soldering process to apply a voltage to the PCB board, the conductive brush comprising:
a brush handle electrically connected to an external power source;
a brush wire made of a conductive and flexible material and fixed and electrically connected to the brush handle;
a supporting member made of an insulating material and overlapped with the brush filaments and fixed to the handle together with the brush filaments to support the brush filaments;
a fixing member including a cover plate covering a portion of the brush filaments and the supporting member and coupled to the handle to fix the brush filaments and the supporting member between the handle and the fixing member,
wherein, the brush silk includes: a first brush wire secured and electrically connected to a first surface of the handle; and a second wire secured and electrically connected to a second surface of the handle opposite the first surface;
the support member includes: a first support member overlapping the first brush filaments and being fixed to a first surface of the handle together with the first brush filaments; and a second support member overlapping the second brush filaments and being secured to a second surface of the handle with the second brush filaments, wherein the second support member is located between the first brush filaments and the second brush filaments; and
the cover plate includes: a first cover plate covering the first brush filaments and the first support member and coupled to the first surface of the handle to fix the first brush filaments and the first support member between the first surface of the handle and the first cover plate; and a second cover plate covering the second brush filaments and the second support member and coupled to the second surface of the handle to fix the second brush filaments and the second support member between the second surface of the handle and the second cover plate.
2. The conductive brush of claim 1, wherein the cover plate and the handle each include a plurality of holes corresponding to each other, and the cover plate is fixed to the handle by screws and nuts through the plurality of holes corresponding to each other.
3. The brush according to claim 1, wherein the cover plate and the brush handle are bonded to each other by a conductive paste,
wherein the conductive adhesive is silver-based conductive adhesive, copper-based conductive adhesive or graphite-based conductive adhesive.
4. The conductive brush of claim 1, wherein the brush filaments are carbon fiber filaments, carbon fiber cloth, conductive cloth, or titanium foil.
5. The conductive brush of claim 2, wherein the brush filaments include a first portion between the cover plate and the handle and a second portion extending from the first portion beyond an edge of the handle,
the first part is carbon fiber cloth or conductive cloth, and the second part is carbon fiber wires or conductive wires extending from the first part.
6. The conductive brush according to claim 1, wherein,
the two ends of the brush handle comprise protruding parts which are respectively inserted into the fixing grooves on the side walls of the tin stripping groove, which face each other.
7. A conductive brush according to claim 1, wherein the supporting member is a silicone sheet, a PVC sheet or a hot melt adhesive film,
the brush handle is a titanium plate or a copper plate, and
the cover plate is a titanium plate, a copper plate, a stainless steel plate or an aluminum plate.
8. The conductive brush of claim 1, further comprising a seal at least partially covering the handle and the cover plate to isolate the handle and the cover plate from the stripping liquid during the stripping process.
9. A tin stripping device is characterized in that the tin stripping device comprises a tin stripping groove component,
the solder stripping assembly includes:
a tin stripping tank for accommodating tin stripping liquid;
an electrode portion provided in the stripping bath, including a cathode plate and the conductive brush according to any one of claims 1 to 8; and
a conveying part which is arranged in the tin stripping groove and comprises a plurality of thin-row roller groups,
wherein the conductive brushes are alternately arranged with the thin-row roller groups and extend in a direction parallel to the extending direction of the thin-row roller groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911044919.XA CN110725001B (en) | 2019-10-30 | 2019-10-30 | Conductive brush for tin stripping equipment and tin stripping equipment comprising conductive brush |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911044919.XA CN110725001B (en) | 2019-10-30 | 2019-10-30 | Conductive brush for tin stripping equipment and tin stripping equipment comprising conductive brush |
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| Publication Number | Publication Date |
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| CN110725001A CN110725001A (en) | 2020-01-24 |
| CN110725001B true CN110725001B (en) | 2023-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911044919.XA Active CN110725001B (en) | 2019-10-30 | 2019-10-30 | Conductive brush for tin stripping equipment and tin stripping equipment comprising conductive brush |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111472001B (en) * | 2020-04-30 | 2022-10-21 | 昆山绿之源智能设备制造有限公司 | Tin stripping equipment |
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| DE4123985A1 (en) * | 1991-07-19 | 1993-01-21 | Hoellmueller Maschbau H | Circuit board electrolytic treatment appts. - has contact brushes protected against electrodeposition |
| US6071400A (en) * | 1996-03-29 | 2000-06-06 | Atotech Deutschland Gmbh | Method and device for the electrochemical treatment with treatment liquid of an item to be treated |
| CN101098662A (en) * | 2004-01-16 | 2008-01-02 | 圣犹大医疗公司心室纤维颤动部 | Brush electrode and method for ablation |
| CN103572361A (en) * | 2012-07-26 | 2014-02-12 | 亚斯杰特股份有限公司 | Electrolytic deflash method and apparatus for strip-shaped elements |
| CN108950562A (en) * | 2018-09-26 | 2018-12-07 | 中南大学 | A kind of method that pcb board two-stage method moves back tin |
| CN211079399U (en) * | 2019-10-30 | 2020-07-24 | 昆山金易得环保科技有限公司 | A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it |
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2019
- 2019-10-30 CN CN201911044919.XA patent/CN110725001B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4123985A1 (en) * | 1991-07-19 | 1993-01-21 | Hoellmueller Maschbau H | Circuit board electrolytic treatment appts. - has contact brushes protected against electrodeposition |
| US6071400A (en) * | 1996-03-29 | 2000-06-06 | Atotech Deutschland Gmbh | Method and device for the electrochemical treatment with treatment liquid of an item to be treated |
| CN101098662A (en) * | 2004-01-16 | 2008-01-02 | 圣犹大医疗公司心室纤维颤动部 | Brush electrode and method for ablation |
| CN103572361A (en) * | 2012-07-26 | 2014-02-12 | 亚斯杰特股份有限公司 | Electrolytic deflash method and apparatus for strip-shaped elements |
| CN108950562A (en) * | 2018-09-26 | 2018-12-07 | 中南大学 | A kind of method that pcb board two-stage method moves back tin |
| CN211079399U (en) * | 2019-10-30 | 2020-07-24 | 昆山金易得环保科技有限公司 | A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it |
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| CN110725001A (en) | 2020-01-24 |
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