CN110662390A

CN110662390A - SMD heat abstractor

Info

Publication number: CN110662390A
Application number: CN201810701666.8A
Authority: CN
Inventors: 刘明禄; 白木学; 岩田�
Original assignee: Tile Base Stone (shanghai) Machinery Equipment Co Ltd
Current assignee: Tile Base Stone (shanghai) Machinery Equipment Co Ltd; Coreless Motor Co Ltd
Priority date: 2018-06-30
Filing date: 2018-06-30
Publication date: 2020-01-07

Abstract

The invention relates to the technical field of heat dissipation equipment, in particular to a patch type heat dissipation device. This SMD heat abstractor, including circuit substrate, radiator and coupling assembling, wherein: the radiator is arranged on the circuit substrate and used for radiating heat generated by each electronic device in the circuit substrate, and the connecting assembly is used for arranging the radiator on the circuit substrate and electrically connecting the radiator with the radiator. The invention avoids the technical problem that the integrated circuit in the closed space causes the operation failure or damage of the electronic device due to high temperature.

Description

SMD heat abstractor

Technical Field

The invention relates to the technical field of heat dissipation equipment, in particular to a patch type heat dissipation device.

Background

With the development of industrial automation, human beings enter a rapid and convenient mechanical automation era. Some devices generate a large amount of heat during operation, and if the excessive heat cannot be dissipated quickly and accumulated to generate high temperature, the devices in operation may be damaged, for example, an integrated circuit inside a computer may be affected by the high temperature to cause unstable operation of the system, even burning of some parts, and a situation that an electronic control device carried in an automobile is heated to cause unstable operation and short service life.

Disclosure of Invention

The invention aims to provide a patch type heat dissipation device which can avoid the technical problem that an integrated circuit in a closed space causes the operation failure or damage of an electronic device due to high temperature.

The technical problem solved by the invention can be realized by adopting the following technical scheme:

the invention provides a patch type heat dissipation device, which comprises a circuit substrate, a radiator and a connecting assembly, wherein: the radiator is arranged on the circuit substrate and used for radiating heat generated by each electronic device in the circuit substrate, and the connecting assembly is used for arranging the radiator on the circuit substrate and electrically connecting the circuit substrate with the radiator.

The radiator is fixedly arranged on the circuit substrate through the connecting assembly and is electrically connected with the circuit substrate, so that the integrated circuit on the circuit substrate is radiated by the radiator.

Optionally, the number of connecting assemblies is at least two.

Optionally, the number of the connecting components is uniformly distributed at two ends where the heat sink is connected with the circuit substrate.

Through the arrangement of the connecting component, the radiator can be prevented from inclining due to gravity unbalance, so that the radiator is stably installed on the circuit substrate.

Optionally, the connecting assembly includes a fastener for fixedly mounting the heat sink on the circuit substrate and a capacitor for connecting the wire on the heat sink to the circuit substrate, the fastener being disposed on the capacitor.

Through the setting to fastener and condenser, can make coupling assembling when fixed with the radiator, can also be with radiator and circuit substrate linear connection.

Optionally, the capacitor is adjustably mounted on the circuit substrate, the capacitor adjusting its position relative to the circuit substrate in accordance with the position of the heat sink.

The circuit substrate can be provided with radiators with different models and specifications by installing the capacitor in a sliding way.

Optionally, the capacitor is a leaded capacitor.

Optionally, the capacitor is a patch capacitor.

Optionally, a first groove is formed in the circuit substrate, the surface mount capacitor is embedded in the first groove, and the surface of the surface mount capacitor is not higher than the surface of the circuit substrate.

Optionally, a first pipeline is further disposed inside the heat sink housing, and the first pipeline is used for allowing an electric wire on the heat sink to pass through to the connection assembly on the circuit substrate.

Through setting up first pipeline, can restrict the trend of electric wire to avoid the electric wire to influence other electron devices on this circuit substrate.

Optionally, the first pipeline is made of an insulating material.

Optionally, the patch type heat dissipation device further comprises a housing, the housing is covered on the circuit substrate, a through hole is formed in the housing, the through hole is convenient for the radiator to radiate heat inside the integrated circuit, and the shape of the through hole is matched with that of the radiator.

Through set up the through-hole on the housing, can be convenient for the radiator with the inside heat dissipation of integrated circuit.

Has the advantages that: by adopting the technical scheme, the invention avoids the technical problem that the integrated circuit in the closed space causes the operation failure or damage of the electronic device due to high temperature.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic structural diagram of an embodiment of the present invention.

Wherein:

100. a circuit substrate;

300. a heat sink;

500. a connecting assembly; 510. a fastener; 530. a capacitor;

700. a housing; 710. and a through hole.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of components and methods consistent with certain aspects of the invention, as detailed in the appended claims. The invention is explained in more detail below with reference to the figures and examples.

In order to avoid the technical problem that the operation of an electronic device is failed or damaged due to high temperature of an integrated circuit in a closed space, the patch type heat dissipation device is provided, so that the failure condition of the electronic device can be reduced, and the service life of the electronic device can be prolonged. The structure of the surface mount heat sink is illustrated with reference to fig. 1 and 2.

The patch type heat dissipation device comprises a circuit substrate 100, a heat radiator 300 and a connecting assembly 500, wherein: the heat sink 300 is mounted on the circuit board 100, the heat sink 300 is used for discharging heat generated by each electronic device inside the circuit board 100, and the connection assembly 500 is used for mounting the heat sink 300 on the circuit board 100 and electrically connecting the heat sink 300. In this embodiment, the heat sink 300 may be mounted on the circuit substrate 100 in a forward direction so as to dissipate heat generated by the integrated circuits on the circuit substrate 100; alternatively, the heat sink 300 may be mounted in reverse on the circuit substrate 100 to extract heat generated by the integrated circuits on the circuit substrate 100. In a specific implementation, the heat sink 300 is a heat dissipation fan.

Optionally, the number of connecting assemblies 500 is at least two.

In order to allow the heat sink 300 to be stably mounted on the circuit substrate 100, the connecting members 500 are uniformly distributed at both ends where the heat sink 300 is connected to the circuit substrate 100. In the present embodiment, one heat sink 300 is connected to the circuit substrate 100 through two connection members 500.

In one possible implementation, the connection assembly 500 includes a fastener 510 and a capacitor 530, the fastener 510 is used for fixedly mounting the heat sink 300 on the circuit substrate 100, the capacitor 530 is used for electrically connecting the wires on the heat sink 300 with the circuit substrate 100, and the fastener 510 is disposed on the capacitor 530.

Since the heat sink 300 has a large number of models, in order to facilitate mounting of heat sinks 300 of different models on the circuit substrate 100, the capacitor 530 is adjustably mounted on the circuit substrate 100, and the capacitor 530 adjusts its position relative to the circuit substrate 100 according to the position of the heat sink 300.

Optionally, capacitor 530 is a leaded capacitor; alternatively, the capacitor 530 is a patch capacitor.

When the capacitor 530 is a lead-type capacitor, in one possible implementation, the capacitor 530 is fixedly mounted on a slider, the slider is slidably mounted on a slide rail, the slide rail is fixedly mounted on the circuit substrate 100, and the capacitor 310 can adjust its position to allow the fastener 510 to fix the heat sink 300 on the circuit substrate 100, and at this time, fix the capacitor 530 on the circuit substrate 100 at the position.

In another possible implementation manner, a support frame is disposed on the circuit substrate 100, a conductive metal rod is disposed on the support frame, a guide rod is further disposed on the support frame, the guide rod is parallel to the metal rod, a conductive block capable of moving along the guide rod is disposed on the guide rod, one end of the conductive block contacts with the metal rod, an electric wire of the heat sink 300 is connected to one end of the metal rod, a lead of the lead capacitor is connected to the conductive block at a position where the conductive block contacts with the metal rod, and when the lead capacitor is positioned according to the fastener 510 connected thereto, another lead is welded to the circuit substrate 100.

When the capacitor 530 is a patch capacitor, the circuit substrate 100 is provided with a first groove, the first groove is in a rounded rectangle, rectangle or special-shaped structure, in order to enable the fastener 510 to fix the heat sink 300 on the circuit substrate 100, the capacitor 530 can adjust the position of the capacitor 530 in the first groove according to the position of the fastener 510, and finally the capacitor 530 is fixed on the circuit substrate 100 at this position. In the present embodiment, the surface of the chip capacitor is not higher than the surface of the circuit substrate 100.

Optionally, two ends of the special-shaped structure in a rectangular shape are respectively connected with a semicircle; or the two ends of the parallelogram of the special-shaped structure are connected with the arc.

In practice, the fastener 510 may be a snap. At this time, a card slot matching with the shape of the buckle needs to be formed on the circuit substrate 100, so that the buckle and the card slot are matched with each other to fix the heat sink 300 on the circuit substrate 100. In this embodiment, the length of the clip and the slot is matched with the adjustable stroke of the capacitor 530, so that when the heat sink 300 is different in model specification, the clip and the slot can cooperate to fix the heat sink 300 on the circuit substrate 100.

In order to prevent the wires of the heat sink 300 from affecting other electrical components on the circuit board 100, a first pipeline is further provided inside the housing of the heat sink 300, and the first pipeline is used for allowing the wires of the heat sink 300 to pass to the connecting assembly 500 on the circuit board 100. In this embodiment, the first pipeline may be a pipeline made of an insulating material.

Optionally, the wall of the housing of heat sink 300 may be further provided with a plurality of guiding rings, and the wires of heat sink 300 may pass through the guiding rings to connect with the connecting assembly 500 at the bottom of heat sink 300. In the present embodiment, the size of the guide ring is set to match the thickness of the electric wire.

In order to prevent the electrical components on the circuit substrate 100 from being corroded by dust, the surface mount heat dissipation device further includes a cover 700, the cover 700 covers the circuit substrate 100, a through hole 710 is formed in the cover 700, and the through hole 710 facilitates the heat sink 300 to dissipate heat inside the integrated circuit. In an embodiment, the shape of the through hole 710 is circular.

It is to be understood that unless otherwise defined, technical or scientific terms used herein have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The terms "connected" or "coupled" and the like as used in the description and claims of the present patent application are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships are changed accordingly.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. The utility model provides a SMD heat abstractor, includes circuit substrate, radiator and coupling assembling, its characterized in that, the radiator is installed circuit substrate is last, the radiator is used for with the heat that inside each electron device of circuit substrate produced distributes away, coupling assembling is used for with the radiator install in circuit substrate is last, and makes circuit substrate with radiator electric connection.

2. The surface mount heat dissipation device of claim 1, wherein the number of connection assemblies is at least two.

3. The surface mount heat dissipation device of claim 2, wherein the connection assemblies are evenly distributed across the connection between the heat sink and the circuit substrate.

4. The surface mount heat sink according to any one of claims 1-3, wherein the connection assembly comprises a fastener for fixedly mounting the heat sink on the circuit substrate and a capacitor for connecting wires on the heat sink to the circuit substrate, the fastener being disposed on the capacitor.

5. The surface mount heat dissipation device of claim 4, wherein the capacitor is slidably mounted on the circuit substrate, and the capacitor adjusts its position relative to the circuit substrate according to the position of the heat sink.

6. The surface mount heat dissipation device of claim 5, wherein the capacitor is a leaded capacitor.

7. The surface mount heat dissipation device of claim 5, wherein the capacitor is a surface mount capacitor.

8. The surface mount heat dissipation device according to claim 7, wherein a first recess is formed in the circuit substrate, the surface mount capacitor is embedded in the first recess, and a surface of the surface mount capacitor is not higher than a surface of the circuit substrate.

9. The patch type heat dissipation device of claim 1, wherein a first pipeline is further disposed inside the heat sink housing, and the first pipeline is used for passing wires on the heat sink to the connection assembly on the circuit substrate.

10. The surface mount heat sink according to claim 1, further comprising a housing, wherein the housing covers the circuit substrate, the housing has a through hole, the through hole facilitates the heat sink to dissipate heat inside the ic, and the shape of the through hole matches the shape of the heat sink.