CN110416140B - Substrate transfer system, electronic device manufacturing apparatus, and electronic device manufacturing method - Google Patents

Substrate transfer system, electronic device manufacturing apparatus, and electronic device manufacturing method Download PDF

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Publication number
CN110416140B
CN110416140B CN201811561559.6A CN201811561559A CN110416140B CN 110416140 B CN110416140 B CN 110416140B CN 201811561559 A CN201811561559 A CN 201811561559A CN 110416140 B CN110416140 B CN 110416140B
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substrate
alignment
chamber
container
electronic device
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CN110416140A (en
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佐藤功康
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Canon Tokki Corp
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Canon Tokki Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A substrate transfer system according to the present invention transfers a substrate from a 1 st apparatus to a relay apparatus, and transfers the substrate from the relay apparatus to a 2 nd apparatus, the relay apparatus including: a container; a substrate mounting table provided in the container and on which a substrate is mounted; and a substrate mounting table driving mechanism for moving the substrate mounting table, the substrate transfer system including: the relay device described above; a position information acquiring unit that acquires substrate position information indicating a position of the substrate with respect to the container; and a control mechanism for controlling the substrate mounting table drive mechanism based on the substrate position information.

Description

Substrate transfer system, electronic device manufacturing apparatus, and electronic device manufacturing method
Technical Field
The present invention relates to the conveyance of substrates in an apparatus.
Background
Recently, as a flat panel display device, an organic EL display device has attracted attention. Organic EL display devices are self-emitting displays, have better characteristics than liquid crystal panel displays such as response speed, viewing angle, and reduction in thickness, and are rapidly replacing conventional liquid crystal panel displays in various portable terminals including monitors, televisions, and smartphones. In addition, the application fields thereof are also expanded to displays for automobiles and the like.
An element of an organic EL display device has a basic configuration in which an organic layer that causes light emission is formed between two opposing electrodes (a cathode electrode, an anode electrode). The organic layer and the electrode metal layer of the organic EL display element are produced by depositing a vapor deposition material on a substrate through a mask having a pixel pattern formed therein in a vacuum apparatus, but in order to deposit the vapor deposition material in a desired pattern at a desired position on the substrate, it is necessary to accurately adjust the relative position between the mask and the substrate before vapor deposition is performed on the substrate.
Therefore, marks (which will be referred to as alignment marks) are formed on the mask and the substrate, and these alignment marks are imaged by a camera provided in the film forming chamber, and the relative positional displacement between the mask and the substrate is measured. When the mask and the substrate are displaced relative to each other, one of the masks is moved relative to the other to adjust the relative position.
Alignment between the substrate and the mask is performed at two stages of coarse alignment and fine alignment (fine alignment). In the rough alignment, rough position adjustment between the substrate and the mask is performed. In the fine alignment, the relative position of the substrate and the mask is adjusted with high accuracy.
In general, a plurality of film forming chambers are provided in one film forming unit, but since both coarse alignment and fine alignment are performed in each film forming chamber, there is a problem in that the alignment process takes a considerable amount of time.
Further, although the positional deviation of the substrate may occur during the transfer of the substrate by the transfer robot in the film deposition unit, it often occurs during the transfer and rotation of the substrate between the buffer chamber (buffer chamber), the swirl chamber (turn chamber), and the passage chamber (pass chamber) on the upstream side of the film deposition unit, and appropriate measures for solving the problem are required.
Disclosure of Invention
Problems to be solved by the invention
The invention aims to improve the conveying precision of a substrate.
Means for solving the problems
A substrate transfer system according to claim 1 of the present invention is a substrate transfer system for transferring a substrate from a 1 st apparatus to a relay apparatus and transferring a substrate from the relay apparatus to a 2 nd apparatus, wherein the relay apparatus includes a container, a substrate mounting table provided in the container for mounting a substrate thereon, and a substrate mounting table driving mechanism for moving the substrate mounting table, and the substrate transfer system includes the relay apparatus, a position information acquiring mechanism for acquiring substrate position information indicating a position of the substrate with respect to the container, and a control mechanism for controlling the substrate mounting table driving mechanism based on the substrate position information.
An apparatus for manufacturing an electronic device according to claim 2 of the present invention includes a 1 st apparatus, a 2 nd apparatus, and a substrate transfer system for transferring a substrate for forming the electronic device from the 1 st apparatus to the 2 nd apparatus, wherein the substrate transfer system is the substrate transfer system according to claim 1 of the present invention, and the 2 nd apparatus includes a transfer chamber for transferring the substrate and a plurality of film forming chambers connected to the transfer chamber.
An apparatus for manufacturing an electronic device according to claim 3 of the present invention includes a 1 st apparatus having a 1 st transfer chamber, a 2 nd apparatus having a 2 nd transfer chamber and a plurality of film forming chambers connected to the 2 nd transfer chamber, and a relay apparatus connected to the 1 st apparatus and the 2 nd apparatus, wherein the relay apparatus includes a 1 st alignment mechanism for adjusting a position of a substrate, and at least one of the plurality of film forming chambers includes a 2 nd alignment mechanism for adjusting a position of the substrate.
The electronic device manufacturing method according to claim 4 of the present invention manufactures an electronic device using the substrate transport system according to claim 1 of the present invention.
A method for manufacturing an electronic device according to claim 5 of the present invention manufactures an electronic device using the apparatus for manufacturing an electronic device according to claim 3 of the present invention.
A method of manufacturing an electronic device according to claim 6 of the present invention includes: a carrying-in step of carrying in the substrate from a 1 st device having a plurality of film forming chambers to the relay device; a 1 st adjustment step of adjusting a position of the substrate disposed on the relay device; a carrying-out step of carrying out the substrate from the relay device to a 2 nd device having a plurality of film forming chambers; a 2 nd adjusting step of adjusting a position of a substrate disposed in the 2 nd apparatus; and a film forming step of forming a film on the substrate in at least one of the plurality of film forming chambers of the 2 nd apparatus after the 2 nd adjusting step.
Effects of the invention
According to the present invention, a technique effective in improving the accuracy of substrate conveyance can be provided.
Drawings
Fig. 1 is a schematic diagram showing an example of the configuration of an apparatus for manufacturing an electronic device.
Fig. 2 is a schematic diagram showing another example of the structure of the manufacturing apparatus for electronic devices.
Fig. 3 is a diagram for explaining an operation of the swirl chamber.
FIG. 4 is a schematic view showing the structure of a film forming apparatus provided in a film forming chamber.
Fig. 5 (a) and 5 (b) are diagrams for explaining a coarse alignment process and a fine alignment process, respectively.
Fig. 6 is a schematic view schematically showing an alignment mechanism in the alignment chamber.
Fig. 7 is a diagram for explaining an alignment operation based on the position of the corner of the substrate.
Fig. 8 is a diagram for explaining an alignment operation based on the position of a virtual corner of the substrate.
Fig. 9 is a diagram for explaining an alignment operation using an alignment mark.
Fig. 10 is a diagram showing a structure for preventing damage to the bellows (bellows) caused by the movement and rotation of the substrate mounting table by the XY θ actuator.
Fig. 11 is an overall view of the organic EL display device and a sectional view of elements of the organic EL display device.
Detailed Description
Preferred embodiments and examples of the present invention will be described below with reference to the accompanying drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Note that the hardware configuration and software configuration of the device, the process flow, the manufacturing conditions, the size, the material, the shape, and the like in the following description are not intended to limit the scope of the present invention to these embodiments unless otherwise specified.
The present embodiment relates to a substrate transfer system, and an apparatus for manufacturing an electronic device. According to the present embodiment, particularly, by performing alignment in advance in the relay device, the alignment process time can be shortened while maintaining the accuracy of the position adjustment of the substrate.
This embodiment can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern on the surface of a substrate having parallel flat plates by vacuum deposition. As a material of the substrate, any material such as glass, resin, metal, or the like can be selected, and as a vapor deposition material, any material such as an organic material, an inorganic material (metal, metal oxide, or the like) can be selected. Specifically, the technique of the present embodiment can be applied to a manufacturing apparatus for an organic electronic device (for example, an organic EL display device, a thin film solar cell), an optical component, or the like. Among these, the manufacturing apparatus of the organic EL display device is one of preferable application examples of the present embodiment because the alignment accuracy and speed between the substrate and the mask are required to be further improved due to the increase in size of the substrate and the high definition of the display panel.
< apparatus for manufacturing electronic device >
Fig. 1 to 3 are schematic views showing an example of an apparatus for manufacturing an electronic device. The manufacturing apparatus of the electronic device of fig. 1 to 3 is used for manufacturing a display panel of an organic EL display device for a smart phone, for example. In the case of a display panel for a smartphone, for example, organic EL is formed on a substrate having a size of about 1800mm × about 1500mm, and then the substrate is cut to produce a plurality of small-sized panels.
As shown in fig. 1, a manufacturing apparatus for electronic devices generally includes a plurality of unit apparatuses, each including a transfer chamber 1, a plurality of film forming chambers 2 disposed around the transfer chamber 1, and a mask loading chamber 3 for storing masks before and after use. A transfer robot (R) for holding and transferring a substrate (S) is provided in the transfer chamber (1). The transfer robot (R) is, for example, a robot having a configuration in which a robot hand for holding the substrate (S) is attached to a multi-joint arm, and carries in and out the substrate (S) and the mask to and from the film forming chambers 2 and the mask loading chamber 3.
Each of the film forming chambers 2 is provided with a film forming device (also referred to as a vapor deposition device). A series of film forming processes such as transfer of a substrate (S) to a transfer robot (R), adjustment (alignment) of the target position of the substrate (S) and a mask, fixing of the substrate (S) to the mask, and film formation (vapor deposition) are automatically performed by a film forming apparatus.
Between the respective unit devices, a buffer chamber 4 and an alignment chamber 6 are provided, the buffer chamber 4 being capable of receiving a substrate (S) from the unit device (1 st device) on the upstream side in the flow direction of the substrate (S) and temporarily storing a plurality of substrates (S) before being transferred to the unit device (2 nd device) on the downstream side, the alignment chamber 6 being capable of receiving the substrate (S) from the buffer chamber 4 and performing alignment before transferring the substrate (S) to the unit device on the downstream side.
According to an example of the manufacturing apparatus of the electronic device of the present embodiment, as shown in fig. 1 and 3 a, the alignment chamber 6 receives the substrate S from the buffer chamber 4 and rotates the orientation of the substrate S by 180 degrees in addition to the alignment described later. Therefore, a rotation mechanism (not shown) for horizontally rotating the substrate S is provided in the alignment chamber 6. With this configuration, the substrate (S) also has the same orientation in the downstream-side unit device as in the upstream-side unit device, and the substrate (S) is processed uniformly in the entire electronic device manufacturing apparatus.
On the other hand, as shown in fig. 2 and 3 (b), according to another example of the manufacturing apparatus of the electronic device, a swirling chamber 5 is provided between the buffer chamber 4 and the alignment chamber 6. A transfer robot (R1) is provided in the whirling chamber 5, and the transfer robot (R1) receives a substrate (S) from the buffer chamber 4 on the upstream side, whirls the corresponding substrate (S), and transfers the substrate to the alignment chamber 6. With such a configuration, the alignment chamber 6 can be made simpler in structure, and the orientation of the substrate (S) can be made the same in the upstream and downstream equipment. In the present specification, the buffer chamber 4, the swirling chamber 5, and the alignment chamber 6 provided between the upstream unit device and the downstream unit device are collectively referred to as a "relay device". The control means for controlling the transfer and alignment of the relay device and the substrate in the relay device is collectively referred to as a "substrate transfer system". Further, according to this configuration, since the masks can be arranged in the same direction in each apparatus, management of the masks can be simplified. For example, when a failure occurs in a manufacturing apparatus of an electronic device and a mask is manually set, the mask may be oriented in the same direction in the upstream and downstream equipment units, and thus, a setting error of the mask can be prevented.
In addition, when the alignment precision is structurally adjusted when assembling the manufacturing device of the electronic equipment, the adjustment is performed by taking one area of the substrate (S) as a reference, but because the orientation of the substrate and the mask is the same, the adjustment in each machine set is the adjustment of the same reference, the assembly speed is improved, and the error is reduced.
According to the present embodiment, the alignment chamber 6 includes a rough alignment mechanism that can substantially adjust the position of the substrate (S) that has been misaligned before the substrate (S) is carried into the cluster device by the transfer robot (R) in the transfer chamber 1. By providing the alignment mechanism (alignment chamber 6) in the relay device, the substrate transfer accuracy can be improved. In addition, the rough alignment conventionally performed for each film forming chamber 2 may not be performed in each film forming chamber 2. The alignment mechanism and operation in the alignment chamber 6 will be described in detail later.
< film Forming apparatus >
Fig. 4 is a schematic diagram showing the structure of the film forming apparatus 20 provided in the film forming chamber 2. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction is used. When the substrate (S) is fixed so as to be parallel to a horizontal plane (XY plane) during film formation, the width direction (direction parallel to the short side) of the substrate (S) is the X direction, and the length direction (direction parallel to the long side) is the Y direction. In addition, the rotation angle around the Z axis is represented by θ.
The vacuum chamber 200 of the film forming apparatus 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen. Inside the vacuum chamber 200, a substrate holding unit 210, a mask (M), a mask stage 221, a cooling plate 230, and a vapor deposition source 240 are provided.
The substrate holding unit 210 is a mechanism that holds the substrate (S) received from the transfer robot (R), and is also referred to as a substrate holder. The mask (M) is a metal mask having an opening pattern corresponding to a thin film pattern formed on the substrate (S), and is fixed to a frame-shaped mask stage 221.
During film formation, a substrate (S) is placed on a mask (M). Therefore, the mask (M) also functions as a carrier for mounting the substrate (S). The cooling plate 230 is a plate member that is brought into close contact with the substrate (S) (the surface opposite to the mask (M)) during film formation to suppress temperature rise of the substrate (S) during film formation, thereby suppressing deterioration or degradation of the organic material. The cooling plate 230 may also serve as a magnet plate. The magnet plate attracts the mask (M) by magnetic force, thereby improving the adhesion between the substrate (S) and the mask (M) during film formation. The vapor deposition source 240 is configured by a crucible for containing a vapor deposition material, a heater, a shutter, a drive mechanism, an evaporation rate monitor, and the like (none of which are shown).
A substrate Z actuator 250, a gripper Z actuator 251, a cooling plate Z actuator 252, an XY θ actuator (not shown), and the like are provided on the upper outer side (atmosphere side) of the vacuum chamber 200. These actuators are constituted by, for example, a motor and a ball screw, or a motor and a linear guide. The substrate Z actuator 250 is a driving mechanism for moving up and down (Z-direction movement) the substrate holding unit 210. The clip Z actuator 251 is a driving mechanism for operating the clamping mechanism of the substrate holding unit 210. The cooling plate Z actuator 252 is a driving mechanism for raising and lowering the cooling plate 230.
The XY θ actuator is a driving mechanism for alignment of the substrate (S). The XY θ actuator moves the entire substrate holding unit 210 and the cooling plate 230 in the X direction, the Y direction, and θ rotation. In addition, in the present embodiment, a configuration is described in which the position of the substrate (S) in the X, Y, and θ directions is adjusted in a state in which the mask (M) is fixed, but the alignment of the substrate (S) and the mask (M) may be performed by adjusting the position of the mask (M) or adjusting the positions of both the substrate (S) and the mask (M).
The XY θ actuator of the film forming chamber 2 of the present embodiment is an alignment mechanism for performing fine alignment, and is constituted by a drive mechanism with higher accuracy than the XY θ actuator (alignment mechanism) of the alignment chamber 6 described later. For example, the XY θ actuator of the film forming chamber has a total of 4 motors, such as 2 motors in the X direction and 2 motors in the Y direction. This enables more precise control of the relative position adjustment of the substrate (S) with respect to the mask (M) in the fine alignment performed in the film forming chamber 2.
An alignment camera 261 for photographing an alignment mark formed on the substrate (S) and the mask (M) through a transparent window provided on the upper surface of the vacuum chamber 200 is provided on the outer upper surface of the vacuum chamber 200 in addition to the above-described driving mechanism. In this embodiment, the alignment camera 261 is provided with 4 stages at positions corresponding to 4 corners of the rectangular substrate (S) and the mask (M).
The alignment camera 261 provided in the film formation apparatus 20 of the present embodiment is a fine alignment camera for accurately adjusting the relative position between the substrate (S) and the mask (M), and is a camera having a narrow angle of view and high resolution. In the conventional film forming apparatus, the coarse alignment camera 260 having a relatively wide angle of view and a low resolution is provided in addition to the fine alignment camera 261, but as described later, in the present embodiment, the coarse alignment is not performed in the film forming chamber 2, but is performed in the alignment chamber 6, and therefore, the coarse alignment camera 260 is not provided in the film forming chamber 2 of the present embodiment.
Therefore, in the present embodiment, 2 coarse alignment cameras 260 shown by broken lines in fig. 4 and 5 (a) can be omitted. For example, if 4 deposition chambers 2 are provided in one deposition unit, a total of 8 coarse alignment cameras 260 can be provided for each deposition chamber, 2.
The following describes an alignment process performed by the alignment mechanism of the film deposition apparatus 20 according to the present embodiment.
As shown in fig. 5 (b), the fine alignment process by the alignment mechanism of the film formation apparatus 20 of the present embodiment is performed in a state where the substrate (S) and the mask (M) are partially in contact with each other.
In this state, the relative positional displacement of the substrate (S) and the mask (M) in the XY plane is measured from the alignment mark images of the substrate (S) and the mask (M) captured by the fine alignment camera 261. When the relative positional deviation between the substrate (S) and the mask (M) exceeds a predetermined threshold value, the alignment stage is driven by the XY θ actuator of the film formation apparatus 20, and the position of the substrate (S) on the substrate holding unit 210 connected to the alignment stage is relatively adjusted in the XY plane.
The alignment process is repeated until the relative positional deviation between the substrate (S) and the mask (M) falls within a predetermined threshold value. When the relative positional deviation between the substrate (S) and the mask (M) is within a predetermined threshold value, the substrate (S) is fixed to the mask (M) and a film forming process is performed.
As described above, in the film deposition apparatus 20 of the present embodiment, the alignment process is not performed in the two-stage process of the coarse alignment and the fine alignment, but only the fine alignment is performed. This can significantly reduce the time required for the alignment process in the plurality of film deposition apparatuses 20 provided in the film deposition unit 1.
The film forming chamber 2 is provided with a control unit 270. The controller 270 has functions of controlling the deposition source, controlling the film formation, and the like, in addition to controlling the substrate Z actuator 250, the clip Z actuator 251, the cooling plate Z actuator 252, the XY θ actuator, and the camera 261. The control unit 270 may be constituted by a computer having a processor, a memory, a storage, an I/O, and the like, for example. In this case, the function of the control section 270 is realized by the processor executing a program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (program logic controller) may be used. Alternatively, a part or all of the functions of the control unit 270 may be constituted by a circuit such as an ASIC or FPGA. Further, the control unit 270 may be provided for each of the film formation devices 20, and 1 control unit 270 may control a plurality of film formation devices 20.
< alignment within Relay apparatus >
As described above, since the rough alignment process for rough position adjustment is conventionally performed for a plurality of (4 in this embodiment) film forming chambers 2 in one unit apparatus, there is a problem that the overall process takes a considerable amount of time.
The relative positional shift between the substrate (S) and the mask (M) also occurs during the process of carrying in/out the substrate (S) to/from each film forming chamber 2 by the transfer robot (R) in the unit device, but also occurs during the process of transferring the substrate (S) by the relay device (the buffer chamber 4, the whirling chamber 5, and the alignment chamber 6) before the substrate (S) is carried into the unit device.
In the present embodiment, by performing the rough alignment process in the alignment chamber 6 and adjusting the position of the substrate (S) in advance in the relay device before the substrate (S) is carried into the unit device, it is possible to greatly reduce the overall time taken for the alignment process while ensuring high-precision position adjustment, even if only the fine alignment process is performed without the rough alignment process in the film forming chamber 2.
Hereinafter, the alignment operation in the relay device and the alignment mechanism for performing the operation will be described in detail by taking the alignment chamber 6 as an example. In the present embodiment, the configuration in which alignment is performed in the alignment chamber 6 is described, but the present embodiment is not limited to this, and may be performed in another part of the relay device, for example, the buffer chamber 4 or the swirling chamber 5.
Fig. 6 is a schematic view schematically showing the structure of the alignment chamber 6.
The substrate transfer system including the alignment chamber 6 includes a vacuum chamber 61 whose interior is maintained in a vacuum state, a substrate mounting table 302 on which a substrate (S) is mounted in the vacuum chamber 61, an alignment mechanism for performing alignment of the substrate (S), and a control mechanism 303 for controlling the operation of the alignment mechanism.
The alignment mechanism of the alignment chamber 6 includes a position information acquisition mechanism (alignment camera) 301 for acquiring information (information indicating the position of the substrate with respect to the vacuum chamber 61) on the position where the substrate (S) is placed on the substrate mounting table, and a substrate mounting table drive mechanism (XY θ actuator) 307 for driving the substrate mounting table 302 in the X-axis direction, the Y-axis direction, and the θ direction. The substrate mounting table 302 is connected to an XY θ actuator 307 via a shaft 310.
The positional information acquisition means can acquire substrate positional information indicating the position of the substrate with respect to the vacuum chamber 61.
Based on the substrate position information, the control mechanism 303 controls a substrate mounting table driving mechanism 307 for driving the substrate mounting table 302.
As described later, the alignment mechanism of the alignment chamber 6 may further include a reference mark setting table 315, and the reference mark setting table 315 is provided with a reference mark for defining a reference position that becomes a reference for adjusting the position of the substrate (S). The fiducial mark setting table 315 is fixed to the vacuum chamber 61. The present embodiment is not limited to the configuration in which the reference mark is formed on the reference mark installation table 315, and may be formed by a method of printing a reference mark on another part of the alignment chamber 6, for example, the vacuum chamber 61 itself, the substrate mounting table 302, or the like, as described later. The reference mark provided on the reference mark providing table 315 or the vacuum container 61 itself is fixed to the vacuum container 61. The substrate position information obtained by using the reference mark fixed to the vacuum chamber 61 in this way indicates the position of the substrate with respect to the vacuum chamber 61. When the substrate placement stage 302 is controlled to move to a predetermined position (e.g., the origin position) in the vacuum chamber 61, it can be considered that the substrate placement stage 302 moves to the same position in the vacuum chamber 61. In this case, the reference mark provided on the substrate mounting table 302 located at the predetermined position may be regarded as being fixed to the vacuum chamber 61. The substrate position information obtained using the reference mark that can be regarded as being fixed to the vacuum chamber 61 also indicates the position of the substrate with respect to the vacuum chamber 61.
The alignment camera 301 is a position information acquisition mechanism for performing a function of substantially adjusting the position of the substrate (S), and is a camera having a lower resolution than the fine alignment camera 261 used in the film formation apparatus 20, but a wide angle of view. In the present embodiment, the positional information acquisition means is described mainly with respect to a camera, but the present embodiment is not limited to this, and other configurations, for example, a laser displacement meter, may be used.
As shown in fig. 6 a, the alignment camera 301 is provided so as to be able to image the substrate (S) and a specific portion of the reference mark installation table 315 through a window (not shown) provided in the bottom surface 306 of the vacuum chamber 61 of the alignment chamber 6. For example, as shown in fig. 6 (b), the alignment cameras 301 are provided at positions corresponding to two corners of the substrate (S) at opposite corners. However, the positions and the number of alignment cameras 301 according to the present embodiment are not limited to the above examples. For example, the alignment cameras 301 may be provided at positions corresponding to all corners of the substrate (S).
The XY θ actuator 307 is provided outside (i.e., on the atmosphere side) the bottom 306 of the vacuum chamber 61 of the alignment chamber 6 so as to be connected to the substrate mounting table 302 via the bottom 306 in the vertical direction of the vacuum chamber 61 of the alignment chamber 6. The XY θ actuator 307 transmits a driving force in the XY θ direction to the substrate mounting table 302 via a servo motor and a power conversion mechanism (e.g., a linear guide) for converting a rotational driving force from the servo motor into a linear driving force. Here, an XYZ rectangular coordinate system in which the vertical direction is the Z direction is used. When the substrate (S) is horizontally placed on the substrate placing table 302, the width direction (direction parallel to the short side) of the substrate (S) is represented as the X direction (1 st direction), the length direction (direction parallel to the long side) is represented as the Y direction (2 nd direction), and the rotation value in the direction around the Z axis (3 rd direction) is represented as θ.
Such an XY θ actuator 307 has a lower accuracy of position adjustment than the XY θ actuator for fine alignment used for fine position adjustment between the substrate (S) and the mask (M) in the film forming chamber 2, but has a wide movement range and a wide range of adjustable positional deviation. The number of X-direction servomotors and the number of Y-direction servomotors used in the XY θ actuator 307 are 2 and 1, respectively, but such numbers are merely examples, and the present embodiment is not limited to such specific numbers.
The control mechanism 303 controls the driving of the XY θ actuator 307 based on the substrate position information of the substrate (S) on the substrate mounting table 302.
The control mechanism 303 includes an image processing unit 304, and the image processing unit 304 calculates positional information of the substrate (S) from an image of a corner portion of the substrate (S) captured by the alignment camera 301 or an image of a virtual corner portion, which will be described later.
The control means 303 further includes a storage unit 305 for storing reference position information of the substrate with respect to the reference position.
The control means 303 calculates the amount of positional deviation of the substrate (S) based on the reference positional information of the substrate (S) stored in advance in the storage unit 305 and the positional information of the substrate (S) calculated by the image processing unit 304.
Next, a specific example of the alignment operation controlled by the control mechanism 303 will be described with reference to fig. 7 to 9.
In the embodiment shown in fig. 7, alignment is performed based on reference position information obtained from the position of the reference mark formed on the reference mark setting table 315 and substrate position information obtained from the position of the corner of the substrate (S) placed on the substrate placing table.
First, a virtual reference mark (virtual reference mark) is assumed at a position separated by a predetermined distance in the XY direction from the reference marks 3151 and 3152 formed on the reference mark mounting table 315, and the positional information of the corresponding virtual reference marks 3153 and 3154 is calculated from the positional information of the reference marks 3151 and 3152. Here, the virtual reference marks 3153 and 3154 correspond to the positions of two corners on opposite corners of the substrate when the substrate is ideally placed on the substrate placing table 302 of the alignment chamber 6.
In the present embodiment, the center point of a line segment (L1) connecting two imaginary reference marks 3153, 3154 on opposite corners is set as an imaginary reference center point (C1), and the position of the imaginary reference center point (C1) functions as a reference position for alignment in the alignment chamber 6.
In the present embodiment, the calculation of the positional information of the virtual reference marks 3153 and 3154 and the calculation of the reference positional information based on the calculation are performed at first (for example, when the alignment chamber 6 is installed) at once, and the information of the position of the obtained virtual reference center point (C1) is stored as the reference positional information in the storage unit 305 of the control mechanism 303.
When the substrate is carried into the alignment chamber 6 and placed on the substrate placing table, the alignment camera 301 captures images of two corners on opposite corners of the substrate, and acquires images of the two corners on opposite corners of the substrate. The image processing unit 304 of the control means 303 calculates positional information of two corner portions on opposite corners of the substrate from the acquired image. The image processing unit 304 calculates position information of a center point (C2) of a line segment (L2) connecting the two corners, from the calculated position information of the two corners. Such information related to the position of the center point (C2) of the substrate corresponds to substrate position information in the present embodiment.
The image processing unit 304 calculates the amount of positional deviation of the substrate based on the positional information (substrate positional information) of the center point (C2) of the line segment (L2) connecting the two corners of the substrate calculated in this way and the information (reference positional information) related to the position of the virtual reference center point (C1) stored in the storage unit 305.
For example, the image processing unit 304 calculates the amount of positional displacement of the substrate with respect to the XY θ direction based on the positional information of the center point (L2) of the line segment (L2) connecting two corners of the substrate at opposite corners, the positional information of the center point (C1) of the line segment (L1) connecting two virtual reference marks at corresponding positions, and the inclination information of the two line segments. That is, in the present embodiment, the amount of positional deviation of the substrate is a distance by which the center point (C2) of the substrate is moved in the XY direction to make the two center points coincide, and after the two center points coincide, the amount of positional deviation of the substrate in the XY θ direction can be calculated by obtaining the angle (θ) of the corner of the substrate by rotating the center points (C1, C2) around the axis in order to make the line segment (L2) connecting the corners of the substrate coincide with the line segment (L1) connecting the virtual reference marks.
When the calculated amount of positional deviation exceeds a predetermined threshold value, the control unit 303 controls the substrate mounting table drive unit based on the calculated amount of positional deviation to move the substrate mounting table in the XY θ direction to adjust the position of the substrate.
Such an alignment operation is repeated until the amount of positional displacement of the substrate (S) falls within a threshold value (allowable value).
When the alignment process is completed with the amount of positional deviation of the substrate within the threshold value, the substrate (S) whose position has been adjusted is carried out from the alignment chamber 6 and carried into the transfer chamber 1 of the cluster device. After the substrate is carried out, the substrate mounting table 302 is returned to the original position.
According to the present embodiment, reference position information as a reference for the alignment process in the alignment chamber 6 is stored in the storage unit 305 in advance, and the corresponding reference position information is read out for each alignment operation to calculate the positional displacement amount of the substrate, whereby image processing for acquiring the position information of the reference mark can be omitted, and the time taken for the entire alignment operation can be shortened. In addition, even in the case where the alignment camera 301 does not see the reference mark during the alignment, the alignment can be performed without interrupting the alignment. However, the present embodiment is not limited to the above-described embodiment, and the alignment camera 301 and the image processing unit 304 may calculate the positional information of the virtual reference mark for each alignment operation.
In the example shown in fig. 7, the amount of positional deviation is calculated using the positional information of the virtual reference mark, but the present embodiment is not limited to this, and alignment may be performed using the position itself of the reference mark formed on the reference mark mounting table 315. That is, alignment can be performed similarly based on the positional information of the reference mark mounting table 315 provided at the positions corresponding to the two corners on the opposite corners of the substrate, respectively, and the positional information of the two corners on the opposite corners of the substrate obtained by the alignment camera 301. In this case, the position of the center point (C1 ') of the line segment (L1') connecting the two reference marks on the opposite corners functions as a reference position.
Fig. 8 illustrates alignment in the case where the corner of the substrate (S) is chamfered for preventing breakage. When a corner portion of a substrate (S) is chamfered, the position of a point where the extensions of two sides adjacent to the corner portion intersect is defined as an imaginary corner portion of the corner portion.
That is, in the embodiment shown in fig. 8, alignment is performed based on substrate position information obtained from the position of an imaginary corner of the substrate (S) placed on the substrate placing table and reference position information obtained from the position of the reference mark formed on the reference mark placing table 315.
In the present embodiment, two corners on opposite corners of a substrate (S) are imaged by an alignment camera 301, and position information of an intersection (virtual corner) of extended lines of two adjacent sides is calculated by an image processing unit 304.
The substrate position information is calculated based on the thus obtained position information of the virtual corner of the substrate (S), and the substrate position information is compared with the reference position information stored in the storage unit 305 of the control unit 303, thereby calculating the amount of positional deviation of the substrate.
When the calculated amount of positional deviation exceeds a predetermined threshold, the control unit 303 controls the substrate mounting table drive unit based on the calculated amount of positional deviation to move the substrate mounting table in the XY θ direction, thereby adjusting the position of the substrate.
Such alignment operation is repeated until the amount of positional displacement of the substrate (S) falls within a threshold value (allowable value).
When the alignment process is completed with the amount of positional deviation of the substrate within the threshold value, the substrate (S) whose position has been adjusted is carried out from the alignment chamber 6 and carried into the transfer chamber 1 of the cluster device. After the substrate is carried out, the substrate mounting table 302 is returned to the original position.
In the embodiment of fig. 7 and 8, the substrate position information is acquired from the position information of the corner portion or the virtual corner portion of the substrate, but the present embodiment is not limited thereto, and the substrate position information may be acquired by another method and alignment may be performed. For example, the substrate position information may be calculated using substrate alignment marks formed at two corners on opposite corners of the substrate.
Fig. 9 is a diagram for explaining an alignment process in the alignment chamber 6 performed using a different part of the vacuum chamber 61, for example, a stage-side alignment mark formed on the substrate mounting stage 302, instead of the reference mark mounting stage 315.
In this embodiment, alignment is performed by the same method as in the other embodiments except that reference position information as a reference in the alignment process of the substrate performed in the alignment chamber 6 is calculated from the position information of the stage-side alignment marks 3021 and 3022.
That is, the reference position information is calculated from the positions of the stage side alignment marks 3021 and 3022 themselves or a virtual alignment mark (not shown) assumed to be located at a position separated by a predetermined distance in the XY direction from the stage side alignment marks 3021 and 3022, and is stored in the storage unit 305. Thereafter, when the alignment process is performed in the alignment chamber 6, the substrate position information acquired by the alignment camera 301 and the image processing unit 304 is compared with the reference position information stored in the storage unit 305, and the positional displacement amount of the substrate is calculated. Then, the position of the substrate is adjusted based on the calculated amount of positional deviation of the substrate.
In the present embodiment, the substrate position information can be calculated from the two corners (imaginary corners) on the opposite corners of the substrate or the substrate alignment marks formed on the two corners on the opposite corners of the substrate, as described in the embodiments of fig. 7 and 8.
In the embodiments shown in fig. 7 to 9, the configuration in which the alignment step is performed using the position information of the center point of the line segment connecting the two corners (or the virtual corners) on the opposite corners of the substrate and the position information of the center point of the line segment connecting the two virtual reference marks as the substrate position information and the reference position information, respectively, has been described, but the present embodiment is not limited thereto, and other methods capable of matching the position of the substrate with the reference position may be used.
For example, the positions of two corners (or virtual corners) on opposite corners of the substrate may be aligned to the positions of two virtual reference marks without calculating the position of the center point. In this case, in order to match one of two corners (or virtual corners) on opposite corners of the substrate obtained by the alignment camera 301 and the image processing unit 304 with the position of the corresponding virtual reference mark, the distance by which the substrate is moved in the XY direction is calculated, and in a state where one corner (or virtual corner) of the substrate matches the position of the corresponding virtual reference mark in this way, an angle by which a line segment connecting two corners (or virtual corners) of the substrate is rotated around the corresponding corner (or virtual corner) is calculated in order to match the other corner (or virtual corner) of the substrate with the other virtual reference mark (or in order to match a line segment connecting two corners (virtual corners) of the substrate with a line segment connecting two virtual reference marks), thereby calculating the amount of positional deviation of the substrate.
Fig. 10 is a diagram showing a structure for preventing damage to an extensible member (bellows) 402 provided at a connection portion between the vacuum chamber 61 and the shaft 310 in the alignment chamber 6 when the substrate mounting table 302 is moved and rotated by the XY θ actuator 307.
An XY θ actuator 307 located on the atmosphere side of the vacuum container 61 of the alignment chamber 6 is connected to the substrate mounting table 302 in the vacuum container of the alignment chamber 6 via a shaft 310.
In the conventional configuration shown in fig. 10 (a), in order to maintain the vacuum state in the vacuum chamber 61 of the alignment chamber 6, a 1 st coupling portion 404 welded (rigidly fixed) to the vacuum chamber of the alignment chamber 6 and a stretchable member (for example, a bellows 402) airtightly connected to the 1 st coupling portion 404 are provided around the shaft 310.
However, the driving operation of the XY θ actuator 307 for alignment, particularly the rotational operation in the θ direction (that is, the twisting operation) is directly transmitted to the bellows 402, and there is a problem that the form of the bellows 402 is deformed (twisted) and the life is shortened.
In the present embodiment, in order to solve such a problem, as shown in fig. 10 (b), the 2 nd coupling part 405 is fixed to the lower outer wall 306 of the alignment chamber 6 in a floating manner via an O-ring (O-ring) 406. This allows the 2 nd coupling part 405 and the alignment chamber 6 to be vacuum-sealed even if relative movement is permitted. That is, since the 2 nd coupling part 405 can rotate relative to the vacuum container 61 of the alignment chamber 6, the bellows 402 is not deformed by the rotation of the XY θ actuator 307 in the θ direction. Such relative rotation of the O-ring 406 is secured by the bearing 407, and the life of the bellows 402 can be greatly increased.
The structure for preventing the torsion of the bellows 402 in such an alignment chamber 6 can also be applied to an XY θ actuator for alignment between the substrate (S) and the mask (M) in the film forming chamber 2.
< method for manufacturing electronic device >
Next, an example of a method for manufacturing an electronic device using the film formation apparatus of the present embodiment will be described. Hereinafter, a structure and a manufacturing method of an organic EL display device are exemplified as an example of an electronic apparatus.
First, the organic EL display device manufactured will be described. Fig. 11 (a) shows an overall view of the organic EL display device 50, and fig. 11 (b) shows a cross-sectional structure of 1 pixel.
As shown in fig. 11 (a), a plurality of pixels 52 each including a plurality of light-emitting elements are arranged in a matrix in a display region 51 of an organic EL display device 50. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel is a minimum unit that can display a desired color in the display region 51. In the case of the organic EL display device of the present embodiment, the pixel 52 is configured by a combination of the 1 st light-emitting element 52R, the 2 nd light-emitting element 52G, and the 3 rd light-emitting element 52B indicating different light emissions from each other. The pixel 52 is often configured by a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is not particularly limited as long as it is at least 1 color or more.
FIG. 11 (B) is a partial cross-sectional view taken along line A-B of FIG. 11 (a). The pixel 52 includes an organic EL element including a 1 st electrode (anode) 54, a hole transport layer 55, light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a 2 nd electrode (cathode) 58 on a substrate 53. The hole transport layer 55, the light emitting layers 56R, 56G, and 56B, and the electron transport layer 57 are in contact with the organic layer. In this embodiment, the light-emitting layer 56R is an organic EL layer that emits red, the light-emitting layer 56G is an organic EL layer that emits green, and the light-emitting layer 56B is an organic EL layer that emits blue. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red, green, and blue light, respectively. The 1 st electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the No. 2 electrode 58 may be formed in common with the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. In addition, in order to prevent the 1 st electrode 54 and the 2 nd electrode 58 from being short-circuited by foreign matter, an insulating layer 59 is provided between the 1 st electrodes 54. In addition, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 60 for protecting the organic EL element from moisture or oxygen is provided.
In fig. 11 (b), the hole transport layer 55 and the electron transport layer 57 are illustrated as one layer, but may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. Further, a hole injection layer having an energy band structure, which can smoothly inject holes from the 1 st electrode 54 into the hole transport layer 55, may be formed between the 1 st electrode 54 and the hole transport layer 55. Similarly, an electron injection layer can be formed between the 2 nd electrode 58 and the electron transport layer 57.
Next, an example of a method for manufacturing an organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and the substrate 53 on which the 1 st electrode 54 is formed are prepared.
An acrylic resin is formed by spin coating on the substrate 53 on which the 1 st electrode 54 is formed, and the acrylic resin is patterned by photolithography so as to form an opening in a portion where the 1 st electrode 54 is formed, thereby forming the insulating layer 59. The opening corresponds to a light-emitting region where the light-emitting element actually emits light.
The substrate 53 with the patterned insulating layer 59 is carried into the 1 st film forming apparatus, and the substrate is held by the substrate holding means, and the hole transport layer 55 is formed as a layer common to the 1 st electrode 54 in the display region. The hole transport layer 55 is formed by vacuum evaporation. In practice, the hole transport layer 55 is formed to have a size larger than the display region 51, and therefore a high-definition mask is not required.
Subsequently, the substrate 53 having been formed on the hole transport layer 55 is carried into the 2 nd film forming apparatus and held by the substrate holding means. Alignment between the substrate and the mask is performed, the substrate is placed on the mask, and the light-emitting layer 56R emitting red light is formed on the portion of the substrate 53 where the red-emitting element is disposed. According to the present embodiment, before the substrate is carried into the film forming unit by the carrying robot (R) in the carrying chamber 1, the rough alignment for roughly adjusting the position of the substrate in the alignment chamber 6 is performed, and only the fine alignment is performed without the rough alignment in the film forming apparatus 20. This can significantly reduce the overall time required for the alignment process.
Similarly to the formation of the light-emitting layer 56R, the light-emitting layer 56G emitting green light is formed by the 3 rd film formation device, and the light-emitting layer 56B emitting blue light is formed by the 4 th film formation device. After the completion of the formation of the light-emitting layers 56R, 56G, and 56B, the electron transport layer 57 is formed over the entire display region 51 by the 5 th film formation apparatus. The electron transport layer 57 is formed as a layer common to the 3-color light emitting layers 56R, 56G, and 56B.
The substrate on which the electron transport layer 57 is formed is moved to a sputtering apparatus to form the 2 nd electrode 57, and then moved to a plasma CVD apparatus to form the protective layer 60, thereby completing the organic EL display apparatus 50.
After the substrate 53 having the patterned insulating layer 59 is carried into the film formation apparatus, until the film formation of the protective layer 60 is completed, if the substrate is exposed to an atmosphere containing moisture or oxygen, there is a possibility that the light-emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this example, the substrate is carried in and out between the film forming apparatuses in a vacuum atmosphere or an inert gas atmosphere.
The above-described embodiments and examples represent one example of the present invention, and the present invention is not limited to the configurations of the above-described embodiments and examples, and can be modified as appropriate within the scope of the technical idea thereof.
Description of the reference numerals
1: conveying chamber
2: film forming chamber
3: mask loading chamber
4: buffer chamber
5: whirling chamber
6: alignment chamber
61: vacuum container
301: position information acquisition mechanism and alignment camera
302: substrate mounting table
303: control mechanism
304: image processing unit
305: storage unit
306: bottom surface of vacuum container of alignment chamber
307: XY theta actuator
310: shaft
311: substrate side alignment marker
312: stage side alignment mark
315: reference mark setting part
3021. 3022: stage side alignment mark
3151. 3152: fiducial marker
3153, 3154: hypothetical fiducial marker
402: corrugated pipe
404: 1 st connecting part
405: 2 nd connecting part
406: o-shaped ring
407: bearing assembly

Claims (34)

1. A substrate transfer system having a relay device for transferring a substrate from a 1 st device to the relay device and transferring a substrate from the relay device to a 2 nd device, wherein,
the relay device includes:
a container;
a substrate mounting table provided in the container and on which a substrate is mounted;
a reference mark which is a member different from the substrate placement table, is fixedly disposed in the container with respect to the container, and indicates a reference position;
a 1 st moving mechanism for moving the substrate mounting table in a 1 st direction along a substrate mounting surface of the substrate mounting table by the 1 st moving mechanism;
a 2 nd moving mechanism for moving the substrate mounting table in a 2 nd direction along the substrate mounting surface and intersecting with the 1 st direction;
a position information acquiring unit that is disposed outside the container and acquires substrate position information indicating a position of the substrate with respect to the container;
a control unit configured to control the 1 st moving unit and the 2 nd moving unit based on 1 st information on a position of the substrate in the container acquired by the position information acquiring unit and 2 nd information on a position of the reference mark; and
a storage unit for storing the 2 nd information,
the control means controls the 1 st moving means and the 2 nd moving means for a plurality of substrates by using the 2 nd information stored in the storage unit in one storage operation.
2. The substrate carrier system according to claim 1, wherein the control means calculates a positional deviation amount of the substrate from the 1 st information and the 2 nd information, and controls the 1 st moving means and the 2 nd moving means based on the positional deviation amount.
3. The substrate carrier system according to claim 1, wherein the member having the reference mark is fixedly provided to the container.
4. The substrate carrier system according to claim 1, wherein the positional information acquisition means includes a camera for acquiring the 1 st information.
5. The substrate carrier system according to claim 4, wherein the camera is provided at a position corresponding to a corner of the substrate placed on the substrate placing table.
6. The substrate carrier system according to claim 4, wherein the cameras are provided at positions corresponding to two diagonal corners of the substrate placed on the substrate placing table, respectively.
7. The substrate handling system according to claim 4, wherein,
the above-mentioned container is a vacuum container,
the camera is disposed on the atmosphere side of the vacuum container of the relay device, and acquires the substrate position information through a transparent window disposed on the vacuum container of the relay device.
8. The substrate carrier system according to claim 5, wherein the control mechanism includes an image processing unit that calculates information on a position where extensions of both sides of the substrate intersect, based on the image of the corner of the substrate captured by the camera.
9. The substrate carrier system according to claim 6, wherein the control means calculates a center point of a line connecting the two corners imaged by the camera.
10. The substrate carrier system according to claim 1, wherein the control means calculates a positional deviation amount of the substrate based on the 2 nd information stored in the storage unit and the 1 st information acquired by the positional information acquisition means.
11. The substrate carrier system according to claim 4, wherein the control means calculates the amount of positional deviation of the substrate based on an image including a reference mark fixed to the container and a corner of the substrate captured by the camera.
12. The substrate carrier system according to claim 1, wherein the control means calculates a positional displacement amount of the substrate based on a substrate alignment mark formed on the substrate and a captured image of the reference mark.
13. The substrate carrier system according to claim 12, wherein the substrate alignment marks are formed at two corners of the substrate at opposite corners.
14. The substrate carrier system according to claim 1, further comprising a 3 rd moving mechanism that moves the substrate mounting table in a rotational direction that rotates about a 3 rd direction intersecting the 1 st direction and the 2 nd direction.
15. The substrate handling system according to claim 1, wherein,
the above-mentioned container is a vacuum container,
the 1 st moving mechanism and the 2 nd moving mechanism are provided on the atmosphere side with respect to the vacuum chamber and below the substrate placement table.
16. The substrate carrier system according to claim 1, wherein the 1 st moving mechanism and the 2 nd moving mechanism include a servo motor and a power conversion mechanism for converting a rotational driving force from the servo motor into a linear driving force.
17. The substrate handling system according to claim 1, wherein,
the above-mentioned container is a vacuum container,
the substrate transfer system includes:
a shaft for transmitting a driving force in at least one of the 1 st direction and the 2 nd direction from an atmosphere side of the vacuum chamber of the relay device to the substrate mounting table; and
and an extensible member that partitions a vacuum side and an atmosphere side of the relay device so as to surround the shaft.
18. The substrate carrier system according to claim 17, wherein the stretchable member is provided so as to be relatively movable with respect to the substrate mounting table when the substrate mounting table is driven in a rotational direction that rotates about a 3 rd direction intersecting the 1 st direction and the 2 nd direction.
19. The substrate carrier system according to claim 18, wherein the stretchable member is coupled to the vacuum chamber of the relay device via a coupling portion, and the coupling portion is fixed to the vacuum chamber of the relay device so as to float in the rotational direction by an O-ring and a bearing.
20. An apparatus for manufacturing an electronic device, comprising:
1, a first device;
a 2 nd device; and
a substrate carrying system for carrying a substrate for forming the electronic device from the 1 st apparatus to the 2 nd apparatus,
the substrate carrying system according to any one of claims 1 to 19,
the 2 nd apparatus includes a transfer chamber for transferring the substrate and a plurality of film forming chambers connected to the transfer chamber.
21. An apparatus for manufacturing an electronic device, comprising:
a 1 st device having a 1 st transfer chamber;
a 2 nd apparatus having a 2 nd transfer chamber and a plurality of film forming chambers connected to the 2 nd transfer chamber; and
a relay device connected to the 1 st device and the 2 nd device,
the relay device includes:
a container;
a substrate mounting table provided in the container and on which a substrate is mounted;
a reference mark which is a member different from the substrate mounting table, is fixedly disposed in the container with respect to the container, and indicates a reference position;
a 1 st moving mechanism for moving the substrate mounting table in a 1 st direction along a substrate mounting surface of the substrate mounting table by the 1 st moving mechanism;
a 2 nd moving mechanism for moving the substrate mounting table in a 2 nd direction along the substrate mounting surface and intersecting with the 1 st direction;
a position information acquiring unit that is disposed outside the container and acquires substrate position information indicating a position of the substrate with respect to the container;
a control unit configured to control the 1 st moving unit and the 2 nd moving unit based on 1 st information on a position of the substrate in the container acquired by the position information acquiring unit and 2 nd information on a position of the reference mark;
a storage unit for storing the 2 nd information; and
a 1 st alignment mechanism for adjusting a position of the substrate,
at least one film forming chamber of the plurality of film forming chambers includes a 2 nd alignment mechanism for adjusting a position of the substrate,
the control means controls the 1 st moving means and the 2 nd moving means for a plurality of substrates by using the 2 nd information stored in the storage unit in one storage operation.
22. The apparatus for manufacturing an electronic device according to claim 21,
a 1 st transfer robot for transferring the substrate to the relay device is disposed in the 1 st transfer chamber,
a 2 nd transfer robot configured to carry out the substrate from the relay device and carry the substrate into the one film forming chamber, the 2 nd transfer robot being disposed in the 2 nd transfer chamber,
the 2 nd transfer robot carries the substrate out of the one film forming chamber and carries the substrate into another film forming chamber of the plurality of film forming chambers.
23. The apparatus for manufacturing an electronic device according to claim 21, wherein the 1 st alignment mechanism of the relay device calculates a positional displacement amount of the substrate based on reference position information indicating a reference position in the relay device and substrate position information of the substrate placed on the substrate placing table, and adjusts the position of the substrate.
24. The apparatus for manufacturing an electronic device according to claim 21, wherein the 2 nd alignment mechanism performs relative alignment between a substrate and a mask for forming a film on the substrate.
25. The apparatus for manufacturing an electronic device according to claim 21, wherein the accuracy of the position adjustment of the 2 nd alignment mechanism is higher than that of the 1 st alignment mechanism.
26. The apparatus for manufacturing an electronic device according to claim 21, wherein a moving range of the 1 st alignment mechanism is larger than a moving range of the 2 nd alignment mechanism.
27. The apparatus for manufacturing an electronic device according to claim 26, wherein a range of positional displacement that can be adjusted is larger in the 1 st alignment mechanism than in the 2 nd alignment mechanism.
28. The apparatus for manufacturing an electronic device according to claim 21,
the 1 st alignment mechanism includes a 1 st alignment camera for photographing a corner of the substrate,
the 2 nd alignment mechanism includes a 2 nd alignment camera for imaging an alignment mark formed on a substrate and a mask for forming a film on the substrate,
the 1 st alignment camera has a resolution lower than that of the 2 nd alignment camera, and the 1 st alignment camera has a field angle larger than that of the 2 nd alignment camera.
29. The apparatus for manufacturing an electronic device according to claim 21,
in the relay device, the 1 st alignment mechanism performs rough alignment of the substrate with respect to a reference position in the relay device,
in the film forming chamber, fine alignment with a higher accuracy of position adjustment than the coarse alignment is performed by the 2 nd alignment mechanism as relative alignment between the substrate and a mask for forming a film on the substrate.
30. The apparatus for manufacturing an electronic device according to claim 29, wherein coarse alignment with a precision of position adjustment corresponding to the coarse alignment performed by the relay device is not performed in the film forming chamber.
31. The apparatus for manufacturing an electronic device according to claim 21,
the relay device includes an alignment chamber provided with the 1 st alignment mechanism and a whirling chamber for changing an orientation of the substrate,
the whirling chamber is provided on the 1 st device side of the alignment chamber.
32. The apparatus for manufacturing an electronic device according to claim 21,
the relay device includes an alignment chamber provided with the 1 st alignment mechanism and a buffer chamber for storing a plurality of substrates,
the buffer chamber is provided on the 1 st device side of the alignment chamber.
33. A method for manufacturing an electronic device, wherein the electronic device is manufactured using the substrate transport system according to any one of claims 1 to 19.
34. A method of manufacturing an electronic device, wherein the electronic device is manufactured using the manufacturing apparatus for an electronic device according to any one of claims 21 to 32.
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