CN110402030A - A kind of manufacturing method and printed circuit board of printed circuit board radiator structure - Google Patents
A kind of manufacturing method and printed circuit board of printed circuit board radiator structure Download PDFInfo
- Publication number
- CN110402030A CN110402030A CN201910689733.3A CN201910689733A CN110402030A CN 110402030 A CN110402030 A CN 110402030A CN 201910689733 A CN201910689733 A CN 201910689733A CN 110402030 A CN110402030 A CN 110402030A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit substrate
- layers
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 96
- 239000010949 copper Substances 0.000 claims abstract description 96
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 95
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 238000003801 milling Methods 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims abstract description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010931 gold Substances 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 230000005611 electricity Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 28
- 239000002344 surface layer Substances 0.000 claims 1
- 230000008719 thickening Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 238000007731 hot pressing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to printed circuit board manufacturing fields, disclose the manufacturing method and printed circuit board of a kind of printed circuit board radiator structure, the following steps are included: S1, offer circuit substrate, the upper and lower surfaces of the circuit substrate are provided with copper clad layers, are substrate between upper surface copper clad layers and lower surface copper clad layers；S2, the setting position milling groove in circuit substrate, and the bottom of groove is milled into the copper clad layers of circuit substrate lower surface；S3, in the heat dissipation layers of copper that bottom portion of groove electroplating thickness is 0.1 ㎜ -0.5 ㎜, and the copper clad layers of radiate layers of copper and circuit substrate lower surface are connected as entirety；S4, the radiating copper layer surface plated conductive layer gold formed in step S3.The present invention is by setting groove, and plating heat dissipation layers of copper, makes the copper clad layers of heat dissipation layers of copper and circuit substrate be connected as entirety, binding force is stronger, and thermal diffusivity is more preferable, reduces printed circuit board manufacture difficulty in groove.
Description
Technical field
The present invention relates to printed circuit board manufacturing fields, in particular to a kind of system of printed circuit board radiator structure
Make method and printed circuit board.
Background technique
High power device is by a large amount of mature applied to pcb board, generation a large amount of warm when due to high power device work at present
Can, temperature, which significantly increases, will lead to component reduced service life.In order to solve the heat dissipation problem of high power device, usually adopt
Use the metal base printed circuit board with excellent heat dispersion performance as the installation carrier of high power device.For example, Publication No.
The Chinese patent of CN202103943U discloses a kind of printed circuit board with metal micro-radiator.Publication No.
The Chinese patent of CN102291938B discloses a kind of preparation method of printed circuit board with metal micro-radiator.It is above-mentioned
Printed circuit board is combined with conventional printed circuit boards by the metal micro-radiator of high heat conductance, heater element is installed on
On metal micro-radiator end face, the heat that heater element distributes when working can be conducted through metal micro-radiator to metal back layer, then
It conducts through metal back layer to outside printed circuit board, realizes heat sinking function.
The preparation method of above-mentioned printed circuit board is to form metal micro-radiator on metal back layer first, and in circuit base
Mounting hole is formed on plate, then by simultaneously hot pressing in the mounting hole of metal micro-radiator embedded circuit substrate, this causes metal is micro- to dissipate
Aligning accuracy between hot device and mounting hole is poor, and the manufacture difficulty of printed circuit board is big, and product qualification rate is low；Metal micro-radiator
Insufficient, the poor heat resistance with circuit substrate binding force；And the excessive glue that hot pressing generates is difficult to remove, and influences heat dissipation effect.
Summary of the invention
For deficiency above-mentioned in the prior art, the present invention provide a kind of printed circuit board radiator structure manufacturing method and
Printed circuit board, big with the printed circuit board manufacture difficulty for solving tool radiator structure, poor heat resistance, product qualification rate is low to ask
Topic.
The solution that the present invention uses is:
A kind of manufacturing method of printed circuit board radiator structure, comprising the following steps:
S1, circuit substrate is provided, the upper and lower surfaces of the circuit substrate are provided with copper clad layers, upper surface copper clad layers
It is substrate between the copper clad layers of lower surface；
S2, the setting position milling groove in circuit substrate, and the bottom of groove be milled into circuit substrate lower surface cover copper
Layer；
S3, in the heat dissipation layers of copper that bottom portion of groove electroplating thickness is 0.1 ㎜ -0.5 ㎜, and radiate layers of copper and circuit substrate following table
The copper clad layers in face are connected as entirety；
S4, the radiating copper layer surface plated conductive layer gold formed in step S3.
Further, in step S2 milling groove mode are as follows: use CNC milling machine equipment, pass through control milling cutter under drawdown
The substrate mill off of circuit substrate is exposed the copper clad layers of circuit substrate lower surface by degree.
Further, in step S2, the depth that the bottom of the groove is milled into circuit substrate lower surface copper clad layers is 10-20
μm。
Further, in step S2, before milling groove, the copper clad layers plating in circuit substrate lower surface thickeies layers of copper,
The copper clad layers of circuit substrate lower surface are thickeied to 70 μm.
Further, in step S3, before plating heat dissipation layers of copper, graphic mask is carried out to circuit substrate, blocks and is not required to electricity
Groove is exposed in the position of plating, in the bottom portion of groove plating heat dissipation layers of copper of exposing.
Further, the circuit substrate is multi-layer board, and the substrate of circuit substrate is laminated by multi-layer coreboard.
The present invention also provides a kind of printed circuit board radiator structures, as obtained by above-mentioned manufacturing method, including circuit base
The upper and lower surfaces of plate, the circuit substrate are provided with copper clad layers, which is characterized in that the circuit substrate is provided with recessed
The copper clad layers of circuit substrate lower surface are goed deep into slot, the bottom of the groove；The bottom of the groove is electroplate with heat dissipation layers of copper, described
Heat dissipation layers of copper and the copper clad layers of circuit substrate lower surface are connected as entirety.The copper clad layers of the circuit substrate lower surface, which are provided with, to be added
Thick copper layer.The radiating copper layer surface is provided with conductive gold layer.
The present invention also provides a kind of printed circuit boards, with above-mentioned printed circuit board radiator structure.
The beneficial effects of the present invention are:
The present invention is by setting groove, and plating heat dissipation layers of copper, makes the copper clad layers of heat dissipation layers of copper and circuit substrate in groove
It is connected as entirety.By hot pressing in the mounting hole of radiator embedded circuit substrate in compared to the prior art, due to hot pressing is unqualified
Cause binding force insufficient, poor heat resistance；Radiator structure of the invention, heat dissipation layers of copper is formed as one with copper clad layers, as whole
The heat dissipating layer of body, binding force is stronger, and thermal diffusivity is more preferable, and without hot-press overflowing glue, there is no the low problems of product qualification rate, reduces
Printed circuit board manufacture difficulty.Using printed circuit board obtained by preparation method of the invention, since groove has a depthkeeping
Degree can place integral thickness of the high performance components without influencing printed circuit board in groove, be suitable for circuit board foot
Very little more demanding integrated installation environment.
Detailed description of the invention
Fig. 1 is the radiator structure schematic diagram of the embodiment of the present invention.
Appended drawing reference: 1- copper clad layers, 2- substrate, 3- thicken layers of copper, 4- groove, 5- heat dissipation layers of copper, 6- conductive gold layer.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached in the embodiment of the present invention
Figure, technical scheme in the embodiment of the invention is clearly and completely described.
A kind of manufacturing method of printed circuit board radiator structure, comprising the following steps:
S1, circuit substrate is provided, specifically, the circuit substrate is single sided board, dual platen or multi-layer board, had been subjected at sawing sheet
Reason, the upper and lower surfaces of the circuit substrate are provided with copper clad layers, are between upper surface copper clad layers and lower surface copper clad layers
Substrate.In the present embodiment, the circuit substrate is multi-layer board, and substrate is laminated by multi-layer coreboard.The core plate is by poly- four
Vinyl fluoride and glass-fiber-fabric composition, dielectric constant is low, and dielectric loss is small, can be used for high-frequency transmission.
S2, the setting position milling groove in circuit substrate, and the bottom of groove be milled into circuit substrate lower surface cover copper
Layer.The mode of milling groove are as follows: use CNC milling machine equipment, by controlling milling cutter descending depth, the substrate of circuit substrate is milled
Fall, exposes the copper clad layers of circuit substrate lower surface.Since copper clad layers surface is coated with the insulating materials such as resin, the bottom of the groove
The depth that portion is milled into circuit substrate lower surface copper clad layers is 10-20 μm, completely to mill insulating layer, guarantees electroplating effect.
S3, in the heat dissipation layers of copper that bottom portion of groove electroplating thickness is 0.1 ㎜ -0.5 ㎜, and radiate layers of copper and circuit substrate following table
The copper clad layers in face are connected as entirety.Before plating heat dissipation layers of copper, graphic mask need to be carried out to circuit substrate, block and be not required to plating
Groove is exposed in position.Then apply certain electric current, carry out graphic plating within a certain period of time, i.e., in the bottom portion of groove of exposing
Plating heat dissipation layers of copper.In the present embodiment, it is described heat dissipation layers of copper with a thickness of 0.2 ㎜.
S4, the radiating copper layer surface plated conductive layer gold formed in step S3.In the present embodiment, the thickness of the conductive gold layer
Degree is 2 μm.
In order to enhance heat dissipation effect, in step S2, before milling groove, circuit substrate lower surface copper clad layers plating plus
Thick copper layer thickeies the copper clad layers of circuit substrate lower surface to 70 μm.
The printed circuit board radiator structure manufactured using the above method, including circuit substrate, the upper table of the circuit substrate
Face and lower surface are provided with copper clad layers 1, are substrate 2, the circuit base between upper surface copper clad layers 1 and lower surface copper clad layers 1
Plate setting fluted 4, the copper clad layers 1 of circuit substrate lower surface are goed deep into the bottom of the groove 4.The bottom of the groove 4 is electroplated
There is heat dissipation layers of copper 5, the heat dissipation layers of copper 5 and the copper clad layers 1 of circuit substrate lower surface are connected as entirety.The circuit substrate following table
The plating setting of copper clad layers 1 in face thickeies layers of copper 3.Conductive gold layer 6 is arranged in 5 electroplating surface of heat dissipation layers of copper.
Heat dissipation layers of copper and the copper clad layers of the radiator structure are integrally attached to, and binding force is stronger, and thermal diffusivity is more preferable.With above-mentioned
The printed circuit board of radiator structure can place high performance components without shadow since groove has certain depth in groove
The integral thickness of printed circuit board is rung, integrated installation environment is suitable for.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of manufacturing method of printed circuit board radiator structure comprising following steps:
S1, circuit substrate is provided, the upper and lower surfaces of the circuit substrate are provided with copper clad layers, and upper surface copper clad layers are under
It is substrate between the copper clad layers of surface；
S2, the setting position milling groove in circuit substrate, and the bottom of groove is milled into the copper clad layers of circuit substrate lower surface；
S3, in the heat dissipation layers of copper that bottom portion of groove electroplating thickness is 0.1 ㎜ -0.5 ㎜, and radiate layers of copper and circuit substrate lower surface
Copper clad layers are connected as entirety；
S4, the radiating copper layer surface plated conductive layer gold formed in step S3.
2. the manufacturing method of printed circuit board radiator structure according to claim 1, which is characterized in that milling in step S2
The mode of groove are as follows: use CNC milling machine equipment, by controlling milling cutter descending depth, the substrate mill off of circuit substrate exposes
The copper clad layers of circuit substrate lower surface.
3. the manufacturing method of printed circuit board radiator structure according to claim 1, which is characterized in that in step S2, institute
It is 10-20 μm that the bottom for stating groove, which is milled into the depth of circuit substrate lower surface copper clad layers,.
4. the manufacturing method of printed circuit board radiator structure according to claim 1, which is characterized in that in step S2, milling
Before cutting groove, the copper clad layers plating in circuit substrate lower surface thickeies layers of copper, and the copper clad layers of circuit substrate lower surface are thickeied
To 70 μm.
5. the manufacturing method of printed circuit board radiator structure according to claim 1, which is characterized in that in step S3, electricity
Before plating heat dissipation layers of copper, graphic mask is carried out to circuit substrate, blocks the position for being not required to plating, exposes groove, in the recessed of exposing
Trench bottom plating heat dissipation layers of copper.
6. the manufacturing method of printed circuit board radiator structure according to claim 1, which is characterized in that the circuit substrate
Substrate for multi-layer board, circuit substrate is laminated by multi-layer coreboard.
7. a kind of printed circuit board radiator structure, including circuit substrate, the upper and lower surfaces of the circuit substrate are respectively provided with
There are copper clad layers, is substrate between upper surface copper clad layers and lower surface copper clad layers, which is characterized in that the circuit substrate is provided with recessed
The copper clad layers of circuit substrate lower surface are goed deep into slot, the bottom of the groove；The bottom of the groove is electroplate with heat dissipation layers of copper, described
Heat dissipation layers of copper and the copper clad layers of circuit substrate lower surface are connected as entirety.
8. printed circuit board radiator structure according to claim 7, which is characterized in that cover the circuit substrate lower surface
Layers of copper is provided with thickening layers of copper.
9. printed circuit board radiator structure according to claim 7, which is characterized in that the radiating copper layer surface is provided with
Conductive gold layer.
10. a kind of printed circuit board, including printed circuit board radiator structure as claimed in claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910689733.3A CN110402030A (en) | 2019-07-29 | 2019-07-29 | A kind of manufacturing method and printed circuit board of printed circuit board radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910689733.3A CN110402030A (en) | 2019-07-29 | 2019-07-29 | A kind of manufacturing method and printed circuit board of printed circuit board radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110402030A true CN110402030A (en) | 2019-11-01 |
Family
ID=68326394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910689733.3A Pending CN110402030A (en) | 2019-07-29 | 2019-07-29 | A kind of manufacturing method and printed circuit board of printed circuit board radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110402030A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216675A (en) * | 2020-09-11 | 2021-01-12 | 中国电子科技集团公司第十三研究所 | Micro-assembly substrate structure and chip micro-assembly method |
| CN113473719A (en) * | 2021-07-06 | 2021-10-01 | 皆利士多层线路版(中山)有限公司 | Heat dissipation aluminum substrate and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024087A (en) * | 1999-07-06 | 2001-01-26 | Sumitomo Metal Mining Co Ltd | Method for formation of bump, wiring board prepared thereby and semiconductor device using the same |
| KR20070079794A (en) * | 2006-02-03 | 2007-08-08 | 삼성전기주식회사 | Manufacturing method of printed circuit board |
| JP2010080702A (en) * | 2008-09-26 | 2010-04-08 | Hitachi Chem Co Ltd | Multilayer printed wiring board |
| CN102858081A (en) * | 2012-06-29 | 2013-01-02 | 广州杰赛科技股份有限公司 | PCB (Printed Circuit Board) capable of preventing metalized blind groove bottom plating layer from being separated from substrate and manufacturing method thereof |
| CN104302092A (en) * | 2013-07-16 | 2015-01-21 | 先丰通讯股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN104363706A (en) * | 2014-11-05 | 2015-02-18 | 共青城超群科技股份有限公司 | Method for manufacturing high-heat-dissipativity organic resin copper-clad plate |
-
2019
- 2019-07-29 CN CN201910689733.3A patent/CN110402030A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024087A (en) * | 1999-07-06 | 2001-01-26 | Sumitomo Metal Mining Co Ltd | Method for formation of bump, wiring board prepared thereby and semiconductor device using the same |
| KR20070079794A (en) * | 2006-02-03 | 2007-08-08 | 삼성전기주식회사 | Manufacturing method of printed circuit board |
| JP2010080702A (en) * | 2008-09-26 | 2010-04-08 | Hitachi Chem Co Ltd | Multilayer printed wiring board |
| CN102858081A (en) * | 2012-06-29 | 2013-01-02 | 广州杰赛科技股份有限公司 | PCB (Printed Circuit Board) capable of preventing metalized blind groove bottom plating layer from being separated from substrate and manufacturing method thereof |
| CN104302092A (en) * | 2013-07-16 | 2015-01-21 | 先丰通讯股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN104363706A (en) * | 2014-11-05 | 2015-02-18 | 共青城超群科技股份有限公司 | Method for manufacturing high-heat-dissipativity organic resin copper-clad plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216675A (en) * | 2020-09-11 | 2021-01-12 | 中国电子科技集团公司第十三研究所 | Micro-assembly substrate structure and chip micro-assembly method |
| CN113473719A (en) * | 2021-07-06 | 2021-10-01 | 皆利士多层线路版(中山)有限公司 | Heat dissipation aluminum substrate and preparation method thereof |
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