CN110388991B - Dynamic heat flow sensor integrating thermoelectric effect - Google Patents
Dynamic heat flow sensor integrating thermoelectric effect Download PDFInfo
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- CN110388991B CN110388991B CN201910789938.9A CN201910789938A CN110388991B CN 110388991 B CN110388991 B CN 110388991B CN 201910789938 A CN201910789938 A CN 201910789938A CN 110388991 B CN110388991 B CN 110388991B
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- 230000005676 thermoelectric effect Effects 0.000 title claims abstract description 11
- 238000012546 transfer Methods 0.000 claims abstract description 53
- 229910001120 nichrome Inorganic materials 0.000 claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 claims abstract description 33
- 229910052593 corundum Inorganic materials 0.000 claims abstract description 24
- 239000010431 corundum Substances 0.000 claims abstract description 24
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims abstract description 21
- 238000009413 insulation Methods 0.000 claims abstract description 19
- 229910052628 phlogopite Inorganic materials 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- 230000003334 potential effect Effects 0.000 claims abstract 2
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 16
- 238000012545 processing Methods 0.000 abstract description 5
- 230000004044 response Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000003908 quality control method Methods 0.000 abstract description 2
- 230000004308 accommodation Effects 0.000 abstract 1
- 230000008859 change Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
- G01K7/06—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials the thermoelectric materials being arranged one within the other with the junction at one end exposed to the object, e.g. sheathed type
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a dynamic heat flow sensor for collecting thermoelectric potential effect, comprising: the T-shaped packaging shell is connected with a T-shaped tail heat sink body, and accommodating through cavities are formed in the T-shaped packaging shell and the T-shaped tail heat sink body; the nichrome heat transfer body is positioned in the containing through cavity, one end of the nichrome heat transfer body is connected with a phlogopite heat insulation sleeve, and a containing through hole is formed in the nichrome heat transfer body; a corundum tube fixed in the accommodation through hole; the end-exposed type single-core nickel-silicon alloy wire is fixed in the corundum tube, and the end face of the single-core nickel-silicon alloy wire is flush with the front end face of the nichrome heat transfer body; and the pure silver plunger is positioned at the outlet position of the accommodating through hole and is connected with the end-exposed single-core nickel-silicon alloy wire head. The dynamic heat flow sensor for collecting the thermoelectric effect has the advantages of simple processing and assembling process, low production cost, easiness in realizing quality control, improvement of the thermal response speed and test accuracy of the sensor and prolongation of effective test time.
Description
Technical Field
The invention belongs to the field of hypersonic ground heat protection test technology and flight test, and particularly relates to a dynamic heat flow sensor with a thermoelectric collection effect.
Background
When the hypersonic aircraft flies in the atmosphere, a high-temperature boundary layer is formed on the surface of the aircraft by interaction with ambient air, and a huge aerodynamic heat load is applied to the structure and the material of the aircraft, so that the structural safety and the service life of the aircraft are seriously affected. In order to effectively screen, evaluate and identify the heat-proof material and the structural heat-proof characteristic of an aircraft, an arc wind tunnel and an arc heater are often used as important pneumatic heat and heat protection ground simulation test platforms, and according to the rail simulation requirement, a pneumatic heating environment for simulating the dynamic change of heat flow is often required; in addition, in the process of the hypersonic aircraft flight test, the heat measurement position faces the dynamic pneumatic heating process due to the influences of factors such as real-time change of parameters of a reentry orbit, transition of an aircraft boundary layer, change of an aircraft posture and the like, so that a heat flow sensor for testing dynamic heat flow needs to be developed. At present, a water-cooled Gordon meter is adopted as dynamic heat flow in a ground heat protection test, and a thermopile thermal resistance layer type heat flow sensor based on micro-electro-mechanical system (MEMS) processing is initially adopted as a flight test environment. The dynamic heat flow sensor has complex structure and high processing cost, and affects wide application. The invention provides a dynamic heat flow sensor with a novel structure aiming at the situation.
Disclosure of Invention
It is an object of the present invention to address at least the above problems and/or disadvantages and to provide at least the advantages described below.
To achieve these objects and other advantages and in accordance with the purpose of the invention, there is provided a dynamic heat flow sensor collecting a thermoelectric effect, comprising:
the T-shaped packaging shell is internally provided with a containing through cavity I, and the outer wall of the smaller end of the T-shaped packaging shell is provided with a thread I;
the phlogopite heat insulation ring is fixedly connected in the accommodating through cavity I at the larger end of the T-shaped packaging shell body through a high-temperature epoxy resin adhesive, the phlogopite heat insulation ring is a hollow circular phlogopite heat insulation ring, and a through hole is formed in the edge of the bottom surface of the phlogopite heat insulation ring;
The T-shaped tail heat sink body is internally provided with a containing through cavity II, the larger end of the T-shaped packaging shell body is positioned in the containing through cavity II, the phlogopite heat insulation ring and the T-shaped tail heat sink body are not contacted with each other, the T-shaped tail heat sink body is detachably connected with the T-shaped packaging shell body, the side wall of the larger end of the T-shaped tail heat sink body is provided with a threaded hole II, and a screw matched with the threaded hole II is arranged in the threaded hole II;
The nickel-chromium alloy heat transfer body is arranged in the accommodating through cavity I, an accommodating through hole is formed in the center of the nickel-chromium alloy heat transfer body, a groove is formed in the side wall of the bottom of the nickel-chromium alloy heat transfer body, the bottom of the nickel-chromium alloy heat transfer body is fixedly connected in the phlogopite heat insulation ring, and the end part of the top end of the nickel-chromium alloy heat transfer body is flush with the end face of the smaller end of the T-shaped packaging outer shell;
One end of the K-type thermocouple wire penetrates through the groove and is fixedly welded in the surface of the nichrome heat transfer body, the part of the K-type thermocouple wire positioned in the groove is fixed in the groove through a high-temperature epoxy resin adhesive, and the other end of the K-type thermocouple wire penetrates through a containing through cavity II at the smaller end of the T-type tail heat sink body and is positioned outside the T-type tail heat sink body;
the single-hole corundum tube is fixed in the containing through hole in the center of the nichrome heat transfer body through a high-temperature epoxy resin adhesive, and the end part of the top end of the single-hole corundum tube is spaced from the outlet position of the containing through hole by a certain distance;
The end-exposed single-core nickel-silicon alloy wire is partially arranged in the single-hole corundum tube and is fixed by coating high-temperature epoxy resin adhesive on the rear end of the corundum tube, the end part of one end of the end-exposed single-core nickel-silicon alloy wire is flush with the end surface of the top end of the nichrome heat transfer body, and the other end of the end-exposed single-core nickel-silicon alloy wire penetrates through a containing through cavity II penetrating through the smaller end of the T-shaped tail heat sink body and is positioned outside the T-shaped tail heat sink body;
The pure silver plunger is fused in a space formed by the end part of the top end of the single-hole corundum tube and the outlet position of the containing through hole through casting or fusion welding, and the pure silver plunger is connected with the head part of the end-exposed single-core nickel-silicon alloy wire.
Preferably, the detachable connection mode of the T-shaped tail heat sink body and the T-shaped packaging shell body is as follows: and the inner wall of the larger end of the T-shaped tail heat sink body and the outer wall of the larger end of the T-shaped packaging shell body are provided with threads III which are matched with each other.
Preferably, the thread III matched with each other on the inner wall of the larger end of the T-shaped tail heat sink body and the outer wall of the larger end of the T-shaped packaging outer shell is a standard M12 thread.
Preferably, the screw thread I on the outer wall of the smaller end of the T-shaped packaging outer shell is a standard M6 external screw thread, and the screw hole II on the side wall of the larger end of the T-shaped tail heat sink body are standard M2 fastening screws and screw thread through holes.
Preferably, the nichrome heat transfer body is in a cylindrical structure with diameters of the top end and the bottom end of 3mm, 6mm and 15mm total length, and the inner diameter of the accommodating through hole in the center of the nichrome heat transfer body is 1mm.
Preferably, the outer diameter of the single-hole corundum tube is phi 1mm, and the inner diameter is phi 0.5mm; the distance between the end part of the top end of the single-hole corundum tube and the position of the outlet of the through hole for accommodating the nichrome heat transfer body is 0.3mm.
Preferably, the outer diameter of the end-exposed single-core nickel-silicon alloy wire is phi 0.3mm.
Preferably, the K-type thermocouple wire is welded at a position of 11mm from the top end face of the nichrome heat transfer body.
The invention at least comprises the following beneficial effects:
The invention is suitable for the dynamic heat flow test of the surface of the arc wind tunnel, the arc heater test environment and the flight test environment model, and has the advantages of simple processing and assembling process, low cost, easy realization of quality control, improvement of the thermal response speed and test accuracy of the sensor and prolongation of effective test time. The heat transfer body of the heat flow sensor directly selects high-temperature-resistant nichrome, and an end exposure type single-core nickel-silicon alloy wire electrically isolated by a corundum sleeve forms a thermocouple junction on the front end face of the sensor, so that the heat flow sensor body is not only the heat transfer body, but also has the thermoelectric effect of a K-type thermocouple; in addition, a pair of K-type thermocouple wires are welded at the rear end of the heat transfer body, and the heat transfer body has the function of serving as a boundary temperature test criterion approximate to a linear dynamic heat transfer body.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
FIG. 1 is a cross-sectional view of a device according to the present invention;
FIG. 2 is a cross-sectional view of a nichrome heat transfer body provided by the present invention;
FIG. 3 is a top view of a nichrome heat transfer body provided by the present invention;
FIG. 4 shows the results of the dynamic heat flow sensor response time detection provided by the present invention.
Detailed Description
The present invention is described in further detail below with reference to the drawings to enable those skilled in the art to practice the invention by referring to the description.
It will be understood that terms, such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
A dynamic heat flow sensor of the collective thermoelectric effect as shown in fig. 1-4, comprising:
The T-shaped packaging shell body 1 is internally provided with a containing through cavity I11, and the outer wall of the smaller end of the T-shaped packaging shell body 1 is provided with threads I13;
The phlogopite heat insulation ring 3 is fixedly connected in a containing through cavity I11 at the larger end of the T-shaped packaging shell body through a high-temperature epoxy resin adhesive 4, the phlogopite heat insulation ring 3 is a hollow circular phlogopite heat insulation ring, and a through hole 31 is formed in the edge of the bottom surface of the phlogopite heat insulation ring 3;
The T-shaped tail heat sink body 5 is internally provided with a containing through cavity II 51, the larger end of the T-shaped packaging shell body 1 is positioned in the containing through cavity II 51, the phlogopite heat insulation ring 3 and the T-shaped tail heat sink body 5 are not contacted with each other, the tail heat sink body 5 is detachably connected with the T-shaped packaging shell body 1, the side wall of the larger end of the T-shaped tail heat sink body 5 is provided with a threaded hole II 14, and a screw 12 matched with the threaded hole II 14 is arranged in the threaded hole II 14;
the nichrome heat transfer body 21 is arranged in the accommodating through cavity I11, an accommodating through hole 22 is formed in the center of the nichrome heat transfer body 21, a groove 222 is formed in the side wall of the bottom 221 of the nichrome heat transfer body 21, the bottom 221 of the nichrome heat transfer body is fixedly connected in the phlogopite heat insulation ring 3, and the end part of the top end of the nichrome heat transfer body 21 is flush with the end surface of the smaller end of the T-shaped packaging shell body 1;
One end of the K-type thermocouple wire 26 passes through the groove 222 and is fixedly welded in the surface 211 of the nichrome heat transfer body 21, the part of the K-type thermocouple wire 26 positioned in the groove 222 is fixed in the groove 222 through the high-temperature epoxy resin adhesive 4, and the other end of the K-type thermocouple wire passes through the accommodating through cavity II 51 at the smaller end of the T-type tail heat sink body 5 and is positioned outside the T-type tail heat sink body 5;
The single-hole corundum tube 23 is fixed in the containing through hole 22 in the center of the nichrome heat transfer body 21 through the high-temperature epoxy resin adhesive 4, and the end part of the top end of the single-hole corundum tube 23 is at a certain interval from the outlet position of the containing through hole 22;
The end-exposed single-core nickel-silicon alloy wire 24, a part of which is arranged in the single-hole corundum tube 23 and is fixed by coating high-temperature epoxy resin adhesive 4 on the rear end of the single-hole corundum tube 23, wherein the end part of one end of the end-exposed single-core nickel-silicon alloy wire 24 is flush with the end surface of the top end of the nichrome heat transfer body 21, and the other end of the end-exposed single-core nickel-silicon alloy wire penetrates through a containing through cavity II 51 at the smaller end of the T-shaped tail heat sink body 5 and is positioned outside the T-shaped tail heat sink body 5;
And a pure silver plunger 25 fused by casting or welding in a space formed between the end of the top end of the single-hole corundum tube 23 and the outlet position of the accommodating through hole 22, and the pure silver plunger 25 is connected with the head of the end-exposure type single-core nickel silicon alloy wire 24.
In the technical scheme, the outer wall of the smaller end of the T-shaped packaging shell body 1 is provided with the thread I13 which is fixedly connected with the model to be measured, and then the measurement is carried out, so that the tight contact can be ensured; the pure silver is welded on the joint of the end-exposed single-core nickel-silicon alloy wire 24 in a casting or fusion welding mode to form a pure silver plunger 25 and is welded with the surrounding nickel-chromium alloy heat transfer body 21 into a whole, so that good connection between the heat transfer body and a thermocouple is ensured, good heat transfer between the nickel-chromium alloy heat transfer body 21 and the single-core nickel-silicon alloy wire 24 is ensured, the contact thermal resistance can be effectively reduced, the thermal response speed is improved, and the processing difficulty is reduced; meanwhile, a surface thermocouple junction can be formed, and the front surface temperature test of the heat flow sensor is realized.
In the above technical scheme, the detachable connection mode of the T-shaped tail heat sink body 5 and the T-shaped package outer shell 1 is as follows: the inner wall of the larger end of the T-shaped tail heat sink body 5 and the outer wall of the larger end of the T-shaped packaging shell body 1 are provided with threads III 52 which are matched with each other. By adopting the mode, the assembly and the disassembly are convenient, and the production difficulty is reduced.
In the above technical solution, the thread III 52 that is matched with the inner wall of the larger end of the T-shaped tail heat sink body 5 and the outer wall of the larger end of the T-shaped package outer shell 1 is a standard M12 thread.
In the above technical scheme, the thread I13 on the outer wall of the smaller end of the T-shaped packaging outer shell 1 is a standard M6 external thread, and the screw 12 and the threaded hole II14 on the side wall of the larger end of the T-shaped tail heat sink 5 are standard M2 fastening screws and threaded through holes. By adopting the mode, the standard threads on the packaging shell are used for fixing the sensor on the model to be tested through the threads, the connection is tight, the good contact between the sensor and the model to be tested is ensured, the disassembly is convenient, and the efficiency can be improved; the T-shaped tail heat sink body is provided with a threaded through hole and a fastening screw, and the packaging shell can be tightly propped up through the screw, so that the packaging shell is prevented from rotating.
In the above technical solution, the nichrome heat transfer body 21 has a cylindrical structure with diameters of top and bottom being Φ3mm and Φ6mm, and a total length of 15mm, and an inner diameter of a receiving through hole in a central position of the nichrome heat transfer body 21 is Φ1mm.
In the above technical solution, the outer diameter of the single-hole corundum tube 23 is Φ1mm, and the inner diameter is Φ0.5mm; the distance between the end of the top end of the single-hole corundum tube 23 and the position of the outlet of the through hole 22 of the nichrome heat transfer body 21 is 0.3mm. In this way, a certain distance is reserved at the position of the outlet of the through hole for accommodating the nichrome heat transfer body, so that the installation of the pure silver plunger is realized, and the pure silver plunger is tightly contacted with the end exposure type single-core nichrome wire.
In the above technical solution, the outer diameter of the end-exposed single-core nickel-silicon alloy wire 24 is Φ0.3mm.
In the above technical solution, the K-type thermocouple wire 26 is welded at a position of 11mm from the top end face of the nichrome heat transfer body 21. By adopting the mode, the K-type thermocouple wires are welded in the nichrome heat transfer body wall, so that the service life can be prolonged, the welding spots are more tightly contacted, and the welding spots are prevented from falling off.
Although embodiments of the present invention have been disclosed above, it is not limited to the details and embodiments shown and described, it is well suited to various fields of use for which the invention would be readily apparent to those skilled in the art, and accordingly, the invention is not limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.
Claims (6)
1. A dynamic heat flow sensor that collects thermoelectric effects, comprising:
the T-shaped packaging shell is internally provided with a containing through cavity I, and the outer wall of the smaller end of the T-shaped packaging shell is provided with a thread I;
the phlogopite heat insulation ring is fixedly connected in the accommodating through cavity I at the larger end of the T-shaped packaging shell body through a high-temperature epoxy resin adhesive, the phlogopite heat insulation ring is a hollow circular phlogopite heat insulation ring, and a through hole is formed in the edge of the bottom surface of the phlogopite heat insulation ring;
The T-shaped tail heat sink body is internally provided with a containing through cavity II, the larger end of the T-shaped packaging shell body is positioned in the containing through cavity II, the phlogopite heat insulation ring and the T-shaped tail heat sink body are not contacted with each other, the T-shaped tail heat sink body is detachably connected with the T-shaped packaging shell body, the side wall of the larger end of the T-shaped tail heat sink body is provided with a threaded hole II, and a screw matched with the threaded hole II is arranged in the threaded hole II;
The nickel-chromium alloy heat transfer body is arranged in the accommodating through cavity I, an accommodating through hole is formed in the center of the nickel-chromium alloy heat transfer body, a groove is formed in the side wall of the bottom of the nickel-chromium alloy heat transfer body, the bottom of the nickel-chromium alloy heat transfer body is fixedly connected in the phlogopite heat insulation ring, and the end part of the top end of the nickel-chromium alloy heat transfer body is flush with the end face of the smaller end of the T-shaped packaging outer shell;
One end of the K-type thermocouple wire penetrates through the groove and is fixedly welded in the surface of the nichrome heat transfer body, the part of the K-type thermocouple wire positioned in the groove is fixed in the groove through a high-temperature epoxy resin adhesive, and the other end of the K-type thermocouple wire penetrates through a containing through cavity II at the smaller end of the T-type tail heat sink body and is positioned outside the T-type tail heat sink body;
the single-hole corundum tube is fixed in the containing through hole in the center of the nichrome heat transfer body through a high-temperature epoxy resin adhesive, and the end part of the top end of the single-hole corundum tube is spaced from the outlet position of the containing through hole by a certain distance;
The end-exposed single-core nickel-silicon alloy wire is partially arranged in the single-hole corundum tube and is fixed by coating high-temperature epoxy resin adhesive on the rear end of the corundum tube, the end part of one end of the end-exposed single-core nickel-silicon alloy wire is flush with the end surface of the top end of the nichrome heat transfer body, and the other end of the end-exposed single-core nickel-silicon alloy wire penetrates through a containing through cavity II penetrating through the smaller end of the T-shaped tail heat sink body and is positioned outside the T-shaped tail heat sink body;
The pure silver plunger is fused in a space formed by the end part of the top end of the single-hole corundum tube and the outlet position of the containing through hole through casting or fusion welding, and is connected with the head part of the end-exposed single-core nickel-silicon alloy wire;
The detachable connection mode of the T-shaped tail heat sink body and the T-shaped packaging shell body is as follows: the inner wall of the larger end of the T-shaped tail heat sink body and the outer wall of the larger end of the T-shaped packaging shell are provided with threads III which are matched with each other;
the screw thread I on the outer wall of the smaller end of the T-shaped packaging outer shell is a standard M6 external screw thread, and the screw and the threaded hole II on the side wall of the larger end of the T-shaped tail heat sink body are standard M2 fastening screws and threaded through holes.
2. The dynamic heat flow sensor of the thermal potential effect collector of claim 1, wherein the mating threads III on the inner wall of the larger end of the T-tail heat sink body and the outer wall of the larger end of the T-package housing are standard M12 threads.
3. The dynamic heat flow sensor for collecting thermoelectric effect according to claim 1, wherein the nichrome heat transfer body has a cylindrical structure with diameters of top and bottom ends of 3mm and 6mm, respectively, and a total length of 15mm, and an inner diameter of the receiving through hole in the central position of the nichrome heat transfer body is 1mm.
4. The dynamic heat flow sensor for collecting thermoelectric effects according to claim 1, wherein the single-hole corundum tube has an outer diameter of Φ1mm and an inner diameter of Φ0.5mm; the distance between the end part of the top end of the single-hole corundum tube and the position of the outlet of the through hole for accommodating the nichrome heat transfer body is 0.3mm.
5. The dynamic heat flow sensor for collecting thermoelectric effects according to claim 1, wherein the end-exposed single-core nickel-silicon alloy wire has an outer diameter of Φ0.3mm.
6. The dynamic heat flow sensor for concentrating the thermoelectric effect according to claim 1, wherein the K-type thermocouple wire is welded at a position of 11mm from the top end face of the nichrome heat transfer body.
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| CN201910789938.9A CN110388991B (en) | 2019-08-26 | 2019-08-26 | Dynamic heat flow sensor integrating thermoelectric effect |
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| CN201910789938.9A CN110388991B (en) | 2019-08-26 | 2019-08-26 | Dynamic heat flow sensor integrating thermoelectric effect |
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| CN110388991B true CN110388991B (en) | 2024-07-12 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111707706B (en) * | 2020-06-04 | 2021-11-30 | 西安交通大学 | Heat flux density measuring device with thermal radiation shield and method |
| CN111947882B (en) * | 2020-09-14 | 2024-03-29 | 中国空气动力研究与发展中心超高速空气动力研究所 | Transient heat flow sensor and test method thereof |
| CN112816103B (en) * | 2021-02-05 | 2024-04-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | Hot wall heat flow sensor and testing method thereof |
| CN113551810B (en) * | 2021-07-21 | 2023-08-18 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling dynamic heat flow sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN210180553U (en) * | 2019-08-26 | 2020-03-24 | 中国空气动力研究与发展中心超高速空气动力研究所 | Dynamic heat flow sensor for collecting heat potential effect |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100308957B1 (en) * | 1999-12-28 | 2001-09-26 | 이계안 | Checking system of heat flux measuring sensor |
| CN103674331B (en) * | 2013-12-13 | 2016-03-16 | 绵阳富林岚科技有限责任公司 | A kind of thermal sink type thermal resistance heat flux sensor |
| JP6398573B2 (en) * | 2014-10-10 | 2018-10-03 | 日本電気株式会社 | Spin heat flow sensor and manufacturing method thereof |
| CN108871599B (en) * | 2017-06-12 | 2024-05-24 | 中国空气动力研究与发展中心超高速空气动力研究所 | Heat flow sensor based on unsteady state heat transfer model |
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2019
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210180553U (en) * | 2019-08-26 | 2020-03-24 | 中国空气动力研究与发展中心超高速空气动力研究所 | Dynamic heat flow sensor for collecting heat potential effect |
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