CN110277323B - Negative pressure packaging process, structure and equipment for fan-out module - Google Patents

Negative pressure packaging process, structure and equipment for fan-out module Download PDF

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Publication number
CN110277323B
CN110277323B CN201910576050.7A CN201910576050A CN110277323B CN 110277323 B CN110277323 B CN 110277323B CN 201910576050 A CN201910576050 A CN 201910576050A CN 110277323 B CN110277323 B CN 110277323B
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injection molding
layer
negative pressure
temporary bonding
bonding layer
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CN110277323A (en
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杨冠南
徐广东
崔成强
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Guangdong University of Technology
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Guangdong University of Technology
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83048—Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses a fan-out module negative pressure packaging process, equipment and a structure, wherein the fan-out module negative pressure packaging process comprises the following steps: a temporary bonding layer is flatly laid on the top surface of a base station along the stacking direction of the packaging body, a plurality of modules are placed on the top surface of the temporary bonding layer in a clearance mode, injection molding is carried out on the top of the modules to form an injection molding layer surrounding the modules, and the bottom surface of the injection molding layer is bonded with the temporary bonding layer; before the injection molding layer is solidified, sucking the open holes which are arranged on the base platform and communicated with the bottom surface of the temporary bonding layer into negative pressure, wherein a plurality of open holes are distributed on the upper surface of the base platform in an array mode. Through the hole with negative pressure, the upper surface of the injection molding layer is forced to be partially incapable of tilting upwards under the action of atmospheric pressure, and meanwhile, the uniform distribution of part of the injection molding layer is effectively ensured. The top surface of the injection molding layer is subjected to atmospheric pressure, so that the whole injection molding layer is uniformly pressed, and the smoothness of the top surface is effectively ensured.

Description

Negative pressure packaging process, structure and equipment for fan-out module
Technical Field
The invention relates to the technical field of packaging, in particular to a fan-out module negative pressure packaging process, fan-out module negative pressure packaging equipment and a fan-out module negative pressure packaging structure.
Background
With the trend of miniaturization and integration of electronic products, the densification of microelectronic packaging technology has gradually become the mainstream of new generation of electronic products. In order to comply with the development of new generation electronic products, especially the development of mobile phones, notebooks and other products, the modules are developed in the direction of higher density, faster speed, smaller size, lower cost and the like. The Fan-out Wafer Level Package (FOPLP) technology has a wider development prospect as an upgrading technology of the Fan-out Wafer Level Package (Fan-out Wafer Level Package). Compared with the traditional lead bonding module, the fan-out type packaging greatly increases the number of pins of the module, reduces the packaging size, simplifies the packaging steps, shortens the distance between the module and the substrate, and improves the module function. The module has the advantages of supporting a process procedure module below 10nm, short interconnection path, high integration degree, ultrathin thickness, high reliability, high heat dissipation capability and the like.
The basic process of the fan-out package is as follows: and covering the substrate with a temporary bonding adhesive, mounting the module, performing injection molding and curing, removing the temporary bonding adhesive and the substrate, and covering the dielectric layer (ABF) and the redistribution layer (RDL). Such a process also presents two fundamental problems for fan-out packages, namely module drift and warpage behavior. During the packaging process, warpage and internal stress are caused by the difference of thermal expansion coefficients of materials such as plastic, silicon and metal. The difference between the thermal expansion coefficients of the module and the injection molding material enables the warpage generated in the cooling process of the injection molding material to be the most main reason for the warpage generation in the large board level fan-out packaging technology.
In summary, how to effectively solve the problem of local warpage in the module packaging process is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, a first objective of the present invention is to provide a fan-out module negative pressure packaging process, which can effectively solve the problems of high internal stress and warpage generated in the packaging process.
In order to achieve the first object, the invention provides the following technical scheme:
a fan-out module negative pressure packaging process comprises the following steps:
a temporary bonding layer is flatly laid on the top surface of a base station along the stacking direction of the packaging body, a plurality of modules are placed on the top surface of the temporary bonding layer in a clearance mode, injection molding is carried out on the top of the modules to form an injection molding layer surrounding the modules, and the bottom surface of the injection molding layer is bonded with the temporary bonding layer;
before the injection molding layer is solidified, sucking the open holes which are arranged on the base platform and communicated with the bottom surface of the temporary bonding layer into negative pressure, wherein a plurality of open holes are distributed on the upper surface of the base platform in an array mode.
In this fan-out module negative pressure packaging technology, set up the trompil that can be sucked into the negative pressure in the base station towards one side of interim bonding layer to make the upper surface on the layer of moulding plastics under the effect of atmospheric pressure through this trompil that has the negative pressure, force the local unable perk that upwards of the layer of moulding plastics, and then guarantee effectively that the layer of moulding plastics is before the solidification, and level and smooth laminating is on the base station, in order to avoid the warpage. In conclusion, the fan-out module negative pressure packaging process can effectively solve the problem of local warping in the module packaging process.
Preferably, one end of the opening close to the temporary bonding layer is gradually widened towards the temporary bonding layer.
Preferably, the method further comprises the step of, for the uncured injection molded layer: and arranging a temperature changing area below the bottom surface of the temporary bonding layer and/or above the top surface of the injection molding layer so as to form a temperature gradient difference between the bottom surface of the temporary bonding layer and the top surface of the injection molding layer.
Preferably, before the opening provided on the submount and communicated to the bottom surface of the temporary bonding layer is sucked to a negative pressure, the method further includes:
and adhering sealant to the peripheral edges of the injection molding layer to form a sealing strip so as to seal gaps between the peripheral edges of the injection molding layer and the peripheral edges of the temporary bonding layer.
Preferably, the sealant is molded into a sealing strip with a right-angled triangle cross section, one straight edge of the sealing strip is bonded with the bearing surface of the base station, and the other straight edge of the sealing strip is bonded with the peripheral edge of the injection molding layer and the peripheral edge of the temporary bonding layer.
In order to achieve the second object, the invention further provides fan-out module negative pressure packaging equipment, which comprises a negative pressure generating device and a base platform, wherein the base platform is used for bearing the temporary bonding layer, the upper platform surface of the base platform is provided with a plurality of openings which are distributed in an array manner, and the negative pressure generating device is communicated with the openings. The fan-out module negative pressure packaging equipment adopts the fan-out module negative pressure packaging process, and has the technical effect, so the fan-out module negative pressure packaging equipment also has the corresponding technical effect.
Preferably, the upper end of the opening is gradually widened upwards.
Preferably, the base station includes the base platform of seting up the slot chamber and covers the orifice plate of slot chamber notch, the orifice plate sets up a plurality of trompils that link up from top to bottom, negative pressure generating device with the slot chamber intercommunication.
In order to achieve the third object, the invention further provides a fan-out module negative pressure packaging structure, which comprises a base platform, wherein a plurality of openings arranged in an array manner are formed on a bearing surface of the base platform; the temporary bonding layer covers the bearing surface of the base platform; a plurality of modules, wherein gaps are arranged on the top surface of the temporary bonding layer; the injection molding layer is injection molded on the module so as to surround the module, the top surface of the injection molding layer is a plane, and the bottom surface of the injection molding layer is bonded on the upper surface of the temporary bonding layer; and the negative pressure generating device is communicated with the open holes. The fan-out module negative pressure packaging structure adopts the fan-out module negative pressure packaging process, and the fan-out module negative pressure packaging process has the technical effects, so the fan-out module negative pressure packaging structure also has corresponding technical effects.
Preferably, the sealing strip is formed by injection molding at the peripheral edge of the injection molding layer, so that the peripheral edge of the injection molding layer and the peripheral edge of the temporary bonding layer are sealed, the cross section of the sealing strip is in a right-angled triangle shape, one straight edge of the sealing strip is bonded with the bearing surface of the base table, and the other straight edge of the sealing strip is bonded with the peripheral edge of the injection molding layer and the peripheral edge of the temporary bonding layer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a fan-out module negative pressure packaging process according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a fan-out module negative pressure package structure according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a fan-out module negative pressure package structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a base station according to an embodiment of the present invention.
The drawings are numbered as follows:
the device comprises a base platform 1, a temporary bonding layer 2, a sealing strip 3, an injection molding layer 4, a module 5, a negative pressure generating device 6 and an opening 7; the arrows in figure 3 indicate the direction of suction.
Detailed Description
The embodiment of the invention discloses a fan-out module negative pressure packaging process which can effectively solve the problems of high internal stress and warping generated in the packaging process.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, fig. 1 is a flow chart of a fan-out module negative pressure packaging process according to an embodiment of the invention; fig. 2 is a schematic structural diagram of a fan-out module negative pressure package structure according to an embodiment of the present invention; FIG. 3 is a schematic cross-sectional view of a fan-out module negative pressure package structure according to an embodiment of the present invention; fig. 4 is a schematic structural diagram of a base station according to an embodiment of the present invention.
In an embodiment, the present embodiment provides a fan-out module under-voltage packaging process for packaging a module 5, where the module 5 mainly refers to a chip, and the fan-out module under-voltage packaging process may specifically be a wafer-level fan-out packaging process or a large board-level fan-out packaging process. Specifically, the fan-out module negative pressure packaging process mainly comprises the following steps:
step 100: along the stacking direction of the packaging body, a temporary bonding layer 2 is flatly laid on the top surface of the base platform 1,
the package stacking direction refers to a stacking direction of the module 5, the temporary bonding layer 2, and the base 1, and generally, the package stacking direction is an up-down direction. For convenience of description, the submount 1 is taken as a base, that is, the direction of the submount 1 toward the temporary bonding layer 2 is a top direction, and the reverse direction is a bottom direction. The temporary bonding layer 2 is flatly paved on the top surface of the base platform 1, the specific paving area is consistent with the size of the injection molding layer 4 which needs to be formed finally, and the specific paving mode can refer to the prior art.
Step 200: and a plurality of modules 5 are arranged on the top surface of the temporary bonding layer 2 in a clearance mode.
After the temporary bonding layer 2 is tiled, the modules 5 are placed, and the modules 5 are juxtaposed in the tiling direction of the temporary bonding layer 2, so that the relative positional relationship between the modules 5 is fixed by the temporary bonding layer 2. The specific relative position relationship between the modules 5 is set as required, and generally, the modules 5 are arranged in an array manner with a certain gap therebetween. Specifically, the chip placement mode can be placed in the forward direction or in the flip-chip manner, and can be specifically selected according to the subsequent process.
Step 300: and (3) injection molding from the top of the module 5 to form an injection molding layer 4 surrounding the module 5, and bonding the bottom surface of the injection molding layer 4 with the temporary bonding layer 2.
The injection molding layer 4 is injected from the top of the module 5 to form a mold layer 4 surrounding the module 5, and the bottom surface of the mold layer 4 is bonded to the temporary bonding layer 2 to effectively prevent the module 5 from shifting, and wherein the top surface of the mold layer 4 is generally formed as a plane and should be higher than the top surface of the module 5 to fully cover the module 5. After the injection molding layer 4 is formed by injection molding, each module 5 is tightly embedded in the injection molding layer 4, so that when the temporary bonding layer 2 is removed at the later stage, the bottom surfaces of the modules 5 are exposed to facilitate connection, and the bottom surface of the injection molding layer 4 and the bottom surface of the module 5 are basically located on the same plane.
Step 400: before the injection layer 4 is solidified, sucking negative pressure into open holes 7 which are arranged on the base platform 1 and communicated with the bottom surface of the temporary bonding layer 2, wherein a plurality of open holes 7 are distributed on the upper surface of the base platform 1 in an array.
Wherein, an opening 7 is arranged on the base platform 1, and the inside of the opening is pumped into negative pressure, wherein the negative pressure refers to air pressure lower than ambient air pressure, which makes the air pressure on the top surface of the injection molding layer 4 larger than the air pressure on the bottom surface of the temporary bonding layer 2, so that a certain pressure is exerted on the upper surface of the injection molding layer 4 by the air pressure. Wherein how to become the negative pressure to trompil 7 suction, for the convenience of suction, can make the bottom of each trompil 7 all communicate with a cavity, only need this cavity suction this moment become the negative pressure can. Wherein the plurality of openings 7 are arranged in an array, typically in a matrix. It should be noted that the specific step 400 may be continued only until the curing of the injection-molded layer 4 is completed, or may be continued until the entire cured injection-molded layer 4 is cut. It should be noted that the not completely cured injection-molded layer should also be an uncured injection-molded layer.
It should be noted that, after the step 400 is executed until the injection molding layer 4 is cured, the temporary bonding layer 2 and the base platform 1 need to be removed, and then the dielectric layer (ABF) and the redistribution layer (RDL) are covered to complete the high-voltage packaging of the whole fan-out module. Specifically, the rewiring can be performed before the injection molding of step 300, or can be performed after the injection molding of step 300.
In this fan-out module negative pressure packaging technology, set up the trompil 7 that can be sucked into the negative pressure at base station 1 towards one side of interim bonding layer 2 to make the upper surface of moulding plastics layer 4 under the effect of atmospheric pressure through this trompil 7 that has the negative pressure, force the local of moulding plastics layer 4 can't upwards the perk, and then guarantee effectively that layer 4 of moulding plastics is before the solidification, and level and smooth laminating is on base station 1, in order to avoid the warpage. In conclusion, the fan-out module negative pressure packaging process can effectively solve the problem of local warping in the packaging process of the module 5.
As described above, a plurality of openings 7 distributed in an array form need to be provided on the top surface of the submount 1, and the number of the corresponding openings 7 is large, and in order to avoid affecting the strength of the submount 1, it is preferable that one end of the opening 7 close to the temporary bonding layer 2 is gradually widened toward the temporary bonding layer 2, that is, the top end is gradually widened from the bottom to the top. Specifically, can make trompil 7 all be gradually wide type from bottom to top, can also make the top section of trompil 7 be gradually wide type, and the bottom section is the cylinder section.
Further, the step 500 is performed on the uncured injection layer 4, specifically, the start execution time of the step 500 may be after the completion of the step 300 and before the start of the step 400, or after the start of the step 400, or may be started in synchronization with the step 400, but the start execution should be performed before the curing of the injection layer 4, and generally performed until the curing of the injection layer 4 stops. Specifically, the step 500 includes: and the temperature changing region is used for setting a temperature changing region at the bottom side of the bottom surface of the temporary bonding layer 2 and/or at the top side of the top surface of the injection molding layer 4 so as to form a temperature gradient difference in the stacking direction of the packages between the bottom surface of the temporary bonding layer 2 and the top surface of the injection molding layer 4. When the top side direction is upward, a temperature changing region is arranged at the lower side of the bottom surface of the temporary bonding layer 2 and/or at the upper side of the top surface of the injection molding layer 4, so that a temperature gradient difference in the up-down direction is formed between the bottom surface of the temporary bonding layer 2 and the top surface of the injection molding layer 4. By forming the temperature gradient difference in the pressurizing direction and in the pressurizing process, the layer-by-layer solidification is generated in the injection molding layer 4 due to the gradient formed by the temperature distribution, and the layer-by-layer smooth solidification can reduce the stress and the warpage.
Wherein, the temperature change area means that the temperature difference exists relative to the peripheral area and the heat can be conducted among each other. The temperature-changing zone may be a high-temperature zone or a low-temperature zone, so that the temperature of the injection-molded layer 4 is influenced by the temperature-changing zone, so that a temperature gradient difference is formed in the stacking direction of the packages. Specifically, considering that the temperature of the injection molded layer 4 is relatively high during injection molding, it is preferable here that the temperature changing region is specifically: and introducing heat exchange fluid into the heat exchange channel of the base station 1 or directly exchanging heat for the base station 1. Can be to letting in low-temperature fluid in the heat transfer passageway of base station 1 to the heat transfer of cooling, can also be to letting in high-temperature fluid in the heat transfer passageway of base station 1 to heat the heat transfer, directly carry out the heat transfer to base station 1 can be directly to base station 1 heating or cooling operation. The high temperature fluid or the low temperature fluid may be air, nitrogen, inert gas, water, oil, etc. which do not react with the package member. The method can be specifically designed according to parameters such as a packaging structure, materials and a process, and the purpose of layer-by-layer curing is achieved. For better heat conduction, the base 1 can be made of copper plate, glass plate, or other materials with different heat transfer properties to control the temperature of the injection layer 4 step by step. It should be noted that the heat exchange channels provided in the base 1 should be offset from the openings 7.
Further, after the step 300 is executed, before the step 400 is executed, that is, before the opening provided on the submount 1 and communicated to the bottom surface of the temporary bonding layer 2 is pumped to the negative pressure, it is preferable that the method further includes the step 600: and adhering the sealant to the peripheral edge of the injection layer 4 to form a sealing strip so as to seal gaps between the peripheral edge of the injection layer 4 and the peripheral edge of the temporary bonding layer. Through coating sealed glue to make can avoid gaseous entering bottom, so that mould plastics the better quilt of layer 4 and flatten and spread on 1 top surface of base station, and play the effect of fixing to the border of layer 4 of moulding plastics, in order to avoid moulding plastics layer 4 and receive extrusion outwards expansion and edge warp. Specifically, in order to better realize sealing, the sealant is preferably injected to form the sealing strip 3 with the cross section being a right triangle, one straight edge of the sealing strip 3 is bonded with the top surface of the base station 1, and the other straight edge is bonded with the peripheral edge of the injection layer 4 and the peripheral edge of the temporary bonding layer.
Correspondingly, step 400 further includes: and uniformly applying high-pressure gas to the top surface of the uncured injection molding layer 4 towards the bottom direction.
Specifically, it is generally necessary to uniformly apply high-pressure gas to the top surface of the uncured injection layer 4 toward the bottom or uniformly pressurize the uncured injection layer 4 by a press plate until the injection layer 4 is cured. In which a pressure is applied to the top surface of the injection molded layer 4 in a direction toward the bottom, i.e., a direction in which the injection molded layer 4 faces the base 1, so that the upper surface of the injection molded layer 4 is pressed downward. And the injection molded layer 4 should be in an uncured state at this time to make the internal density distribution uniform by pressurizing the upper surface of the injection molded layer 4 to flow the molten material in the injection molded layer 4 toward the gap. The pressurizing mode is to blow the base station 1 by applying high-pressure gas, so that the top surface of the injection layer 4 is pressurized, and specifically, a plurality of high-pressure gas nozzles distributed in an array form can be arranged on the top side of the top surface of the injection layer 4.
A more specific application, the package process after the injection molding process, such as for a 320 mm side square large board level fan-out package, where a single chip is a 5 mm side square chip, and the single chip includes a fan-out area that is a 8 mm side square area. Around the fixed copper base station 1 on the interim bonding layer, mould plastics layer 4 and adopt the epoxy compound to mould plastics at 175 ℃ (centigrade), before the material solidification of moulding plastics, structure from the bottom up at this moment is negative pressure generating device 6, base station 1, interim bonding layer 2, chip and the layer 4 of moulding plastics in proper order, through the negative pressure system of bleeding that the array through-hole is connected on the support plate, it forms 10KPa (kilopascal) negative pressure to bleed, make interim bonding layer keep the plane level and smooth all the time, thereby reduce the warpage that the material solidification of moulding plastics arouses. After the injection molding material is solidified, a series of subsequent packaging processes such as subsequent grinding (grinding), base station 1 separation (debonding), Patterned passivation (Patterned passivation), re-wiring (RDL), under bump metal (UBM deposition), etching (etching), ball grid array embedding (BGA mount) and the like are performed to form a final fan-out type packaging structure.
In another specific application, a packaging process after an injection molding process is used for rewiring, and a large board-level fan-out packaging process of a square with the side length of 120 mm is used, wherein a single chip is a square chip with the side length of 5 mm, and the single chip comprises a square area with the fan-out area of 8 mm. Fixing the periphery of a temporary bonding layer on a copper base platform 1, wherein an injection molding layer 4 is formed by injection molding at 170 ℃ by adopting an epoxy resin compound, before the injection molding material is cured, the structure at the moment sequentially comprises a negative pressure generating device 6, the base platform 1, the temporary bonding layer 2, a chip and the injection molding layer 4 from bottom to top, and air extraction treatment is carried out to form 20KPa (kilopascal) negative pressure through an air extraction negative pressure system connected with array through holes on a support plate, so that the temporary bonding layer is always kept flat and flat, and the warping caused by the curing of the injection molding material is reduced. After the injection molding material is solidified, a series of subsequent packaging processes such as subsequent grinding (grinding), base station 1 separation (debonding), Patterned passivation (Patterned passivation), re-wiring (RDL), under bump metal (UBM deposition), etching (etching), ball grid array embedding (BGA mount) and the like are performed to form a final fan-out type packaging structure.
Based on the fan-out module negative pressure packaging process provided in the above embodiment, the invention further provides fan-out module negative pressure packaging equipment, and specifically, the fan-out module negative pressure packaging equipment comprises a base platform 1 and a negative pressure generating device 6, wherein an upper platform surface of the base platform 1 is used for bearing a temporary bonding layer, a plurality of openings 7 distributed in an array are formed in the upper surface of the base platform 1, and the negative pressure generating device 6 is communicated with the openings 7 to suck the interiors of the openings 7 to form negative pressure so as to ensure that the openings 7 form negative pressure suction to the temporary bonding layer 2. Wherein, the fan-out module negative pressure packaging specifically executes steps 100 to 300 in the above embodiment on the base station 1. Wherein the negative pressure generation means is activated after the completion of the step 300 to suck the inside of the opening 7 to be negative pressure. Because the fan-out module negative pressure packaging equipment adopts the fan-out module negative pressure packaging process, the fan-out module negative pressure packaging equipment has the beneficial effects that the embodiment is referred.
Further, as the above-mentioned embodiment, the opening 7 is disposed in a manner that the upper end of the opening 7 on the base 1 is gradually widened upward.
Further, in order to better install the base 1, it is preferable that the base 1 includes a bottom base having a cavity and a hole plate covering a notch of the cavity, the hole plate is provided with a plurality of through holes 7, and the negative pressure generating device 6 is communicated with the cavity.
The fan-out module negative pressure packaging equipment can further comprise a heat exchange device, wherein the heat exchange device is arranged on the upper side of the base station 1 to exchange heat with the upper surface of the injection layer 4 or be used for exchanging heat with the upper side surface of the injection layer 4 which is not solidified, before the injection layer 4 is not solidified, the heat exchange device starts to work, so that the injection layer 4 is in the up-and-down direction, namely the stacking direction of the packaging body forms temperature gradient difference, wherein the negative pressure generating device 6 and the heat exchange device work until the injection layer 4 is completely solidified, the atmosphere on the top surface of the plastic packaging layer is pressurized, the injection molding material is smoothly solidified layer by layer due to the temperature gradient difference, the stress is reduced, the warpage is reduced, and the steps 400 and 500 are completed. The heat exchange device can be arranged in the manner of the above embodiments.
Specifically, the fan-out module negative pressure packaging equipment can further comprise a plurality of high-pressure gas nozzles which are distributed in an array form and are arranged on the upper side of the base platform 1 to spray high-pressure gas to the top surface of the injection molding layer 4.
Based on the fan-out module negative pressure packaging process provided in the above embodiment, the present invention further provides a fan-out module negative pressure packaging structure, and specifically, the fan-out module negative pressure packaging structure includes: the base station 1 is provided with a plurality of openings 7 arranged in an array on a bearing surface; a temporary bonding layer 2 covering the bearing surface of the base platform 1; a plurality of chip modules 5 which are arranged on the top surface of the temporary bonding layer 2 in a clearance mode; the injection molding layer 4 is injection molded on the chip module 5 so as to surround the chip module 5, the top surface of the injection molding layer 4 is a plane, and the bottom surface of the injection molding layer is bonded on the upper surface of the temporary bonding layer 2; and the negative pressure generating device 6 is used for being communicated with each opening 7. Wherein the module 5 may be a chip or other module 5 that needs to be packaged. That is, the fan-out module negative pressure packaging structure is an integral structure of the fan-out module negative pressure packaging process in the state of executing the step 400. Because the fan-out module negative pressure packaging structure adopts the fan-out module negative pressure packaging process in the embodiment, please refer to the embodiment for the beneficial effects of the fan-out module negative pressure packaging structure.
Further, it is preferable that the peripheral edge of the injection layer 4 is injection-molded with a sealing strip 3 having a right-angled triangle cross section, so as to seal the peripheral edge of the injection layer 4 and the peripheral edge of the temporary bonding layer, wherein one straight edge of the sealing strip 3 is bonded to the top surface of the base 1, and the other straight edge is bonded to both the peripheral edge of the injection layer 4 and the peripheral edge of the temporary bonding layer. Please refer to the above embodiments for specific technical effects.
Similarly, the fan-out module negative pressure packaging structure may further include a heat exchange device for exchanging heat with the base platform 1 or arranged on the upper side of the base platform 1 for exchanging heat with the upper surface of the injection molding layer 4, so as to form a temperature gradient difference between the top surface of the injection molding layer 4 and the bottom surface of the temporary bonding layer 2. Please refer to the above embodiments for specific technical effects. The specific arrangement of the heat exchange device can refer to the above embodiments.
Specifically, the fan-out module negative pressure packaging equipment can further comprise a plurality of high-pressure gas nozzles which are distributed in an array form and are arranged on the top side of the injection molding layer 4 to spray high-pressure gas to the top side of the top surface of the injection molding layer 4.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (6)

1. A fan-out module negative pressure packaging process is characterized by comprising the following steps:
a temporary bonding layer is flatly laid on the top surface of a base station along the stacking direction of the packaging body, a plurality of modules are placed on the top surface of the temporary bonding layer in a clearance mode, injection molding is carried out on the top of the modules to form an injection molding layer surrounding the modules, and the bottom surface of the injection molding layer is bonded with the temporary bonding layer;
after the injection molding layer is formed and before the injection molding layer is solidified, sucking negative pressure into an opening which is arranged on the base platform and communicated to the bottom surface of the temporary bonding layer, wherein a plurality of openings are distributed on the upper surface of the base platform in an array mode.
2. The fan-out module negative pressure packaging process of claim 1, wherein one end of the opening close to the temporary bonding layer is gradually widened towards the temporary bonding layer.
3. The fan-out module negative pressure packaging process of claim 2, further comprising performing the steps of, for the uncured injection molded layer: and arranging a temperature changing area below the bottom surface of the temporary bonding layer and/or above the top surface of the injection molding layer so as to form a temperature gradient difference between the bottom surface of the temporary bonding layer and the top surface of the injection molding layer.
4. The fan-out module negative pressure packaging process of claim 1, wherein before the opening provided on the submount and communicated to the bottom surface of the temporary bonding layer is sucked to be negative pressure, the process further comprises:
and adhering sealant to the peripheral edges of the injection molding layer to form a sealing strip so as to seal gaps between the peripheral edges of the injection molding layer and the peripheral edges of the temporary bonding layer.
5. The fan-out module negative pressure packaging process of claim 4, wherein the sealant is injection molded into a sealing strip with a right triangle cross section, one straight edge of the sealing strip is bonded with the bearing surface of the base platform, and the other straight edge is bonded with the peripheral edge of the injection molding layer and the peripheral edge of the temporary bonding layer.
6. A fan-out module negative pressure packaging structure is characterized by comprising:
the bearing surface of the base station is provided with a plurality of openings which are arranged in an array manner;
the temporary bonding layer covers the bearing surface of the base platform;
a plurality of modules, wherein gaps are arranged on the top surface of the temporary bonding layer;
the injection molding layer is injection molded on the module so as to surround the module, the top surface of the injection molding layer is a plane, and the bottom surface of the injection molding layer is bonded on the upper surface of the temporary bonding layer;
the negative pressure generating device is used for being communicated with each opening; the sealing strip is formed by injection molding at the peripheral edge of the injection molding layer, so that the peripheral edge of the injection molding layer and the peripheral edge of the temporary bonding layer are sealed, the cross section of the sealing strip is in a right-angled triangle shape, one straight edge of the sealing strip is bonded with the bearing surface of the base table, and the other straight edge of the sealing strip is bonded with the peripheral edge of the injection molding layer and the peripheral edge of the temporary bonding layer.
CN201910576050.7A 2019-06-28 2019-06-28 Negative pressure packaging process, structure and equipment for fan-out module Active CN110277323B (en)

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