CN110098141B - Method for manufacturing electronic component box - Google Patents
Method for manufacturing electronic component box Download PDFInfo
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- CN110098141B CN110098141B CN201810392443.8A CN201810392443A CN110098141B CN 110098141 B CN110098141 B CN 110098141B CN 201810392443 A CN201810392443 A CN 201810392443A CN 110098141 B CN110098141 B CN 110098141B
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- electronic component
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- layer
- unit electronic
- receiving grooves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
- H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Elimination Of Static Electricity (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
A method of manufacturing an electronic component cartridge comprising: forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively; forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding; cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n receiving grooves, where M and N are natural numbers; and forming a conductive layer on the cut surface by automatically or manually making contact and friction between the cut surface of the unit electronic component case and a synthetic resin containing a conductor or a conductive polymer material by a contact friction member so as to electrically connect the first and second antistatic layers to each other.
Description
Cross Reference to Related Applications
The priority of korean patent application No. 10-2018-0010885, korean patent application No. 10-2018-0015100, filed on the date of 2018, month 2, and korean patent application No. 10-2018-0026654, filed on the date of 2018, month 3, and 29, respectively, was claimed according to u.s.c. ≡119, which is incorporated herein by reference in its entirety.
Technical Field
Embodiments of the inventive concepts described herein relate to a method of manufacturing an electronic component box (magazine), and more particularly, to a method of manufacturing an electronic component box that includes a tray or carrier tape to package electronic components such as semiconductor devices.
Background
In order to package individual electronic components such as semiconductor devices in units of mxn (M and N are natural numbers), or electronic components formed by assembling mutually different electronic components in a module, trays or carrier tapes have been used. Each such packaging container has a first antistatic layer and a second antistatic layer formed of a conductive material on upper and lower surfaces of a base layer which constitutes a body and includes a nonconductive synthetic resin and has antistatic properties to prevent static electricity from damaging electronic components such as semiconductor devices or electronic components formed by assembling mutually different electronic components in a module. Even if static electricity occurs in a container including a tray or a carrier tape, the static electricity is transferred to the outside by the first antistatic layer and the second antistatic layer without being received in the receiving groove by the electronic component, and thus the electronic component is prevented from being damaged.
The tray or carrier tape is formed by: forming a first antistatic layer and a second antistatic layer having conductivity on upper and lower surfaces of a base layer formed of a fabric sheet containing a non-conductive synthetic resin; heating the fabric sheet; when the sheet reaches the tray mold, performing a vacuum molding process or an air pressure molding process on the sheet between the top mold and the bottom mold to form a receiving groove for receiving the electronic component; and cutting the sheet in units of m×n (M and N are natural numbers) receiving grooves.
When the result is cut into unit trays or unit carrier tapes after the molding process, fine burrs generated by the remaining portions of any one or more of the base layer and the first and second antistatic layers are formed on the cut surface, without completely removing the base layer and the first and second antistatic layers. In addition, the cut surface is not smooth and rough, resulting in fine particles. Such burrs and fine particles adhere to the electronic components accommodated in the receiving grooves, short-circuiting or damaging the electronic components.
Therefore, burrs and fine particles must be removed from the cut surface of the electronic component cartridge including the unit tray or the unit carrier tape.
According to the related art, deburring and fine particles have been disclosed in korean patent application No. 2017-0023538 entitled "electronic component case and manufacturing method thereof" filed by the applicant of the present application.
According to the related art, a method of manufacturing an electronic component box includes: a process of forming a first antistatic layer and a second antistatic layer on upper and lower surfaces of a base layer formed of a fabric sheet; a process of forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding; cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n (M and N are natural numbers) receiving grooves; and forming conductive layers electrically connected to the first and second antistatic layers at edge portions of the cut surface of the unit electronic component box and the upper and lower surfaces of the unit electronic component box.
When the fabric sheet is cut into unit electronic component cassettes having m×n (M and N are natural numbers) receiving grooves, a plurality of burrs may be formed on the cut surface, and the cut surface may be uneven and rough. Accordingly, the conductive layer, which electrically connects the first antistatic layer and the second antistatic layer to each other, is formed on the cut surface together with the edge portions of the upper and lower surfaces of the unit electronic component box in a state where the conductive polymer material is mixed with the organic solvent. The conductive layer is automatically or manually formed by dipping or spraying. In addition, the conductive layer may be automatically or manually coated and formed using cloth, sponge, or brush. When the conductive layer is formed, the conductive layer may be formed in a state where a plurality of dicing unit electronic element cassettes are overlapped with each other to improve productivity.
The dipping method is to form the conductive layer by immersing the cut surface in an organic solvent mixed with a conductive polymer material and put in a container, wherein edge portions of the upper and lower surfaces of one or more cut unit electronic component cases overlap each other. The spraying manner is to form the conductive layer by spraying an organic solvent containing a conductive polymer material on edge portions of the upper and lower surfaces of the cutting surface and the one or more cutting unit electronic component cassettes overlapping each other. In addition, the conductive layer is formed using a cloth, sponge, or brush in such a manner that an organic solvent mixed with a conductive polymer material is applied to the cloth, sponge, or brush, and the organic solvent is applied to the cutting surface and edge portions of the upper and lower surfaces of one or more cutting unit electronic component cases overlapping each other.
However, when the conductive layer is formed according to the related art, the organic solvent mixed with the conductive polymer material may be applied to the outer surfaces of the receiving grooves, i.e., the contact surfaces between the adjacent unit electronic component cases, instead of being applied to the edge portions of the upper and lower surfaces of the cut unit electronic component cases with a predetermined width. Therefore, adjacent unit electronic component cassettes may be combined with each other without being separated from each other after the drying process. In addition, when the conductive layer is formed by using cloth, foreign substances such as fluff may be generated and adhere to the coated surface of the unit electronic component box.
Disclosure of Invention
Embodiments of the inventive concept provide a method of manufacturing an electronic component case, which can improve productivity by simultaneously forming a plurality of conductive layers.
Embodiments of the inventive concept provide a method of manufacturing an electronic component box, which can prevent adjacent unit electronic component boxes from being combined with each other such that the adjacent unit electronic component boxes are separated from each other even in a case where conductive layers are formed on a plurality of electronic component boxes.
Embodiments of the inventive concept provide a method of manufacturing an electronic component case, which can prevent foreign substances such as fluff from adhering to a coated surface of a unit electronic component case when a conductive layer is formed.
According to one embodiment of the inventive concept, a method of manufacturing an electronic component cartridge includes: forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively; forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding; cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n receiving grooves, where M and N are natural numbers; and forming a conductive layer on the cut surface by automatically or manually making contact and friction between the cut surface of the unit electronic component case and a synthetic resin containing a conductor or a conductive polymer material by a contact friction member so as to electrically connect the first and second antistatic layers to each other.
According to another embodiment of the inventive concept, a method of manufacturing an electronic component cartridge includes: forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively; forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding; cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n receiving grooves, where M and N are natural numbers; forming a conductive layer by: the cut surfaces of one or more unit electronic component cartridges overlapped with each other are conveyed on one or more rollers constituting a container of a coating apparatus, the rollers constituting the coating apparatus and being contaminated with an organic solvent in which a synthetic resin containing a conductive or conductive polymer material is dissolved, and the organic solvent is applied to the cut surfaces while removing burrs and fine particles generated on the side surfaces of the base layer.
According to another embodiment of the inventive concept, a method of manufacturing an electronic component cartridge includes: forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively; forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding; cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n receiving grooves, where M and N are natural numbers; forming a conductive layer by: the method includes transferring a cut surface of one or more unit electronic component cartridges overlapped with each other on one or more Mayer (Mayer) bars in a container constituting a coating apparatus, the Mayer bars including a rotating rod and a wire surrounding an outer circumferential surface of the rotating rod, constituting the coating apparatus and being contaminated with an organic solvent in which a synthetic resin including a conductive or conductive polymer material is dissolved, and applying the organic solvent to the cut surface while removing burrs and fine particles generated on a side of the base layer.
The conductor constituting the conductive layer includes a conductive material or a conductive metal.
The conductive polymer material constituting the conductive layer includes one of 3, 4-ethylenedioxythiophene (PEDOT), polystyrene sulfonate (PSS), pyrrole, and polyaniline.
When the conductive layer is formed, the organic solvent includes one of toluene, methyl Ethyl Ketone (MEK), acetone, acetic acid, trichloroethylene (TCE), dimethyl sulfoxide (DMSO), dichloromethane (DCM), hexafluoro-2-propanol (HFP), and alcohol.
The contact friction member includes an ink pad including an absorbing member that absorbs the organic solvent in which a synthetic resin including the conductor or the conductive polymer material is dissolved, and a mesh surrounding the absorbing member.
The absorbent member includes one of a nonwoven fabric, a cloth, a sponge, and a metal brush.
The mesh comprises a metal mesh having a mesh size of 100-500 mesh.
The one or more rollers rotate in a direction opposite to a conveyance direction of the one or more unit electronic component cassettes such that the one or more rollers engage with the one or more unit electronic component cassettes.
The one or more rollers include one of metal, ceramic, silicone, synthetic resin, rubber, and Teflon (Teflon).
The one or more rollers have a plurality of fine protrusions embossed or engraved in the surface of the one or more rollers.
The one or more wheat bars are rotated in a direction opposite to a conveying direction of the one or more unit electronic component cassettes such that the one or more wheat bars are engaged with the one or more unit electronic component cassettes.
The rotating rod includes one of metal, ceramic, silicone, synthetic resin, rubber, and teflon.
The wire is formed of one of metal and synthetic resin.
Drawings
The above and other objects and features will become apparent by reference to the following description of the drawings, in which like reference numerals refer to like parts throughout the various views unless otherwise specified, and in which:
fig. 1 is a top view showing an electronic component cartridge according to the inventive concept;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
fig. 3A to 3D are flowcharts illustrating a method of manufacturing an electronic component cartridge according to the inventive concept;
FIG. 4 is a perspective view illustrating an ink pad used in one embodiment of the inventive concept;
FIG. 5 is a side view illustrating the process state of FIG. 3D;
fig. 6 is a perspective view illustrating a coating apparatus used in another embodiment of the inventive concept;
fig. 7 and 8 are side views illustrating a process state of fig. 3D by using a coating apparatus used in another embodiment of the inventive concept;
fig. 9 is a perspective view illustrating a coating apparatus used in still another embodiment of the inventive concept; and
fig. 10 is a perspective view illustrating a coating apparatus used in still another embodiment of the inventive concept to which the process state of fig. 3D is applied.
Detailed Description
Hereinafter, the inventive concept will be described in detail with reference to the accompanying drawings.
Fig. 1 is a top view illustrating an electronic component cartridge 10 according to the inventive concept, and fig. 2 is a cross-sectional view taken along line A-A of fig. 1.
According to the inventive concept, the electronic component case 10 includes a base layer 11, first and second antistatic layers 13 and 15, a receiving groove 19, and a conductive layer 17.
The base layer 11 is formed of a synthetic resin having a thickness of about 0.5mm to 3mm so that the electronic component case 10 has a hardness sufficient to maintain its shape. The base layer 11 may be formed of any one of solvent-resistant resins such as Polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), and Polycarbonate (PC) that are insoluble in an organic solvent, or may be formed of any one of soluble resins such as Polystyrene (PS), polyvinyl chloride (PVC), or Acrylonitrile Butadiene Styrene (ABS) that are soluble in an organic solvent. In addition, the base layer 11 may include a composite resin layer of a soluble resin and a solvent-resistant resin.
The first and second antistatic layers 13 and 15 are extruded from the upper and lower surfaces of the base layer 11, respectively, and have a thickness of about 0.005mm to about 0.3 mm. The first and second antistatic layers 13 and 15 are formed of any one of the same materials as the base layer 11, i.e., PE, PP, PET, PC or the like solvent-resistant resin to obtain excellent adhesive force, or a material obtained by including a conductive material such as carbon nanotube or conductive carbon or a conductive metal such as gold (Au), silver (Ag), copper (Cu) or aluminum (Al) in any one of the soluble resins such as PS, PVC and ABS, so that the surface resistivity of the first and second antistatic layers 13 and 15 is in the range of about 106 Ω/square to about 109 Ω/square.
In addition, the first and second antistatic layers 13 and 15 may be formed such that the upper and lower surfaces of the base layer 11 are coated with any one of conductive polymer materials, for example, 3, 4-ethylenedioxythiophene (PEDOT), polystyrene sulfonate (PSS), pyrrole, and polyaniline.
When the first and second antistatic layers 13 and 15 are formed of a solvent-resistant resin or a soluble resin containing a conductive material or a conductive metal, the first and second antistatic layers 13 and 15 are formed opaque due to the contained conductive material or conductive metal. In addition, when the first and second antistatic layers 13 and 15 are formed of a conductive polymer material, the first and second antistatic layers 13 and 15 are formed transparently. Accordingly, the first and second antistatic layers 13 and 15 may be selectively formed as needed. In other words, when the base layer 11 is formed of a transparent synthetic resin such as PE, PP, PET, PC or PVC, the first and second antistatic layers 13 and 15 may be formed of a conductive polymer material to obtain the transparent electronic component case 10.
The receiving grooves 19 are formed such that the base layer 11, the first antistatic layer 13, and the second antistatic layer 15 are molded to be arranged in a matrix form. Although it is shown that 1×2 receiving grooves 19 are formed, m×n receiving grooves 19 may be formed, where M and N are natural numbers.
The conductive layer 17 is formed at a thickness of about 0.005mm to about 0.3mm on the side of the base layer 11 and dried at a lower temperature of about 25 deg.c to about 90 deg.c so that the conductive layer 17 is electrically connected with the first and second antistatic layers 13 and 15. Accordingly, the conductive layer 17 electrically connects the first and second antistatic layers 13 and 15 to each other while covering the exposed side of the base layer 11.
The conductive layer 17 is formed of any one of synthetic resins such as polyurethane resin, polyester resin, acrylic resin, vinyl resin, and butyral resin, which contain conductive materials such as carbon nanotubes and conductive carbon, or any one of conductive metals such as Au, ag, cu, and Al. In other words, in a state in which the synthetic resin containing the above-described conductive material is mixed with any one of organic solvents such as toluene, methyl Ethyl Ketone (MEK), acetone, acetic acid, trichloroethylene (TCE), dimethyl sulfoxide (DMSO), methylene chloride (DCM), hexafluoro-2-propanol (HFP), and alcohols, the conductive layer 17 is formed when the mixture is applied to the side of the electronic component case 10. The conductive layer 17 is formed by passing through the pad 330 shown in fig. 4 while being in contact with the pad 30. The stamp 30 is formed in a structure in which an absorbing member 31 is enclosed by a mesh 33 formed of metal, the absorbing member 31 including a nonwoven fabric, cloth, sponge, or metal brush, and containing an organic solvent mixed with a synthetic resin containing the above-mentioned conductive metal.
In addition, the conductive layer 17 is formed by the coating device 40 shown in fig. 6. The coating apparatus 40 includes one or more (e.g., about 1 to 10) rollers 41 and a container 45, and the container 45 contains an organic solvent mixed with a synthetic resin containing a conductive metal. Accordingly, the conductive layer 17 is formed by conveying the cut surfaces of one or more (for example, about 1 to 200) unit electronic component cassettes 10 overlapping each other while being in contact with about 1 to 10 rollers 41. The roller 41 may include any one of metal, ceramic, silicone, synthetic resin, and rubber, and may have a plurality of fine protrusions 43 embossed or engraved on the surface of the roller 41. In addition, the roller 41 may be formed of teflon.
In addition, the conductive layer 17 may be formed of a mixture of any one of conductive polymer materials (e.g., 3, 4-ethylenedioxythiophene (PEDOT), polystyrene sulfonate (PSS), pyrrole, and polyaniline) with any one of organic solvents (e.g., toluene, methyl Ethyl Ketone (MEK), acetone, acetic acid, trichloroethylene (TCE), dimethyl sulfoxide (DMSO), dichloromethane (DCM), hexafluoro-2-propanol (HFP), and alcohols).
Since the conductive layer 17 electrically connects the first antistatic layer 13 and the second antistatic layer 15 to each other, even if a plurality of electronic component cassettes 10 are stacked, the conductive layer 17 can easily remove static electricity. Therefore, the electronic components in the receiving groove 19 can be prevented from being electrostatically destroyed. In addition, since the conductive layer 17 is formed of an organic solvent containing a conductive material, burrs 21 that may be generated at the sides are dissolved to be removed or buried and covered without being exposed.
In other words, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of any one of soluble resins such as PS, PVC, and ABS, and when the conductive layer 17 is formed, the burr 21 is dissolved by an organic solvent containing a conductive material and thus removed. In addition, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of any one of solvent-resistant resins such as PE, PP, PET and PC, and when the conductive layer 17 is formed, even if the burrs 21 and the fine particles are not dissolved, the burrs 21 and the fine particles are buried inside without being exposed to the outside.
In addition, when the conductive layer 17 is formed, since the burrs 21 and the fine particles are dissolved and removed by the organic solvent even at a low temperature, the electronic component box can be prevented from being deformed by heat. In addition, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of a solvent-resistant resin, and when the conductive layer 17 is formed, even if the burrs 21 and the fine particles are not dissolved, the burrs 21 and the fine particles are buried inside the conductive layer 17 without being exposed to the outside. Therefore, the time for removing the burrs 21 and the fine particles is reduced, thereby improving productivity.
Fig. 3A to 3D are flowcharts illustrating a method of manufacturing an electronic component cartridge according to the inventive concept.
Referring to fig. 3A, a first antistatic layer 13 and a second antistatic layer 15 are formed on the upper and lower surfaces of a base layer 11 including a fabric sheet. The base layer 11 may be formed of any one of solvent-resistant resins such as PE, PP, PET and PC or soluble resins such as PS, PVC and ABS, and may have a thickness of about 0.5mm to about 3 mm.
In addition, the first and second antistatic layers 13 and 15 may be formed on the upper and lower surfaces of the base layer 11 by extruding the same material as the base layer 11 (i.e., any one of solvent-resistant resins such as PE, PP, PET and PC or soluble resins such as PS, PVC and ABS) in a sheet form. In addition, according to the present disclosure, the base layer 11 may be formed of a composite resin layer including a soluble resin and a solvent-resistant resin.
In this case, a conductive material such as carbon nanotube or conductive carbon or a conductive metal such as Au, ag, cu or Al is contained in the synthetic resin for forming the first and second antistatic layers, and is extruded at a thickness of about 0.005mm to about 0.3mm, thereby forming the conductive layer 17. The surface resistivity of the first antistatic layer 13 and the second antistatic layer 15 is about 10 6 Omega/square to about 10 9 Omega/square.
In addition, the first and second antistatic layers 13 and 15 may be formed by coating any one of conductive polymer materials such as 3, 4-ethylenedioxythiophene (PEDOT), polystyrene sulfonate (PSS), pyrrole, and polyaniline.
Referring to fig. 3B, the receiving grooves 19 are formed in a matrix form by performing air pressure molding on the base layer 11 and the first and second antistatic layers 13 and 15.
Forming m×n receiving grooves (M and N are natural numbers) is to form a tray. Since the receiving grooves 19 are continuously formed in one row and a plurality (for example, about 1 to 5) of columns, a carrier tape wound on a roller can be formed.
Referring to fig. 3C, the result of the fabric state having the plurality of receiving grooves 19 is cut into unit electronic component cases 10 having m×n receiving grooves 19, where M and N are natural numbers. A plurality of burrs 21 may be generated on the cut surface, and the unit electronic box 10 may be uneven and rough. Thus, the fine particles may slightly adhere to the cutting surface. The burr 21 may be formed as the base layer 11, or the first and second antistatic layers 13 and 15 are not completely removed to remain.
Referring to fig. 3D, the conductive layer 17 is formed on the cut surface of the unit electronic component box 10 such that the conductive layer 17 is electrically connected with the first and second antistatic layers 13 and 15. According to the manner of forming the conductive layer 17 in one embodiment of the inventive concept, the conductive layer 17 is formed to have a thickness of about 0.005mm to about 0.3mm by using the stamp 30 shown in fig. 4, and dried at a lower temperature of about 25 ℃ to about 90 ℃. In other words, as shown in fig. 5, the conductive layer 17 is formed by placing the stamp 30 in a container 35 containing an organic solvent in which a synthetic resin containing a conductive material or a conductive metal is dissolved, and by allowing the surface of the stamp 30 to contact and rub against the cut surface of one or more (for example, about 1 to 200) unit electronic component cartridges 10 overlapped with each other automatically or manually to coat. Accordingly, the cut surface of each of about 1 to 200 unit electronic component cartridges 10 overlapping each other is coated with an organic solvent mixed with a conductive polymer material, which wets the absorbing member 31 of the stamp pad 30, thereby forming the conductive layer 17. In this case, the burrs 21 and fine particles generated on the side of the base layer 11 of each unit electronic box 10 are dissolved by an organic solvent mixed with a conductive polymer material and rubbed with the mesh 33 of the stamp pad 30 to be mechanically removed. In addition, when the conductive layer 17 is formed, since the coated surface of the unit electronic component cartridge 10 is not in contact with the absorbing member 31 through the mesh 33, it is possible to prevent foreign substances such as fluff from adhering to the coated surface.
The absorbing member 31 of the stamp pad 30 absorbs the organic solvent in which the synthetic resin containing the conductive material or the conductive metal is dissolved in the container 35, and performs contact friction with the cut surfaces of 1 to 200 unit electronic component cartridges overlapped with each other. In this case, the absorbing member 31 applies an organic solvent in which a synthetic resin containing a conductive material or a conductive metal is dissolved to the cut surface to form the conductive layer 17. The mesh 33 surrounding the absorbing member 31 coats the organic solvent, in which the synthetic resin including the conductive material or the conductive metal is dissolved, on the edge portions of the upper and lower surfaces of the unit electronic component cases with a predetermined width to prevent the organic solvent from being applied to the outer surfaces of the receiving grooves 19, i.e., the contact surfaces between the adjacent unit electronic component cases 10, so that the unit electronic component cases are not bonded to each other but separated from each other. The absorbing member 31 may be any one of a nonwoven fabric, a cloth, a sponge, and a metal brush. Additionally, mesh 33 may comprise a mesh having a mesh size of about 100-500 mesh.
The conductive material constituting the conductive layer 17 may include any one of carbon nanotubes and conductive carbon, and the conductive metal may include any one of Au, ag, cu, and Al. In addition, the synthetic resin constituting the conductive layer 17 may include any one of polyurethane resin, polyester resin, acrylic resin, vinyl resin, and butyral resin. The organic solvent may include any one of toluene, methyl Ethyl Ketone (MEK), acetone, acetic acid, trichloroethylene (TCE), dimethyl sulfoxide (DMSO), dichloromethane (DCM), hexafluoro-2-propanol (HFP), and alcohol.
In addition, the conductive layer 17 may be formed by mixing any one of conductive polymer materials (e.g., 3, 4-ethylenedioxythiophene (PEDOT), polystyrene sulfonate (PSS), pyrrole, and polyaniline) with the above-described organic solvent.
When the conductive layer 17 is formed, the mesh 33 of the pad 30 prevents the absorbing member 31 in contact with the cut surface of the unit electronic cassette 10 from being deformed. The organic solvent in which the synthetic resin including the conductive material or the conductive metal is dissolved is applied to the edge portions of the upper and lower surfaces of the one or more unit electronic component cases 10 and the cut surfaces of the one or more unit electronic component cases 10 overlapped with each other at a predetermined width, without being applied to the outer surfaces of the receiving grooves 19, i.e., the contact surfaces 10 between the adjacent unit electronic component cases.
In addition, since the conductive layer 17 is formed in a state in which the synthetic resin including the conductive material is mixed with the organic solvent, the burrs 21 and the fine particles generated on the side of the base layer 11 are dissolved to be removed or buried in the conductive layer 17 without being exposed to the outside.
In other words, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of any one of soluble resins such as PS, PVC, and ABS, and when the conductive layer 17 is formed, the burrs 21 and the fine particles are dissolved by an organic solvent to be removed. In addition, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of any one of solvent-resistant resins such as PE, PP, PET and PC, and when the conductive layer 17 is formed, even if the burrs 21 and the fine particles are not dissolved, the burrs 21 and the fine particles are buried inside the conductive layer 17 without being exposed to the outside.
In addition, when the conductive layer 17 is formed, burrs 21 and fine particles generated on the side surfaces may be mechanically removed by friction with the mesh 33, although the burrs 21 and fine particles may be removed by dissolution by an organic solvent mixed with a synthetic resin.
According to the manner of forming the conductive layer 17 in one embodiment of the inventive concept, the conductive layer 17 is formed to have a thickness of about 0.005mm to about 0.3mm by using the stamp 30 shown in fig. 4, and dried at a lower temperature of about 25 ℃ to about 90 ℃.
In addition, according to another embodiment of the inventive concept, the conductive layer 17 may be formed by using the coating apparatus 40 shown in fig. 6. In other words, as shown in fig. 7 and 8, the conductive layer 17 is formed by conveying the cut surface of one or more (for example, about 1 to 200) unit electronic component cassettes 10 overlapping each other while being in contact with one or more (for example, about 1 to 10) rollers 41 of the coating device 40. As one or more (e.g., about 1 to 10) rollers 41 are rotated, an organic solvent in which a synthetic resin including a conductive material or a conductive metal is dissolved in the container 45 is simultaneously applied to the cut surfaces of one or more unit electronic component cassettes 10 (e.g., about 1 to 200 unit electronic component cassettes 10 overlapped with each other).
In this case, the rotation direction of one or more (for example, about 1 to 10) rollers 41 is opposite to the conveyance direction of one or more (for example, about 1 to 200) unit electronic component cassettes 10 overlapped with each other, so that the one or more rollers are engaged with the one or more electronic component cassettes 10. In other words, when about 1 to 200 unit electronic component cassettes 10 overlapped with each other are conveyed from right to left, about 1 to 10 rollers 41 are rotated clockwise. Accordingly, as the frictional force between the cut surfaces of the unit electronic component cassettes 10 and the one or more rollers 41, which are transferred to overlap each other, increases, burrs 21 and fine particles generated at the side of each base layer 11 can be not only dissolved by the organic solvent, but also mechanically removed by the frictional force. In addition, the roller 41 including metal does not generate foreign substances such as fluff when removing the burrs 21 and fine particles. In addition, since the burrs 21 and the fine particles mechanically removed by friction are dissolved inside the container 45 by the organic solvent in which the synthetic resin containing the conductive material or the conductive metal is dissolved, it is possible to prevent the burrs 21 and the fine particles from being reapplied to the unit electronic component box 10 by the rotating roller 41. The roller 41 may include any one of metal, ceramic, silicone, synthetic resin, and rubber, and may have a plurality of fine protrusions 43 embossed or engraved on the surface of the roller 41. In addition, the roller 41 may be formed of teflon.
The fine protrusions 43 embossed or engraved in the surface of one or more (e.g., about 1-10) rollers 41 further increase the friction with the cut surfaces of about 1-200 unit electronic component cassettes 43 overlapped with each other. Therefore, the burrs 21 and the fine particles generated on the side of the base layer 11 can be mechanically removed more easily. In addition, the roller 41 allows the organic solvent in which the synthetic resin including the conductive material or the conductive metal is dissolved to be applied in a stable and uniform thickness due to the fine protrusions 43 thereof. Accordingly, the conductive layer 17 is formed by applying the organic solvent to the edge portions of the upper and lower surfaces of the unit electronic component cases 10 and the cut surfaces of the unit electronic component cases 10 with a predetermined width, preventing the organic solvent from being applied to the outer surfaces of the receiving grooves 19, i.e., the contact surfaces between adjacent unit electronic component cases 10.
When the conductive layer 17 is formed, since the roller 41 of the coating device 40 is prevented from being deformed due to contact with the cut surface of the unit electronic component cassettes 10, the organic solvent in which the synthetic resin containing the conductive material or the conductive metal is dissolved is applied to the cut surface of the one or more unit electronic component cassettes 10 overlapped with each other in a uniform width, not to the outer surface of the receiving groove 19, that is, the contact surface between the adjacent unit electronic component cassettes 10. Accordingly, the conductive layer 17 is formed by applying the organic solvent to edge portions of the upper and lower surfaces around the cut surface of the unit electronic component cassettes 10 overlapping each other with a uniform width. Therefore, after the drying process, the adjacent unit electronic component cassettes 10 can be prevented from being bonded to each other.
In addition, according to another embodiment of the present invention, the conductive layer 17 may be formed by using the coating device 50 shown in fig. 9. In other words, the conductive layer 17 is formed by conveying the cut surface of one or more (for example, about 1 to 200) unit electronic component cassettes 10 overlapping each other while being in contact with one or more (for example, about 1 to 10) of the miller bars 51 of the coating apparatus 50, as shown in fig. 10. When the lever 53 is rotated, one or more (for example, about 1 to 10) of the miller bars 51 apply an organic solvent in which a synthetic resin including a conductive material or a conductive metal is dissolved to the cutting surface of the conveyed one or more (for example, about 1 to 200) unit electronic component cassettes 10 overlapping each other through the wire 54.
In this case, the rotation direction of the rotation lever 53 constituting one or more (for example, about 1 to 10) of the miller bars 51 is opposite to the conveyance direction of one or more (for example, about 1 to 200) unit electronic component cassettes 10 overlapped with each other, so that the rotation lever 53 is engaged with the one or more electronic component cassettes 10. In other words, when about 1 to 200 unit electronic component cassettes 10 overlapped with each other are conveyed from right to left, the rotating lever 53 rotates clockwise. Accordingly, as the frictional force between the cut surfaces of the approximately 1-200 unit electronic component cassettes 10 overlapped with each other and the wires 54 constituting the miller bars 51, which are transferred, increases, burrs 21 and fine particles generated at the side of each base layer 11 can be not only dissolved by the organic solvent, but also mechanically removed by the frictional force. In addition, the wire 54 does not generate foreign matter such as fluff when removing the burrs 21 and fine particles. In addition, since the burrs 21 and the fine particles mechanically removed by friction are dissolved inside the container 45 by the organic solvent in which the synthetic resin containing the conductive material or the conductive metal is dissolved, it is possible to prevent the burrs 21 and the fine particles from being reapplied to the unit electronic component box 10 by the wire 54 being rotated. The rotating rod 53 constituting the miller bar 51 may include any one of metal, ceramic, silicone, synthetic resin, and rubber, and the wire 54 may be formed of one of metal and synthetic resin. In addition, the rotating rod 53 may include teflon. In addition, wires 54 having a diameter of about 0.005mm to about 0.5mm may adjust the thickness of conductive layer 17 according to the diameter. In other words, when the wire 54 has a small diameter, the conductive layer 17 is coated and formed to have a thin thickness. When the wire 54 has a large diameter, the conductive layer 17 is coated and formed to have a thicker thickness.
The wires 54 formed on the surface of one or more (e.g., about 1-10) rotating bars 53 may increase friction with the cutting surface of the transferred about 1-200 unit electronic component cassettes 10 overlapping each other, thereby more easily mechanically removing burrs 21 and fine particles from the side of the base layer 11. In addition, the wire 54 formed on the surface of the rotating rod 53 is coated with an organic solvent in which a synthetic resin including a conductive material or a conductive metal is dissolved, in a stable and uniform thickness. Accordingly, the conductive layer 17 is coated and formed on edge portions of the upper and lower surfaces of the unit electronic component cases 10 with a predetermined width to prevent the organic solvent from being applied to the outer surfaces of the receiving grooves 19 of the unit electronic component cases 10, i.e., the contact surfaces between adjacent unit electronic component cases 10.
Even in another embodiment or another embodiment of the present inventive concept, any one of conductive polymer materials such as 3, 4-ethylenedioxythiophene (PEDOT), polystyrene sulfonate (PSS), pyrrole, and polyaniline may be mixed with the above-described organic solvent, thereby forming the conductive layer 17 as described in one embodiment of the present inventive concept.
Since the conductive layer 17 electrically connects the first antistatic layer 13 and the second antistatic layer 15 to each other, even if a plurality of electronic component cassettes 10 are stacked, the conductive layer 17 can easily remove static electricity. Therefore, the electronic components in the receiving groove 19 can be prevented from being electrostatically destroyed.
In addition, since the conductive layer 17 is dried at a lower temperature of about 25 ℃ to about 90 ℃ after the conductive layer 17 is formed, the electronic component case can be prevented from being deformed by heat. In addition, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of a solvent-resistant resin, and when the conductive layer 17 is formed, even if the burrs 21 and the fine particles are not dissolved, the burrs 21 and the fine particles are buried inside the conductive layer 17 without being exposed to the outside. Therefore, the time for removing the burrs 21 and the fine particles is reduced, thereby improving productivity.
As described above, since the conductive layers can be simultaneously formed on the cut surfaces of one or more unit electronic component cassettes overlapping each other, productivity can be improved. In addition, an organic solvent in which a synthetic resin including a conductive material or a conductive metal is dissolved is applied to edge portions of the upper and lower surfaces of the unit electronic component cases with a predetermined width, thereby preventing the unit electronic devices from being combined with each other so that the unit electronic component cases are easily separated from each other. In addition, when the conductive layer is formed, the coated surface of the unit electronic component cartridge is not in contact with the absorbing member through the mesh, thereby preventing foreign substances such as fluff from adhering to the coated surface. In addition, when the conductive layer is formed, the coated surface of the unit electronic component cartridge is not in contact with the roller, thereby preventing foreign substances such as fluff from adhering to the coated surface.
Although the inventive concept has been described with reference to the embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the inventive concept. Accordingly, it should be understood that the above embodiments are not limiting, but rather illustrative.
Claims (11)
1. A method of manufacturing an electronic component cartridge, comprising:
forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively;
forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding;
cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n receiving grooves, where M and N are natural numbers; and
forming a conductive layer on a cut surface of the unit electronic component cartridge by automatically or manually making contact and friction between the cut surface and a synthetic resin containing a conductor or a conductive polymer material by a contact friction member to electrically connect the first and second antistatic layers to each other,
wherein the contact friction member includes an ink pad including an absorbing member that absorbs an organic solvent in which the synthetic resin including the conductor or the conductive polymer material is dissolved, and a mesh surrounding the absorbing member.
2. The method of claim 1, wherein the absorbent member comprises one of a nonwoven fabric, a cloth, a sponge, and a metal brush.
3. The method of claim 1, wherein the mesh comprises a metal mesh having a mesh size of 100-500.
4. A method of manufacturing an electronic component cartridge, comprising:
forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively;
forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding;
cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n receiving grooves, where M and N are natural numbers; and
the conductive layer is formed by: conveying cut surfaces of one or more unit electronic component cartridges overlapped with each other on one or more rollers constituting a container of a coating apparatus, the rollers constituting the coating apparatus and being contaminated with an organic solvent in which a synthetic resin containing a conductive or conductive polymer material is dissolved, and applying the organic solvent to the cut surfaces while removing burrs and fine particles generated on the side of the base layer,
wherein the one or more rollers rotate in a direction opposite to a conveyance direction of the one or more unit electronic component cassettes such that the one or more rollers engage with the one or more unit electronic component cassettes;
the one or more rollers have a plurality of fine protrusions embossed or engraved in the surface of the one or more rollers.
5. The method of claim 4, wherein the one or more rollers comprise one of metal, ceramic, silicone, synthetic resin, rubber, and teflon.
6. A method of manufacturing an electronic component cartridge, comprising:
forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively;
forming a plurality of receiving grooves in a matrix form by subjecting the base layer and the first and second antistatic layers to air pressure molding;
cutting the result of the fabric state having the receiving grooves into unit electronic component cases having m×n receiving grooves, where M and N are natural numbers; and
the conductive layer is formed by: conveying a cut surface of one or more unit electronic component cartridges overlapped with each other on one or more wheat bars in a container constituting a coating apparatus, the wheat bars including a rotating rod and a wire surrounding an outer circumferential surface of the rotating rod, constituting the coating apparatus and being contaminated with an organic solvent in which a synthetic resin including a conductor or a conductive polymer material is dissolved, and applying the organic solvent to the cut surface while removing burrs and fine particles generated on a side surface of the base layer,
wherein the one or more wheat bars are rotated in a direction opposite to a conveying direction of the one or more unit electronic component cassettes such that the one or more wheat bars are engaged with the one or more unit electronic component cassettes.
7. The method of claim 6, wherein the rotating rod comprises one of metal, ceramic, silicone, synthetic resin, rubber, and teflon.
8. The method of claim 6, wherein the wire is formed of one of metal and synthetic resin.
9. The method of any one of claims 1, 4, 6, wherein the conductor comprising the conductive layer comprises a conductive material or a conductive metal.
10. The method of any one of claims 1, 4, 6, wherein the conductive polymer material comprising the conductive layer comprises one of 3, 4-ethylenedioxythiophene (PEDOT), polystyrene sulfonate (PSS), pyrrole, and polyaniline.
11. The method according to any one of claims 1, 4, and 6, wherein when the conductive layer is formed, the organic solvent comprises one of toluene, methyl Ethyl Ketone (MEK), acetone, acetic acid, trichloroethylene (TCE), dimethyl sulfoxide (DMSO), dichloromethane (DCM), hexafluoro-2-propanol (HFP), and alcohol.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180010885A KR102072286B1 (en) | 2018-01-29 | 2018-01-29 | Fabricating method for electronic components magazine |
| KR10-2018-0010885 | 2018-01-29 | ||
| KR10-2018-0015100 | 2018-02-07 | ||
| KR1020180015100A KR102186468B1 (en) | 2018-02-07 | 2018-02-07 | Fabricating method for electronic components magazine |
| KR10-2018-0026654 | 2018-03-07 | ||
| KR1020180026654A KR102154895B1 (en) | 2018-03-07 | 2018-03-07 | Fabricating method for electronic components magazine |
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| CN110098141A CN110098141A (en) | 2019-08-06 |
| CN110098141B true CN110098141B (en) | 2023-06-16 |
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| CN201810392443.8A Active CN110098141B (en) | 2018-01-29 | 2018-04-27 | Method for manufacturing electronic component box |
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| CN111010788A (en) * | 2019-12-17 | 2020-04-14 | 深圳市麦捷微电子科技股份有限公司 | Method for eliminating electrostatic adsorption of surface acoustic wave filter |
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| US20030150770A1 (en) * | 2002-02-13 | 2003-08-14 | Berkley Industries Llc | Chip clamshell packaging |
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| US20150083641A1 (en) * | 2013-09-25 | 2015-03-26 | Texas Instruments Incorporated | Selective heat seal wafer cover tape (has tape) |
| KR101773530B1 (en) * | 2016-09-13 | 2017-08-31 | 윤세원 | Retroreflective sheet and fabricating method thereof |
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| CA1224445A (en) * | 1982-08-26 | 1987-07-21 | Gerald E. Mueller | Transparent container for electrostatic sensitive electronic components |
| KR20000063759A (en) * | 2000-08-02 | 2000-11-06 | 윤덕용 | High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| JP2002347831A (en) * | 2001-05-28 | 2002-12-04 | Denki Kagaku Kogyo Kk | Carrier tape unit |
| WO2002096773A1 (en) * | 2001-05-28 | 2002-12-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Electronic component container |
| WO2003034508A1 (en) * | 2001-10-12 | 2003-04-24 | Nichia Corporation | Light emitting device and method for manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6578033B2 (en) | 2019-09-18 |
| JP2019131286A (en) | 2019-08-08 |
| CN110098141A (en) | 2019-08-06 |
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