CN109952014A - A kind of composite shield cover - Google Patents
A kind of composite shield cover Download PDFInfo
- Publication number
- CN109952014A CN109952014A CN201910290713.9A CN201910290713A CN109952014A CN 109952014 A CN109952014 A CN 109952014A CN 201910290713 A CN201910290713 A CN 201910290713A CN 109952014 A CN109952014 A CN 109952014A
- Authority
- CN
- China
- Prior art keywords
- shield cover
- transparent substrates
- composite shield
- cover according
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002131 composite material Substances 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000005540 biological transmission Effects 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims description 33
- 238000002834 transmittance Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
This application involves the shielding of electromagnetic interference more particularly to a kind of shielding cases.The application composite shield cover receives and offers window in light one side, and transparent substrates are stamped on window, and transparent substrates are equipped with the shielded layer of light transmission, and other panels of shielding case are sheet metal or the nonmetallic thin plate for being compounded with shielded layer.The application opens up window in light one side by receiving in composite shield cover, the transparent substrates for being provided with light transmission shielded layer are stamped on window, laser reflection light can pass through transparent substrates, photodiode is set to receive the reflected light of sufficient intensity, the light transmission shielded layer in transparent substrates also has shield effectiveness simultaneously, can satisfy shielding requirements.
Description
Technical field
The present application relates to the shielding of electromagnetic interference (EMI) more particularly to a kind of shielding cases.
Background technique
Photodiode is the significant components of laser radar, is used for receives echo-signal.In its use process, because compared with
The return value of mistake is generated vulnerable to outside electromagnetic interference, therefore shielding case is needed to do electromagnetic protection to it；Currently, well known electronics
Element shielding case majority is by foreign white copper punch forming, and it includes 5 wall surfaces, is completely shielded with being formed after PCB pad solder
Space, shielding element sending itself, received electromagnetic interference.
When photodiode uses conventional shields, need in shielding case aperture, to guarantee light-transmissive shielding case, quilt
Photodiode is received, but the integrality of shielding case is destroyed while shielding case aperture, causes shield effectiveness bad, according to
Old generation electromagnetic interference.
To solve the above problems, those skilled in the art are usually shielding case to be processed as hole, reticular structure, but be limited to
The line width of existing processing technology, the fenestral fabric of shielding case punching press is greater than shielding case wall thickness, i.e. grid line width is larger, this is just
Causing shielding case, to block light source serious, although shield effectiveness is excellent, the pickup electrode that photodiode is received is weak, causes ranging
Ability die-offs.
Summary of the invention
The embodiment of the present application is to propose a kind of composite shield cover, and optical element cannot be met simultaneously by solving existing shielding case
Light transmittance and shield effectiveness the problem of.
For this purpose, the present patent application embodiment uses following technical scheme:
On the one hand, a kind of composite shield cover receives and offers window in light one side, transparent substrates, transparent base are stamped on window
Bottom is equipped with the shielded layer of light transmission, and other panels of shielding case are sheet metal or the nonmetallic thin plate for being compounded with shielded layer.
In one possible implementation, the set-up mode between the transparent substrates and shielding case window is Nian Jie
Or it is clamped or is spirally connected.
In one possible implementation, the transparent substrates be glass substrate or transparent resin substrate, it is described
Shielded layer is conductive grid.
It in one possible implementation, further include anti-reflection film when the transparent substrates are glass substrate, it is described
Anti-reflection film is plated in glass substrate and is not provided in the one side of conductive grid.
In one possible implementation, the conductive grid material is conductive silver paste or graphene.
In one possible implementation, the mesh number of the lattice is 16~100 mesh, and line width is 85~500 μm.
In one possible implementation, the mesh number of the lattice is 40~60 mesh, and line width is 100~300 μm.
In one possible implementation, the single mesh shape of the lattice is triangle or quadrangle or six
Side shape.
In one possible implementation, the transparent substrate thickness is 0.3-0.5mm.
In one possible implementation, the transparent substrates light transmittance is greater than 95%.
The embodiment of the present application opens up window in light one side by receiving in composite shield cover, is stamped on window and is provided with light transmission
The transparent substrates of shielded layer, laser reflection light can make photodiode receive the reflection of sufficient intensity by transparent substrates
Light, while the light transmission shielded layer in transparent substrates also has shield effectiveness, can satisfy shielding requirements.
Detailed description of the invention
Fig. 1 is the schematic diagram of the embodiment of the present application.
Fig. 2 is the electro-conductive glass schematic diagram of the embodiment of the present application.
Fig. 3 is the electro-conductive glass schematic diagram that the embodiment of the present application has anti-reflection film.
Fig. 4 is the conductive grid schematic diagram of the embodiment of the present application.
In figure: 1, electro-conductive glass；2, conductive adhesive；3, shielding case；4, glass substrate；5, anti-reflection film；6, conductive grid；
7, window；8, supporting leg.
Specific embodiment
Further illustrate the technical solution of the application below with reference to the accompanying drawings and specific embodiments.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application
Attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is only
The embodiment of the application a part, instead of all the embodiments.Based on the embodiment in the application, ordinary skill people
Member's every other embodiment obtained without making creative work, all should belong to the model of the application protection
It encloses.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so as to embodiments herein described herein.In addition, term " includes " and " tool
Have " and their any deformation, it is intended that cover it is non-exclusive include, for example, containing a series of steps or units
Process, method, device, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include without clear
Other step or units listing to Chu or intrinsic for these process, methods, product or equipment.
As shown in Figure 1, a kind of composite shield cover receives and offers window 7 in light one side, transparent base is stamped on window 7
Bottom, transparent substrates are equipped with the shielded layer of light transmission, and other panels of shielding case 3 are sheet metal or the non-gold for being compounded with shielded layer
Metal thin plate, as shown in Figure 1 and Figure 2, transparent substrates are glass substrate 4 in the present embodiment, and transparent substrates as needed also can be selected saturating
Bright resin substrate.Shielded layer is conductive grid 6, and conductive grid 6 is printed on formation electro-conductive glass 1, electro-conductive glass in glass substrate 4
1 covers on window 7, and electro-conductive glass 1 and other panels of shielding case 3 are grounded.Shielding case 3 is welded on pcb board by supporting leg 8
On (pcb board is not drawn into).Wherein, in other panels of the shielding case 3, sheet metal or it is compounded with the nonmetallic thin of shielded layer
The integral thickness of plate is the common thickness in this field, such as integral thickness is 0.1mm to 2mm.
The application opens up window 7 in light one side by receiving in composite shield cover, and electro-conductive glass 1, laser are stamped on window 7
Reflected light can make photodiode or other receiving elements (being not drawn into figure) receive sufficient intensity by electro-conductive glass 1
Reflected light, while electro-conductive glass 1 is because be provided with shielded layer, it may have shield effectiveness is guaranteeing that it is enough that receiving element receives
Meet shielding requirements while reflected light.
Set-up mode between the transparent substrates and shielding case window 7 is Nian Jie or is clamped or is spirally connected.It is wherein transparent
Substrate selects glass substrate 4(, that is, electro-conductive glass) when can only be bonded because glass substrate 4 is small in size, easy using being spirally connected or be clamped
It is broken；It is spirally connected or is clamped and be suitable for the case where transparent substrates select transparent resin substrate.When the electro-conductive glass 1 and shielding case
When set-up mode between window 7 is bonding, the electro-conductive glass 1 is combined to the window of shielding case 3 by conductive adhesive 2
On, the conductive adhesive 2 is conductive glue or two-sided conducting adhesive cloth.
Electro-conductive glass 1 is combined on window 7 using conductive adhesive 2, electro-conductive glass 1 and shielding case 3 is made to form one
Complete electromagnetic shielding shell excludes the electromagnetic interference of outer bound pair electronic component.
As shown in figure 3, the electro-conductive glass 1 further includes an anti-reflection film 5, the anti-reflection film 5, which is plated in glass substrate 4, not to be had
In the one side for having printing conductive grid 6.The electro-conductive glass structure is followed successively by glass substrate 4, anti-reflection film 5, conductive grid 6.
Anti-reflection film 5 is plated to glass substrate 4 to handle, and so that the light transmittance of anti-reflective glass piece is greater than 95%, integrally formed combined screen
Cover light transmittance is covered greater than 90%, and translucent effect is good.Conductive coating is printed or is sprayed in 4 side of glass substrate, forms conductive grid 6,
6 material of conductive grid is the printable conductive materials such as conductive silver paste or graphene, through high temperature sintering after printing, to add
Its strong stability and peel strength.
The mesh number of the lattice is 16~100 mesh, and line width is 85~500 μm.
The lattice of conductive grid 6 has variable mesh number and line width, to adapt to the electromagnetic shielding glass of different needs
Masking value.
Further, the mesh number of the lattice is 40~60 mesh, and line width is 100~300 μm.
Above-mentioned mesh number, line width are selected, light transmittance and shielding properties can be preferably taken into account.
As shown in figure 4, the single mesh shape of the lattice is quadrangle, triangle may be alternatively provided as needed
Or hexagon.
The transparent substrates 1 are with a thickness of 0.3-0.5mm.
1 light transmittance of transparent substrates is greater than 95%.
1 light transmittance of transparent substrates is greater than 95%, guarantees that enough reflected lights enter receiving element, with a thickness of 0.3-0.5mm,
Too thick influence shielding case overall dimensions, too thin intensity are not frangible enough.
Describe the technical principle of the application in conjunction with specific embodiments above.These descriptions are intended merely to explain the application's
Principle, and it cannot be construed to the limitation to the application protection scope in any way.Based on the explanation herein, the technology of this field
Personnel do not need to pay for creative labor the other specific embodiments that can associate the application, these modes are fallen within
Within the protection scope of the application.
Claims (10)
1. a kind of composite shield cover, which is characterized in that it receives and offers window in light one side, is stamped transparent substrates on window,
Transparent substrates are equipped with the shielded layer of light transmission, and other panels of shielding case for sheet metal or are compounded with the nonmetallic thin of shielded layer
Plate.
2. a kind of composite shield cover according to claim 1, which is characterized in that the transparent substrates and shielding case window
Between set-up mode be bonding clamping or be spirally connected.
3. a kind of composite shield cover according to claim 1 or 2, which is characterized in that the transparent substrates are glass base
Piece or transparent resin substrate, the shielded layer are conductive grid.
4. a kind of composite shield cover according to claim 3, which is characterized in that the transparent substrates are glass substrate
When, it further include anti-reflection film, the anti-reflection film is plated in glass substrate and is not provided in the one side of conductive grid.
5. a kind of composite shield cover according to claim 4, which is characterized in that the conductive grid material is conductive silver
Slurry or graphene.
6. a kind of composite shield cover according to claim 5, which is characterized in that the mesh number of the lattice be 16~
100 mesh, line width are 85~500 μm.
7. a kind of composite shield cover according to claim 6, which is characterized in that the mesh number of the lattice is 40~60
Mesh, line width are 100~300 μm.
8. a kind of composite shield cover according to claim 7, which is characterized in that the single mesh shape of the lattice
For triangle or quadrangle or hexagon.
9. a kind of composite shield cover according to claim 8, which is characterized in that the transparent substrate thickness is 0.3-
0.5mm。
10. a kind of composite shield cover according to claim 9, which is characterized in that the transparent substrates light transmittance is greater than
95%。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910290713.9A CN109952014A (en) | 2019-04-11 | 2019-04-11 | A kind of composite shield cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910290713.9A CN109952014A (en) | 2019-04-11 | 2019-04-11 | A kind of composite shield cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109952014A true CN109952014A (en) | 2019-06-28 |
Family
ID=67014877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910290713.9A Pending CN109952014A (en) | 2019-04-11 | 2019-04-11 | A kind of composite shield cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109952014A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117008084A (en) * | 2022-04-29 | 2023-11-07 | 深圳市速腾聚创科技有限公司 | Optical-mechanical system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1214504A (en) * | 1997-10-09 | 1999-04-21 | 日本胜利株式会社 | Optical discs, producing methods and production apparatus of optical discs |
| CN101245685A (en) * | 2007-02-14 | 2008-08-20 | 宋丽 | Electromagnetic shielding glass and method for producing the same |
| CN204408844U (en) * | 2015-03-19 | 2015-06-17 | 成都中科唯实仪器有限责任公司 | The electromagnetic screen of light-emitting device |
| CN106409774A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Shielding cover, packaging structure, and manufacturing method of packaging structure |
| CN207692292U (en) * | 2018-01-15 | 2018-08-03 | 中国科学院国家天文台 | A kind of high-precision laser range-finding equipment electromagnetic shielding cabin |
| CN208410983U (en) * | 2018-06-12 | 2019-01-22 | 睿惢思工业科技（苏州）有限公司 | A kind of form electromagnetic shielding glass |
-
2019
- 2019-04-11 CN CN201910290713.9A patent/CN109952014A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1214504A (en) * | 1997-10-09 | 1999-04-21 | 日本胜利株式会社 | Optical discs, producing methods and production apparatus of optical discs |
| CN101245685A (en) * | 2007-02-14 | 2008-08-20 | 宋丽 | Electromagnetic shielding glass and method for producing the same |
| CN204408844U (en) * | 2015-03-19 | 2015-06-17 | 成都中科唯实仪器有限责任公司 | The electromagnetic screen of light-emitting device |
| CN106409774A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Shielding cover, packaging structure, and manufacturing method of packaging structure |
| CN207692292U (en) * | 2018-01-15 | 2018-08-03 | 中国科学院国家天文台 | A kind of high-precision laser range-finding equipment electromagnetic shielding cabin |
| CN208410983U (en) * | 2018-06-12 | 2019-01-22 | 睿惢思工业科技（苏州）有限公司 | A kind of form electromagnetic shielding glass |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117008084A (en) * | 2022-04-29 | 2023-11-07 | 深圳市速腾聚创科技有限公司 | Optical-mechanical system |
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| PB01 | Publication | ||
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