CN109887769B - Selective laser forming-based gradient functional tungsten-copper material electrical contact and preparation method thereof - Google Patents
Selective laser forming-based gradient functional tungsten-copper material electrical contact and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a gradient functional tungsten-copper material electrical contact based on selective laser forming and a preparation method thereof. In the tungsten-copper alloy electrical contact material manufactured by the traditional manufacturing method, the tungsten and copper are not uniformly distributed, the microstructure is thick, the local microstructure is not uniform completely, the shape of the product is limited, and the potential of the material cannot be fully exerted. The invention can control the solid phase ratio of tungsten and copper of the final product by controlling the porosity of each layer in the design stage, ensure the porosity by modeling, manufacture a tungsten alloy framework by laser selection area forming, and then infiltrate copper alloy into the pores, thereby realizing the accurate control of the distribution of tungsten and copper materials and the tungsten-copper ratio in the front end structure of the electrical contact.
Description
Technical Field
The invention belongs to the field of preparation of complex high-performance materials from tungsten-copper alloys, and particularly relates to a gradient functional tungsten-copper material electrical contact based on selective laser forming and a preparation method thereof.
Background
The electrical contact is an important part of a high-voltage electrical appliance switch, and is widely applied to the electrical contact and an electrode material of a high-voltage electrical appliance due to the high pressure resistance and the electric ablation resistance of the tungsten-copper composite material. The traditional preparation methods of the tungsten-copper alloy are a sintering-infiltration method and a mixed powder sintering method, but because the tungsten-copper material is not melted and is a typical pseudo alloy, the sintering densification is difficult, the porosity is high and is not easy to control, the using effect and the service life of the electrical contact can be greatly influenced, and because the shape of the product and the uniform distribution degree of the material are limited, the potential of the material can not be exerted to the maximum extent, the method capable of controlling the solid phase distribution and the solid phase ratio of the tungsten-copper alloy can play a great role in improving the electric conduction and heat conduction performance, the electric ablation resistance performance and the mechanical performance of the tungsten-copper alloy.
Disclosure of Invention
The invention aims to overcome the defects and provides a gradient functional tungsten copper material electrical contact based on selective laser forming and a preparation method thereof, wherein a printing model is established to control porosity and pore distribution, then a 3DLMP-250 laser metal 3D printer is used for printing a tungsten alloy framework, and then directional solidification is carried out under high temperature and high vacuum, so that an electrical contact structure with a contact main body having uniform tungsten copper solid phase distribution and gradient change and no larger interface layer at the contact part of a copper rod and the contact is manufactured.
In order to achieve the purpose, the gradient function tungsten-copper material electrical contact based on selective laser forming comprises a tungsten alloy framework, wherein the tungsten alloy framework comprises a base and a copper alloy rod, the copper alloy rod is fixed on the base, the lower layer of the base is a net-shaped structure formed by splicing small triangles, the porosity of the net-shaped structure is 30% -40%, the lowest part of the net-shaped structure is a compact structure, the bottom of the net-shaped structure is provided with a hollow groove, the upper layer of the base is a hollow honeycomb structure with the porosity gradually reduced along with the increase of the height, the porosity of the bottom of the hollow honeycomb structure is 30% -40%, and the porosity of the top of the hollow honeycomb structure is 20% -25%;
the reticular structure and the hollow honeycomb structure are both filled with copper alloy solution.
The content of the copper alloy in the tungsten alloy framework accounts for 0-40 percent of the total percentage.
The preparation method of the gradient functional tungsten-copper material electrical contact based on selective laser forming comprises the following steps:
preparing a tungsten alloy framework by selective laser forming; preparing a high-temperature-resistant ceramic mold through a gel film-injection process, wherein the size of the inner wall of the ceramic mold is the same as that of the tungsten alloy framework;
fixing a ceramic mold on the upper layer of the tungsten alloy framework;
step three, heating at high temperature and in vacuum to prepare molten copper alloy;
step four, infiltrating the prepared copper alloy solution into a tungsten alloy framework in a vacuum environment through a ceramic tube in a ceramic mold, and filling the tungsten alloy framework into a net structure and a hollow honeycomb structure;
controlling the cooling temperature to directionally solidify the copper alloy to obtain unidirectional-growth directional crystals;
and step six, removing the ceramic mold to finally obtain the copper-tungsten electrical contact.
In the first step, the manufacturing method of the tungsten alloy framework comprises the following steps:
firstly, a tungsten skeleton model is built by UG, then the built model is exported to STL format, and then the model is imported into layered software Magics to be sliced, and an SLC file is generated;
and secondly, importing the SLC file into a laser metal 3D printer, and sintering tungsten alloy powder through a laser selective area to prepare a tungsten alloy framework with gradient density, wherein the printing material is spherical tungsten alloy powder.
Ball milling of the spherical tungsten alloy powder in heptane for 24 hr to obtain particle size of 5-25 micron, printer head power of 200-300W, printing layer thickness of 25-50 micron and printing speed of 50-500 mm/s.
The preparation method of the high-temperature resistant ceramic die comprises the following steps:
and injecting the prepared quartz ceramic slurry into a mold in a vacuum environment through a gel film-injection process, putting the cast part into a freeze dryer, and then separating the resin mold after freezing by using liquid nitrogen to obtain the high-temperature ceramic mold required for casting the copper alloy melt.
The preparation method of the molten copper alloy comprises the following steps:
adding Ni powder, Co powder or Fe powder with the mass ratio of 0.1-1.5% of the copper powder into the copper powder to be melted, uniformly ball-milling, and then melting the mixed powder at 1200-1400 ℃ to obtain copper alloy melt.
And in the fourth step, the LMC cooling vacuum directional solidification furnace is used as equipment, under the conditions that the vacuum degree is 0.08MPa, the temperature in the furnace is 1200-1400 ℃, and the argon atmosphere, the copper alloy melt is poured into the net structure and the hollow honeycomb structure in the tungsten alloy framework through the pouring gate above the ceramic tube, and the hollow cavity is filled with the copper alloy melt.
And fifthly, in an LMC cooling vacuum directional solidification furnace, controlling the vacuum degree of the LMC cooling vacuum directional solidification furnace to be 0.08MPa, the temperature in the furnace to be 1200-1400 ℃, the cooling mechanism of a cooling ring to be water cooling, the temperature to be 50-100 ℃, enabling an electric contact to gradually pass through the cooling ring from bottom to top, and drawing at the speed of 3-5 mm/min, so that the copper alloy is directionally solidified, and the columnar-crystal copper alloy is obtained.
Compared with the prior art, the electric contact disclosed by the invention has the advantages that the distribution of tungsten-copper materials in the tungsten-copper alloy and the tungsten-copper ratio are controlled through design. In the tungsten-copper alloy electrical contact material manufactured by the traditional manufacturing method, the tungsten and copper are not uniformly distributed, the microstructure is thick, the local microstructure is not uniform completely, the shape of the product is limited, and the potential of the material cannot be fully exerted. The invention can control the solid phase ratio of tungsten and copper of the final product by controlling the porosity of each layer in the design stage, ensure the porosity by modeling, manufacture a tungsten alloy framework by laser selection area forming, and then infiltrate copper alloy into the pores, thereby realizing the accurate control of the distribution of tungsten and copper materials and the tungsten-copper ratio in the front end structure of the electrical contact. At the connection part of copper alloy pole, this application adopts the mode that the gradient reduces the porosity, makes copper alloy pole and tungsten alloy material junction not have great obvious boundary layer, can improve the mechanical properties and the life of structure.
Furthermore, when the content of the copper alloy in the tungsten alloy matrix is between 0% and 40%, the larger the content of the copper alloy is, the better the electric and heat conducting performance of the tungsten-copper material is, but the hardness of the tungsten-copper material is reduced. The overall hardness of the electrical contact can be obviously improved by designing the structure of the tungsten alloy framework, so that the occupation ratio of the copper alloy can be improved as much as possible on the premise of ensuring that the hardness of the electrical contact meets the requirement, and the electric conduction and heat conduction performance of the electrical contact is improved.
The method of the invention prepares the tungsten alloy framework by selective laser forming, can manufacture complex structures which are difficult to realize in the traditional mode, and prepares the electrical contact based on the selective laser forming technology, thus being easier to realize a hollow structure which can improve the electrical ablation resistance and the thermal conductivity of the electrical contact; according to the invention, the copper alloy is infiltrated in the high-vacuum environment, so that the porosity of the alloy material can be reduced, the density of the tungsten-copper alloy can reach 94-95% by the existing sintering infiltration method, and the copper alloy can better fill the cavity by the vacuum infiltration method, so that the density of the tungsten-copper alloy can reach more than 99%; the invention makes the copper alloy directionally solidify by controlling the cooling temperature to grow into the wanted crystal grains, thus not only reducing the interface layer between the crystal grains and improving the electric conduction and heat conduction performance, but also reducing the larger interface layer between the copper alloy rod and the tungsten alloy framework and improving the mechanical performance because the copper in the tungsten copper alloy and the copper in the copper alloy rod grow together.
Furthermore, the distribution and proportion of the copper material in the tungsten matrix can be accurately controlled through design, and experiments prove that the more uniformly the copper alloy is distributed in the tungsten phase, the better the wear resistance and the electric ablation resistance of the tungsten alloy material can be combined with the electric conduction and the heat conduction of the copper alloy material, and the electric contact structure with excellent performance can be manufactured.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of a mesh structure formed by joining small triangles according to the present invention;
FIG. 3 is a vertical cross-sectional view of a hollow honeycomb structure of the present invention;
FIG. 4 is a schematic structural view of a refractory ceramic mold;
wherein, 1, copper alloy rod; 2. a network structure; 3. a groove; 4. a hollow honeycomb structure; 5. a copper alloy layer; 6. a tungsten alloy layer; 7. a ceramic mold; 8. a hollow cylinder.
Detailed Description
The invention will be further explained with reference to the drawings.
Referring to fig. 1, 2 and 3, the gradient functional tungsten-copper material electrical contact based on selective laser forming comprises a tungsten alloy framework, wherein the tungsten alloy framework comprises a base and a copper alloy rod 1, the copper alloy rod 1 is fixed on the base, the lower layer of the base is a net-shaped structure 2 formed by splicing small triangles, the height of the net-shaped structure 2 is 15mm, the porosity of the net-shaped structure 2 is 30% -40%, the lowest part 1 mm-2 mm of the net-shaped structure 2 is a compact structure, the bottom of the net-shaped structure 2 is provided with a hollow groove 3, the depth of the groove 3 is 5 mm-10 mm, the upper layer of the base is a hollow honeycomb-shaped structure 4 with the porosity gradually reduced along with the increase of the height, the height of the hollow honeycomb-shaped structure is 2mm, the porosity of the bottom of the hollow honeycomb-shaped structure is 30;
the reticular structure 2 and the hollow honeycomb structure 4 are both filled with copper alloy solution.
The content of the copper alloy in the tungsten alloy framework accounts for 0-40 percent of the total percentage.
Referring to fig. 1 to 4, the preparation method of the gradient functional tungsten-copper material electrical contact based on selective laser forming comprises the following steps:
preparing a tungsten alloy framework by selective laser forming; preparing a high-temperature-resistant ceramic mold through a gel film-injection process, wherein the size of the inner wall of the ceramic mold is the same as that of the tungsten alloy framework;
fixing the ceramic mold on the upper layer of the tungsten alloy framework, wherein the distance between the inner upper surface of the lower layer and the upper surface of the tungsten alloy framework is 1-2 mm, and the side surface of the lower layer is tightly matched with the tungsten alloy framework;
step three, heating at high temperature and in vacuum to prepare molten copper alloy;
step four, infiltrating the prepared copper alloy solution into a tungsten alloy framework in a vacuum environment through a ceramic tube in a ceramic mold, and filling the reticular structure 2 and the hollow honeycomb structure 4 of the tungsten alloy framework with the prepared copper alloy solution;
controlling the cooling temperature to directionally solidify the copper alloy to obtain unidirectional-growth directional crystals;
and step six, removing the ceramic mold to finally obtain the copper-tungsten electrical contact.
In the first step, the manufacturing method of the tungsten alloy framework comprises the following steps:
firstly, a tungsten skeleton model is built by UG, then the built model is exported to STL format, and then the model is imported into layered software Magics to be sliced, and an SLC file is generated;
and secondly, importing the SLC file into a laser metal 3D printer, and sintering tungsten alloy powder through a laser selective area to prepare a tungsten alloy framework with gradient density, wherein the printing material is spherical tungsten alloy powder.
Ball milling of the spherical tungsten alloy powder in heptane for 24 hr to obtain particle size of 5-25 micron, printer head power of 200-300W, printing layer thickness of 25-50 micron and printing speed of 50-500 mm/s.
The preparation method of the high-temperature resistant ceramic die comprises the following steps:
printing a lower layer with a regular hexagon structure by using a photocuring printer, wherein the size of the inner wall of the lower layer is the same as that of the tungsten alloy framework, the side length of the outer wall is 3-6 mm longer than that of the inner wall, and the height of the lower layer is 5-10 mm; the upper layer is of a hollow cylindrical structure, the inner wall of the upper layer is phi 5 mm-phi 10mm, the outer wall of the upper layer is phi 10 mm-phi 15mm, the height of the upper layer is 10 mm-15 mm, the wall thicknesses of the upper layer and the lower layer are both 0.5 mm-1 mm, 6-10 hollow cylinders with the diameter of 1 mm-2 mm, the wall thickness of 0.5 mm-1 mm and the height of 1 mm-2 mm are arranged on the edge of the inner wall of the lower layer.
And injecting the prepared quartz ceramic slurry into a mold in a vacuum environment through a gel film-injection process, putting the cast part into a freeze dryer, and then separating the resin mold after freezing by using liquid nitrogen to obtain the high-temperature ceramic mold required for casting the copper alloy melt.
The preparation method of the molten copper alloy comprises the following steps:
adding Ni powder, Co powder or Fe powder with the mass ratio of 0.1-1.5% of the copper powder into the copper powder to be melted, ball-milling for 24h, and then melting the mixed powder at 1200-1400 ℃ to obtain copper alloy melt.
And in the fourth step, the LMC cooling vacuum directional solidification furnace is used as equipment, under the conditions that the vacuum degree is 0.08MPa, the temperature in the furnace is 1200-1400 ℃, and the argon atmosphere, the copper alloy melt is poured into the net structure 2 and the hollow honeycomb structure 4 in the tungsten alloy framework through the pouring gate above the ceramic tube, and the hollow cavity is filled.
And fifthly, in an LMC cooling vacuum directional solidification furnace, controlling the vacuum degree of the LMC cooling vacuum directional solidification furnace to be 0.08MPa, the temperature in the furnace to be 1200-1400 ℃, the cooling mechanism of a cooling ring to be water cooling, the temperature to be 50-100 ℃, enabling an electric contact to gradually pass through the cooling ring from bottom to top, and drawing at the speed of 3-5 mm/min, so that the copper alloy is directionally solidified, and the columnar-crystal copper alloy is obtained.
The proportion and the distribution of the copper alloy material in the tungsten alloy matrix can be designed by using a 3D printing technology, so that the copper alloy can be uniformly distributed in the tungsten alloy matrix. The tungsten alloy framework is manufactured by selective laser forming, and the tungsten alloy framework with a complex structure can be manufactured, so that a better structure can be designed to improve the electric conduction and heat conduction performance of the electric contact, and the limitation of the traditional manufacturing method is avoided.
The crystal grains are directionally solidified by controlling the cooling temperature to grow into the wanted crystal grains, so that the interface layer between the crystal grains can be reduced, the electric conduction and heat conduction performance of the crystal grains are improved, and the larger interface layer between the copper alloy rod and the tungsten alloy framework can be avoided because the copper in the tungsten copper alloy and the copper in the copper alloy rod grow together, and the mechanical property of the crystal grains is improved.
Claims (8)
1. The preparation method of the gradient functional tungsten-copper material electrical contact based on selective laser forming is characterized in that the electrical contact comprises a tungsten alloy framework, the tungsten alloy framework comprises a base and a copper alloy rod (1), the copper alloy rod (1) is fixed on the base, the lower layer of the base is a net-shaped structure (2) formed by splicing small triangles, the porosity of the net-shaped structure (2) is 30% -40%, the lowest part of the net-shaped structure (2) is a compact structure, a hollow groove (3) is arranged at the bottom of the net-shaped structure (2), the upper layer of the base is a hollow honeycomb-shaped structure (4) with the porosity gradually reduced along with the increase of the height, the porosity of the bottom of the hollow honeycomb-shaped structure is 30% -40%, and the porosity of the top is 20% -25%;
copper alloy solution is filled in the reticular structure (2) and the hollow honeycomb structure (4);
the preparation method comprises the following steps:
preparing a tungsten alloy framework by selective laser forming; preparing a high-temperature-resistant ceramic mold through a gel film-injection process, wherein the size of the inner wall of the ceramic mold is the same as that of the tungsten alloy framework;
fixing a ceramic mold on the upper layer of the tungsten alloy framework;
step three, heating at high temperature and in vacuum to prepare molten copper alloy;
step four, infiltrating the prepared copper alloy solution into a tungsten alloy framework in a vacuum environment through a ceramic tube in a ceramic mold, and filling the tungsten alloy framework into a net structure (2) and a hollow honeycomb structure (4);
controlling the cooling temperature to directionally solidify the copper alloy to obtain unidirectional-growth directional crystals;
and step six, removing the ceramic mold to finally obtain the copper-tungsten electrical contact.
2. The method for preparing the gradient functional tungsten-copper material electrical contact based on the selective laser forming is characterized in that the content of the copper alloy in the tungsten alloy framework accounts for 0-40% of the total percentage.
3. The method for preparing the gradient functional tungsten-copper material electrical contact based on the selective laser forming is characterized in that in the first step, the manufacturing method of the tungsten alloy framework comprises the following steps:
firstly, a tungsten skeleton model is built by UG, then the built model is exported to STL format, and then the model is imported into layered software Magics to be sliced, and an SLC file is generated;
and secondly, importing the SLC file into a laser metal 3D printer, and sintering tungsten alloy powder through a laser selective area to prepare a tungsten alloy framework with gradient density, wherein the printing material is spherical tungsten alloy powder.
4. The method for preparing the gradient functional tungsten-copper material electrical contact based on the selective laser forming is characterized in that spherical tungsten alloy powder is subjected to ball milling in heptane for 24 hours, the particle size is 5-25 μm, the power of a laser head of a printer is 200-300W, the thickness of a printing layer is 25-50 μm, and the printing speed is 50-500 mm/s.
5. The preparation method of the gradient functional tungsten-copper material electrical contact based on the selective laser forming is characterized in that the preparation method of the high-temperature resistant ceramic die is as follows:
and injecting the prepared quartz ceramic slurry into a mold in a vacuum environment through a gel film-injection process, putting the cast part into a freeze dryer, and then separating the resin mold after freezing by using liquid nitrogen to obtain the high-temperature ceramic mold required for casting the copper alloy melt.
6. The method for preparing the gradient functional tungsten-copper material electrical contact based on the selective laser forming is characterized in that the method for preparing the molten copper alloy is as follows:
adding Ni powder, Co powder or Fe powder with the mass ratio of 0.1-1.5% of the copper powder into the copper powder to be melted, uniformly ball-milling, and then melting the mixed powder at 1200-1400 ℃ to obtain copper alloy melt.
7. The method for preparing the gradient functional tungsten-copper material electrical contact based on the selective laser forming is characterized in that in the fourth step, an LMC cooling vacuum directional solidification furnace is used as equipment, copper alloy melt is poured into a net structure (2) and a hollow honeycomb structure (4) in a tungsten alloy framework through a pouring gate above a ceramic tube under the argon atmosphere at the vacuum degree of 0.08MPa and the temperature in the furnace of 1200-1400 ℃, and the cavity is filled with the copper alloy melt.
8. The preparation method of the gradient functional tungsten-copper material electrical contact based on the selective laser forming is characterized in that in the fifth step, in an LMC cooling vacuum directional solidification furnace, under the argon atmosphere, the vacuum degree of the LMC cooling vacuum directional solidification furnace is controlled to be 0.08MPa, the temperature in the furnace is 1200-1400 ℃, the cooling mechanism of a cooling ring is water cooling, the temperature is 50-100 ℃, the electrical contact gradually passes through the cooling ring from bottom to top, and the drawing speed is 3-5 mm/min, so that the copper alloy is directionally solidified, and the columnar-crystal copper alloy is obtained.
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| CN110373667A (en) * | 2019-07-10 | 2019-10-25 | 西安理工大学 | The immediate processing method of tungsten-copper alloy performance is improved based on precinct laser fusion equipment |
| CN111689764B (en) * | 2020-07-06 | 2022-05-31 | 南京理工大学 | Low-cost preparation of ceramic powder for selective laser melting and defocusing forming method thereof |
| CN112077312B (en) * | 2020-09-27 | 2022-01-28 | 江苏科技大学 | Preparation method of copper-aluminum transition section composite structure |
| CN112530724B (en) * | 2020-10-19 | 2023-09-08 | 陕西斯瑞新材料股份有限公司 | Method for manufacturing electron beam welding copper-tungsten contact by using tungsten powder |
| CN114799207B (en) * | 2022-03-31 | 2024-04-12 | 西安航天发动机有限公司 | Forming method of complex prefabricated member of metal perspiration material |
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