CN109830518B - Display panel and display device - Google Patents
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- CN109830518B CN109830518B CN201910149204.4A CN201910149204A CN109830518B CN 109830518 B CN109830518 B CN 109830518B CN 201910149204 A CN201910149204 A CN 201910149204A CN 109830518 B CN109830518 B CN 109830518B
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 112
- 239000002184 metal Substances 0.000 claims abstract description 90
- 238000005538 encapsulation Methods 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000003292 glue Substances 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 75
- 230000001070 adhesive effect Effects 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 173
- 230000003068 static effect Effects 0.000 description 13
- 230000005611 electricity Effects 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The embodiment of the invention provides a display panel and a display device, relates to the technical field of display, and is used for improving the compactness of packaging glue at the edge of the display panel and further improving the antistatic capability at the edge. The first substrate of the display panel comprises a display area and an encapsulation area, wherein the encapsulation area surrounds the display area; in the direction of perpendicular to display panel, the encapsulation region is including setting gradually in the buffer layer of first base plate one side, the metal level, array rete and encapsulation glue, and the encapsulation region includes first encapsulation region and second encapsulation region, and the second encapsulation region is from the edge of first base plate extends to the center, and first encapsulation region is located between second encapsulation region and the display area, and in the direction of perpendicular to display panel, the array rete is in the thickness of second encapsulation region is more than or equal to the array rete and is in the thickness of first encapsulation region.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to a display panel and a display device.
[ background of the invention ]
An Organic Light-Emitting Diode (OLED) display panel is widely used in the display technology field because it has many advantages such as active Light emission, high contrast, no viewing angle limitation, and flexible display.
At present, in order to improve the water and oxygen resistance of each OLED device in a flexible OLED display panel, an encapsulation adhesive (frit) is generally used to encapsulate the display panel. During specific manufacturing, a reflective metal layer is required to be arranged at a position corresponding to the packaging adhesive to reflect laser to the packaging adhesive, so that the packaging adhesive is melted. Moreover, due to the design requirement of the narrow frame of the flexible OLED display panel, when a display panel with a target size is manufactured at present, the display panel with the required size is usually formed by cutting at the position of the packaging adhesive, and in order to avoid the influence of the cutting stress on the reflective metal layer, the width of the metal layer is usually set to be narrow, so that a section difference occurs between the packaging adhesive and the reflective metal layer at the edge of the display panel, the compactness of the fused packaging adhesive at the edge is poor, and the antistatic capability at the edge is influenced.
[ summary of the invention ]
In view of this, embodiments of the present invention provide a display panel and a display device, so as to improve the compactness of the packaging adhesive at the edge of the display panel, and further improve the antistatic capability at the edge.
In one aspect, an embodiment of the present invention provides a display panel, including a first substrate; the first substrate comprises a display area and an encapsulation area, wherein the encapsulation area surrounds the display area;
in a direction perpendicular to the display panel, the packaging region comprises a buffer layer, a metal layer, an array film layer and packaging glue which are sequentially arranged on one side of the first substrate;
the packaging area comprises a first packaging area and a second packaging area, the second packaging area extends from the edge of the first substrate to the center, the first packaging area is located between the second packaging area and the display area, and in the direction perpendicular to the display panel, the thickness of the array film layer in the second packaging area is larger than or equal to that of the array film layer in the first packaging area.
In another aspect, an embodiment of the present invention provides a display device, including the display panel described above.
According to the display panel and the display device provided by the embodiment of the invention, the thickness of the array film layer in the display panel in the second packaging area is set to be larger than or equal to the thickness of the array film layer in the first packaging area, and the thickness of the packaging glue in the second packaging area is smaller than or equal to the thickness of the packaging glue in the first packaging area, so that the density of the packaging glue in the second packaging area is larger than or equal to the density of the packaging glue in the first packaging area, and the defect caused by the lower density of the packaging glue close to the edge of the first substrate can be avoided, thereby improving the capability of the packaging glue at the edge against external static damage, and preventing static from further extending into the display panel to damage a device structure.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view illustrating a frame region of a display panel according to the prior art;
FIG. 2 is a schematic cross-sectional view of a frame region of another prior art display panel;
FIG. 3 is a schematic view of the package adhesive of FIG. 2 after melting;
fig. 4 is a schematic diagram of a display panel according to an embodiment of the invention;
FIG. 5 is a schematic cross-sectional view along AA' of FIG. 4;
FIG. 6 is another schematic cross-sectional view along AA' of FIG. 4;
FIG. 7 is a further schematic cross-sectional view along AA' of FIG. 4;
FIG. 8 is a further schematic cross-sectional view along AA' of FIG. 4;
FIG. 9 is a schematic top view of the metal layer of FIG. 8;
FIG. 10 is a further schematic cross-sectional view along AA' of FIG. 4;
FIG. 11 is a further schematic cross-sectional view along AA' of FIG. 4;
FIG. 12 is a further schematic cross-sectional view along AA' of FIG. 4;
fig. 13 is a schematic diagram of a display device according to an embodiment of the invention.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, etc. may be used to describe package regions in embodiments of the present invention, these package regions should not be limited by these terms. These terms are only used to distinguish the package regions from each other. For example, the first encapsulation area may also be referred to as the second encapsulation area, and similarly, the second encapsulation area may also be referred to as the first encapsulation area, without departing from the scope of embodiments of the present invention.
At present, when a display panel is packaged by using a packaging adhesive (frit), a colloidal packaging adhesive is generally coated on a frame position of the display panel, and then the colloidal packaging adhesive is melted at a high temperature by laser irradiation. In order to improve the utilization rate of the laser, a reflective metal layer is usually disposed below the package adhesive to reflect the incident laser to the package adhesive, so as to accelerate the melting rate of the package adhesive. Since the display panel with a larger area is generally cut into the display panel with a desired shape according to the need after the packaging of the display panel is completed, as shown in fig. 1, fig. 1 is a schematic cross-sectional view of a frame region of a display panel in the prior art, wherein a packaging adhesive 2 ' is coated on an upper substrate 3 ' and a lower substrate 4 ' for bonding. After the upper substrate 3 'and the lower substrate 4' are bonded together by the encapsulant 2 ', the larger-sized display panel is typically cut along the cutting line 10' in fig. 1 to obtain the display panel with the desired size. However, this method will result in the frame region of the display panel also including the region 6 'where the packaging adhesive 2' is not formed, i.e. the frame region of the display panel has a larger size, which is not favorable for the narrow frame design of the display panel.
In order to reduce the size of the frame region of the display panel, as shown in fig. 2, fig. 2 is a schematic cross-sectional view of the frame region of another display panel in the prior art, wherein in the display panel, a cut is performed on the packaging adhesive 2', that is, a cut on cut is adopted to form a display panel with a desired size. Specifically, as shown in fig. 2, the encapsulation adhesive 2 'is coated on the upper substrate 3' and bonded to the lower substrate 4 ', and the encapsulation adhesive 2' is not yet subjected to laser melting. The edge of the encapsulation adhesive 2 ' coincides with the cut edge 10 ', and in order to reduce the influence of the cutting stress on the reflective metal layer 1 ', the reflective metal layer 1 ' is usually disposed at a position having a certain distance from the cut edge 10 ', that is, the edge of the display panel, that is, the cut edge 10 ' does not pass through the reflective metal layer 1 '. In this way, although the region 6' in fig. 1 does not need to be provided in the frame region of the display panel with respect to fig. 1, the thickness of the film layer near the edge of the display panel is caused to be thinner, and a level difference is formed between the film layer at the edge far from the display panel.
Further, as shown in fig. 3, fig. 3 is a schematic diagram of the package adhesive 2 'in fig. 2 after being melted, at this time, since the reflective metal layer 1' is not disposed at a position close to the edge 10 'of the display panel, that is, at the area 21', the compactness of the package adhesive formed at the area 21 'is smaller than that of the package adhesive formed at the area 22', so that external static electricity is likely to enter from the area, which affects the normal operation of various electronic devices in the display panel. Moreover, since the density of the packaging adhesive formed in the region 21' is low, the possibility of external water and oxygen intrusion is increased, and the packaging reliability of the display panel is also affected. In addition, since the compactness of the encapsulation adhesive formed at the region 21 'is less than that of the encapsulation adhesive formed at the region 22', the interface bonding force between the encapsulation adhesive located at the region 21 'and the film layer 5' in contact therewith will be weak, and the encapsulation adhesive located at the region 21 'will be easily separated from the film layer 5', further affecting the encapsulation reliability of the display panel.
Based on this, an embodiment of the present invention provides a display panel, as shown in fig. 4, fig. 4 is a schematic diagram of the display panel provided in the embodiment of the present invention, wherein the display panel includes a first substrate 1, the first substrate 1 includes a display area 11 and an encapsulation area 12, and the encapsulation area 12 surrounds the display area 11. Alternatively, as shown in fig. 5 and fig. 6, fig. 5 and fig. 6 are two schematic cross-sectional views along AA' of fig. 4, in a direction perpendicular to the display panel, the encapsulation region 12 includes the buffer layer 2, the metal layer 3, the array film layer 4 and the encapsulation adhesive 5 sequentially disposed on one side of the first substrate 1; the encapsulation area 12 includes a first encapsulation area 121 and a second encapsulation area 122, the second encapsulation area 122 extends from the edge 10 of the first substrate 1 toward the center, and the first encapsulation area 121 is located between the second encapsulation area 122 and the display area 11. Specifically, as shown in fig. 5, in the direction perpendicular to the display panel, the thickness H42 of the array film layer 4 in the second encapsulation area 122 is greater than the thickness H41 of the array film layer 4 in the first encapsulation area 121. Alternatively, as shown in fig. 6, the thickness H42 of the array film layer 4 in the second encapsulation region 122 is equal to the thickness H41 of the array film layer 4 in the first encapsulation region 121.
The array film Layer 4 includes an Inter Metal Dielectric (IMD) and an Inter Layer Dielectric (ILD) extending to the display region 11 for separating the Metal material Layer and the Metal material Layer, and the semiconductor material Layer and the Metal material Layer, and may be formed of silicon oxide or nitride.
In the embodiment of the invention, the thickness H42 of the array film layer 4 in the second packaging region 122 is set to be greater than or equal to the thickness H41 of the array film layer 4 in the first packaging region 121, and when the display panel is packaged by the packaging adhesive 5, as shown in fig. 5, by providing the second substrate 6 opposite to the first substrate 1 in the display panel, the packaging adhesive 5 is firstly coated on one side of the second substrate 6, then the second substrate 6 coated with the packaging adhesive 5 is attached to the first substrate, and after the attachment, the second substrate 6 is located on the side of the packaging adhesive 5 away from the first substrate 1. Since the thickness H42 of the array film layer 4 in the second encapsulation area 122 is set to be greater than or equal to the thickness H41 of the array film layer 4 in the first encapsulation area 121 in the embodiment of the present invention, the space left for the encapsulation adhesive 5 in the second encapsulation area 122 is less than or equal to the space left for the encapsulation adhesive 5 in the first encapsulation area 121. Therefore, after the packaging adhesive 5 is subjected to laser melting, the thickness of the packaging adhesive 5 in the second packaging region 122 is smaller than or equal to the thickness of the packaging adhesive 5 in the first packaging region 121, so that the density of the packaging adhesive 5 in the second packaging region 122 is greater than or equal to the density of the packaging adhesive 5 in the first packaging region 121, that is, the density of the packaging adhesive 5 at a position close to the edge 10 of the first substrate 1 is greater than or equal to the density of the packaging adhesive 5 at a position far from the edge 10 of the first substrate 1, and thus the defect that the density of the packaging adhesive 5 at a position close to the edge 10 of the first substrate 1 is low can be avoided, the external static electricity resistance of the packaging adhesive 5 at the edge 10 is improved, and external static electricity is prevented from further extending to the inside of the display panel to damage the device structure. In addition, according to the embodiment of the invention, external water and oxygen can be better blocked from entering the display panel from the edge 10 of the first substrate 1, and the possibility that each device located in the display panel is invaded by water and oxygen is reduced.
Illustratively, as shown in fig. 5, the array film layer 4 includes a first surface 40 far away from the first substrate 1, the encapsulation adhesive 5 includes a second surface 50 far away from the second substrate 6, and the first surface 40 is in contact with the second surface 50. The projection of the packaging adhesive 5 on the plane of the first substrate 1 and the projection of the metal layer 3 on the plane of the first substrate 1 are overlapped, so that the energy of the laser is reflected to the packaging adhesive 5 by utilizing the metal layer 3, the energy utilization rate of the laser is improved, and the melting rate of the packaging adhesive 5 is improved.
It should be understood that the above-mentioned first surface 40 being in contact with the second surface 50 means that the first surface 40 is in close contact with the second surface 50, and no other film layer is included therebetween.
In addition, by setting the thickness H42 of the array film layer 4 in the second encapsulation area 122 to be greater than or equal to the thickness H41 of the array film layer 4 in the first encapsulation area 121, the embodiment of the invention can enable the interface bonding force between the first surface 40 and the second surface 50 of the second encapsulation area 122 to be greater than or equal to the interface bonding force between the first surface 40 and the second surface 50 of the first encapsulation area 121, thereby reducing the possibility of peeling between the encapsulation adhesive 5 and the array film layer 4 in the second encapsulation area 122, and further reducing the possibility of external water and oxygen entering the display panel from the edge 10 of the first substrate 1.
For example, in the embodiment of the present invention, the arrangement of the array film layer 4 and the metal layer 3 may be various, and the following descriptions are respectively given:
as shown in fig. 5, the array film layer 4 covers the first packaging region 121 and the second packaging region 122; and in the second encapsulation area 122, orthographic projections of the array film layer 4 and the metal layer 3 on a plane perpendicular to the display panel do not overlap. That is, the array film layer 4 is disposed in both the first package region 121 and the second package region 122, the metal layer 3 is not disposed in the second package region 122 near the edge 10 of the first substrate 1, and the metal layer 3 is disposed only in the first package region 121 far from the edge 10 of the first substrate 1. This arrangement can reduce the influence of the cutting stress on the metal layer 3 and reduce the possibility of cracks occurring in the metal layer 3 when the display panel is cut and formed along the edge 10 of the first substrate 1.
Also, as shown in fig. 5, in a direction perpendicular to the display panel, a thickness H42 of the array film layer 4 in the second encapsulation area 122 is made greater than or equal to a sum of a thickness H41 of the array film layer 4 in the first encapsulation area 121 and a thickness H3 of the metal layer 3 in the first encapsulation area 121. On the basis of reducing the influence of the cutting stress on the metal layer 3, the density of the packaging adhesive 5 located in the second packaging region 122 is improved, and external static electricity is better prevented from entering the display panel from one side of the edge 10 of the first substrate 1.
Alternatively, the metal layer 3 may be disposed in the second package region 122 according to the embodiment of the present invention. Specifically, as shown in fig. 6 and 7, fig. 7 is another schematic cross-sectional view along AA' of fig. 4, and unlike the embodiment shown in fig. 5, in fig. 6 and 7, the metal layer 3 is disposed in both the first package region 121 and the second package region 122. Moreover, the array film layer 4 and the metal layer 3 both cover the first package region 121 and the second package region 122, and the array film layer 4 and the metal layer 3 are flush with each other at the edge 10 of the first substrate 1; the metal layer 3 includes a first sub-metal layer 31, a groove 30, and a second sub-metal layer 32 sequentially arranged along the edge 10 of the first substrate 1 in the direction extending toward the center, and the groove 30 separates the first sub-metal layer 31 and the second sub-metal layer 32. With this arrangement, even if cracks are generated in the first sub-metal layer 31 near the edge 10 when the display panel is cut and formed along the edge 10 of the first substrate 1, the provision of the groove 30 between the first sub-metal layer 31 and the second sub-metal layer 32 can prevent the cracks from extending to the second sub-metal layer 32, thereby preventing the cracks from being generated inside the display panel and improving the mechanical strength of the display panel.
Alternatively, in the embodiments shown in fig. 6 and 7, the first sub-metal layer 31 may be disposed at the second package region 122, the second sub-metal layer 32 may be disposed at the first package region 121, and, in a direction perpendicular to the display panel, as shown in fig. 6, a sum of a thickness H42 of the array film layer 4 at the second package region 122 and a thickness H31 of the first sub-metal layer 31 may be set equal to a sum of a thickness H41 of the array film layer 4 at the first package region 121 and a thickness H32 of the second sub-metal layer 32, or, as shown in fig. 7, a sum of a thickness H42 of the array film layer 4 at the second package region 122 and a thickness H31 of the first sub-metal layer 31 may be set to be greater than a sum of a thickness H41 of the array film layer 4 at the first package region 121 and a thickness H32 of the second sub-metal layer 32, so as to better block static electricity from the first sub-metal layer 1 side into the display panel, the density of the packaging adhesive 5 located in the second packaging region 122 is improved, and the interface bonding force between the packaging adhesive 5 located in the second packaging region 122 and the array film layer 4 is improved.
Based on the metal layer 3 also disposed in the second encapsulation region 122, as shown in fig. 8 and fig. 9, for example, fig. 8 is a schematic cross-sectional view along AA' in fig. 4, and fig. 9 is a schematic top view of the metal layer in fig. 8, wherein, according to the embodiment of the present invention, the hole 300 may also be disposed in the metal layer 3, such that even when the display panel is cut along the edge 10 of the first substrate 1, a crack is generated in the metal layer 3 near the edge 10, the hole 300 disposed in the metal layer 3 can act as a barrier to crack propagation, and the possibility of crack propagation extending to the inside of the display panel is reduced. In addition, in the direction extending from the edge 10 of the first substrate 1 to the center, the embodiment of the invention not only can further reduce the possibility of cracks extending to the center of the display panel by setting the density of the holes 300 to be gradually increased, thereby further improving the mechanical performance of the display panel and reducing the possibility of external water and oxygen entering the display panel along the gap generated by the cracks, thereby improving the packaging reliability of the display panel, but also can set the density of the holes 300 in the metal layer 3 at the position close to the edge 10 to be smaller than the density of the holes 300 at the position close to the center of the display panel, so that when the array film layer 4 is formed on the metal layer 3, the amount of the array film layer 4 filled with the holes 300 in the second packaging region 122 is less than the amount of the array film layer 4 filled with the holes 300 in the first packaging region 121, that is, the thickness of the array film layer 4 in the second package region 122 can be made larger than the thickness of the array film layer 4 in the first package region 121, so that the density of the package adhesive 5 in the second package region 122 can be further improved when the display panel is packaged by the package adhesive 5.
In addition, in the embodiment of the invention, the holes 300 are arranged in the metal layer 3, so that the contact area between the metal layer 3 and the array film layer 4 can be increased, the interface bonding force between the metal layer 3 and the array film layer 4 can be increased, the possibility of peeling between the metal layer 3 and the array film layer 4 is reduced, and the packaging failure is reduced.
On the basis that the second package region 122 is not provided with the metal layer 3, the embodiment of the present invention provides a plurality of different solutions, which are respectively described below:
for example, the present invention may fabricate the array film layer 4 in the first package region 121 and the second package region 122, respectively. Specifically, as shown in fig. 10, fig. 10 is a schematic cross-sectional view along AA' of fig. 4, wherein the array film layer 4 may be arranged as a first array film layer 41 located at the first encapsulation area 121, and a second array film layer 42 located at the second encapsulation area 122. In the direction perpendicular to the display panel, the thickness H42 of the second array film layer is set to be greater than or equal to the sum of the thickness H41 of the first array film layer 41 and the thickness H3 of the metal layer 3, so that on the basis of reducing the influence of the cutting stress on the metal layer 3, the density of the packaging adhesive 5 located in the second packaging region 122 is improved, external static electricity is better prevented from entering the display panel from the edge 10 side of the first substrate 1, and the interface bonding force between the packaging adhesive 5 located in the second packaging region 122 and the array film layer 4 is improved.
For example, in the case of the display panel having the structure shown in fig. 10, in particular, during the manufacturing process, the first array film layer 41 and the second array film layer 42 may be manufactured by different processes, so as to manufacture the display panel satisfying the thickness requirement in the first encapsulation area 121 and the second encapsulation area 122.
Alternatively, as shown in fig. 11, fig. 11 is still another schematic cross-sectional view along AA' of fig. 4, wherein, unlike the embodiment shown in fig. 10, in fig. 9, a second array film layer 42 is disposed to cover the first encapsulation area 121 and the second encapsulation area 122. Specifically, as shown in fig. 11, the first array film 41 is disposed only on the side of the second encapsulation region 122, which is away from the first substrate 1, of the buffer layer 2, the second array film 42 is disposed to completely cover the first encapsulation region 121 and the second encapsulation region 122, and the second array film 42 is located on the side of the first array film 41, which is away from the first substrate 1. That is, taking the direction shown in fig. 11 as an example, the lower surfaces of the first array film layer 41 and the metal layer 3 are both in contact with the upper surface of the buffer layer 2, and the second array film layer 42 covering the first encapsulation area 121 and the second encapsulation area 122 is formed by one process, that is, the thickness H421 of the second array film layer 42 located in the first encapsulation area 121 is equal to the thickness H422 of the second array film layer 42 located in the second encapsulation area 122 along the direction perpendicular to the display panel. And the thickness H41 of the first array film layer 41 is greater than or equal to the thickness H3 of the metal layer 3, so as to improve the density of the packaging adhesive 5 located in the second packaging region 122 on the basis of reducing the influence of the cutting stress on the metal layer 3, further better prevent external static electricity from entering the display panel from the edge 10 side of the first substrate 1, and improve the interface bonding force between the packaging adhesive 5 located in the second packaging region 122 and the array film layer 4.
Illustratively, for the display panel having the structure shown in fig. 11, specifically, in the manufacturing process, after forming the buffer layer 2 covering the first package region 121 and the second package region 122 on the first substrate 1, the metal layer 3 is formed on the side of the buffer layer 2 located in the first package region 121 away from the first substrate 1, the first array film layer 41 is formed on the side of the buffer layer 2 located in the second package region 122 away from the first substrate 1, the thickness H41 of the first array film layer 41 is controlled to be greater than or equal to the thickness H3 of the metal layer 3, then the second array film layer 42 is formed on the side of the first array film layer 41 and the metal layer 3 away from the buffer layer 2 by using a procedure, and the second array film layer 42 covers the first package region 121 and the second package region 122. Therefore, the display panel meeting the thickness requirement is manufactured in the first package region 121 and the second package region 122, the density of the package adhesive 5 located in the second package region 122 is improved, external static electricity is prevented from entering the display panel from the edge 10 side of the first substrate 1, and the interface bonding force between the package adhesive 5 located in the second package region 122 and the array film layer 4 is improved.
Alternatively, as shown in fig. 12, fig. 12 is a schematic cross-sectional view along AA' of fig. 4, wherein, unlike the embodiment shown in fig. 10, in fig. 12, the first array film layer 41 is disposed to cover the first encapsulation area 121 and the second encapsulation area 122. Specifically, as shown in fig. 12, the array film layer 4 includes a first array film layer 41 completely covering the first package region 121 and the second package region 122, and a second array film layer 42 only covering the second package region 122, wherein the first array film layer 41 is located on a side of the metal layer 3 away from the first substrate 1, and the second array film layer 42 is located on a side of the first array film layer 41 away from the metal layer 3. That is, taking the direction shown in fig. 9 as an example, the lower surfaces of the first array film 41 and the metal layer 3 are both in contact with the upper surface of the buffer layer 2, and the first array film 41 covering the first encapsulation area 121 and the second encapsulation area 122 is formed by a process, that is, the thickness H411 of the first array film 41 in the first encapsulation area 121 and the thickness H412 of the first array film 41 in the second encapsulation area 122 are equal to each other along the direction perpendicular to the display panel. And the thickness H42 of the second array film layer is greater than or equal to the thickness H3 of the metal layer, so as to better prevent external static electricity from entering the display panel from the edge 10 side of the first substrate 1 on the basis of reducing the influence of the cutting stress on the metal layer 3, improve the density of the packaging adhesive 5 located in the second packaging region 122, and improve the interface bonding force between the packaging adhesive 5 located in the second packaging region 122 and the array film layer 4.
For example, for the display panel having the structure shown in fig. 12, specifically, in the manufacturing process, after the buffer layer 2 covering the first package region 121 and the second package region 122 is formed on the first substrate 1, the metal layer 3 is formed on the side of the buffer layer 2 located in the first package region 121 away from the first substrate 1, then the first array film layer 41 is formed on the side of the metal layer 3 located in the first package region 121 away from the buffer layer 2 and the side of the buffer layer 2 located in the second package region 122 away from the first substrate 1 in a single process, then the second array film layer 42 is formed on the side of the first array film layer 41 located in the second package region 122 away from the buffer layer 2, and the thickness H42 of the second array film layer is greater than or equal to the thickness H3 of the metal layer. Therefore, the display panel meeting the thickness requirement is manufactured in the first package region 121 and the second package region 122, the density of the package adhesive 5 located in the second package region 122 is improved, external static electricity is prevented from entering the display panel from the edge 10 side of the first substrate 1, and the interface bonding force between the package adhesive 5 located in the second package region 122 and the array film layer 4 is improved.
For example, the buffer layer 2 and the array film layer 4 may be made of inorganic materials such as silicon oxide and silicon nitride.
As shown in fig. 13, fig. 13 is a schematic view of a display device according to an embodiment of the present invention, where the display device includes the display panel 100. The specific structure of the display panel 100 has been described in detail in the above embodiments, and is not described herein again. Of course, the display device shown in fig. 13 is only a schematic illustration, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, or a television.
In the display device provided by the embodiment of the invention, the thickness H42 of the array film layer 4 in the second package region 122 of the display panel is set to be greater than or equal to the thickness H41 of the array film layer 4 in the first package region 121, and when the display panel is packaged by the package adhesive 5, the thickness of the package adhesive 5 in the second package region 122 is less than or equal to the thickness of the package adhesive 5 in the first package region 121, so that the density of the package adhesive 5 in the second package region 122 is greater than or equal to the density of the package adhesive 5 in the first package region 121, and thus, a defect formed by the lower density of the package adhesive 5 near the edge 10 of the first substrate 1 can be avoided, the capability of the package adhesive 5 at the edge 10 against external electrostatic damage is improved, and static electricity is prevented from further extending to the interior of the display panel to damage a device structure.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (11)
1. A display panel, comprising: a first substrate; the first substrate comprises a display area and an encapsulation area, wherein the encapsulation area surrounds the display area;
in a direction perpendicular to the display panel, the packaging region comprises a buffer layer, a metal layer, an array film layer and packaging glue which are sequentially arranged on one side of the first substrate;
the packaging area comprises a first packaging area and a second packaging area, the second packaging area extends from the edge of the first substrate to the center, the first packaging area is located between the second packaging area and the display area, and in the direction perpendicular to the display panel, the thickness of the array film layer in the second packaging area is larger than that of the array film layer in the first packaging area; or the thickness of the array film layer in the second packaging area is equal to that of the array film layer in the first packaging area, and the second packaging area comprises a metal layer;
the material of the array film layer comprises silicon oxide or nitride.
2. The display panel according to claim 1,
the array film layer covers the first packaging area and the second packaging area, and in the second packaging area, orthographic projections of the array film layer and the metal layer on a plane perpendicular to the display panel do not overlap;
wherein, in a direction perpendicular to the display panel, a thickness of the array film layer in the second packaging area is greater than a sum of thicknesses of the array film layer and the metal layer in the first packaging area.
3. The display panel of claim 2, wherein the array film layers comprise a first array film layer and a second array film layer, wherein the first array film layer is located in the first encapsulation area and the second array film layer is located in the second encapsulation area;
the first array film layer and the second array film layer are formed through different procedures; the thickness of the second array film layer is larger than the sum of the thicknesses of the first array film layer and the metal layer in a direction perpendicular to the display panel.
4. The display panel of claim 2, wherein the array film layer comprises a first array film layer and a second array film layer, the first array film layer is disposed only in the second package region and on a side of the buffer layer away from the first substrate, and the second array film layer is disposed on a side of the first array film layer away from the first substrate and completely covers the first package region and the second package region;
the thickness of the first array film layer is greater than that of the metal layer in a direction perpendicular to the display panel.
5. The display panel according to claim 2,
the array film layer comprises a first array film layer and a second array film layer, the first array film layer is positioned on one side of the metal layer far away from the first substrate, the second array film layer is positioned on one side of the first array film layer far away from the metal layer,
the first array film layer completely covers the first packaging area and the second packaging area, and the second array film layer is only arranged in the second packaging area;
the thickness of the second array film layer is greater than that of the metal layer in a direction perpendicular to the display panel.
6. The display panel of claim 1, wherein the array film layer and the metal layer both cover the first and second encapsulation regions,
the array film layer and the metal layer are flush at the edge of the first substrate;
the metal layer comprises a first sub-metal layer, a groove and a second sub-metal layer which are sequentially arranged along the edge of the first substrate in the central extending direction, and the groove separates the first sub-metal layer from the second sub-metal layer.
7. The display panel according to claim 6, wherein the metal layer comprises holes, and the density of the holes increases along the direction extending from the edge of the first substrate to the center.
8. The display panel according to claim 1, further comprising a second substrate disposed opposite to the first substrate, wherein the second substrate is disposed on a side of the encapsulation adhesive away from the first substrate;
the array film layer comprises a first surface far away from the first substrate, the packaging adhesive comprises a second surface far away from the second substrate, the first surface is in contact with the second surface, and the projection of the packaging adhesive on the plane where the first substrate is located is overlapped with the projection of the metal layer on the plane where the first substrate is located.
9. The display panel according to claim 8,
the density of the packaging glue in the second packaging region is greater than or equal to that of the packaging glue in the first packaging region.
10. The display panel of claim 9, wherein an interfacial bonding force between the first surface and the second surface of the second encapsulation area is greater than or equal to an interfacial bonding force between the first surface and the second surface of the first encapsulation area.
11. A display device characterized by comprising the display panel according to any one of claims 1 to 10.
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| CN113950712B (en) * | 2020-05-09 | 2023-09-29 | 京东方科技集团股份有限公司 | Display substrate, display panel, display device and manufacturing method of display panel |
| CN111769213B (en) * | 2020-07-31 | 2023-05-23 | 武汉天马微电子有限公司 | Display panel and display device |
| CN114038346B (en) * | 2021-11-26 | 2023-05-30 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
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Effective date of registration: 20211026 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN TIANMA MICROELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |