CN109695826A - Integral type UV-LED light source module group and preparation method thereof - Google Patents
Integral type UV-LED light source module group and preparation method thereof Download PDFInfo
- Publication number
- CN109695826A CN109695826A CN201910157349.9A CN201910157349A CN109695826A CN 109695826 A CN109695826 A CN 109695826A CN 201910157349 A CN201910157349 A CN 201910157349A CN 109695826 A CN109695826 A CN 109695826A
- Authority
- CN
- China
- Prior art keywords
- light source
- circuit board
- led
- module group
- integral type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 238000009826 distribution Methods 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 238000001125 extrusion Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 11
- 239000011701 zinc Substances 0.000 claims description 11
- 229910052725 zinc Inorganic materials 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011324 bead Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004837 Ultraviolet (UV) light curing adhesive Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to integral type UV-LED light source module groups and preparation method thereof, the UV-LED light source module group includes: radiator, it is formed with the light source accommodating chamber entirely longitudinally extended along it, there is a plurality of light source slot longitudinally extended along radiator, a plurality of light source slot is parallel to each other and arc-shaped distribution in light source accommodating chamber；Two longitudinal ends of radiator are arranged in end cap；The oral area of light source accommodating chamber is arranged in light penetrating panel；The bottom surface of each light source slot all have it is multiple along radiator longitudinal direction array distribution and with the metal heat-conducting of radiator integrally connected protrusion, and the bottom surface of each light source slot is respectively and fixedly provided with circuit board, and circuit board has the through hole passed through for thermally conductive protrusion；UV-LED luminescent device, and the circuit board electrical connection that the UV-LED luminescent device and the thermally conductive protrusion are passed through are provided in each thermally conductive protrusion.In preparation method embodiment of the present invention, after preparing radiator by extrusion forming, thermally conductive protrusion is prepared by electroplating technology.
Description
Technical field
The UV-LED light source module group and preparation method thereof that the present invention relates to a kind of for ultraviolet light curing apparatus.
Background technique
Ultraviolet light solidification equipment utilization ultraviolet light (usually 200-450nm) irradiating ultraviolet light curing materials (such as glue
Or ink) it is made to generate polymerization reaction to solidify, there is very extensive application in industries such as printing, coatings.Traditional purple
For outer uv equipment using ultraviolet light mercury lamp as light source, power consumption is big, and needs to configure row because ultraviolet light mercury lamp generates ozone
Device of air causes equipment overall operation at high cost.UV-LED (ultraviolet LED) has the low power consumption, long-life, small-sized
Change, lightweight and be free of mercury ingredient the advantages that, in recent years, UV-LED light source module group more and more substitute ultraviolet light mercury lamp
Using on ultraviolet light curing apparatus.
UV-LED luminescent device (such as UV-LED lamp bead or chip) can distribute amount of heat during the work time, this is not only
It is required that there is excellent heating conduction as its mechanical support and the circuit board for being electrically connected carrier, and need to reduce as far as possible
Thermal resistance between the circuit board and radiator connected to it improves the work of UV-LED luminescent device to realize rapid cooling
Performance and used life avoids UV-LED luminescent device from occurring " dead lamp " phenomenon because of overheat.
The first Chinese patent application CN201820671305.9 of applicant discloses a kind of UV-LED light source module group, including
The radiator that longitudinally extends and it is respectively fixedly connected with first end cover and second end cover in two longitudinal ends of radiator, heat dissipation
The downside of body has the light source accommodating chamber entirely longitudinally extended along it, and the oral area of light source accommodating chamber is provided with light penetrating panel；Light source
Have in accommodating chamber it is multiple be arranged in parallel and longitudinal light source slot of arc-shaped distribution, be provided with one in each longitudinal direction light source slot
UV-LED lamp bar group, and the oral area of each longitudinal light source slot is provided with a bar shaped collector lens group；Wherein, UV-LED lamp bar packet
The UV-LED luminescent device of circuit board and setting on circuit boards is included, there is heat-conducting cream or thermally conductive between circuit board and radiator
Pad.
In above-mentioned UV-LED light source module group, UV-LED luminescent device is arranged (forms heat even on circuit boards with circuit board
Connect and be electrically connected), generated heat need to be via circuit board and heat-conducting cream or heat conductive pad in the UV-LED luminescent device course of work
It is transmitted to radiator, leads to inside heat-conducting cream or heat conductive pad, at the contact interface of heat-conducting cream or heat conductive pad and circuit board and radiator
Bubble presence is often had, the heat transmission by UV-LED luminescent device to radiator is influenced.
Summary of the invention
The first object of the present invention is to provide a kind of UV-LED light source module group with excellent heat dissipation property.
The second object of the present invention is to provide a kind of method for preparing above-mentioned UV-LED light source module group at low cost.
In order to realize the first above-mentioned purpose, the embodiment of the invention provides a kind of integral type UV-LED light source module groups, use
In being releasably attached in ultraviolet light curing apparatus comprising:
Metallic heat dissipating part, downside are formed with the light source accommodating chamber entirely longitudinally extended along it, have in light source accommodating chamber
The a plurality of light source slot longitudinally extended along metallic heat dissipating part, which is parallel to each other and arc-shaped distribution；
Two longitudinal ends of metallic heat dissipating part are arranged in end cap；
The oral area of light source accommodating chamber is arranged in light penetrating panel；
Wherein, the bottom surface of each light source slot all has multiple metals along radiator longitudinal direction array distribution and and metallic heat dissipating part
The metal heat-conducting protrusion of integrally connected, and the bottom surface of each light source slot is respectively and fixedly provided with circuit board, which has leads for metal
The through hole that hot protrusion passes through；Be provided in each metal heat-conducting protrusion with its hot linked UV-LED luminescent device, and should
UV-LED luminescent device is electrically connected with the conducting wire for being formed in circuit board surface.
In above-mentioned technical proposal, on the one hand, UV-LED luminescent device is arranged in metal heat-conducting protrusion and is thermally connected with it,
Heat in UV-LED luminescent device can be conducted without circuit board to radiator；On the other hand, metal heat-conducting protrusion with
Metallic heat dissipating part integrally connected eliminates the thermal resistance between metal heat-conducting protrusion and metallic heat dissipating part.UV- of the invention as a result,
LED light source mould group has integrated radiating structure, to reach excellent heat dissipation performance.
In one particular embodiment of the present invention, metallic heat dissipating part is aluminium radiator, and metal heat-conducting protrusion includes being formed
Nickel layer or zinc layers in light source groove bottom and the layers of copper that is formed in nickel layer or zinc layers.Nickel layer or zinc layers can increase
The binding force of layers of copper and aluminium radiator, layers of copper are then convenient for the welded connecting between metal heat-conducting protrusion and UV-LED luminescent device.
Preferably, nickel layer or zinc layers with a thickness of 10 microns to 50 microns.
In one particular embodiment of the present invention, circuit board is flexible circuit board, the flexible circuit board and light source slot
Bottom surface bonding connection.It in this specific embodiment, is in polymorphic structure based on metallic heat dissipating part, therefore circuit board uses flexible circuit board
And by the bottom surface bonding connection of itself and light source slot, higher packaging efficiency can achieve.
In one particular embodiment of the present invention, the surface phase of the top surface of metal heat-conducting protrusion and circuit board conductive wire
Concordantly.It is convenient for the UV-LED device of such as UV-LED lamp bead being welded to the conducting wire of circuit board simultaneously as a result, and metal is led
On plume.
In one particular embodiment of the present invention, metallic heat dissipating part has water-cooling channel, the inner surface shape of water-cooling channel
At concaveconvex structure；The upside of metallic heat dissipating part is formed there are two the supporting side walls longitudinally extended along it, is carried in supporting side walls
Top cover is provided with the water pipe head being connected to water-cooling channel on top cover.
In one particular embodiment of the present invention, the both lateral sides of light source notch have strip-shaped clamp groove, and light source slot
Oral area be provided with the bar shaped collector lens mating with strip-shaped clamp groove.
In order to realize the second above-mentioned purpose, the present invention also provides a kind of systems of above-mentioned integral type UV-LED light source module group
Preparation Method comprising following steps:
S1: metallic heat dissipating part is prepared using aluminium extrusion moulding process；
S3: using electroplating technology in the bottom surface of light source slot production metal heat-conducting protrusion；
Circuit board: being fixed to the bottom surface of light source slot by S5, wherein making through hole of the metal heat-conducting protrusion across circuit board；
S7: it establishes and is thermally connected between UV-LED luminescent device and metal heat-conducting protrusion, and in UV-LED luminescent device
It establishes and is electrically connected between the conducting wire of circuit board surface.
In the present invention, metallic heat dissipating part is prepared using extrusion forming process, using electroplating technology light source slot bottom surface system
Make metal heat-conducting protrusion, has the advantages that high production efficiency, at low cost.
A specific embodiment according to the present invention, in step S3, using electroplating technology first in the bottom surface shape of light source slot
At the nickel layer with a thickness of 10 microns to 50 microns perhaps zinc layers then on nickel layer or zinc layers be electroplated predetermined altitude copper post and
Obtain metal heat-conducting protrusion.Selectively, metallic heat dissipating part is machined out or chemical etching and to obtain metal heat-conducting convex
It rises.
A specific embodiment according to the present invention, circuit board are single layer or multi-layer flexible circuit board, benefit in step S5
Flexible circuit board adhesion is fixed to the bottom surface of light source slot with adhesive, to reach higher packaging efficiency.Selectively, it utilizes
Circuit board is fixed on the bottom surface of light source slot by screw.
In order to illustrate more clearly of the object, technical solutions and advantages of the present invention, with reference to the accompanying drawing and specific embodiment party
The present invention is described in further detail for formula.
It should be noted that different piece in attached drawing may not be with phase in order to clearly illustrate structure to be expressed
Describe in proportion, therefore, unless explicitly stated otherwise, otherwise content expressed by attached drawing is not constituted to the size of each part, ratio pass
The limitation of system.
Detailed description of the invention
Fig. 1 is the schematic perspective view of UV-LED light source module group preferred embodiment of the present invention；
Fig. 2 is the cross-sectional structure schematic diagram of UV-LED light source module group preferred embodiment of the present invention；
Fig. 3 is the partial enlarged view in Fig. 2 in circle of dotted line a-quadrant.
Specific embodiment
UV-LED light source module group embodiment
Fig. 1 to 3 is please referred to, the UV-LED light source module group as the preferred embodiment of the present invention includes metallic heat dissipating part 1, two
End cap 2, top cover 3 and light penetrating panel 4；Wherein, radiator 1, which has, is located at its downside and accommodates along the light source that it entirely longitudinally extends
Chamber 11；Two end caps 2 are fixedly connected on two longitudinal ends of radiator 1 by screw respectively, and from its both ends seal light source
Accommodating chamber 11.The oral area of light source accommodating chamber 11 is arranged in light penetrating panel 4；Wherein, the both lateral sides tool of 11 oral area of light source accommodating chamber
There is strip-shaped clamp groove 113, the both lateral sides of light penetrating panel 4 are plugged in strip-shaped clamp groove 113, are provided with and are used in strip-shaped clamp groove 113
The sealing strip 41 in gap between sealed light-transmitting panel 4 and radiator 1.
With the light source slot 111 of four arranged in parallel and arc-shaped distributions, 111 edge of light source slot in light source accommodating chamber 11
Radiator 1 it is entire it is longitudinal extend, the bottom surface of each light source slot 111 all have it is multiple along the longitudinal array distribution of radiator 1 and with
The metal heat-conducting protrusion 101 (please referring to Fig. 3) of 1 integrally connected of radiator, and the bottom surface of each light source slot 111 is respectively and fixedly provided with circuit
Plate 5.Circuit board 5 extends along the longitudinal direction of radiator 1, and surface is formed with conducting wire 51, and it has for metal heat-conducting protrusion
101 through holes passed through.Specific in the present embodiment, metal heat-conducting protrusion 101 includes that plating is formed in 111 bottom surface of light source slot
Thickness is about 20 micron nickel layers and the layers of copper that is formed on nickel layer；Circuit board 5 is single layer only with single layer of conductive route
The bottom surface of flexible circuit board or multi-layer flexible circuit board with multilayer conductive route, circuit board 5 and light source slot 111, which bonds, to be connected
It connects, the top surface of metal heat-conducting protrusion 101 and the surface flush of conducting wire 51.
Fig. 2 and 3 are please referred to, is provided in each metal heat-conducting protrusion 101 and is thermally connected with it and shines as UV-LED
The UV-LED lamp bead 6 of device, UV-LED lamp bead 6 have heat sink 52 and positioned at heat sink 52 opposite sides electrode 61, electrode 61 with
It is electrically connected between conducting wire 51, heat sink 52 are thermally connected with metal heat-conducting protrusion 101.Due to four 111 arc-shaped points of light source slot
Cloth, therefore the illumination spot of the UV-LED lamp bead 6 in four light source slots 111 is least partially overlapped and reach the ultraviolet lighting of enhancing
Intensity.
The oral area of light source slot 111 is provided with bar shaped collector lens 7；Specifically, the both lateral sides of 111 oral area of light source slot have
Strip-shaped clamp groove 112, the both lateral sides of bar shaped collector lens 7 are plugged in strip-shaped clamp groove 112.The right and left of 1 upside of radiator
Along the supporting side walls 13 that it longitudinally extends there are two being formed, top cover 3 is carried in supporting side walls 13, and passes through screw and support-side
Wall 13 is fixedly connected；Fixed on top cover 3 there are two handles 31, in order to grasp the UV-LED light source module group.It is also solid on top cover 36
It is fixed there are two conductive contact 8 and two water pipe heads 9, conductive contact 8 via pass through in radiator 1 inner lead of wire guide with
Circuit board 5 is electrically connected.Conductive contact 8 and water pipe head 9 are arranged on top cover 3, convenient for UV-LED light source module group to be installed to
In ultraviolet light curing apparatus and from wherein dismantling.
Two water-cooling channels 12 for running through radiator 1 in the longitudinal direction, the inner surface of water-cooling channel 12 are formed in radiator 1
It is formed with the concaveconvex structure 121 longitudinally extended, to increase the heat exchange area between cooling water and radiator 1.Two water coolings are logical
The wherein one end in road 12 is interconnected and is sealed by end cap 2, and the wherein other end of two water-cooling channels 12 is respectively with setting in top cover 3
On two water pipe heads 9 connection, cooling water pipe 91 is connected to water pipe head 9, to convey cooling water into water-cooling channel 12.
UV-LED light source module group preparation method embodiment
As a preferred embodiment of the present invention, the preparation method of above-mentioned integral type UV-LED light source module group includes as follows
Step:
S1: metallic heat dissipating part 1 is prepared using aluminium extrusion moulding process；
S3: metal heat-conducting protrusion 101 is made in the bottom surface of light source slot using electroplating technology；Specifically, using electroplating technology
First the bottom surface of light source slot 111 formed then be electroplated on nickel layer with a thickness of 20 microns of nickel layer predetermined altitude copper post and
Obtain metal heat-conducting protrusion 101；
S5: flexible circuit board 5 is adhered using adhesive and is fixed to the bottom surface of light source slot 111, wherein making metal heat-conducting
Protrusion 101 passes through the through hole of circuit board 5；
S7: establishing between UV-LED lamp bead 6 and metal heat-conducting protrusion 101 and be thermally connected, and in UV-LED lamp bead 6 and electricity
Electrical connection is established between the conducting wire 51 on 5 surface of road plate.Specifically, metal is soldered to by heat sink the 62 of UV-LED lamp bead 6 to lead
Hot protrusion 101 and establish thermal connection between, and the electrode 61 of UV-LED lamp bead 6 is soldered to conducting wire 51 simultaneously and
Electrical connection is established between；Wherein it is possible to successively carry out the welding of UV-LED lamp bead 6 in every light source slot 111.
The preparation method of above-mentioned integral type UV-LED light source module group further includes assembling end cap 2, top cover 3, conductive contact 8 and water
The step of pipe fitting 9, and established between circuit board 5 and between circuit board 5 and conductive contact 8 and be electrically connected using conducting wire
Step etc., the concrete operations of these steps will be obvious to those skilled in the art that therefore omit herein to its
Explanation.
Although depicting the present invention above by preferred embodiment, but it is to be understood that, those of ordinary skill in the art
It is not departing from invention scope of the invention, it is all according to being improved on an equal basis made by the present invention, it should be protection scope of the present invention institute
Cover.
Claims (10)
1. integral type UV-LED light source module group, for being releasably attached in ultraviolet light curing apparatus comprising:
Metallic heat dissipating part, downside are formed with the light source accommodating chamber entirely longitudinally extended along it, have in the light source accommodating chamber
The a plurality of light source slot longitudinally extended along the metallic heat dissipating part, a plurality of light source slot is parallel to each other and arc-shaped distribution；
Two longitudinal ends of the radiator are arranged in end cap；
The oral area of the light source accommodating chamber is arranged in light penetrating panel；
It is characterized by: the bottom surface of each light source slot all have it is multiple along metallic heat dissipating part longitudinal direction array distribution and with
The metal heat-conducting protrusion of the metallic heat dissipating part integrally connected, and the bottom surface of each light source slot is respectively and fixedly provided with circuit board, institute
Stating circuit board has the through hole passed through for the metal heat-conducting protrusion；Be provided in each metal heat-conducting protrusion and its
Hot linked UV-LED luminescent device, and the UV-LED luminescent device and the conducting wire electricity for being formed in the circuit board surface
Connection.
2. integral type UV-LED light source module group as described in claim 1, it is characterised in that: the metal heat-conducting protrusion includes shape
At in the nickel layer or zinc layers of the light source groove bottom and the layers of copper being formed in the nickel layer or zinc layers.
3. integral type UV-LED light source module group as claimed in claim 2, it is characterised in that: the thickness of the nickel layer or zinc layers
It is 10 microns to 50 microns.
4. integral type UV-LED light source module group as described in claim 1, it is characterised in that: the circuit board is flexible circuit
Plate, the bottom surface bonding connection of the flexible circuit board and the light source slot.
5. integral type UV-LED light source module group as described in claim 1, it is characterised in that: the top surface of the metal heat-conducting protrusion
With the surface flush of the conducting wire.
6. integral type UV-LED light source module group as described in claim 1, it is characterised in that: the metallic heat dissipating part has water cooling
The inner surface in channel, the water-cooling channel forms concaveconvex structure；There are two along its longitudinal direction for the upside formation of the metallic heat dissipating part
The supporting side walls of extension carry top cover in the supporting side walls, are provided on the top cover and are connected to the water-cooling channel
Water pipe head.
7. integral type UV-LED light source module group as described in claim 1, it is characterised in that: lateral the two of the light source notch
Side has strip-shaped clamp groove, and the oral area of the light source slot is provided with the bar shaped collector lens mating with the strip-shaped clamp groove.
8. a kind of preparation method of integral type UV-LED light source module group as described in claim 1, it is characterised in that including walking as follows
It is rapid:
S1: the metallic heat dissipating part is prepared using aluminium extrusion moulding process；
S3: the metal heat-conducting protrusion is made in the bottom surface of the light source slot using electroplating technology；
The circuit board: being fixed to the bottom surface of the light source slot by S5, wherein the metal heat-conducting protrusion is made to pass through the electricity
The through hole of road plate；
S7: it establishes and is thermally connected between the UV-LED luminescent device and metal heat-conducting protrusion, and in the UV-LED
It establishes and is electrically connected between luminescent device and the conducting wire of the circuit board surface.
9. preparation method as claimed in claim 8, it is characterised in that: in step S3, using electroplating technology first in the light
The bottom surface of source slot forms that perhaps then zinc layers are electroplated on the nickel layer or zinc layers with a thickness of 10 microns to 50 microns of nickel layer
The copper post of predetermined altitude and obtain metal heat-conducting protrusion.
10. preparation method as claimed in claim 8, it is characterised in that: the circuit board is single layer or multi-layer flexible circuit
Flexible circuit board adhesion is fixed to the bottom surface of the light source slot in step S5 by plate using adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910157349.9A CN109695826A (en) | 2019-03-01 | 2019-03-01 | Integral type UV-LED light source module group and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910157349.9A CN109695826A (en) | 2019-03-01 | 2019-03-01 | Integral type UV-LED light source module group and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109695826A true CN109695826A (en) | 2019-04-30 |
Family
ID=66233781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910157349.9A Pending CN109695826A (en) | 2019-03-01 | 2019-03-01 | Integral type UV-LED light source module group and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109695826A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073159A1 (en) * | 2009-09-28 | 2011-03-31 | Yu-Nung Shen | Heat Dissipating Device and Module Using Same |
| CN201827857U (en) * | 2010-09-28 | 2011-05-11 | 南京汉德森科技股份有限公司 | Heat conducting structure of LED light source |
| CN204272571U (en) * | 2014-11-26 | 2015-04-15 | 乐健科技（珠海）有限公司 | There is printed circuit board (PCB) and the LED light source module of micro-radiator |
| CN208090482U (en) * | 2018-05-07 | 2018-11-13 | 力普士科技（珠海）有限公司 | UV-LED curing light source systems |
| CN209415071U (en) * | 2019-03-01 | 2019-09-20 | 力普士科技（珠海）有限公司 | Integral type UV-LED light source module group |
-
2019
- 2019-03-01 CN CN201910157349.9A patent/CN109695826A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073159A1 (en) * | 2009-09-28 | 2011-03-31 | Yu-Nung Shen | Heat Dissipating Device and Module Using Same |
| CN201827857U (en) * | 2010-09-28 | 2011-05-11 | 南京汉德森科技股份有限公司 | Heat conducting structure of LED light source |
| CN204272571U (en) * | 2014-11-26 | 2015-04-15 | 乐健科技（珠海）有限公司 | There is printed circuit board (PCB) and the LED light source module of micro-radiator |
| CN208090482U (en) * | 2018-05-07 | 2018-11-13 | 力普士科技（珠海）有限公司 | UV-LED curing light source systems |
| CN209415071U (en) * | 2019-03-01 | 2019-09-20 | 力普士科技（珠海）有限公司 | Integral type UV-LED light source module group |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8723146B2 (en) | Micro-channel-cooled high heat load light emitting device | |
| CN208090482U (en) | UV-LED curing light source systems | |
| CN209415071U (en) | Integral type UV-LED light source module group | |
| CN101472449A (en) | Combined structure and method of radiator and circuit | |
| CN203339226U (en) | Heat radiation structure of micro projector | |
| CN107845722A (en) | A kind of LED car lamp heat conduction encapsulating structure, LED car lamp and manufacture method | |
| CN207587758U (en) | Secondary condensation UV-LED curing light source systems | |
| CN111370991A (en) | Semiconductor laser, stacked array and horizontal array of insulating type heat sink | |
| CN101202270A (en) | LED module set and method of manufacture | |
| CN209418557U (en) | Circuit board and ultraviolet LED curing light source | |
| CN203192859U (en) | Heat-dissipating lead frame structure | |
| CN109695826A (en) | Integral type UV-LED light source module group and preparation method thereof | |
| CN102011967A (en) | LED light bar module | |
| CN201448619U (en) | Liquid heat radiation LED lamp | |
| CN208967486U (en) | For the cured LED light source system of UV | |
| CN201448618U (en) | Dispersed liquid heat emission LED lamp | |
| CN204986521U (en) | Light -emitting diode device | |
| CN101135431A (en) | LED lamp based on COA technology | |
| CN207602619U (en) | A kind of LED car lamp heat conduction encapsulating structure, LED car lamp | |
| CN117894773A (en) | Water-cooling and oil-cooling spraying composite heat dissipation power module device | |
| CN116544205A (en) | Integrated power semiconductor module | |
| CN202721196U (en) | LED directly-conducting heat radiator | |
| CN207899721U (en) | Light-focusing type UV-LED curing light source systems | |
| CN201412786Y (en) | LED mounting structure of large power LED illumination lamp | |
| CN208197825U (en) | UV-LED curing light source system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |