CN109060495B - Device capable of adjusting thermal resistance - Google Patents
Device capable of adjusting thermal resistance Download PDFInfo
- Publication number
- CN109060495B CN109060495B CN201811054785.5A CN201811054785A CN109060495B CN 109060495 B CN109060495 B CN 109060495B CN 201811054785 A CN201811054785 A CN 201811054785A CN 109060495 B CN109060495 B CN 109060495B
- Authority
- CN
- China
- Prior art keywords
- thermal resistance
- metal conduit
- heat
- outer layer
- funnel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000003507 refrigerant Substances 0.000 claims abstract description 24
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 18
- 239000010959 steel Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 18
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 abstract description 8
- 238000000053 physical method Methods 0.000 abstract 1
- 230000001276 controlling effect Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/42—Low-temperature sample treatment, e.g. cryofixation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention discloses a device capable of adjusting thermal resistance, which comprises a heat-insulating outer layer, a refrigerant container, a thermal resistance adjusting device and a test sample block, wherein the thermal resistance adjusting device comprises a metal conduit, two steel balls and two plugging devices, the steel balls are placed in the metal conduit through a funnel, the two plugging devices are respectively arranged at the joint of the metal conduit, the funnel and a collecting device, the collecting device is connected with the metal conduit, and the refrigerant container is connected with external refrigerants through a liquid column valve. The device can realize the adjustment of thermal resistance by a physical method in a temperature control occasion, and can control heat conduction in a high-efficiency and convenient way.
Description
Technical Field
The invention belongs to the technical field of temperature control devices, and particularly relates to a device capable of adjusting thermal resistance.
Background
The existing temperature control technology mainly comprises two kinds, namely, fixing devices such as a thermal resistance wire in a thermal manager, and controlling the temperature only through an electric heating principle. And secondly, the working temperature is kept in a required range by placing a radiator to adjust the boundary conditions of heat dissipation management. The temperature control range of the two devices is limited, meanwhile, the volume of the device can be increased along with the increase of the temperature range, the excessive volume can have larger influence on additional products, and the convenience of the temperature control device installation under some irregular conditions is questionable. The above-mentioned problems can be solved by adjusting the thermal resistance, which is known in both position and overall volume and does not change, in a manner similar to an adjustable resistor, i.e. a thermally device varistor corresponding to a dynamically adjustable resistor is essential in the thermal circuit. In a large number of applications of electronic circuits, an adjustable resistor (potentiometer) capable of dynamically changing an electrical load and meeting the circuit requirement by adjusting the resistance value plays a vital role, and a common adjustable resistor mainly changes the resistance value by changing the length of a resistor connected into the circuit, and can also adjust the resistance value by temperature, illumination intensity, pressure and the like. However, studies on adjustable thermal resistance are rarely done at present. Therefore, the research on the technical means for adjusting the thermal resistance is necessary, and the thermal resistance can be adjusted by the number of the thermal resistance connected with the thermal bridge of different types so as to meet the requirement of heat conduction and temperature control.
Disclosure of Invention
The present invention is directed to solving the above problems and providing a device capable of adjusting thermal resistance by changing the number of thermal bridges connected to different types of thermal resistance to meet the heat conduction requirement.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a device of adjustable thermal resistance, includes heat preservation skin, refrigerant container, thermal resistance adjusting device and collection device, the refrigerant container sets up in heat preservation skin and links to each other with external refrigerant through the liquid column valve, thermal resistance adjusting device includes metal pipe, fills a plurality of heat conductor balls in the metal pipe and sets up the blocking device at metal pipe both ends, metal pipe contacts with refrigerant container bottom, collection device sets up in metal pipe's exit.
Preferably, a funnel is arranged at one end of the metal conduit, the heat conductor ball is placed into the metal conduit through the funnel, and the blocking device is arranged between the connection part of the metal conduit and the funnel and the connection part of the metal conduit and the collecting device.
Preferably, the diameters of the heat conductor balls are not exactly the same.
Preferably, the heat conductor balls are steel balls or glass balls.
Preferably, the metal conduit is penetrated through the heat-insulating outer layer, two ends of the metal conduit are positioned outside the heat-insulating outer layer, and the collecting device is also positioned outside the heat-insulating outer layer.
Preferably, a vacuum gauge and an atmosphere conduit are further arranged on the side wall of the heat-insulating outer layer.
The beneficial effects of the invention are as follows: the device capable of adjusting the thermal resistance is suitable for temperature control occasions, breaks through numerical limitation and operation inconvenience of controlling heat transfer by controlling boundary conditions in the conventional temperature control device, and adjusts the thermal resistance by physical sliding action to control heat transfer, thereby realizing temperature control. The device has simple structure, is easy for mass production and manufacture, has strong practicability and is worth popularizing in the industry.
Drawings
FIG. 1 is a schematic diagram of a device for adjusting thermal resistance according to the present invention;
FIG. 2 is a schematic diagram of the equivalent thermal resistance of the device of the present invention with adjustable thermal resistance.
Reference numerals illustrate: 1. a liquid column valve; 2. a refrigerant container; 3. a funnel; 4. a metal conduit; 5. a heat conductor ball; 6. a blocking device; 7. testing a sample block; 8. a collecting device; 9. a vacuum gauge; 10. an outer heat preservation layer; 11. an atmosphere duct.
Detailed Description
The present invention will be further described with reference to the drawings and the specific embodiments thereof in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be noted that directional terms, such as "upper", "lower", "front", "rear", "left", "right", etc., mentioned in the following embodiments are merely directions with reference to the drawings, and thus, the directional terms are used for illustrating but not limiting the present invention.
As shown in fig. 1, the device for adjusting thermal resistance of the present invention comprises an insulating outer layer 10, a refrigerant container 2, a thermal resistance adjusting device and a collecting device 8. The refrigerant container 2 is arranged in the heat-insulating outer layer 10, and the upper part of the refrigerant container is connected with the top of the heat-insulating outer layer 10. The refrigerant container 2 is connected with the external refrigerant through the liquid column valve 1.
The thermal resistance adjusting device comprises a metal conduit 4, a plurality of heat conductor balls 5 filled in the metal conduit, and blocking devices 6 arranged at two ends of the metal conduit. The metal conduit 4 is in contact with the bottom of the refrigerant container 2, and the test sample block 7 is in contact with the bottom of the metal conduit 4. The upper end of the metal conduit 4 is provided with a funnel, and the heat conductor ball 5 is placed into the metal conduit 4 through the funnel 3. The two plugging devices 6 are respectively arranged at the junction of the metal conduit 4 and the funnel 3 and between the junction of the metal conduit 4 and the collecting device 8. The collecting device 8 is arranged at the outlet end of the lower part of the metal conduit 4. The thermal resistance adjusting device may be disposed inside the heat insulation outer layer 10, as shown in fig. 1, or may be a metal conduit 4 penetrating through the heat insulation outer layer 10, with its two ends located outside the heat insulation outer layer 10, and the collecting device 8 also disposed outside the heat insulation outer layer 10. The funnel end and the collecting device are arranged on the heat-insulating outer layer, so that the heat-conducting spheres can be conveniently placed in and recovered.
The heat conductor balls 5 are spheres made of heat conductor material, and are mainly used as thermal bridges for heat transfer. The heat conductor ball can be a steel ball or other heat conductors with different heat conductivity coefficients, such as glass balls. The diameters of the heat conductor balls 5 are not identical, and the specific number, the diameter range distribution and the arrangement mode of the heat conductor balls can be reasonably set according to actual requirements. In this embodiment, the heat conductor balls 5 are steel balls.
Further, the thermal resistance adjustment means may operate under vacuum or different atmospheric conditions. Specifically, a vacuum gauge 9 and two atmosphere ducts 11 are provided on the side wall of the heat insulating outer layer 10. The two atmosphere conduits are respectively positioned at the upper part and the lower part of the left side and the right side of the heat-preserving outer layer 10, and the vacuum gauge 9 is positioned at the upper part of the right side of the heat-preserving outer layer 10. The vacuum condition is realized by a vacuum gauge 9, and different atmosphere conditions can be introduced by atmosphere conduits 11 arranged at two sides of the heat-preserving outer layer 10 with different nitrogen, air and other inert gases.
The following detailed description of the operation and principles of the present invention further demonstrate the advantages of the present invention:
in this embodiment, as shown in fig. 1, an external refrigerant is added into the refrigerant container 2 through the liquid column valve 1, and the temperature of the test sample block 7 needs to be controlled by the thermal resistance adjusting device in the process of cooling. A certain number of steel balls are placed into the metal guide pipe 4 from the funnel 3, the two-side blocking devices 6 are started to seal the metal guide pipe 4, and at the moment, the steel balls in the metal guide pipe 4 can generate a thermal bridge between the refrigerant container 2 and the test sample block 7. When the steel balls are not placed, the refrigerant and the test sample block transfer energy through heat radiation, and when a certain number of steel balls are placed, a plurality of heat bridges are formed between the refrigerant container 2 and the test sample block 7 to transfer energy through heat conduction. After the number, the size and the arrangement mode of the steel balls are changed, the overall heat conductivity coefficient of the metal conduit 4 is changed, the number and the distribution of the heat bridges are also changed, and then the transferred energy is changed, and the change is used for controlling the cooling effect of the refrigerant on the test sample block 7. The collecting device 8 is used for the thermal resistance adjusting device to recycle the steel balls in the process of adjusting the thermal resistance.
As shown in fig. 2, the principle of adjusting the thermal resistance of the steel ball can be approximately regarded as series-parallel resistors in an electronic circuit according to the similarity of heat conduction and electric conduction. Each steel ball corresponds to a thermal resistance with one resistance value, the contact between the steel balls corresponds to a connection mode between the thermal resistances, and after the number, the size and the arrangement mode of the steel balls are regulated, the number, the resistance value and the series-parallel connection mode of the resistors can be changed correspondingly. According to the calculation formula (1) of the total thermal resistance of the series-parallel thermal resistance, the change condition of the total thermal resistance value in the metal conduit 4 after the number, the size, the arrangement mode and the materials of the steel balls are changed can be obtained. Furthermore, the thermal resistance adjusting device can be approximately regarded as a sliding thermal resistor of the same ratio sliding resistor, and the sliding thermal resistor can realize the adjustment function of the thermal resistance, because the steel ball can be adjusted through the physical sliding function, and the thermal resistance is further adjusted.
（1）
Wherein R is 1 、R 2 、R 3 … … are each thermal resistance, R Total (S) Is the total thermal resistance of series-parallel thermal resistance.
The device capable of adjusting the thermal resistance is characterized by being capable of adjusting the thermal resistance by a physical sliding method under various temperature control occasions so as to achieve the purpose of controlling the temperature. The invention breaks through the numerical limitation and the operation inconvenience of the prior temperature control device for controlling the heat transfer by controlling the boundary conditions, and controls the heat transfer by controlling the heat resistance.
Those of ordinary skill in the art will recognize that the embodiments described herein are for the purpose of aiding the reader in understanding the principles of the present invention and should be understood that the scope of the invention is not limited to such specific statements and embodiments. Those of ordinary skill in the art can make various other specific modifications and combinations from the teachings of the present disclosure without departing from the spirit thereof, and such modifications and combinations remain within the scope of the present disclosure.
Claims (4)
1. An adjustable thermal resistance device, characterized by: comprises an outer heat-insulating layer (10), a refrigerant container (2), a thermal resistance adjusting device and a collecting device (8), wherein the refrigerant container (2) is arranged in the outer heat-insulating layer (10) and is connected with external refrigerants through a liquid column valve (1), the thermal resistance adjusting device comprises a metal conduit (4), a plurality of heat conductor balls (5) filled in the metal conduit and blocking devices (6) arranged at two ends of the metal conduit, the metal conduit (4) is in contact with the bottom of the refrigerant container (2), and the collecting device (8) is arranged at the outlet end of the metal conduit (4); one end of the metal conduit (4) is provided with a funnel, the heat conductor ball (5) is put into the metal conduit (4) through the funnel (3), and the blocking device (6) is arranged between the joint of the metal conduit (4) and the funnel (3) and the joint of the metal conduit (4) and the collecting device (8); the diameters of the heat conductor balls (5) are not identical.
2. The adjustable thermal resistance apparatus of claim 1, wherein: the heat conductor ball (5) is a steel ball or a glass ball.
3. The adjustable thermal resistance apparatus of any one of claims 1-2, wherein: the metal conduit (4) is penetrated with the heat-insulating outer layer (10), two ends of the metal conduit are positioned at the outer side of the heat-insulating outer layer (10), and the collecting device (8) is also positioned at the outer side of the heat-insulating outer layer (10).
4. The adjustable thermal resistance apparatus of any one of claims 1-2, wherein: the side wall of the heat preservation outer layer (10) is also provided with a vacuum gauge (9) and an atmosphere conduit (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811054785.5A CN109060495B (en) | 2018-09-11 | 2018-09-11 | Device capable of adjusting thermal resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811054785.5A CN109060495B (en) | 2018-09-11 | 2018-09-11 | Device capable of adjusting thermal resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109060495A CN109060495A (en) | 2018-12-21 |
| CN109060495B true CN109060495B (en) | 2024-03-15 |
Family
ID=64761207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811054785.5A Active CN109060495B (en) | 2018-09-11 | 2018-09-11 | Device capable of adjusting thermal resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109060495B (en) |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6901052A (en) * | 1968-01-24 | 1969-07-28 | Raytheon Co | Heat transfer structure |
| CA1042418A (en) * | 1968-01-24 | 1978-11-14 | Raytheon Company | Heat transfer structure |
| GB2003596A (en) * | 1977-08-31 | 1979-03-14 | Dornier System Gmbh | Controllable heat pipe |
| US4649990A (en) * | 1985-05-06 | 1987-03-17 | Hitachi, Ltd. | Heat-conducting cooling module |
| US4890667A (en) * | 1988-10-17 | 1990-01-02 | Battelle Memorial Institute | Method and apparatus for improving heat transfer in a fluidized bed |
| US5438838A (en) * | 1992-09-08 | 1995-08-08 | Leica Ag | Chamber for freeze-drying by cryosorption |
| WO2003065014A1 (en) * | 2002-01-30 | 2003-08-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Sample support for the cryoconservation of biological samples |
| JP2005321152A (en) * | 2004-05-10 | 2005-11-17 | Matsushita Electric Ind Co Ltd | Heat transfer device and cooling device using the same |
| CN1980560A (en) * | 2005-11-29 | 2007-06-13 | 讯凯国际股份有限公司 | Water-cooling type radiating structure and mfg. method |
| CN101968240A (en) * | 2010-11-16 | 2011-02-09 | 上海海事大学 | Device and method for movably supplying heat by using phase-change heat-storage balls |
| AT509608A4 (en) * | 2010-12-23 | 2011-10-15 | Leica Mikrosysteme Gmbh | DEVICE AND METHOD FOR COOLING SAMPLES DURING ONE ION BEAM PREPARATION |
| WO2012175627A2 (en) * | 2011-06-22 | 2012-12-27 | Commissariat à l'énergie atomique et aux énergies alternatives | Thermal management system with variable-volume material |
| JP2013004708A (en) * | 2011-06-16 | 2013-01-07 | Sgk Kk | Heat radiation structure and heat radiation material |
| CN102997635A (en) * | 2012-12-20 | 2013-03-27 | 四川省机械研究设计院 | Boiling drawer tray drier |
| DE102013226518A1 (en) * | 2013-10-15 | 2015-04-16 | Hyundai Motor Company | SYSTEM FOR CONTROLLING THE HEAT CONDUCTIVITY OF A HOUSING OF ELECTRONIC PARTS |
| CN106158790A (en) * | 2015-04-10 | 2016-11-23 | 台达电子工业股份有限公司 | Power model and thermal interface structure thereof |
| CN206196216U (en) * | 2016-09-07 | 2017-05-24 | 大唐移动通信设备有限公司 | Heat radiator for compound thermal pad piece and communication equipment |
| WO2018015350A1 (en) * | 2016-07-20 | 2018-01-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Refrigerated container and method for transporting cryosamples |
| CN108121379A (en) * | 2017-11-21 | 2018-06-05 | 中国科学院理化技术研究所 | Temperature control device and temperature control method |
| JP2018100822A (en) * | 2016-12-19 | 2018-06-28 | 株式会社デンソー | Heat conduction device |
| CN208937401U (en) * | 2018-09-11 | 2019-06-04 | 四川省机械研究设计院 | The device of adjustable thermal resistance |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4695851B2 (en) * | 2003-07-10 | 2011-06-08 | シチズンホールディングス株式会社 | Micro chemical chip temperature controller |
| US20080038871A1 (en) * | 2006-08-10 | 2008-02-14 | George Liang-Tai Chiu | Multipath soldered thermal interface between a chip and its heat sink |
| CN102844104A (en) * | 2010-01-12 | 2012-12-26 | 西尔万资源公司 | Heat transfer interface |
| KR101044351B1 (en) * | 2010-05-26 | 2011-06-29 | 김선기 | Heat cooler |
| US9696068B2 (en) * | 2012-09-19 | 2017-07-04 | Nec Corporation | Cooling apparatus, heat receiving section and boiling section used therein, and method of manufacturing the same |
-
2018
- 2018-09-11 CN CN201811054785.5A patent/CN109060495B/en active Active
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6901052A (en) * | 1968-01-24 | 1969-07-28 | Raytheon Co | Heat transfer structure |
| CA1042418A (en) * | 1968-01-24 | 1978-11-14 | Raytheon Company | Heat transfer structure |
| GB2003596A (en) * | 1977-08-31 | 1979-03-14 | Dornier System Gmbh | Controllable heat pipe |
| US4649990A (en) * | 1985-05-06 | 1987-03-17 | Hitachi, Ltd. | Heat-conducting cooling module |
| US4890667A (en) * | 1988-10-17 | 1990-01-02 | Battelle Memorial Institute | Method and apparatus for improving heat transfer in a fluidized bed |
| US5438838A (en) * | 1992-09-08 | 1995-08-08 | Leica Ag | Chamber for freeze-drying by cryosorption |
| WO2003065014A1 (en) * | 2002-01-30 | 2003-08-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Sample support for the cryoconservation of biological samples |
| JP2005321152A (en) * | 2004-05-10 | 2005-11-17 | Matsushita Electric Ind Co Ltd | Heat transfer device and cooling device using the same |
| CN1980560A (en) * | 2005-11-29 | 2007-06-13 | 讯凯国际股份有限公司 | Water-cooling type radiating structure and mfg. method |
| CN101968240A (en) * | 2010-11-16 | 2011-02-09 | 上海海事大学 | Device and method for movably supplying heat by using phase-change heat-storage balls |
| AT509608A4 (en) * | 2010-12-23 | 2011-10-15 | Leica Mikrosysteme Gmbh | DEVICE AND METHOD FOR COOLING SAMPLES DURING ONE ION BEAM PREPARATION |
| JP2013004708A (en) * | 2011-06-16 | 2013-01-07 | Sgk Kk | Heat radiation structure and heat radiation material |
| WO2012175627A2 (en) * | 2011-06-22 | 2012-12-27 | Commissariat à l'énergie atomique et aux énergies alternatives | Thermal management system with variable-volume material |
| CN102997635A (en) * | 2012-12-20 | 2013-03-27 | 四川省机械研究设计院 | Boiling drawer tray drier |
| DE102013226518A1 (en) * | 2013-10-15 | 2015-04-16 | Hyundai Motor Company | SYSTEM FOR CONTROLLING THE HEAT CONDUCTIVITY OF A HOUSING OF ELECTRONIC PARTS |
| CN106158790A (en) * | 2015-04-10 | 2016-11-23 | 台达电子工业股份有限公司 | Power model and thermal interface structure thereof |
| WO2018015350A1 (en) * | 2016-07-20 | 2018-01-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Refrigerated container and method for transporting cryosamples |
| CN206196216U (en) * | 2016-09-07 | 2017-05-24 | 大唐移动通信设备有限公司 | Heat radiator for compound thermal pad piece and communication equipment |
| JP2018100822A (en) * | 2016-12-19 | 2018-06-28 | 株式会社デンソー | Heat conduction device |
| CN108121379A (en) * | 2017-11-21 | 2018-06-05 | 中国科学院理化技术研究所 | Temperature control device and temperature control method |
| CN208937401U (en) * | 2018-09-11 | 2019-06-04 | 四川省机械研究设计院 | The device of adjustable thermal resistance |
Non-Patent Citations (2)
| Title |
|---|
| Thermal study of enhanced plastic ball grid array package with flat heat spreader;Huang, TP，et al;《JOURNAL OF REINFORCED PLASTICS AND COMPOSITES》;第26卷(第2期);155-167 * |
| 基于颗粒尺度的离散颗粒传热模型;卜昌盛, 陈晓平, 刘道银, 等;《化工学报》;第63卷(第3期);698-704 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109060495A (en) | 2018-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207086588U (en) | Cooling device after a kind of copper cash extruding | |
| CN103677011B (en) | One is applicable to extend blackbody wide temperature range control system under vacuum condition | |
| CN107171087A (en) | A kind of electric power parallel groove clamp | |
| CN109060495B (en) | Device capable of adjusting thermal resistance | |
| WO2014187053A1 (en) | Power transmission line for preventing snow and ice disaster | |
| CN206096968U (en) | Temperature control device for detecting semiconductor device | |
| CN213071916U (en) | Mill uses intelligent control by temperature change switch board | |
| CN103500733B (en) | A kind of insulation heat pipe radiator of explosive-proof structure | |
| CN208937401U (en) | The device of adjustable thermal resistance | |
| CN105522987B (en) | A kind of intelligent vehicle-carried power distribution protective device and its method | |
| CN204989135U (en) | Dual -purpose sample frame of high low temperature of heat radiation formula | |
| CN208695974U (en) | A kind of copper free wire wire drawing machine cooled down step by step | |
| CN107602915A (en) | A kind of composite heat-conducting silicone grease | |
| CN204289538U (en) | A kind of water-cooled high power semi-conductor refrigeration low-temperature cold bench | |
| CN103500734B (en) | A kind of liquid cold insulation formula radiator | |
| CN214668157U (en) | High-low temperature test bed suitable for deformation test of phase change energy storage device | |
| CN207365679U (en) | A kind of lithium battery Quick drying box | |
| CN105202612A (en) | Semiconductor heating device | |
| CN205644427U (en) | Support for notebook based on pa er pastes effect | |
| CN206061179U (en) | A kind of electrically heated rod of mould inside heating | |
| CN206531742U (en) | A kind of device of the micro- water densities of on-line monitoring SF6 | |
| CN106644826A (en) | Device for monitoring micro-water density of SF6 on line | |
| CN203934241U (en) | A kind of Microwave Power Tubes heat abstractor | |
| CN213662259U (en) | Dehumidifying temperature control device for gas | |
| CN112594964A (en) | Flat-plate sleeve type nitrogen cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 610000, No. three, 30 South Renmin Road, Chengdu, Sichuan, Wuhou District Applicant after: Sichuan Machinery Research and Design Institute (Group) Co.,Ltd. Address before: 610044, No. three, 30 South Renmin Road, Chengdu, Sichuan, Wuhou District Applicant before: SICHUAN PROVINCIAL MACHINERY RESEARCH & DESIGN INSTITUTE |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |