CN109040621A - A kind of infrared mould group with reinforcement heat sinking function - Google Patents
A kind of infrared mould group with reinforcement heat sinking function Download PDFInfo
- Publication number
- CN109040621A CN109040621A CN201811096853.4A CN201811096853A CN109040621A CN 109040621 A CN109040621 A CN 109040621A CN 201811096853 A CN201811096853 A CN 201811096853A CN 109040621 A CN109040621 A CN 109040621A
- Authority
- CN
- China
- Prior art keywords
- mould group
- infrared
- infrared mould
- circuit board
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002787 reinforcement Effects 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 17
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000005011 phenolic resin Substances 0.000 claims abstract description 4
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000005387 chalcogenide glass Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The infrared mould group with reinforcement heat sinking function that the invention discloses a kind of.The infrared mould group includes from rear to the preceding sheet metal being sequentially coaxially arranged, circuit board, reinforcement heat sink, infrared acquisition component and lens assembly；The material of the reinforcement heat sink is phenolic resin or ceramics.The material that the present invention passes through selection heat dissipation stiffening plate, infrared mould group is radiated by the circumferential direction or bottom surface for the stiffening plate that radiates, solves the heat dissipation problem of the infrared mould group having a size of 10cm rank, and since ceramics are larger in the thermal coefficient of vertical direction, complexed metal piece, the heat that infrared mould group generates can be directed at extraneous structural member by bottom, thus auxiliary heat dissipation.
Description
Technical field
The invention belongs to infrared detection fields, more particularly, to a kind of infrared mould group with reinforcement heat sinking function.
Background technique
Traditional infrared product, typical such as infrared machine core, since the volume of machine core is larger, and the structural member of machine core is exhausted
Major part is the excellent aluminum alloy material of heat dissipation, can effectively meet machine by the outer surface of fuselage and the ontology material of machine core
The cooling requirements of core.Existing infrared mould group also generallys use aluminium alloy production, is mainly radiated, is being needed using its shell
It in the case where being transferred, can transfer the socket of a plastic substrate in enclosure, the metal pins in the socket can also be with
By a part of heat derives.
Infrared mould group is made using nonmetallic and semiconductor material, the volume of infrared mould group can be reduced, reduce its energy consumption,
To be applied in product or the industry of demand infrared imaging or thermometric but narrow space, if smart home is (such as intelligence
Air-conditioning), safety monitoring, the infrared functional accessory of mobile phone, tablet computer etc..Minimum can be extremely in the volume theory of Minitype infrared mould group
8.5cm×8.5cm×9cm.However, being dissipated in traditional machine core structure by shell and ontology material in the case where material variation
The mode of heat is less applicable in.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides a kind of infrared mould group, its object is to
By the improvement to material, reinforcement heat sinking function is achieved the effect that, the technology for thus solving the heat dissipation of Minitype infrared mould group is asked
Topic.
To achieve the above object, according to one aspect of the present invention, provide a kind of infrared mould group, including from it is rear to preceding according to
Sheet metal, circuit board, reinforcement heat sink, infrared acquisition component and the lens assembly of secondary coaxial arrangement；The reinforcement heat sink
Material is phenolic resin or ceramics.
Preferably, the material of the sheet metal is steel, molybdenum copper or aluminium alloy.
Preferably, the reinforcement heat sink with a thickness of 0.1cm~0.3cm.
Preferably, the circuit board is flexible circuit board.
Preferably, the lens assembly includes lens barrel, and the lens barrel is provided with light in one end far from infrared acquisition component
System.
As it is further preferred that the optical system is made of Gasir chalcogenide glass.
As it is further preferred that being provided with shutter assembly in the front end of the optical system.
As it is further preferred that the shutter assembly includes metal shell, the metal shell is set to described red
The circumferential direction of external mold group, the upper end are connected with the shutter assembly, radiate for auxiliary shuttern component.
As it is further preferred that the material of the lens barrel is polycarbonate.
As it is further preferred that the lens assembly further includes being set between the lens barrel and infrared acquisition component
Microscope base, the lens barrel are sheathed in the microscope base.
As it is further preferred that the microscope base is used to adjust the phase between the lens barrel and the infrared acquisition component
It adjusts the distance.
Preferably, the front end of the lens assembly is provided with temperature sensor.
Preferably, the infrared acquisition component includes detector protective cradle, detector and protecting window, the protection window
Mouth coaxial arrangement is in the front end of detector, and the detector protective cradle is for fixing the detector and the protecting window.
As it is further preferred that the thermal coefficient of the material of the detector protective cradle is higher than 200W/ (mK).
As it is further preferred that the material of the detector protective cradle is aluminium alloy or copper.
Preferably, it is connected between the circuit board and the heat dissipation stiffening plate with anisotropic conductive film.
Preferably, the size of the infrared mould group is less than 15cm.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, have it is following beneficial to effect
Fruit:
1, the present invention is radiated using the reinforcement heat sink that sheet metal and ceramic substrate form, and infrared mould group is led to
The circumferential direction or bottom surface heat dissipation for crossing reinforcement heat sink, solve heat dissipation problem of the size less than the infrared mould group of 10cm rank；
2, the material of heat dissipation stiffening plate is preferably ceramics, and since ceramics are larger in the thermal coefficient of vertical direction, energy will be red
The heat that external mold group generates is directed at extraneous structural member by bottom, thus auxiliary heat dissipation；
3, the circuit board of the infrared mould group is preferably flexible circuit board, and the bottom of the flexible circuit board is provided with metal
Piece can guarantee that the bottom surface of the infrared mould group is combined closely with extraneous structural member, and further auxiliary radiates；
4, it is connected between the circuit board and the heat dissipation stiffening plate with anisotropic conductive film, it can only with current limit
By the direction flowing perpendicular to anisotropic conductive film, radiating efficiency is improved while conducting electric current.
Detailed description of the invention
Fig. 1 is the infrared mould group Longitudinal cross section schematic of the embodiment of the present invention；
Fig. 2 is the infrared mould group heat dissipation path schematic diagram of the embodiment of the present invention；
Fig. 3 is that the infrared mould group of the embodiment of the present invention is installed on bottom metal frame top view；
Fig. 4 is that the infrared mould group of the embodiment of the present invention is installed on bottom metal frame side view；
In all the appended drawings, identical appended drawing reference is used to denote the same element or structure, in which: 1- shutter assembly；
The fast doorway 1a-；3a- optical system；3b- lens barrel；3c- microscope base；3- lens assembly；5a- protecting window；5b- detector；5c- is visited
Survey device protective cradle；5- infrared acquisition component；7- ceramic substrate；8- anisotropic conductive film (Anisotropic
Conductive Film,ACF)；9- flexible circuit board (FPC)；9a- electric interfaces；The infrared mould group of 10-；The external world 11- structural member.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
As shown in Figure 1, the present invention provides a kind of infrared mould group 10, include from bottom surface to top surface be sequentially coaxially arranged it is soft
Property circuit board 9, anisotropic conductive film 8, radiate stiffening plate 7, infrared acquisition component 5 and lens assembly 3；In the lens assembly
Front end be provided with the shutter assembly 1.The lens assembly 3 is made of optical system 3a, lens barrel 3b and microscope base 3c, optical system
Become a component after fixing between system 3a and lens barrel 3b by dispensing and is sheathed in lens barrel 3b, the lens barrel 3b and microscope base 3c
Between be provided with voice coil motor, for adjusting the relative position of lens barrel 3b Yu microscope base 3c in the axial direction；Wherein, the material of lens barrel 3b
For polycarbonate (PC), the material of the microscope base 3b is liquid crystal polyester (LCP), and the material of optical system 3a is Gasir sulphur system glass
Glass.Relevant reading circuit is distributed on ceramic substrate 7, is connected to respectively with infrared acquisition component 5b and flexible circuit board 9.It is described
Electric interfaces and shutter interface are provided on flexible circuit board 9, as external electric interfaces.
Infrared acquisition component 5 includes protecting window 5a, detector 5b and detector protective cradle 5c, when installation, protects glass
Glass 5a is bonded in the encapsulation upper surface of detector 5b, and the lower surface of detector 5b is by picking up the positioning on heat dissipation stiffening plate 7
Mark point post package is on heat dissipation stiffening plate 7, and detector protective cradle 6 is equally by picking up the positioning being arranged on ceramic substrate 7
On heat dissipation stiffening plate 7, detector protective cradle 6 also can protect Mark point post package simultaneously as the installation pedestal of microscope base 4
Detector.It is connected through a screw thread and is assembled on microscope base.Shutter assembly 1 is then fixed on heat dissipation stiffening plate 7 by dispensing.Heat dissipation is mended
It is attached between strong plate 7 and flexible circuit board 9 by anisotropic conductive film 8, the characteristic of anisotropic conductive film 8 is can
Can only be circulated between reinforcement heat sink 7 and flexible circuit board 9 by vertical axis Z-direction with current limit, can solve it is some with
The microscopic wire connectivity problem that can not be handled toward connector.
The material of the reinforcement heat sink 7 is PCB circuit board or ceramic substrate, wherein PCB circuit board generallys use paper base
Circuit board (paper base fiber infiltrates phenolic resin or obtains), therefore, the similar substrate of constituent also has effect same.Due to ceramics
Heat dissipation performance is better than PCB circuit board, in the present embodiment using ceramic substrate.From figure 2 it can be seen that the present embodiment is red
The path that external mold group 10 radiates has I, II, III 3.It, can be in infrared mould group 10 when the material of reinforcement heat sink 7 is ceramics
Most bottom surface setting sheet metal is for radiating, so that the bottom surface of reinforcement heat sink is radiating surface, thus main heat sink path
It is I, i.e., first conducts from infrared acquisition component 5b to ceramic substrate 7, then is transmitted to from ceramic substrate 7, anisotropic conductive film 8 soft
On property circuit board 9, then exported to extraneous heat dispersion heat sink by the sheet metal of 9 lower surface of flexible circuit board.And if reinforcement heat sink
Material be other materials (such as metal), since it is essentially identical in thermal coefficient vertically and horizontally, in addition to path I
Outside, it can also first can also be conducted from infrared acquisition component 5b to reinforcement heat sink 7, then dissipated from reinforcement by II, III heat dissipation
The circumferential surface radiating of hot plate 7, or the shell conducted upwards to shutter assembly 1 from reinforcement heat sink 7 radiate.Sheet metal
Material steel, molybdenum copper or aluminium alloy can be used, wherein molybdenum copper can guarantee best heat dissipation performance in the case where same cost.
Obvious I path of path is most short from path, and path is shorter, then the thermal resistance of structural member is smaller, is more conducive to radiate.
Secondly from the point of view of installing and using, the outer surface of the shell of the circumferential surface of reinforcement heat sink 7 and shutter assembly 1 is being installed
In the process due to the scale error of part, can not well it be contacted with surrounding in assembly, thus reach heat dissipation effect,
And the lower surface of infrared mould group 10 in use will tightly be attached on the extraneous structural member 11 of its bottom surface (such as machine
Metal framework), if Fig. 3 is that the infrared mould group 10 of the embodiment of the present invention is installed on bottom metal frame top view, it is seen that be partially this
The infrared mould group 10 of inventive embodiments；It is left if Fig. 4 is that the infrared mould group 10 of the embodiment of the present invention is installed on bottom metal frame side view
The netted hatching line part in side is extraneous structural member 11.Therefore, the material of reinforcement heat sink 7 is preferably ceramics.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (9)
1. a kind of infrared mould group with reinforcement heat sinking function, which is characterized in that including from rear to the preceding gold being sequentially coaxially arranged
Belong to piece, circuit board, reinforcement heat sink, infrared acquisition component and lens assembly；The material of the reinforcement heat sink is phenolic resin
Or ceramics.
2. infrared mould group as described in claim 1, which is characterized in that the material of the sheet metal is steel, molybdenum copper or aluminium alloy.
3. infrared mould group as described in claim 1, which is characterized in that the circuit board is flexible circuit board.
4. infrared mould group as described in claim 1, which is characterized in that the lens assembly includes lens barrel, and the lens barrel is remote
One end from infrared acquisition component is provided with optical system.
5. infrared mould group as claimed in claim 4, which is characterized in that the lens assembly further include be set to the lens barrel with
Microscope base between infrared acquisition component, the lens barrel are sheathed in the microscope base.
6. infrared mould group as claimed in claim 4, which is characterized in that the front end of the optical system is provided with shutter group
Part.
7. infrared mould group as described in claim 1, which is characterized in that the front end of the lens assembly is provided with temperature sensing
Device.
8. infrared mould group as described in claim 1, which is characterized in that the infrared acquisition component includes detector protection branch
Frame, detector and protecting window, in the front end of detector, the detector protective cradle is used for for the protecting window coaxial arrangement
The fixed detector.
9. infrared mould group as described in claim 1, which is characterized in that with different between the circuit board and the heat dissipation stiffening plate
Property conductive adhesive film in side's is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811096853.4A CN109040621B (en) | 2018-09-20 | 2018-09-20 | Infrared module with reinforcement heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811096853.4A CN109040621B (en) | 2018-09-20 | 2018-09-20 | Infrared module with reinforcement heat dissipation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109040621A true CN109040621A (en) | 2018-12-18 |
| CN109040621B CN109040621B (en) | 2024-08-13 |
Family
ID=64616979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811096853.4A Active CN109040621B (en) | 2018-09-20 | 2018-09-20 | Infrared module with reinforcement heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109040621B (en) |
Cited By (3)
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| CN112505856A (en) * | 2020-12-23 | 2021-03-16 | 江苏奥雷光电有限公司 | High-speed mini photoelectric conversion module design and process method |
| CN112857248A (en) * | 2019-11-12 | 2021-05-28 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
| CN113447132A (en) * | 2020-03-27 | 2021-09-28 | 维沃移动通信有限公司 | Electronic device |
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