CN108550681B - A kind of LED chip COB encapsulating structure - Google Patents
A kind of LED chip COB encapsulating structure Download PDFInfo
- Publication number
- CN108550681B CN108550681B CN201810385680.1A CN201810385680A CN108550681B CN 108550681 B CN108550681 B CN 108550681B CN 201810385680 A CN201810385680 A CN 201810385680A CN 108550681 B CN108550681 B CN 108550681B
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- Prior art keywords
- conductive
- recess
- led chip
- nail
- groove
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- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 239000006071 cream Substances 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of LED chip COB encapsulating structures, the present invention realizes that the circuit pattern of insulating substrate lower surface is drawn using recess, groove and through-hole, the circuit pattern can be more advantageous to the lookup of failure LED chip, because it can detect multiple through-holes with flexible route；The use of conductive nail can reduce the use of conductive paste, and make electric conductivity more preferable to avoid the spilling of conductive paste；The reasonable selection of the size of the head of a nail can make the head of a nail when with different materials, so that whether the conductive paste in groove is flexibly directly electrically connected with post or carries out secondary connection by the conductive paste in recess.
Description
Technical field
The present invention relates to LED to encapsulate manufacturing field, and in particular to a kind of LED chip COB encapsulating structure.
Background technique
Existing LED encapsulation is mostly COB form, realizes that LED's is series-parallel using the circuit pattern on insulating substrate.
Such as attached drawing 1, multiple LED chips 2 are carried on insulating substrate 1, and LED chip 2 is inverted on the insulating substrate 1 via soldered ball 3
Circuit pattern (not shown), be finally sealed via potting resin 4, this kind encapsulation area source need in advance insulation base
Circuit pattern is formed on plate 1, circuit pattern can not adjust and change in series and parallel, there are also be exactly some LED core after encapsulating
After piece failure, it is difficult to find the LED chip of failure.
Summary of the invention
Based on solving the above problems, the present invention provides a kind of LED chip COB encapsulating structures comprising:
Insulating substrate, the insulating substrate have opposite first surface and second surface, set on the first surface
Multiple recesses are equipped with, further include multiple through-holes of the bottom surface and second surface through the recess inside the insulating substrate,
And it is with a thickness of d1；
Adhesive layer with a thickness of d2, is set on the first surface, and is had corresponding with the multiple recess more
A groove, the multiple groove are respectively connected with logical with the multiple recess；
Multiple LED chips are adhered on the adhesive layer, and have multiple electrodes pad, the multiple electrode pad point
The multiple groove is not corresponded to and is exposed in the multiple groove；
Potting resin is set on the multiple LED chip and adhesive layer；
Conductive paste fills full the multiple groove；
Multiple conductive nails, the multiple conductive nail include conductive post and the conductive head of a nail, and the multiple conductive nail is inserted
Enter in the multiple recess and multiple through-holes and its bottom end flushed with the second surface, and multiple conductive nails have length L,
Wherein L meets d1 < L < d1+d2, and post has length L1, wherein L1=d1, in addition, the size of the head of a nail be substantially equal to it is described recessed
The opening size of slot and recess；
Conductive pattern is set on second surface；
Multiple welding blocks are formed on second surface and are connected with the bottom end of the multiple conductive nail and conductive pattern
It connects.
According to an embodiment of the invention, the opening size of the recess is equal to the opening size of the groove, the through-hole
Opening size be less than the recess opening size.
According to an embodiment of the invention, the conductive pattern realizes the in series or in parallel of the multiple LED chip.
According to an embodiment of the invention, being filled with insulating materials in the multiple through-hole and multiple recesses.
According to an embodiment of the invention, the insulating materials is the polymer materials such as sealing resin, polyimides.
The present invention also provides another LED chip COB encapsulating structures comprising:
Insulating substrate, the insulating substrate have opposite first surface and second surface, set on the first surface
Multiple recesses are equipped with, further include multiple through-holes of the bottom surface and second surface through the recess inside the insulating substrate,
And it is with a thickness of d1；
Adhesive layer with a thickness of d2, is set on the first surface, and is had corresponding with the multiple recess more
A groove, the multiple groove are respectively connected with logical with the multiple recess；
Multiple LED chips are adhered on the adhesive layer, and have multiple electrodes pad, the multiple electrode pad point
The multiple groove is not corresponded to and is exposed in the multiple groove；
Potting resin is set on the multiple LED chip and adhesive layer；
Conductive paste fills full the multiple groove；
Multiple conductive nails, the multiple conductive nail include the head of a nail of conductive post and insulation, and the multiple conductive nail is inserted
Enter in the multiple recess and multiple through-holes and its bottom end flushed with the second surface, and multiple conductive nails have length L,
Wherein L meets d1 < L < d1+d2, and post has length L1, wherein L1=d1, in addition, the size of the head of a nail be less than the groove and
The opening size of recess but the opening size for being greater than the through-hole；
Conductive pattern is set on second surface；
Multiple welding blocks are formed on second surface and are connected with the bottom end of the multiple conductive nail and conductive pattern
It connects.
According to an embodiment of the invention, being filled with conductive paste in the recess.
According to an embodiment of the invention, the diameter of the multiple post is slightly less than the opening size of the through-hole, such as logical
Hole opening size is 1mm, and the diameter of post is 0.8mm.
Advantages of the present invention is as follows:
(1) present invention realizes that the circuit pattern of insulating substrate lower surface is drawn using recess, groove and through-hole, the circuit diagram
Case can be more advantageous to the lookup of failure LED chip, because it can detect multiple through-holes with flexible route；
(2) use of conductive nail can reduce the use of conductive paste, and make electric conductivity more to avoid the spilling of conductive paste
It is good；
(3) reasonable selection of the size of the head of a nail can make the head of a nail when with different materials, so that the conduction in groove
Whether cream is flexibly directly electrically connected with post or carries out secondary connection by the conductive paste in recess.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the LED chip COB encapsulating structure of the prior art；
Fig. 2 is the cross-sectional view of LED chip COB encapsulating structure of the invention.
Specific embodiment
First embodiment
Referring to fig. 2, LED chip COB encapsulating structure of the invention comprising:
Insulating substrate 11, the insulating substrate 11 has opposite first surface and second surface, in the first surface
On be provided with multiple recesses 17, further include inside the insulating substrate 11 through the recess 17 bottom surface and second surface
Multiple through-holes 15, and it is with a thickness of d1；
Adhesive layer 16 with a thickness of d2, is set on the first surface, and is had corresponding with the multiple recess 17
Multiple grooves 19, the multiple groove 19 is respectively connected with logical with the multiple recess 17；
Multiple LED chips 12 are adhered on the adhesive layer 16, and have multiple electrodes pad 13, the multiple electrode
Pad 13 respectively corresponds the multiple groove 19 and exposes in the multiple groove 19；
Potting resin 14 is set on the multiple LED chip 12 and adhesive layer 16；
Conductive paste fills full the multiple groove 19；
Multiple conductive nails, the multiple conductive nail include conductive post 20 and the conductive head of a nail 21, the multiple conduction
Nail is inserted in the multiple recess 17 and multiple through-holes 15 and its bottom end is flushed with the second surface, and multiple conductive nails have
There is length L, wherein L meets d1 < L < d1+d2, and post 20 has length L1, wherein L1=d1, in addition, the size of the head of a nail 21 is big
Cause the opening size for being equal to the groove and recess；
Conductive pattern 18, is set on second surface；
Multiple welding blocks 22, be formed on second surface and with 18 phase of the bottom end of the multiple conductive nail and conductive pattern
Connection.
According to an embodiment of the invention, the opening size of the recess 17 is equal to the opening size of the groove 19, it is described
The opening size of through-hole 15 is less than the opening size of the recess 17.
Wherein, the conductive pattern 18 realizes the in series or in parallel of the multiple LED chip 12.The multiple through-hole 15
With in multiple recesses 17 be filled with insulating materials.The insulating materials is the polymer materials such as sealing resin, polyimides.It is described
The diameter of multiple posts 20 is slightly less than the opening size of the through-hole 15, such as 15 opening size of through-hole is 1mm, post 20 it is straight
Diameter is 0.8mm.
Second embodiment
It is basic with first embodiment the present invention also provides another LED chip COB encapsulating structure referring still to Fig. 2
Identical, difference is that the multiple conductive nail includes the head of a nail 21 of conductive post 20 and insulation, and the multiple conductive nail is inserted
Enter in the multiple recess 17 and multiple through-holes 15 and its bottom end is flushed with the second surface, and multiple conductive nails have length
L is spent, wherein L meets d1 < L < d1+d2, and post has length L1, wherein L1=d1, in addition, the size of the head of a nail 21 is less than described
The opening size of groove 19 and recess 17 but the opening size for being greater than the through-hole 15, and filled with conduction in the recess 17
Cream, such post 20 are first connect with the conductive paste in recess 17, and the conductive paste in recess 17 the head of a nail 20 marginal portion and
Conductive paste electrical connection in groove 19.
Finally, it should be noted that obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Other various forms of variations or variation out.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (8)
1. a kind of LED chip COB encapsulating structure comprising:
Insulating substrate, the insulating substrate have opposite first surface and second surface, are provided on the first surface
Multiple recesses further include multiple through-holes of the bottom surface and second surface through the recess inside the insulating substrate, and its
With a thickness of d1；
Adhesive layer with a thickness of d2, is set on the first surface, and is had corresponding with the multiple recess multiple recessed
Slot, the multiple groove are respectively connected with logical with the multiple recess；
Multiple LED chips are adhered on the adhesive layer, and have multiple electrodes pad, and the multiple electrode pad is right respectively
It answers the multiple groove and exposes in the multiple groove；
Potting resin is set on the multiple LED chip and adhesive layer；
Conductive paste fills full the multiple groove；
Multiple conductive nails, the multiple conductive nail include conductive post and the conductive head of a nail, and the multiple conductive nail is inserted in
In the multiple recess and multiple through-holes and its bottom end is flushed with the second surface, and multiple conductive nails have length L, wherein
L meets d1 < L < d1+d2, and post has length L1, wherein L1=d1, in addition, the size of the head of a nail be substantially equal to the groove and
The opening size of recess；
Conductive pattern is set on second surface；
Multiple welding blocks are formed on second surface and are connected with the bottom end of the multiple conductive nail and conductive pattern.
2. LED chip COB encapsulating structure according to claim 1, it is characterised in that: the opening size of the recess is equal to
The opening size of the groove, the opening size of the through-hole are less than the opening size of the recess.
3. LED chip COB encapsulating structure according to claim 1, it is characterised in that: the conductive pattern is realized described more
A LED chip it is in series or in parallel.
4. LED chip COB encapsulating structure according to claim 1, it is characterised in that: the multiple through-hole and multiple recesses
It is interior to be filled with insulating materials.
5. LED chip COB encapsulating structure according to claim 4, it is characterised in that: the insulating materials is that polyamides is sub-
Amine.
6. a kind of LED chip COB encapsulating structure comprising:
Insulating substrate, the insulating substrate have opposite first surface and second surface, are provided on the first surface
Multiple recesses further include multiple through-holes of the bottom surface and second surface through the recess inside the insulating substrate, and its
With a thickness of d1；
Adhesive layer with a thickness of d2, is set on the first surface, and is had corresponding with the multiple recess multiple recessed
Slot, the multiple groove are respectively connected with logical with the multiple recess；
Multiple LED chips are adhered on the adhesive layer, and have multiple electrodes pad, and the multiple electrode pad is right respectively
It answers the multiple groove and exposes in the multiple groove；
Potting resin is set on the multiple LED chip and adhesive layer；
Conductive paste fills full the multiple groove；
Multiple conductive nails, the multiple conductive nail include the head of a nail of conductive post and insulation, and the multiple conductive nail is inserted in
In the multiple recess and multiple through-holes and its bottom end is flushed with the second surface, and multiple conductive nails have length L, wherein
L meets d1 < L < d1+d2, and post has length L1, wherein L1=d1, in addition, the size of the head of a nail is less than the groove and recess
Opening size but be greater than the through-hole opening size；
Conductive pattern is set on second surface；
Multiple welding blocks are formed on second surface and are connected with the bottom end of the multiple conductive nail and conductive pattern.
7. LED chip COB encapsulating structure according to claim 6, it is characterised in that: filled with conduction in the recess
Cream.
8. LED chip COB encapsulating structure according to claim 6, it is characterised in that: the diameter of the multiple post is smaller
In the opening size of the through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810385680.1A CN108550681B (en) | 2018-04-26 | 2018-04-26 | A kind of LED chip COB encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810385680.1A CN108550681B (en) | 2018-04-26 | 2018-04-26 | A kind of LED chip COB encapsulating structure |
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| Publication Number | Publication Date |
|---|---|
| CN108550681A CN108550681A (en) | 2018-09-18 |
| CN108550681B true CN108550681B (en) | 2019-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810385680.1A Active CN108550681B (en) | 2018-04-26 | 2018-04-26 | A kind of LED chip COB encapsulating structure |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673790A (en) * | 2008-09-11 | 2010-03-17 | 先进开发光电股份有限公司 | Light-emitting diode and manufacturing method thereof |
| CN102263194A (en) * | 2011-04-13 | 2011-11-30 | 日月光半导体制造股份有限公司 | Semiconductor packaging and method for manufacturing same |
| CN104600187A (en) * | 2014-01-22 | 2015-05-06 | 胡文松 | Heat radiation structure of high illumination surface adhesive LED |
| CN106299077A (en) * | 2015-05-26 | 2017-01-04 | 碁鼎科技秦皇岛有限公司 | LED encapsulation structure and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10262563B2 (en) * | 2015-09-30 | 2019-04-16 | Cheng-Chang TransFlex Display Corp. | LED display |
-
2018
- 2018-04-26 CN CN201810385680.1A patent/CN108550681B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673790A (en) * | 2008-09-11 | 2010-03-17 | 先进开发光电股份有限公司 | Light-emitting diode and manufacturing method thereof |
| CN102263194A (en) * | 2011-04-13 | 2011-11-30 | 日月光半导体制造股份有限公司 | Semiconductor packaging and method for manufacturing same |
| CN104600187A (en) * | 2014-01-22 | 2015-05-06 | 胡文松 | Heat radiation structure of high illumination surface adhesive LED |
| CN106299077A (en) * | 2015-05-26 | 2017-01-04 | 碁鼎科技秦皇岛有限公司 | LED encapsulation structure and preparation method thereof |
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| CN108550681A (en) | 2018-09-18 |
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