CN108251820A - The manufacturing method and manufacturing equipment of self-heating product/material - Google Patents

The manufacturing method and manufacturing equipment of self-heating product/material Download PDF

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Publication number
CN108251820A
CN108251820A CN201810192667.4A CN201810192667A CN108251820A CN 108251820 A CN108251820 A CN 108251820A CN 201810192667 A CN201810192667 A CN 201810192667A CN 108251820 A CN108251820 A CN 108251820A
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China
Prior art keywords
conducting wire
class conducting
substrate
self
liquid
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Pending
Application number
CN201810192667.4A
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Chinese (zh)
Inventor
张国祯
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Wuxi Boshuo Jingrui Technology Co ltd
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Wuxi Boshuo Jia Rui Technology Co Ltd
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Priority to CN201810192667.4A priority Critical patent/CN108251820A/en
Publication of CN108251820A publication Critical patent/CN108251820A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45544Atomic layer deposition [ALD] characterized by the apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0209Pretreatment of the material to be coated by heating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4581Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Surface Heating Bodies (AREA)

Abstract

The present invention is for conductive film in the prior art since production technology reaches the level of commercialization industrialization not yet,The deficiency that cannot be produced in batches,A kind of method and apparatus that can prepare self-heating product/material in batches is provided,This equipment includes substrate transfer device,Nm-class conducting wire laying apparatus,Drying unit and ALD deposition device,The manufacturing method and manufacturing equipment of self-heating product/material using the present invention,Substrate can directly be heated by composite conductive thin film after adding in electrode,Without again that composite conductive thin film is compound with substrate,Therefore production efficiency is high,And since ALD is with type,Therefore it can be deposited in the substrate of any shape,The plank or metal that the self-heating vehicle glass self-heating of arbitrary shape can be made answer material,And whole equipment is simple in structure,Self-heating device/material can be produced in enormous quantities,It is chemical bonds between substrate and composite conductive thin film,It is tightly combined,It is not easily to fall off,Therefore long lifespan.

Description

The manufacturing method and manufacturing equipment of self-heating product/material
Technical field
The present invention relates to the preparation methods and manufacturing equipment of self-heating product or material.
Background technology
Conductive film material obtains the high attention of comparison in automotive field at present, since some conductive films have light-permeable Property, is used for the heating of windshield to remove the fog of windscreen surface, be also increasingly used in as glasses, For removing the fog of lens surface and wrist-watch cap surface above the wearable devices such as wrist-watch, but due to the limitation of processing technology, The commercialization of these products does not obtain substantive progress, there are no commercialized production equipment and production method is formed, makes conduction The application of film is restricted, it is now desired to be provided a kind of can prepare these conductive films and applied such as glass etc. Method and apparatus in substrate, the product or material for obtaining energy self-heating are directly used in vehicle glass etc..
Invention content
The object of the present invention is to for prior art conductive film since production technology reaches commercialization industrialization not yet Level, a kind of method and apparatus that can prepare self-heating product/material in batches is provided.
The purpose of the present invention is what is be achieved through the following technical solutions:
The manufacturing equipment of self-heating product/material, including substrate transfer device, nm-class conducting wire laying apparatus, drying unit and ALD Precipitation equipment, nm-class conducting wire laying apparatus include nm-class conducting wire dispersion liquid liquid discharge device and nm-class conducting wire dispersion liquid disperser, dry Equipment for drying includes baker, and by the liquid of the nm-class conducting wire dispersion liquid in baker removal substrate, ALD deposition device includes heavy Product chamber and nozzle, nozzle be arranged in deposit cavity, substrate is deposited in deposit cavity by nozzle, by substrate transfer device according to The technique of setting sends substrate to nm-class conducting wire laying apparatus, drying unit, apparatus for atomic layer deposition;Nm-class conducting wire dispersion liquid Liquid discharge device is solution liquid-drop machine, and the solution liquid-drop machine includes liquid droping head, cavity volume and fluid hole, dropping liquid are provided on liquid droping head Head is located above substrate;Nm-class conducting wire soldering apparatus is further included, the nm-class conducting wire soldering apparatus is light illuminator;Light illuminator is by purple Outer lamp tube array and ultraviolet lamp tube display fixing device composition;Substrate transfer device is band transmission device, and the nm-class conducting wire divides Dispersion liquid liquid discharge device, nm-class conducting wire dispersion liquid disperser, baker, deposit cavity and nozzle are arranged above conveyer belt;Substrate Transfer device is winding unwinding device, and winding unwinding device includes unreeling shaft and Scroll, and Scroll and unreeling shaft are at least one For driving shaft, flexible substrates are arranged on unreeling shaft in rolls, head end connection Scroll, in Scroll and are unreeled between centers and are provided with Power roller;Nm-class conducting wire dispersion liquid liquid discharge device, nm-class conducting wire dispersion liquid disperser, the transmission of deposit cavity and nozzle along flexible substrates Direction setting positioned at Scroll and unreels between centers, above substrate;Precipitation equipment be arranged on before nm-class conducting wire laying apparatus or It is arranged on after drying unit;Nm-class conducting wire dispersion solution is propellers, is set on the surface of propellers along the length direction of axis Spiral groove.
The manufacturing method of self-heating product/material is included in atomic layer deposition bottom conductive film in substrate --- the bottom of at Latticed nm-class conducting wire layer --- liquid in removal nm-class conducting wire layer --- is laid on layer conductive film and passes through atomic layer deposition again Long-pending method deposited top layer conductive film on nm-class conducting wire;Removal is coated on nanometer and leads after liquid in removal nm-class conducting wire layer Nm-class conducting wire staggeredly is welded to connect and reticulates integral structure by the organic matter on line surface, and the bottom passes through ALD deposition Mode is grown on substrate;Nanometer is coated on by the removal of the method for ultraviolet light after the liquid in removing nm-class conducting wire layer Nm-class conducting wire is simultaneously welded to connect by the organic matter of conductive line surfaces, then the deposited top layer conductive film on nm-class conducting wire layer again;When When the deposition surface of substrate is curved surface or Irregular Boundary Surface, the first atomic layer deposition bottom conductive film in flexible flat substrate is again Fu is made and closes Dao electricity Qian films, by composite conductive thin film hot pressing in substrate surface by way of hot pressing;Substrate is rigid basement.
Device and method using the present invention prepare self-heating product/material, by substrate transfer device by substrate transfer to ALD deposition intracavitary deposits bottom conductive film first in substrate, then is laid with nm-class conducting wire by nm-class conducting wire laying apparatus On bottom conductive film surface, the liquid in nm-class conducting wire liquid is removed by drying unit, dries nm-class conducting wire liquid, then pass through ALD deposition device deposited top layer conductive film on bottom conductive film obtains conductive laminated film in substrate, this is conductive Thin film deposition can directly heat substrate by composite conductive thin film in substrate after adding in electrode, without again will Composite conductive thin film is compound with substrate, therefore production efficiency is high, and since ALD is with type, can be deposited on any shape In the substrate of shape, the self-heating vehicle glass of arbitrary shape, self-heating plastic foil, the floor of self-heating, self-heating can be made Plank or metal answer material, and whole equipment is simple in structure, self-heating device/material can be produced in enormous quantities.
Furthermore it is chemical bonds between substrate and composite conductive thin film, is tightly combined, it is not easily to fall off, therefore long lifespan.
Description of the drawings
Fig. 1 is steel substrate self-heating product/material production equipment example structure schematic diagram.
Fig. 2 is flexible substrates self-heating product/material production equipment example structure schematic diagram;
Fig. 3 be using hot pressing die by curved surface or irregular substrate the embodiment state together with flexible compound conductive film hot pressing Schematic diagram.
Reference sign
1- substrate transfer devices;101- live-rollers;102- conveyer belts;103- unreeling shafts;104- Scrolls
2- nm-class conducting wire laying apparatus;201- nm-class conducting wire dispersion liquid liquid discharge devices;202- nm-class conducting wire dispersion liquid dispersers 203- liquid droping heads
3- drying units;4-ALD precipitation equipments;5- nm-class conducting wire welders;6- substrates;
7- pressure heads;9- flexible compound conductive films.
Specific embodiment
The present invention is further described with reference to specific embodiment:
Having structure and self-heating product/material of material can be prepared using this device and method, including substrate 6 and composite guide Conductive film, composite conductive thin film include bottom conductive film, nm-class conducting wire layer and top layer conductive film, composite conductive thin film and pass through Its bottom conductive film is fixed in substrate.
Self-control heating product/material is prepared using following equipment.Including substrate transfer device 1, nm-class conducting wire laying apparatus 2nd, drying unit 3 and ALD deposition device 4, nm-class conducting wire laying apparatus 2 include nm-class conducting wire dispersion liquid liquid discharge device 201 and receive Rice conducting wire dispersion liquid disperser 202, drying unit 3 includes evaporator, can be disperseed the nm-class conducting wire in substrate 6 by evaporator The liquid removal of liquid or baker, as long as the liquid in nm-class conducting wire dispersion liquid can be removed, ALD deposition dress It puts 4 and includes deposit cavity and nozzle(It is not shown in figure), nozzle is arranged in deposit cavity, and deposition is completed in deposit cavity, by Substrate transfer device 1 sends substrate 6 to nm-class conducting wire laying apparatus 2, drying unit 3, atomic layer deposition according to the technique of setting Product device.Manipulator may be used in substrate transfer device, needs that workbench is set to carry out support substrate at this time, completes on the table Water and atomic layer deposition are removed in the laying of nm-class conducting wire, the dispersion of nm-class conducting wire, nm-class conducting wire drying.
When substrate 6 is rigidity base material, substrate transfer device 1 is preferably band transmission device, it includes conveyer belt 102 with before Transfer roller 101 afterwards, conveyer belt 102 are sleeved on preceding transfer roller and rear transfer roller, nm-class conducting wire dispersion liquid liquid discharge device 201, nanometer The direction of transfer of conducting wire dispersion liquid disperser 202, deposit cavity and nozzle along conveyer belt 102 is set gradually, positioned at conveyer belt 102 Between rear and front end, nm-class conducting wire dispersion liquid liquid discharge device 201, is arranged on conveyer belt 102 at nm-class conducting wire dispersion liquid disperser 202 Top, the top that the heater of drying unit 3 can be arranged on conveyer belt 102 can also be arranged on the lower section of conveyer belt 102, Conveyer belt 102 may pass through atomic layer deposition chamber, and nozzle is arranged on the top of conveyer belt 102, nm-class conducting wire dispersion liquid laying apparatus, Nm-class conducting wire dispersion liquid disperser 202, drying unit 3 are set gradually along the direction of transfer of conveyer belt 102, atomic layer deposition chamber Before being arranged on nm-class conducting wire laying apparatus 2 with nozzle, it can also be arranged on after drying unit 3 or in nanometer Atomic layer deposition chamber and nozzle are respectively provided with after the front of conducting wire laying apparatus 2 and drying unit 3, as long as being arranged on conveyer belt Substrate can be transmitted to deposit cavity by conveyer belt and send out deposit cavity by top.Nano-solution laying apparatus can be received Rice solution nozzle, preferably nano-solution liquid-drop machine, liquid-drop machine include liquid droping head 203, the setting receiving nano fluid on liquid droping head Cavity volume and fluid hole, nano fluid dispersion liquid oozes by fluid hole;Nano fluid disperser can be brush roll or scraper plate, Nm-class conducting wire dispersion liquid disperser 202 is propellers in preferred scheme, spiral groove is set on the surface of propellers, using this The nm-class conducting wire dispersion liquid disperser 202 of kind structure, the groove on surface can be when roller be rotated by nano fluid homogeneous dispersion Laying is opened, and nm-class conducting wire dispersion liquid can be pushed along groove, therefore the presence of groove, can receiving 6 excess surface of substrate Rice conducting wire dispersion liquid is pushed to the few place of nano fluid dispersion liquid, therefore, it is possible to well by nm-class conducting wire homogeneous dispersion It is laid on 6 surface of substrate.Preferred drying unit 3 includes heating head, is provided with heater in heating head, is distributed by heating head Heat from below or top pass through nm-class conducting wire dispersion liquid;In preferred structure, nm-class conducting wire welding is also set up Device 5 decomposes the organic matter of the mesh nano conductive line surfaces of process, and mesh nano conducting wire is welded together, and nanometer is led The heating unit that mesh nano conducting wire can be made to link together may be used in wire bonding connection device 5, it is therefore desirable to first make nm-class conducting wire table The organic matter in face decomposes the device that nm-class conducting wire can again be welded to each other, and is such as preferably displayed using ultraviolet lamp tube.The ultraviolet lamp Pipe displays the top that substrate transfer device is fixed on by fixing device.
When substrate 6 is flexible parent metal, substrate transfer device 1 preferably winds unwinding device, and winding unwinding device includes Unreeling shaft 103 and Scroll 104, Scroll 104 and unreeling shaft 103 are at least one for driving shaft, and flexible substrates 6 are arranged in rolls On unreeling shaft 103, head end connection Scroll 104 is provided with jockey pulley between Scroll 104 and unreeling shaft 103 and keeps flexible base Bottom 6 is smooth and horizontal, and " volume pair is referred to as using the method that this winding unwinding device prepares composite conductive thin film on a flexible substrate The method of volume ";Nm-class conducting wire dispersion liquid liquid discharge device 201, nm-class conducting wire dispersion liquid disperser 202, deposit cavity and nozzle are along soft Property substrate 6 direction of transfer position setting, between Scroll 104 and unreeling shaft 103, remaining setting with rigid basement 6 preparation Equipment.
This self-heating product/material is prepared using following flow:Bottom conductive film is set by apparatus for atomic layer deposition It puts in substrate 6, then nm-class conducting wire dispersion liquid is laid on bottom conductive film by nm-class conducting wire dispersion liquid laying apparatus And by homogeneous dispersion be dispersed on bottom conductive film by nm-class conducting wire dispersion liquid disperser 202, it is netted in order to obtain Nm-class conducting wire layer needs repeatedly to be laid with, then dries nm-class conducting wire dispersion liquid by drying unit 3, then by atomic layer deposition Top layer conductive film is arranged on bottom conductive film and covers netted nm-class conducting wire by device;In preferred scheme, nanometer Dispersion liquid after drying, is welded together nm-class conducting wire by nm-class conducting wire welder 5, forms single-piece mesh structure, Again by way of atomic layer deposition on bottom conductive film deposited top layer conductive film, mesh nano conducting wire is fixed on bottom On layer conductive film.More accelerate it is highly preferred that decomposing the organic matter on nm-class conducting wire surface by using light irradiation, residual is more It is few, the contact resistance of nm-class conducting wire to each other is reduced, and nm-class conducting wire can be made to be heated, nm-class conducting wire is welded together, shape Integrated reticular structure.
Self-heating product/material is prepared using the above apparatus and method, 2 net distribution of nm-class conducting wire layer is in bottom conduction It is deposited on bottom conductive film by ALD methods with bottom conductive film Ohm connection, top layer conductive film on film 1, it will Mesh nano conducting wire is fixed on bottom conductive film, and it is integral that top layer conductive film can connect each nm-class conducting wire, and can be with Bottom conductive film and top layer conductive film and nm-class conducting wire is made to link into an integrated entity.In the present invention, substrate 6 can be rigidity, Such as glass, ceramics, metal, stone material or flexibility, such as plastics, resin, can be it is organic or inorganic, As long as conductive film can be deposited in substrate 6 with the method for ALD, substrate 6 can be plane or curved surface Or it is irregular, because of the characteristics of ALD deposition is peculiar, the thickness ratio of composite conductive thin film is more uniform.When substrate 6 is curved surface or not Rule surface face table when, particularly rigid basement when, preferably first by the method for " roll-to-roll " on planar flexible substrate The flexible compound Dao electricity Qian films 9 of flexible substrate/bottom conductive film/nm-class conducting wire layer/top layer conductive film composition are prepared, are made It, will be flexible by way of hot pressing with the surface of pressure head 7 and curved surface or the hot pressing die of the surface shape complementary of irregular substrate Composite conductive thin film 9 and substrate 6 are combined together in substrate and prepare composite conductive thin film.Composite conductive thin film is preferably saturating Bright, then at this point, bottom conductive film and top layer conductive film are preferably transparent conductive film, preferably transparent oxide is thin Film can obtain transparent self-heating product as windshield, building glass in this way.
Example structure as shown in Figure 3 may be used in hot pressing die, it includes hot pressing pressure head 7, the work of the hot pressing pressure head 7 Make surface as curved surface, the size and shape of the size and shape of the curved surface and the curved surface of substrate is mutually complementary, could be incited somebody to action in this way with it Composite conductive thin film is pressed in substrate.

Claims (13)

1. the manufacturing equipment of self-heating product/material, which is characterized in that be laid with dress including substrate transfer device (1), nm-class conducting wire (2), drying unit (3) and ALD deposition device (4) are put, nm-class conducting wire laying apparatus includes nm-class conducting wire dispersion liquid liquid discharge device (201) and nm-class conducting wire dispersion liquid disperser (202), drying unit include baker, by the nanometer in baker removal substrate The liquid of conducting wire dispersion liquid, ALD deposition device include deposit cavity and nozzle, and nozzle is arranged in deposit cavity, and substrate is in deposit cavity It is interior to be deposited by nozzle, substrate is sent to nm-class conducting wire laying apparatus according to the technique of setting, dry by substrate transfer device Equipment for drying, apparatus for atomic layer deposition.
2. a kind of manufacturing equipment of self-heating product/material as described in claim 1, the nm-class conducting wire dispersion liquid goes out liquid dress Solution liquid-drop machine is set to, the solution liquid-drop machine includes liquid droping head, is provided with cavity volume and fluid hole on liquid droping head, liquid droping head is located at Above substrate.
3. the manufacturing equipment of self-heating product/material as described in claim 1, it is characterised in that:Further include nm-class conducting wire weldering Device is connect, the nm-class conducting wire soldering apparatus is light illuminator.
4. the manufacturing equipment of self-heating product/material as claimed in claim 3, it is characterised in that:The light illuminator by Ultraviolet lamp tube array and ultraviolet lamp tube display fixing device composition.
5. the manufacturing equipment of self-heating product/material as described in one of claim 1-4 items, it is characterised in that:The base Bottom transfer device is band transmission device, and the nm-class conducting wire dispersion liquid liquid discharge device, is dried at nm-class conducting wire dispersion liquid disperser Device, deposit cavity and nozzle are arranged above conveyer belt.
6. the manufacturing equipment of self-heating product/material as described in one of claim 1-4 items, which is characterized in that the base Bottom transfer device is winding unwinding device, and winding unwinding device includes unreeling shaft and Scroll, Scroll and unreeling shaft at least one A flexible substrates are arranged on unreeling shaft in rolls for driving shaft, head end connection Scroll, in Scroll and are unreeled between centers and are provided with Jockey pulley;Nm-class conducting wire dispersion liquid liquid discharge device, nm-class conducting wire dispersion liquid disperser, the biography of deposit cavity and nozzle along flexible substrates It send direction setting, positioned at Scroll and unreel between centers, above substrate.
7. the manufacturing equipment of self-heating product/material as described in claim 1, which is characterized in that the precipitation equipment setting Before nm-class conducting wire laying apparatus or after being arranged on drying unit.
8. the manufacturing equipment of self-heating product/material as described in claim 1, which is characterized in that the nm-class conducting wire dispersion Solution is propellers, and spiral groove is set along the length direction of axis on the surface of propellers.
9. the manufacturing method of self-heating product/material, which is characterized in that be included in atomic layer deposition bottom conductive thin in substrate Film --- is laid with latticed nm-class conducting wire layer --- liquid in removal nm-class conducting wire layer --- again to lead on bottom conductive film Cross the method for the atomic layer deposition deposited top layer conductive film on nm-class conducting wire.
10. the manufacturing method of self-heating product/material as claimed in claim 9, which is characterized in that in removal nm-class conducting wire layer Liquid after removal be coated on the organic matter on nm-class conducting wire surface, nm-class conducting wire staggeredly be welded to connect and reticulate integral type knot Structure, the bottom are grown on substrate by ALD deposition mode.
11. the manufacturing method of self-heating product/material as claimed in claim 10, which is characterized in that in removal nm-class conducting wire The organic matter on nm-class conducting wire surface is coated on by the removal of the method for ultraviolet light after liquid in layer and welds nm-class conducting wire It connects in succession, then the deposited top layer conductive film on nm-class conducting wire layer again.
12. the manufacturing method of self-heating product/material as claimed in claim 9, which is characterized in that when the deposition surface of substrate During for curved surface or Irregular Boundary Surface, first atomic layer deposition bottom conductive film is made Fu and closes Dao electricity Qian again in flexible flat substrate Film, by composite conductive thin film hot pressing in substrate surface by way of hot pressing.
13. the manufacturing method of self-heating product/material as claimed in claim 12, which is characterized in that the substrate is rigidity Substrate.
CN201810192667.4A 2018-03-09 2018-03-09 The manufacturing method and manufacturing equipment of self-heating product/material Pending CN108251820A (en)

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