CN108231708B - Heat exchanger for double-sided cooling of electronic modules - Google Patents
Heat exchanger for double-sided cooling of electronic modules Download PDFInfo
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- CN108231708B CN108231708B CN201710600887.1A CN201710600887A CN108231708B CN 108231708 B CN108231708 B CN 108231708B CN 201710600887 A CN201710600887 A CN 201710600887A CN 108231708 B CN108231708 B CN 108231708B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The heat exchanger assembly includes first and second heat dissipating elements enclosing a fluid flow path and a clamping assembly. The heat dissipating elements are separated by a space in which at least one heat generating electronic component is located, wherein an outside surface of each electronic component is in thermal contact with the heat dissipating elements. The clamping assembly includes first and second spring elements disposed in contact with an outer surface of the heat dissipating element. The spring elements are coupled together to apply a compressive force to the heat dissipating elements and cause the electronic component to be clamped between the heat dissipating elements. Each spring element includes a discrete force application region for applying a force to the heat dissipating element and a plurality of fastening regions for compressing and maintaining the position of the spring element relative to the outer surface of the heat dissipating element.
Description
Cross Reference to Related Applications
The present application claims priority and benefit from U.S. provisional patent application No. 62/433,936 filed on day 2016, 12, 14, the contents of which are incorporated herein by reference.
Technical Field
The present invention relates to a heat exchanger having a pair of heat sinks for cooling opposite sides of an electronic device package including a plurality of heat-generating electronic components.
Background
Electric vehicles ("EVs") and hybrid electric vehicles ("HEVs") employ power electronics that generate large amounts of thermal energy. This thermal energy must be dissipated to avoid overheating of these devices, which may result in damage or reduced performance.
Automotive power electronics typically include one or more heat-generating electronic components such as transistors, resistors, capacitors, field Effect Transistors (FETS), insulated Gate Bipolar Transistors (IGBTs), power inverters, dc-to-dc converters, and dc-to-dc converters. These components may be mounted on a substrate such as a printed circuit board.
Although the structure of automotive power electronics is variable, in some applications the power electronics are provided with opposing planes along which cooling may take place. IGBTs are examples of power electronics that may have such a structure. Such devices may be cooled by contacting one or both of the opposite planes of the device with a heat sink. In order to maximize thermal contact with the plane of the power electronic device, the heat sink has a planar surface along which the heat sink contacts the power electronic device, and a thin layer of Thermal Interface Material (TIM) may be disposed between the heat sink and the plane of the power electronic device. To enhance heat transfer, a cooling fluid, such as air or a liquid coolant, may be circulated along or through the fins.
The known cooling device of the power electronic device may comprise means for clamping the first and second heat sink devices to opposite sides of the power electronic device package in a staggered overlapping arrangement to improve the thermal contact between the electronic device and the heat sink. An electronic assembly having first and second heat dissipating devices positioned in thermal communication with first and second side surfaces of an electronic device package is disclosed in U.S. patent No.7,295,433B2 to Taylor et al. The electronic assembly disclosed by Taylor et al is held together by a pair of clamps secured together, each clamp having a shape configured to engage or receive the perimeter of one of the heat dissipating devices.
There remains a need for a simple and efficient heat exchanger for double-sided cooling of heat-generating electronic components, thereby providing efficient thermal communication between the heat sink and opposite side surfaces of the electronic component.
Disclosure of Invention
In an embodiment, there is provided a heat exchanger assembly comprising: a first heat dissipating element and a second heat dissipating element separated by a space, wherein the first heat dissipating element defines a first fluid flow path, the second heat dissipating element defines a second fluid flow path, and wherein the first and second heat dissipating elements are parallel to one another; at least one heat-generating electronic component located in the space and sandwiched between the first and second heat-dissipating elements, wherein each of the heat-generating electronic components has a first side surface in thermal contact with an inner surface of the first heat-dissipating element and an opposite side surface in thermal contact with an inner surface of the second heat-dissipating element; and a clamping assembly comprising: (a) A first spring element arranged in contact with an outer surface of the first heat dissipating element; and (b) a second spring element disposed in contact with an outer surface of the second heat dissipating element; wherein the first and second heat dissipating elements are sandwiched between the first and second spring elements, and wherein the first and second spring elements are coupled together to apply a compressive force to the first and second heat dissipating elements and thereby cause the at least one heat generating electronic component to be clamped between the first and second heat dissipating elements.
In an embodiment, each of the spring elements includes one or more discrete force application areas for applying a force to one of the heat dissipating elements, and a plurality of fastening areas for maintaining the position of the spring element relative to the outer surface of the heat dissipating element in contact therewith. In an embodiment, at least one force application area is provided for each of the at least one heat generating component. In an embodiment, the compressive force exerted by each of the spring elements is at a maximum in at least one force application region.
In an embodiment, the heat exchanger assembly comprises a plurality of said heat generating electronic components aligned along a longitudinal axis of the heat dissipating element, and wherein each of the spring elements comprises a plurality of said force applying regions.
In an embodiment, the force application areas are positioned such that at least some of the force application areas are substantially centrally located above or below a side surface of one of the heat generating electronic components.
In an embodiment, at least some of the width dimension of the spring elements of the force application area along a direction transverse to the longitudinal axis is located approximately in the middle of one of the spring elements.
In an embodiment, the force application areas are spaced apart along the longitudinal axis by a center-to-center distance between adjacent heat generating electronic components.
In an embodiment, a fastening region is located at an outer edge of each of the spring elements and is positioned outwardly beyond a peripheral edge of the heat dissipating element.
In an embodiment, the fastening areas in the respective spring elements are arranged in a mutually perpendicular alignment.
In an embodiment, the fastening region is provided with fastening means for receiving a fastener by which the spring elements are joined together. In an embodiment, the fastening means is a slot or hole, and wherein the fastener comprises a rod, screw or bolt.
In an embodiment, each of the spring elements comprises a plurality of X-shaped members, each of the X-shaped members comprising a pair of intersecting leg members arranged diagonally with respect to the longitudinal axis of the heat dissipating element. In an embodiment, the leg members have opposite ends at which the fastening regions are located and at which adjacent X-shaped members of the spring element are joined together.
In an embodiment, at least some of the force application areas are located at points where leg members of each of the X-shaped members cross each other.
In an embodiment, each of the spring elements is non-planar in its uncompressed state, wherein the force application region generally lies in one of a plurality of planes spaced apart from the plane in which the fastening region generally lies, and the leg member generally slopes as it extends between the force application region and the fastening region.
In an embodiment, each of the force application areas is defined by a bend formed in the spring element. In an embodiment, each of the bends is parallel to the longitudinal axis. In an embodiment, the bends are oriented in the same direction so that the spring element has an overall convex shape in a transverse dimension perpendicular to the longitudinal axis with the spring element in an uncompressed state, and wherein the spring element is mounted on the heat dissipating element with the convex shape oriented toward the heat dissipating element.
In an embodiment, each of the spring elements comprises:
-a plurality of inner force application areas aligned along a longitudinal axis;
-a plurality of outer force application areas, each of the outer force application areas being located in the vicinity of one of the fastening areas; and
-a plurality of intermediate force application areas, each of the intermediate force application areas being positioned along one of the leg members between one of the inner force application areas and one of the outer force application areas.
In an embodiment, the heat exchanger assembly further comprises heat dissipating plates fixed to the outer surfaces of the first and second heat dissipating elements, wherein each of the heat dissipating plates comprises a recess in which the leg member of the spring element is received.
In an embodiment, each of the spring elements is integrally formed from a spring steel sheet or spring steel sheet and is uniform in overall thickness.
In an embodiment, the heat radiating elements are connected in a serial arrangement with an inlet opening provided in the first heat radiating element and an outlet opening provided in the second heat radiating element, wherein the inlet opening and the outlet opening are arranged side by side at the first end of the heat exchanger assembly, and wherein the inlet opening and the outlet opening are provided with fittings arranged side by side and protruding in the same direction. In an embodiment, the first and second heat dissipating elements are each formed with a raised portion in which the respective inlet and outlet openings are located; wherein each of the raised portions extends transversely across a portion of the respective heat dissipating element from approximately the longitudinal axis of the heat dissipating element to a longitudinally extending outer peripheral edge of the heat dissipating element.
Drawings
The invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
FIG. 1 is a top perspective view of a heat exchanger according to an embodiment;
FIG. 2 is a top plan view of the heat exchanger of FIG. 1;
FIG. 3 is a bottom plan view of the heat exchanger of FIG. 1;
FIG. 4 is a side view of the heat exchanger of FIG. 1;
FIG. 5 is a cross-sectional view taken along line 5-5' of FIG. 4;
FIG. 6 is a top perspective view showing a spring plate of the heat exchanger of FIG. 1;
FIG. 7 is a top plan view of the spring plate of FIG. 6;
FIG. 8 is a side view of the spring plate of FIG. 6;
FIG. 9 is a front view of the spring plate of FIG. 6;
FIG. 10 is a front view of a spring plate having an alternative configuration;
FIG. 11 is a cross-sectional view similar to FIG. 5 showing the spring plate prior to the application of a clamping force; and
fig. 12 is a cross-sectional view similar to fig. 5 showing the spring plate after the clamping force is applied.
Detailed Description
A heat exchanger assembly 10 according to an exemplary embodiment is described below with reference to fig. 1-5.
The heat exchanger assembly 10 includes a first heat dissipating element 12 (upper portion in the drawing) and a second heat dissipating element 14 (lower portion in the drawing). The two heat dissipating elements 12, 14 are separated by a space 16, and at least one heat generating electronic component 18 is located in the space 16, wherein the at least one heat generating electronic component 18 is sandwiched between the first heat dissipating element 12 and the second heat dissipating element 14. In the present embodiment, the space 16 accommodates a plurality of heat generating electronic components 18. The electronic component 18 may include an IGBT, and although not shown in the drawing, the electronic component 18 may be mounted on a circuit board.
The first heat rejection element 12 of the heat exchanger assembly 10 has a hollow interior defining a first fluid flow passage 20. In this embodiment, the first heat dissipating element 12 includes a first plate pair 26, the first plate pair 26 including a pair of plates 28, 30 sealed together at their peripheral edges. The first plate 28 is flat and planar, and the second plate 30 is shaped with a flat planar bottom and a protruding peripheral flange 32 with a peripheral sealing surface 34, the second plate 30 being sealingly joined to the first plate 28 along the peripheral sealing surface 34, for example by brazing or welding.
The second heat rejection element 14 of the heat exchanger assembly 10 similarly has a hollow interior defining a second fluid flow passage 36. In this embodiment, the second heat dissipating element 14 includes a second plate pair 42, the second plate pair 42 including a pair of plates 44, 46 sealed together at their peripheral edges. The first plate 44 is flat and planar, and the second plate 46 is shaped with a flat planar bottom and a protruding peripheral flange 48 with a peripheral sealing surface 50, the second plate 46 being sealingly joined to the first plate 44 along the peripheral sealing surface 34, for example by brazing or welding.
The first and second heat dissipating elements 12, 14 and the respective first and second flow channels 20, 36 may be parallel to each other. Furthermore, the heat exchanger assembly 10 has a central longitudinal axis a (fig. 2 and 3) that is parallel to the long dimension of the heat dissipating elements 12, 14 and to the direction of fluid flow through the first and second flow channels 20, 36. The heat dissipating elements 12, 14 are elongated and the flow channels 20, 36 extend from one end of the heat dissipating elements 12, 14 to the other end thereof. The heat exchanger plates 28, 30, 44, 46 may be constructed of aluminum or an aluminum alloy, although not necessary to the present invention.
The first plate 28, 44 of each heat dissipating element 12, 14 is flat and planar and constitutes a heat dissipating plate. Each of the heat dissipation plates 28, 44 has a thickness that is significantly greater than the thickness of the second plates 30, 46. It should be appreciated that the heat exchanger assembly 10 may alternatively be constructed from plate pairs made of relatively thin plates and individual heat sinks secured to the outer surface of one of the plates of each plate pair by brazing or welding.
The heat-generating electronic component 18 is sandwiched between the heat-radiating elements 12, 14. The heat-generating electronic components 18 may be generally in the shape of rectangular prisms, each having a pair of opposing major side surfaces, namely a first side surface 22 and a second side surface 24. The first side surface 22 and the second side surface 24 are flat, planar and parallel to the heat dissipating elements 12, 14. The first side surface 22 of each heat generating electronic component 18 is in thermal contact with the first plate 28 of the first heat dissipating element 12, wherein the surface of the first plate 28 of the first heat dissipating element 12 in thermal contact with the first side surface 22 of the heat generating electronic component 18 is sometimes referred to herein as the inner surface of the first heat dissipating element 12 and is denoted by reference numeral 27 in fig. 4 and 5. The opposite surface of the first heat dissipating element 12 is sometimes referred to herein as the outer surface of the first heat dissipating element 12 and is denoted by reference numeral 29 in fig. 4 and 5.
The second side surface 24 of each heat generating electronic component 18 is in thermal contact with the first plate 44 of the second heat dissipating element 14, wherein the surface of the first plate 44 in thermal contact with the second side surface 24 of the heat generating electronic component 18 is sometimes referred to herein as the inner surface of the second heat dissipating element 14 and is denoted by reference numeral 45 in fig. 4 and 5. The opposite surface of the second heat dissipating element 14 is sometimes referred to herein as the outer surface of the second heat dissipating element 14 and is denoted by reference numeral 47 in fig. 4 and 5.
The first and second side surfaces 22, 24 of the heat-generating electronic component 18 are shown in the drawings as being generally square having a width dimension that is generally the same as the width of the heat-dissipating elements 12, 14 transverse to the longitudinal axis a.
The heat exchanger assembly 10 includes three heat-generating electronic components 18 aligned along a longitudinal axis a and spaced apart from one another. The heat emitted by the electronic component 18 is transferred through the first plates 28, 44 of the respective heat-radiating elements 12, 14 to the coolant circulating in the first and second flow channels 20, 36. It should be appreciated that the heat exchanger assembly 10 may include more or less than three heat-generating electronic components 18 and may be arranged in multiple rows, and that the heat-dissipating elements 12, 14 having increasing or decreasing lengths and/or widths may be provided according to the number, size, and arrangement of the heat-generating electronic components 18.
The first and second flow channels 20, 36 of the heat exchanger assembly 10 are connected in series such that the coolant flows first through one of the flow channels 20, 36 and then through the other of the flow channels 20, 36. In the illustrated embodiment, the coolant flows through the first fluid flow channel 20 and then through the second fluid flow channel 36 to cool the opposite side surfaces 22, 24 of the heat generating electronic component 18. Thus, the first heat dissipating element 12 comprising the first plate pair 26 is provided with an inlet opening 52 and an associated inlet fitting 54, while the second heat dissipating element 14 comprising the second plate pair 42 is provided with an outlet opening 56 and an associated outlet fitting 58. Although the heat exchanger assembly 10 is shown as having a series flow configuration, it should be appreciated that the heat exchanger assembly 10 may be configured such that coolant flows through the first and second heat rejection elements 1, 14 in parallel. For example, each heat-radiating element 12, 14 may be provided with its own inlet and outlet openings and inlet and outlet fittings, each connected to the coolant circulation system, similar to the arrangement shown in the above-mentioned U.S. patent No.7,295,433. Alternatively, the heat dissipating elements 12, 14 may be connected together by inlet and outlet manifolds such that only one inlet and one outlet opening is required.
The location of the openings 52, 56 and fittings 54, 58 will vary from application to application. In this embodiment, the inlet opening 52 and the outlet opening 56 are arranged side by side at the same end of the heat exchanger assembly 10, wherein the respective inlet fitting 54 and outlet fitting 58 extend in the same direction perpendicular to the plane in which the heat radiating elements 12, 14 lie. Thus, the inlet opening 52 and the inlet fitting 54 are provided in the second plate 30 of the first heat dissipating element 12, while the outlet opening 56 and the outlet fitting 58 are provided in the first plate 44 of the second heat dissipating element 14. In an alternative series arrangement, a single coaxial inlet/outlet fitting may be provided, as disclosed for example in US2014/0224452A1 by Abels.
To facilitate allowing the inlet opening 52 and the outlet opening 56 and their associated fittings 54, 58 to be arranged side by side, the respective plates 28, 30, 44, 46 and the heat dissipating elements 12, 14 are formed with raised portions 60,62, wherein the inlet opening 52 and the inlet fitting 54 are located in the inlet raised portion 60 and the outlet opening 56 and the outlet fitting 58 are located in the outlet raised portion 62. The raised portions 60,62 extend laterally across a portion of the respective heat dissipating element 12, 14, i.e., from approximately mid-way (near the central axis a) to the longitudinally extending outer peripheral edge of the heat dissipating element 12 or 14 and do not extend outwardly beyond the longitudinal edges of the heat dissipating element 12, 14, respectively. However, it should be understood that the raised portions 60,62 are in fluid communication with the full width fluid flow channels 20, 36.
At the end of the heat exchanger assembly 10 opposite the openings 52, 56, fittings 54, 58 and raised portions 60,62, a diverting passage 64 is provided through which diverting passage 64 coolant exits the first fluid flow channel 20 and enters the second fluid flow channel 36. As shown in fig. 2 and 4, the diverting channel 64 is defined by a spacer element 66 having a sidewall and a hollow interior, the spacer element 66 being in sealed fluid communication with and extending between a communication opening 68 provided in the first plate 28 of the first heat dissipating element 12 and a communication opening 70 provided in the second plate 30 of the second heat dissipating element 14.
As can be seen from the side view of fig. 4, the diverting channel 64 and the spacer 66 are located near the ends of the heat dissipating elements 12, 14 such that the heat generating electronic component 18 is located between the diverting channel 64 and the raised portions 60,62 in which the inlet opening 52 and the outlet opening 56 are provided. Thus, coolant entering the heat exchanger assembly 10 through the inlet opening 52 and the inlet fitting 54 flows along the first side surface 22 of the heat generating component 18 through the first fluid flow channels 20 and then through the turn channels 64 into the second fluid flow channels 36. The coolant then flows through the second fluid flow channels 36 along the second side surface 24 of the heat generating component 18 and exits the heat exchanger assembly 10 through the outlet opening 56 and the outlet fitting 58. In this way, cooling is achieved along both side surfaces 22, 24 of each heat generating component 18.
Although not shown in the drawings, the first and second flow passages 20, 36 may be provided with turbulating inserts, each of which may include fins or turbulators. As used herein, the terms "fin" and "turbulator" are intended to mean a corrugated turbulating insert having a plurality of axially extending ridges or crests connected by sidewalls, wherein the ridges are rounded or flat. As defined herein, a "fin" has continuous ridges, while a "turbulator" has ridges that are interrupted along its length, such that axial flow through the turbulator is tortuous. Turbulators are sometimes referred to as offset or slit strip fins, and examples of such turbulators are described in U.S. Pat. No. re.35,890 (So) and U.S. Pat. No. 6,273,183 (So et al). The entire contents of So and So et al are incorporated herein by reference.
Thermal contact between the heat dissipating elements 12, 14 and the heat generating component 18 may be enhanced by providing a thin layer of Thermal Interface Material (TIM) at the interface between the inner surface 27 of the first heat dissipating element 12 (the first plate 28 of the first plate pair 26) and the first side surface 22 of the heat generating component 18 and by providing a thin layer of TIM at the interface between the inner surface 45 of the second heat dissipating element 14 (the first plate 44 of the second plate pair 42) and the second side 24 of the heat generating component 18. The TIM may include a thermally conductive grease, wax, or metallic material.
Thermal contact is enhanced by applying a compressive force to the heat exchanger assembly 10 to bring the heat dissipating elements 12, 14 into intimate thermal contact with the heat generating component 18. This is accomplished by applying a compressive force to the heat sink elements 12, 14 using the clamping assembly 72.
The clamping assembly 72 includes a pair of spring elements 74. In this embodiment, the pair of spring elements 74 are integrally formed from a single piece of spring steel plate, such as by stamping and bending. A first one of the spring elements 74 is arranged in direct or indirect thermal contact with the outer surface 29 of the first heat sink element 12, and a second one of the spring elements 74 is arranged in direct or indirect thermal contact with the outer surface 47 of the second heat sink element 14. In the present embodiment, the first and second spring elements 74 are identical to each other, but this is not required.
Each spring element 74 includes one or more discrete force application areas 76 for applying a compressive force to one of the heat sink elements 12, 14 and a plurality of fastening areas 78 for maintaining the position of the spring element 74 relative to the heat sink elements 12, 14.
The spring elements 74 of the present embodiment each comprise a plurality of force application areas 76, wherein at least one such area 76 is provided for each of the heat generating components 18. As shown, with the spring elements 74 attached to the heat exchanger assembly 10 and to each other, the first heat dissipating element 12 and the second heat dissipating element 14 are sandwiched between the first spring element 74 and the second spring element 74, and a compressive force is applied to the heat dissipating elements 12, 14 through the spring elements 74. The compressive force is at a maximum in the force application region 76 to provide enhanced cooling of the heat-generating electronic components 18, as described further below.
The location of the force application area 76 in the spring element 74 is selected such that the compressive force applied by the spring element 74 is focused or concentrated in an area where heat of the heat-generating electronic component 18 tends to be concentrated, thereby providing enhanced cooling. For example, the plurality of inner force application areas 76A are generally centrally located above or below the side surfaces 22, 24 of one of the heat generating components 18. The inner force application area 76A is positioned to maximize the compressive force in the middle of the side surfaces 22, 24 of the heat generating component 18 in which heat may be concentrated. In this embodiment, the inner force application area 76A is located approximately midway between the spring elements 74 and is substantially aligned along the longitudinal axis a of the heat exchanger assembly 10 in the lateral dimension shown in the end view of fig. 9. In the longitudinal dimension, the inner force application areas 76A are spaced apart a center-to-center distance between adjacent heat generating components 18.
Each of the spring elements 74 may include an additional force application area 76. For example, in the exemplary embodiment, each of spring elements 74 includes a pair of intermediate force application areas 76B and a pair of outer force application areas 76C. Each of the intermediate force application areas 76B is spaced apart near the middle between the middle of the spring element 74 and its outer edge to apply a compressive force to the area of the heat generating component 18 between the middle of the side surfaces 22, 24 and its outer edge. Each of the outer force application areas 76C is spaced apart proximate the outer edges of the spring elements 74 to apply a compressive force to the areas of the heat generating component 18 proximate the outer edges of the side surfaces 22, 24 thereof.
The fastening region 78 is located at the outer edge of the spring element 74 near the outer force application region 76C such that the fastening region 78 extends outwardly beyond the peripheral edges of the heat dissipating elements 12, 14. As can be seen in fig. 4, when the spring elements 74 are mounted on the heat exchanger assembly 10, the fastening regions 78 in the respective spring elements 74 are arranged in vertical alignment with each other. Furthermore, the fastening region 78 is provided with means allowing the first and second spring elements 74 to be joined together in order to apply a compressive force to the first heat dissipating element 12 and the second heat dissipating element 12, thereby causing the heat generating electronic component 18 to be clamped between the first heat dissipating element 12 and the second heat dissipating element 14. In this embodiment, the connection means for joining the first and second spring elements 74 is in the form of an open-ended slot 80.
Each spring element 74 in the present embodiment is configured as a plurality of X-shaped members 82, wherein three such members are provided in each spring element 74. Each X-shaped member 82 includes a pair of intersecting leg members 84, each disposed diagonally with respect to the longitudinal axis a. The opposite ends of the leg members 84 serve as locations for the fastening regions 78 and/or as connection points for adjacent X-shaped members 82 within the same spring element 74. As can be seen in the figures, the inner force application area 76A is located at the intersection of leg members 84 in each of the X-shaped members 82. The intermediate force application region 76B is located along the leg member 84 between the intersection and opposite ends thereof. The outer force application region 76C is located at or near the end of the leg member 84.
The spring elements 74 are each configured such that the compressive force applied to the heat dissipating elements 12, 14 and the heat generating component 18 is at a maximum at the force application area 76. In the present embodiment, as described above, each of the spring elements 74 is integrally formed of a spring steel sheet or a spring steel plate, and is uniform in overall thickness. To maximize the compressive force at the force application area 76, the spring element 74 is formed by bending to be non-planar in the uncompressed state, as shown in fig. 7-9. More specifically, the spring element 74 is formed such that the force application region 76 generally lies in one or more planes, while the fastening region 78 generally lies in another plane, the plane of the fastening region 78 being spaced apart from the one or more planes of the fastening region 76, and the leg member 84 generally slopes as it extends from the force application region 76 to the fastening region 78.
In the illustrated embodiment, each force application region 76 is defined by a bend formed in the spring element 74, each of the bends being parallel to the longitudinal axis a. As shown in the end view of fig. 9, the degree of bending may be the same or different in the different force application areas 76. In this embodiment, the curvature defining the outer force application region 76C is sharper than the relatively shallower curvature defining the inner force application region 76A and the intermediate force application region 76B. The angle of each bend may be on the order of less than about 10 degrees, for example about 5 degrees.
As shown in fig. 9, the bends all face in the same direction to give the resilient element 74 an overall convex shape in a transverse dimension perpendicular to the longitudinal axis with the spring element 74 in the uncompressed state as shown. When the spring element 74 is mounted on one of the heat dissipating elements 12, 14, the convex shape faces the heat dissipating element 12, 14 and the concave surface of the spring element 74 faces away from the heat dissipating element 12, 14.
In alternative embodiments, the non-planar configuration of spring element 74 may be achieved at least in part by thickening at least some of force application regions 76 relative to other regions of spring element 74. For example, FIG. 10 shows a spring element 74 'according to an alternative embodiment that is identical to the spring element 74 except that each of the force application regions 76 is defined at least in part by a localized thickening of the spring element 74' in the force application region 76. Further, at least some of the force application areas 76 may be defined by bends as described above for the spring element 74. For example, at least the thickened central force application region 76A of the spring element 74' is also defined by a bend, as described above with reference to the spring element 74.
The clamping assembly 72 also includes a plurality of fastening elements 86. In this embodiment, each of the fastening elements 86 comprises a rod with a shaft 88, and the shaft 88 is provided with an expansion head 90 at each end. The shaft 88 has a diameter such that it can slide into one of the open ended slots 80. The clamping assembly 72 is assembled to the heat exchanger assembly 10 by pressing the spring element 74 against the plate pairs 26 and 42 with a press, and then inserting the fastening element 86 into the slot 80, and then releasing the press.
The fastening element 86 may not be a shaft 88 with an expansion head 90, but may comprise a screw, bolt or bolt, and the slot 80 may be replaced with a hole closed around its edge.
As described above, the first and second spring elements 74 are disposed in direct or indirect contact with the outer surfaces 29, 47 of the first and second heat dissipating elements 12, 14. In the embodiment shown in fig. 1-5, the heat exchanger assembly 10 includes an outer heat sink plate 92 directly secured to and in thermal contact with the outer surfaces 29, 47 of the heat sink elements 12, 14. These outer heat-dissipating plates 92 may be provided in thermal contact with additional heat-generating electronic components (not shown) arranged along the outer surfaces 29, 47 of the heat-dissipating elements 12, 14, for example. In the embodiment shown in fig. 11 and 12, the heat exchanger assembly 10 does not include the outer heat sink 92 and the spring elements 74 are in direct contact with the outer surfaces 29, 47 of the first and second heat sink elements 12, 14.
The outer heat sinks 92 include grooves 94 (fig. 5) for receiving the leg members 84 of the spring elements 74 such that an upper surface of each spring member 74 will be substantially coplanar with or slightly recessed relative to an outer surface of one of the outer heat sinks 92. These grooves 94 extend through a portion of the thickness of the outer heat sink 92. This can be seen in fig. 4 and 5. This arrangement ensures that the outer surface of the outer heat spreader plate 92 will be in thermal contact with additional heat generating components disposed along the outer surfaces 29, 47 of the heat spreading elements 12, 14.
The configuration of the outer heat sink 92 may also assist in positioning and retaining the spring element 74 relative to the heat sink elements 12, 14 because the leg members 84 of the spring element 74 are received in the grooves 94 of the outer heat sink 92.
It should be appreciated that the outer heat sink 92 is not an essential component of the heat exchanger assembly 10 and that the spring elements 74 may be in direct contact with the outer surfaces 29, 47 of the heat sink elements 12, 14.
Fig. 11 and 12 are used to illustrate the positioning of the spring element 74 relative to other components of the heat exchanger assembly 10 before and after it is compressed into contact with the first and second heat dissipating elements 12, 14.
With the spring element 74 mounted on the heat exchanger assembly 10 as shown in fig. 4, 5 and 12, the spring element 74 may have a generally flat planar appearance as shown in fig. 4 and 5 such that portions of the spring element 74 outside the outer force application area 76 may appear to be in contact with the outer surfaces 29, 47 of the first and second heat dissipating elements 12, 14. However, it should be appreciated that the advantages of the clamping assembly 72 are not dependent on thermal contact between the heat dissipating elements 12, 14 and the portion of the spring element 74 that is located outside of the force application area 76, and thus the spring element 74 may deviate slightly from a planar configuration when mounted on the heat exchanger assembly 10. Further, even though the spring element 74 has a generally planar appearance as in fig. 4 and 5, it should be appreciated that compressive forces will be concentrated at the force application region 76. It will be appreciated that selective application of compressive forces in vertical alignment with the area of the heat-generating electronic component to be cooled will provide more efficient thermal contact between the heat-dissipating elements 12, 14 and the heat-generating electronic component 18 than conventional perimeter clamping, which may be located outside the area of the heat-generating electronic component 18 in a conventional manner. The compressive force exerted by the spring element 74 on the heat-generating electronic component 18 by the heat-dissipating elements 12, 14 is indicated by arrows in fig. 12. It can be seen that the compressive force exerted by the spring element 74 is exerted at a plurality of points between the edges of the heat generating electronic component 18 and may be distributed over the entire surface area of the heat generating electronic component 18.
It should be appreciated that the compressive force provided by the clamping assembly 72 will improve thermal contact between the heat dissipating elements 12, 14 over the entire surface area of the heat generating component 18, and that the compressive force may be high enough to compress some of the TIM from the interface area between the heat dissipating elements 12, 14 and the heat generating electronic component 18 such that the TIM will still eliminate any gaps between the heat dissipating elements 12, 14 and the heat generating electronic component 18 while being thin enough in other areas to minimize the thermal insulating effect of the TIM.
Although the present invention has been described in terms of exemplary embodiments, it is not limited thereto. Rather, the invention includes all embodiments that may fall within the scope of the following claims.
Claims (22)
1. A heat exchanger assembly, comprising:
a first heat dissipating element and a second heat dissipating element separated by a space, wherein the first heat dissipating element defines a first fluid flow channel and the second heat dissipating element defines a second fluid flow channel, and wherein the first and second heat dissipating elements are parallel to each other;
at least one heat-generating electronic component located in the space and sandwiched between first and second heat-dissipating elements, wherein each heat-generating electronic component has a first side surface in thermal contact with an inner surface of the first heat-dissipating element and an opposite side surface in thermal contact with an inner surface of the second heat-dissipating element; and
a clamping assembly comprising:
(a) A first spring element arranged in contact with an outer surface of the first heat dissipating element; and
(b) A second spring element arranged in contact with an outer surface of the second heat dissipating element;
wherein the first and second heat dissipating elements are sandwiched between the first and second spring elements, and wherein the first and second spring elements are joined together to apply a compressive force to the first and second heat dissipating elements and thereby cause at least one heat generating electronic component to be clamped between the first and second heat dissipating elements;
each spring element includes one or more discrete force application areas for applying a force to one of the first and second heat dissipating elements, and a plurality of fastening areas for maintaining the position of the spring element relative to an outer surface of the heat dissipating element in contact therewith;
the force application areas are positioned such that at least some of the force application areas are generally centrally located above or below a side surface of one of the at least one heat-generating electronic component;
the force application areas are spaced apart along the longitudinal axis by a center-to-center distance between adjacent heat generating electronic components.
2. The heat exchanger assembly of claim 1, wherein at least one force application area is provided for each of the at least one heat generating component.
3. The heat exchanger assembly of claim 1, wherein the compressive force applied by each of the first spring element and the second spring element is at a maximum in the at least one force application region.
4. The heat exchanger assembly of claim 1, wherein the heat exchanger assembly includes a plurality of the heat-generating electronic components aligned along a longitudinal axis of a heat-dissipating element, and wherein each of the first spring element and the second spring element includes a plurality of the force-applying regions.
5. The heat exchanger assembly of claim 1, wherein at least some of the force application areas are located approximately midway between one of the first spring element and the second spring element in a width direction of the spring element transverse to the longitudinal axis.
6. The heat exchanger assembly of claim 1, wherein the fastening region is located at an outer edge of each spring element and is positioned outwardly beyond a peripheral edge of the heat dissipating element.
7. The heat exchanger assembly of claim 6, wherein the fastening regions in the respective spring elements are arranged in perpendicular alignment with each other.
8. The heat exchanger assembly of claim 6, wherein the fastening region is provided with fastening means for receiving a fastener by which the first spring element and the second spring element are joined together.
9. The heat exchanger assembly of claim 8, wherein the fastening means is a slot or hole, and wherein the fastener comprises a rod, screw, or bolt.
10. The heat exchanger assembly of claim 1, wherein each of the first and second spring elements comprises a plurality of X-shaped members, each of the X-shaped members comprising a pair of cross-leg members disposed diagonally with respect to a longitudinal axis of the heat dissipating element.
11. The heat exchanger assembly of claim 10, wherein the leg members have opposite ends, the fastening regions being located at the opposite ends and adjacent X-shaped members of the spring element being joined together at the opposite ends.
12. The heat exchanger assembly of claim 10, wherein at least some of the force application areas are located at points where the leg members of each of the X-shaped members intersect each other.
13. The heat exchanger assembly of claim 12, wherein each of the first and second spring elements is non-planar in its uncompressed state, wherein the force application region generally lies in one of a plurality of planes spaced apart from a plane in which the fastening region generally lies, and the leg member generally slopes as it extends between the force application region and the fastening region.
14. The heat exchanger assembly of claim 10, wherein each of the force application areas is defined by a bend formed in a spring element.
15. The heat exchanger assembly of claim 14, wherein each of the bends is parallel to the longitudinal axis.
16. The heat exchanger assembly of claim 14, wherein the bends all face in the same direction with the spring element in an uncompressed state such that the spring element has an overall convex shape in a transverse dimension perpendicular to the longitudinal axis, and wherein the spring element is mounted on the heat dissipating element with the convex shape facing the heat dissipating element.
17. The heat exchanger assembly of claim 10, wherein each of the force application areas is defined by a localized thickening of a spring element in the force application area, and optionally wherein one or more of the force application areas are defined by a bend formed in the spring element.
18. The heat exchanger assembly of claim 10, wherein each of the first spring element and the second spring element comprises:
-a plurality of inner force application areas aligned along the longitudinal axis;
-a plurality of outer force application areas, each of said outer force application areas being located in the vicinity of one of said fastening areas; and
-a plurality of intermediate force application areas, each of said intermediate force application areas being positioned along one of said leg members between one of said inner force application areas and one of said outer force application areas.
19. The heat exchanger assembly of claim 10, further comprising a heat sink plate secured to the outer surfaces of the first and second heat dissipating elements, wherein each of the heat sinks includes a recess in which the leg members of the spring element are received.
20. The heat exchanger assembly of claim 1, wherein each of the first spring element and the second spring element is integrally formed of spring steel sheet or spring steel plate and is uniform in overall thickness.
21. The heat exchanger assembly of claim 1, wherein the first heat dissipating element and the second heat dissipating element are connected in a serial arrangement with an inlet opening provided in the first heat dissipating element and an outlet opening provided in the second heat dissipating element, wherein the inlet opening and the outlet opening are arranged side by side at a first end of the heat exchanger assembly, and wherein the inlet opening and the outlet opening are provided with fittings arranged side by side and protruding in the same direction.
22. The heat exchanger assembly of claim 21, wherein the first and second heat dissipating elements are each formed with a raised portion in which the respective inlet and outlet openings are located; wherein each of the raised portions extends transversely across a portion of the respective heat dissipating element from approximately the longitudinal axis of the heat dissipating element to a longitudinally extending outer peripheral edge of the heat dissipating element.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017222350.2A DE102017222350A1 (en) | 2016-12-14 | 2017-12-11 | HEAT EXCHANGER FOR DOUBLE-SIDED COOLING OF ELECTRONIC MODULES |
| US15/840,504 US10600721B2 (en) | 2016-12-14 | 2017-12-13 | Heat exchanger for dual-sided cooling of electronic modules |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662433936P | 2016-12-14 | 2016-12-14 | |
| US62/433,936 | 2016-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108231708A CN108231708A (en) | 2018-06-29 |
| CN108231708B true CN108231708B (en) | 2023-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710600887.1A Active CN108231708B (en) | 2016-12-14 | 2017-07-21 | Heat exchanger for double-sided cooling of electronic modules |
| CN201720895064.1U Active CN207602552U (en) | 2016-12-14 | 2017-07-21 | For the heat exchanger assembly of at least one heat-generating electronic part of two-sided cooling |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720895064.1U Active CN207602552U (en) | 2016-12-14 | 2017-07-21 | For the heat exchanger assembly of at least one heat-generating electronic part of two-sided cooling |
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| CN (2) | CN108231708B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231708B (en) * | 2016-12-14 | 2023-08-04 | 达纳加拿大公司 | Heat exchanger for double-sided cooling of electronic modules |
| CN111076595B (en) * | 2020-01-10 | 2020-12-08 | 山东华昱压力容器股份有限公司 | Plate-tube type fused salt heat storage component and heat storage tank thereof |
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| CN207602552U (en) * | 2016-12-14 | 2018-07-10 | 达纳加拿大公司 | For the heat exchanger assembly of at least one heat-generating electronic part of two-sided cooling |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040150956A1 (en) * | 2003-01-24 | 2004-08-05 | Robert Conte | Pin fin heat sink for power electronic applications |
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|---|---|---|---|---|
| US5306065A (en) * | 1993-03-16 | 1994-04-26 | Ades Bruce A | Supplemental visor assembly |
| US5926369A (en) * | 1998-01-22 | 1999-07-20 | International Business Machines Corporation | Vertically integrated multi-chip circuit package with heat-sink support |
| WO2001008460A1 (en) * | 1999-07-21 | 2001-02-01 | Allman Richard K | Thermally-coupled heat dissipation apparatus for electronic devices |
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| CN104617085A (en) * | 2013-11-04 | 2015-05-13 | 江苏宏微科技股份有限公司 | Stack-up assembled power module |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN207602552U (en) | 2018-07-10 |
| CN108231708A (en) | 2018-06-29 |
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