CN107768366B - COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof - Google Patents
COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof Download PDFInfo
- Publication number
- CN107768366B CN107768366B CN201711178602.6A CN201711178602A CN107768366B CN 107768366 B CN107768366 B CN 107768366B CN 201711178602 A CN201711178602 A CN 201711178602A CN 107768366 B CN107768366 B CN 107768366B
- Authority
- CN
- China
- Prior art keywords
- thermal protection
- conductive
- green ceramic
- temperature sensor
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 100
- 238000005538 encapsulation Methods 0.000 claims abstract description 4
- 230000005611 electricity Effects 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 claims description 58
- 239000007788 liquid Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 238000004080 punching Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000000462 isostatic pressing Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 10
- 230000033228 biological regulation Effects 0.000 abstract description 6
- 230000009467 reduction Effects 0.000 abstract description 4
- 238000002788 crimping Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 208000003443 Unconsciousness Diseases 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an improvement of LED packaging, in particular to a COB packaging of a buried thermal protection IC and a packaging method thereof, which adopts the following technical scheme: COB encapsulation of landfill thermal protection IC, LTCC base plate, thermal protection IC, temperature sensor, LED chip, LTCC base plate is folded the crimping by more than two-layer green ceramic piece and is formed, thermal protection IC, temperature sensor sets up in LTCC base plate, the LED chip is fixed on LTCC base plate, only separate one deck green ceramic piece between temperature sensor and the LED chip, thermal protection IC, temperature sensor electricity is connected, only separate one deck green ceramic piece between temperature sensor and the LED chip, when the base plate temperature exceeds limiting temperature, feedback the information to thermal protection IC by temperature sensor, thermal protection IC carries out hierarchical decline regulation and control to the output current, both guaranteed in time to reduce the temperature of LED light source, avoid too fast reduction output current to lead to the luminance change that the human eye perceivable, reach overheat protection's purpose in unknowingly, fundamentally solve the too high problem of chip temperature.
Description
Technical Field
The invention relates to the field of LED packaging, in particular to a COB packaging of a buried thermal protection IC and a packaging method thereof.
Background
The light-emitting diode (LIGHT EMITTING diode) is taken as an electroluminescent device, can directly convert electric energy into light energy, has a series of advantages of green environmental protection, short response time, low cost, high light-emitting brightness, long service life and the like, and is known as a green illumination energy source in the 21 st century.
Along with the rapid development of small-pitch LEDs, COB (Chip On Board) packages are increasingly favored by the LED industry. Compared with the traditional SMD package, the COB packaged LED light source is an integrally packaged area light source. COB encapsulation is to adhere an LED chip to a PCB substrate by conductive or non-conductive silver adhesive, and then wire bonding is carried out to realize electrical connection, so that the processes of a bracket, wire bonding and the like are omitted, the technical problem of reflow soldering is not required, the cost is reduced, and the reliability is improved. The existing COB package can divide one large chip into more than ten small chips, so that the uniformity of light distribution is fully improved, but the requirement on heat dissipation is higher.
The power used for light emission by the LED chip is only a small fraction of the input power, leaving a large fraction of the electrical power to be converted into thermal energy. The problem of the excessively high temperature of the LED chip cannot be fundamentally solved only by external heat dissipation. At present, a PCB copper foil circuit layer is generally attached to a metal substrate in an LED package with an overheat protection function, an LED array is arranged in the center, a patch temperature sensor is arranged on the periphery of the LED package, the temperature sensor senses the temperature of the substrate, and when the temperature exceeds a limiting temperature, signals are transmitted to a heat protection IC, so that power-off protection is realized on an LED chip, and junction temperature is reduced.
The packaging method adopted by the prior art can achieve the purpose of temperature control to a certain extent, but because a certain distance exists between the temperature sensor and the LED chip and protective glue with low heat conductivity exists between the temperature sensor and the LED chip, the temperature change of the sensor is not easy to induce. And when the temperature of the substrate is too high, the power-off protection is adopted, so that the LED light source is not beneficial to the application in daily life.
Disclosure of Invention
The invention aims to provide a COB package of a buried thermal protection IC and a packaging method thereof, wherein the thermal protection IC and a temperature sensor are buried in a substrate, only one layer of green ceramic chip with a thickness of about 50um is arranged between the temperature sensor and an LED chip, so that the temperature change of the LED chip can be sensitively and rapidly sensed, when the temperature exceeds a limiting temperature, the temperature sensor transmits signals to the thermal protection IC, the thermal protection IC carries out graded descending regulation and control on output current, the temperature of an LED light source is timely reduced, the brightness change perceived by human eyes due to excessively fast reduction of the output current is avoided, the flickering sense is generated, the purpose of overheat protection is achieved in an unconscious way, the service life of the LED is further prolonged, the light attenuation is reduced, and the reliability of the light source is improved.
In order to achieve the above purpose, the invention adopts the following technical scheme: the LED chip is fixed on the LTCC substrate, only one layer of green ceramic chip is separated between the temperature sensor and the LED chip, and the thermal protection IC is respectively and electrically connected with the LED chip and the temperature sensor.
Further, the LTCC substrate is printed with electrical interconnection wires made of conductive paste, and the LED chip is electrically connected with the electrical interconnection wires on the surface of the LTCC substrate through gold wires.
Further, the LTCC substrate is provided with element placing through holes and conductive through holes, and conductive materials are injected into the conductive through holes.
Preferably, the thickness of the top layer green ceramic tile is 40-60um.
Further, the surface of the LED chip is covered with protective glue and fluorescent powder glue.
Further, the LTCC substrate includes a top layer green ceramic tile, a first functional green ceramic tile, and a second functional green ceramic tile that are sequentially disposed from top to bottom, the top layer green ceramic tile is provided with at least one first conductive via, the placement ceramic tile is provided with at least one second conductive via, the element placement via is provided with at least one third conductive via, and the element placement via can accommodate the thermal protection IC and the temperature sensor.
Further, a third functional green ceramic chip is further included between the first functional green ceramic chip and the second functional green ceramic chip, at least four fourth conductive through holes are formed in the third functional green ceramic chip, two fourth conductive through holes are electrically connected with the anode and the cathode of the thermal protection IC and are matched with the third conductive through holes in position, and the other two fourth conductive through holes are electrically connected with the current output end and the input end of the thermal protection IC and are matched with the second conductive through holes in position.
Further, the upper surface and the lower surface of the top layer raw ceramic chip are printed with electrical interconnection wires made of conductive paste, a thermal protection IC and a temperature sensor are placed on the lower surface of the top layer raw ceramic chip and fixed by using die bond adhesive, the electrical interconnection wires are sequentially communicated with a power input end and a power output end of the thermal protection IC, a first conductive through hole is connected with a second conductive through hole, and the number of the second conductive through hole is the same as that of the third conductive through hole, and the positions of the second conductive through hole and the third conductive through hole are matched.
The invention provides a packaging method, which comprises the following steps:
Punching the green ceramic chip by adopting a laser technology or a mechanical punching technology to obtain a component placement through hole and a conductive through hole;
Aligning the conductive through holes of the upper and lower adjacent layers of green ceramic chips;
A step of firmly pasting the green ceramic chips by adopting mechanical shaft pressure or liquid isostatic pressing to obtain a prefabricated substrate;
the current output end and the input end of the thermal protection IC are electrically connected with the electrical interconnection wire through the conductive path;
the positive and negative electrodes of the thermal protection IC are electrically connected with an external power supply through a conductive path;
printing conductive paste on the upper surface and/or the lower surface of the top green ceramic chip by adopting a screen printing or mask printing method to manufacture an electrical interconnection wire;
Filling the insulating heat conduction into the component placement through holes of the prefabricated substrate and solidifying the component placement through holes;
A step of firmly adhering the prefabricated substrate and the top layer green ceramic chip by adopting mechanical axial pressure or liquid isostatic pressure to obtain an LTCC substrate;
the anode and the cathode of the LED chip are interconnected with the electric interconnection wire through gold wires;
Sequentially coating protective glue and fluorescent powder glue on the surface of the LED chip by adopting spin coating, spray coating or printing and other methods;
and mounting the peripheral optical component on the LTCC substrate to obtain the COB package of the embedded thermal protection IC.
Further, the step of firmly adhering the functional green ceramic chip by mechanical axial pressure or liquid isostatic pressing to obtain the prefabricated substrate comprises the following steps:
Placing the thermal protection IC and the temperature sensor on the lower surface of the top-layer green ceramic chip, fixing the thermal protection IC and the temperature sensor by using a die bond adhesive, and electrically connecting the thermal protection IC and the temperature sensor;
filling the conductive through holes with conductive materials to form conductive paths;
And (3) firmly adhering the first functional green ceramic chip and the second functional green ceramic chip by adopting mechanical axial pressure or liquid isostatic pressure to obtain the prefabricated substrate.
As another embodiment, the step of firmly adhering the functional green ceramic tile to obtain the prefabricated substrate by mechanical axial pressure or liquid isostatic pressure comprises the following steps:
Aligning the two ends of the conductive through holes of the first functional raw ceramic chip, the third functional raw ceramic chip and the second functional raw ceramic chip, and filling conductive materials to form conductive paths;
a step of firmly adhering the first functional raw ceramic chip, the third functional raw ceramic chip and the second functional raw ceramic chip by adopting mechanical shaft pressure or liquid isostatic pressure;
And placing a thermal protection IC and a temperature sensor in the element placing through hole, wherein the thermal protection IC is electrically connected with the temperature sensor, and the temperature sensor is positioned at the periphery of the thermal protection IC.
The invention has the advantages that: 1. the packaging mode of the landfill method is adopted, so that only one layer of green ceramic chip (the thickness is about 50 um) is arranged between the temperature sensor and the LED chip, the temperature of the chip can be sensitively sensed, the temperature of the chip is conducted into the substrate, the temperature sensor can sensitively sense the temperature of the substrate, when the temperature of the substrate exceeds the limiting temperature, the temperature sensor feeds information back to the thermal protection IC, the thermal protection IC carries out graded descending regulation and control on the output current, the temperature of an LED light source is ensured to be reduced in time, the brightness change perceived by human eyes due to the excessively fast reduction of the output current is avoided, the purpose of overheat protection is achieved unknowingly, and the problem of excessively high temperature of the chip is fundamentally solved;
The preparation process of the LTCC substrate is mature, and the thermal protection IC, the temperature sensor and the filling metal wires are synchronously installed in the manufacturing process, so that the process difficulty and the production cost can be reduced.
Drawings
FIG. 1 is a cross-sectional view of the structure of example 1;
FIG. 2 is an exploded view of the LTCC substrate of example 1;
FIGS. 3a and b are cross-sectional and top views of the prefabricated substrate of example 1;
FIG. 4 is a schematic view of the component mounting of example 1;
FIG. 5 is a schematic diagram of the electrical connection of example 1;
FIGS. 6a, b, c are cross-sectional views of LTCC substrates, upper surfaces of the substrates, and lower surfaces of the substrates of example 1;
FIG. 7 is a schematic diagram showing the arrangement of printed circuits and LED chips on the upper surface of the LTCC substrate of example 1;
FIG. 8 is a cross-sectional view of the LED light source COB package of example 1;
FIG. 9 is an exploded view of the LTCC substrate of example 2;
FIGS. 10a and b show the top and bottom surfaces of the top green tile of example 2;
FIG. 11 is a schematic view of the mounting of the lower surface element of the top green tile of example 2;
fig. 12 is a structural sectional view of embodiment 2.
LTCC substrate, 2, thermal protection IC,3, temperature sensor, 4, LED chip, 5, electrical interconnect wire, 6, protective paste, 7, phosphor paste, 8, conductive material, 9, optical element, 10, gold wire, 11, top layer green tile, 12, first functional green tile, 13, second functional green tile, 14, third functional green tile, 91, first conductive via, 92, second conductive via, 93, third conductive via, 94, element placement via, 95, fourth conductive via, 121, insulating thermally conductive resin.
Detailed Description
Example 1:
The COB package of the landfill thermal protection IC2 of the embodiment 1 of the invention is shown in figures 1-8, and comprises an LTCC substrate 1, a thermal protection IC2, a temperature sensor 3 and an LED chip 4, wherein the LTCC substrate 1 comprises a top layer of green ceramic chips 11, a first functional green ceramic chip 12, a third functional green ceramic chip 14 and a second functional green ceramic chip 13 which are sequentially arranged from top to bottom, the upper surface and the lower surface of the top layer of green ceramic chips 11 are printed with electrical interconnection wires 5 made of conductive paste, the thermal protection IC2 and the temperature sensor 3 are placed on the lower surface of the top layer of green ceramic chips 11, the thermal protection IC2 and the temperature sensor 3 are fixed by using a die bonding adhesive, the electrical interconnection wires 5 are sequentially communicated with a power input end and a power output end of the thermal protection IC2, the first conductive through holes 91 are connected, the second conductive through holes 92 and the third conductive through holes 93 are the same in number and are matched with the thermal protection IC2 and the temperature sensor 3 in the LTCC substrate 1, the LED chip 4 is fixed on the LTCC substrate 1, the temperature sensor chip 4 is connected with the LED chip 4 through the LTCC substrate 10 and the LED chip 4, the temperature sensor chip 4 is connected with the LED chip 4, and the temperature sensor chip 4 is connected with the LED chip 4.
The third functional green tile 14 is provided with four fourth conductive vias 95, two fourth conductive vias 95 are electrically connected to the positive and negative electrodes of the thermal protection IC2 and aligned with the third conductive vias 93, and the other two fourth conductive vias 95 are electrically connected to the current output, input terminals of the thermal protection IC2 and aligned with the second conductive vias 92.
The element placing through holes 94 and the conductive through holes can be obtained by punching on the green ceramic chip by a mechanical punching technology or a laser punching technology, the shape of the through holes can be one or more of a circle, a rectangle, a circular ring and the like, the through hole precision of the green ceramic chip can be ensured by punching by the laser technology, and the phenomena of uneven slurry hanging on the wall of the through holes, residual slurry on the back surface, hole blocking and the like are prevented.
The temperature sensor 3 senses the temperature of the LTCC substrate 1, and when the temperature of the LTCC substrate 1 exceeds a limited temperature, a signal is transmitted to the thermal protection IC2, and the temperature sensor 3 may be one or more of a patch type temperature sensor, a magnetic temperature sensor, a screw thread fixing temperature sensor, or the like
Further, the LTCC substrate 1 is printed with an electrical interconnection wire 5 made of conductive paste, the arrangement mode of the electrical interconnection wire 5 is specifically adjusted according to the arrangement mode of the LED chip 4, and the anode and the cathode of the LED chip 4 are electrically connected with the electrical interconnection wire 5 on the surface of the LTCC substrate 1 through a gold wire 10; the LTCC substrate 1 is provided with element placing through holes 94 and conductive through holes, and conductive materials 8 are injected into the conductive through holes; by injecting a conductive material 8 into the conductive through hole, the conductive material 8 is copper, aluminum, gold or alloy metal liquid as a vertical passage between the green ceramic chips.
Furthermore, the thermal protection IC2 can perform graded descending regulation and control on the output current, so that the temperature of the LED chip 4 is reduced in time, and meanwhile, the problem that the output current is reduced too fast to cause the change of brightness perceived by human eyes is avoided, and the purpose of overheat protection is achieved unknowingly.
The protective glue 6 is epoxy resin or silica gel, the fluorescent powder glue 7 is a composite material obtained by mixing silica gel and fluorescent powder according to a certain proportion, and the silica gel and the fluorescent powder are sequentially coated on a chip in a spraying, spin coating or deposition mode to obtain a fluorescent powder layer far away from coating. The epoxy resin or the silica gel is adopted as the protective gel 6, so that the luminous flux of the LED can be increased, the viscosity is low, the defoaming is easy, the LED is suitable for encapsulation and compression molding, the LED has better durability and reliability, the effect of far away from coating of fluorescent powder which is the same as that of other complex far away coating technologies can be realized by adopting simple modes such as spraying, spin coating or deposition, and the like, and meanwhile, the LED meets the optical requirements of illumination uniformity, high luminous efficiency, color temperature control, color uniformity control and the like.
Preferably, the thickness of the top layer green ceramic chip 11 is 40-60um, preferably 50um, and the packaging mode of the landfill method is adopted, so that only one layer of 50um green ceramic chip is arranged between the temperature sensor 3 and the LED chip 4, the temperature change of the LED chip 4 can be sensitively sensed, when the temperature exceeds the limiting temperature, the temperature sensor 3 transmits signals to the thermal protection IC2, the thermal protection IC2 carries out graded descending regulation and control on the output current, the temperature of the LED light source is ensured to be reduced in time, the brightness change perceived by human eyes due to the fact that the output current is reduced too fast is avoided, the purpose of overheat protection is achieved in an unconscious manner, the service life of the LED is further prolonged, the light attenuation is reduced, and the reliability of the light source is improved.
The invention also discloses a packaging method of the COB package of the landfill thermal protection IC2, which comprises the following steps:
Punching the green ceramic chip by using a laser technique or a mechanical punching technique to obtain a component placement through hole 94 and a conductive through hole; the conductive through holes of the upper and lower adjacent layers of green ceramic chips are aligned, the conductive through holes are filled with a conductive material 8 such as a metal liquid of copper, aluminum, gold or alloy, and a vertical conductive path is formed after the conductive through holes are cooled, and the component placement through holes 94 are used for placing the thermal protection IC2 and the temperature sensor 3, so that the conductive material 8 is not filled into the through holes.
The first functional green ceramic chip 12, the third functional green ceramic chip 14 and the second functional green ceramic chip 13 are firmly stuck by mechanical axial pressure or liquid isostatic pressure to obtain a prefabricated substrate, the thermal protection IC2 and the temperature sensor 3 are placed in an element placing through hole 94 of the prefabricated substrate, wherein the thermal protection IC2 is positioned in the center of the element placing through hole 94, the temperature sensor 3 is positioned at the periphery, the positions of the protection IC and the temperature sensor 3 can be correspondingly adjusted according to requirements, the number of the temperature sensors 3 can be 1 or more, the anode and the cathode of the thermal protection IC2 are electrically connected with an external power supply through a conductive path, the insulating heat conducting resin 121 is filled into the element placing through hole 94 of the prefabricated substrate and solidified, and the top layer green ceramic chip 11 and the prefabricated substrate are firmly stuck by mechanical axial pressure or liquid isostatic pressure to obtain the LTCC substrate 1.
And printing conductive paste on the upper surface of the LTCC substrate 1 by adopting a screen printing or mask printing method to manufacture the electrical interconnection wires 5, wherein the arrangement mode of the electrical interconnection wires 5 is specifically adjusted according to the arrangement mode of the LED chips 4, and finally, the anode and the cathode of the LED chips 4 are electrically connected with the electrical interconnection wires 5 through gold wires 10.
And sequentially coating a protective adhesive 6 and a fluorescent powder adhesive 7 on the surface of the LED chip 4 by adopting spin coating, spray coating or printing and the like, and finally installing a peripheral optical element 9 to finish the COB package of the landfill thermal protection IC 2.
Example 2:
this embodiment is substantially the same as embodiment 1 except that: as shown in fig. 9-12, the LTCC substrate 1 includes a top layer green ceramic tile 11, a first functional green ceramic tile 12, and a second functional green ceramic tile 13 sequentially disposed from top to bottom, the top layer green ceramic tile 11 is provided with at least one first conductive via 91, the placement ceramic tile is provided with at least one second conductive via 92 and the component placement via 94, the second functional green ceramic tile 13 is provided with at least one third conductive via 93, the thermal protection IC2 and the temperature sensor 3 are placed on the lower surface of the top layer green ceramic tile 11, and the component placement via 94 can accommodate the thermal protection IC2 and the temperature sensor 3.
In the embodiment, the upper surface and the lower surface of the top layer green ceramic chip 11 are printed with the electrical interconnection wires 5 made of conductive paste, wherein the arrangement mode of the electrical interconnection wires 5 on the upper surface of the top layer green ceramic chip 11 is specifically adjusted according to the arrangement mode of the LED chips 4, and finally, the positive and negative electrodes of the LED chips 4 are interconnected with the electrical interconnection wires 5 through gold wires 10; the arrangement mode of the electrical interconnection wires 5 on the lower surface of the top layer green ceramic chip 11 is specifically adjusted according to the position of the thermal protection IC2, the thermal protection IC2 and the temperature sensor 3 are placed on the lower surface of the top layer green ceramic chip 11, the thermal protection IC2 and the temperature sensor 3 are interconnected through gold wires 10 by using die bond adhesive for fixation.
Because the thermal protection IC2 and the temperature sensor 3 are arranged on the lower surface of the top-layer raw ceramic chip 11, a third functional raw ceramic chip 14 is not needed to be additionally arranged, and the production cost and the manufacturing procedure are saved; meanwhile, heat emitted by the LED chip 4 is transferred along the direction perpendicular to the wall surface, the temperature sensor 3 arranged on the lower surface of the top green ceramic chip 11 can sense the temperature change of the LED chip 4 more sensitively in a heat conduction mode, when the temperature exceeds a limiting temperature, the temperature sensor 3 transmits signals to the heat protection IC2, the heat protection IC2 carries out graded descending regulation and control on output current, so that the temperature of an LED light source is guaranteed to be reduced in time, the brightness change perceived by human eyes due to excessively fast reduction of the output current is avoided, the purpose of overheat protection is achieved in unknowing, the service life of the LED is further prolonged, the light attenuation is reduced, and the reliability of the light source is improved.
The packaging manner of this embodiment is basically the same as that of embodiment 1, except that:
the step of firmly pasting the functional green ceramic chips by adopting mechanical axial pressure or liquid isostatic pressing to obtain the prefabricated substrate comprises the following steps:
Printing conductive paste on the upper and lower surfaces of the top green ceramic tile 11 by adopting a screen printing or mask printing method to manufacture the electrical interconnection wires 5; placing the thermal protection IC2 and the temperature sensor 3 on the lower surface of the top layer green ceramic chip 11, fixing the thermal protection IC2 and the temperature sensor 3 by using die bond adhesive, and electrically connecting the thermal protection IC2 and the temperature sensor 3; filling the conductive through holes with a conductive material 8 to form conductive paths; the first functional green ceramic chip 12 and the second functional green ceramic chip 13 are firmly adhered by adopting mechanical axial pressure or liquid isostatic pressure to obtain a prefabricated substrate.
Of course, the above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, so that all equivalent modifications made in the principles of the present invention are included in the scope of the present invention.
Claims (8)
1. The utility model provides a COB encapsulation of landfill thermal protection IC, includes LTCC base plate (1), thermal protection IC (2), temperature sensor (3) and LED chip (4), its characterized in that: the utility model discloses a temperature sensor, including LTCC base plate (1), temperature sensor (3) are in LTCC base plate (1), temperature sensor (3) are fixed in on LTCC base plate (1), only separate one deck green ceramic piece between temperature sensor (3) and LED chip (4), thermal protection IC (2) are connected with LED chip (4) and temperature sensor (3) electricity respectively, LTCC base plate (1) are including top layer green ceramic piece (11), first function green ceramic piece (12) and second function green ceramic piece (13) that set gradually from top to bottom, top layer green ceramic piece (11) set up at least one first conductive through-hole (91), first function green ceramic piece (12) set up at least one second conductive through-hole (92) and component placement through-hole (94), second function green ceramic piece (13) set up at least one third conductive through-hole (93), component placement through-hole (94) can be held IC (2) and temperature sensor (40-60) thickness green ceramic piece.
2. The COB package of claim 1 wherein the thermal protection IC is embedded, wherein: the LTCC substrate (1) is printed with electrical interconnection wires (5) made of conductive paste, and the LED chip (4) is electrically connected with the electrical interconnection wires (5) on the surface of the LTCC substrate (1).
3. The COB package of claim 2 wherein the thermal protection IC is embedded, wherein: still include third function green ceramic chip (14) between first function green ceramic chip (12) and the second function green ceramic chip (13), third function green ceramic chip (14) set up four at least electrically conductive through-holes (95), and wherein two electrically conductive through-holes (95) are connected and are matched with third electrically conductive through-hole (93) position with the positive negative pole electricity of thermal protection IC (2), and two other electrically conductive through-holes (95) are connected and are matched with second electrically conductive through-hole (92) position with thermal protection IC (2) electric current output, input electricity respectively.
4. A COB package as claimed in claim 3, wherein the thermal protection IC is embedded by: the upper surface and the lower surface of the top layer raw ceramic chip (11) are printed with electric interconnection wires (5) made of conductive slurry, a thermal protection IC (2) and a temperature sensor (3) are placed on the lower surface of the top layer raw ceramic chip (11), the thermal protection IC is fixed by using die bond adhesive, the electric interconnection wires (5) are sequentially communicated with a power input end, a power output end, a first conductive through hole (91) and a second conductive through hole (92) of the thermal protection IC (2), and the second conductive through hole (92) and the third conductive through hole (93) are identical in number and matched in position.
5. The COB package of claim 4 wherein the thermal protection IC is embedded, wherein: and the surface of the LED chip (4) is covered with a protective adhesive (6) and a fluorescent powder adhesive (7).
6. A packaging method for preparing the COB package of the buried thermal protection IC of claim 1, characterized by: the method comprises the following steps:
① A step of punching the green ceramic chip by a laser technique or a mechanical punching technique to obtain a component placement through hole (94) and a conductive through hole;
② Aligning the conductive through holes of the upper and lower adjacent layers of green ceramic chips;
③ The step of firmly pasting the functional green ceramic chips by adopting mechanical axial pressure or liquid isostatic pressing to obtain the prefabricated substrate comprises the following steps:
the current output end and the input end of the thermal protection IC (2) are electrically connected with the electrical interconnection wire (5) through the conductive path;
the positive and negative electrodes of the thermal protection IC (2) are electrically connected with an external power supply through a conductive path;
filling the insulating heat-conducting resin into the component placement through holes (94) of the prefabricated substrate and solidifying the insulating heat-conducting resin;
Printing conductive paste on the upper surface and/or the lower surface of the top green ceramic chip (11) by adopting a screen printing or mask printing method to manufacture an electrical interconnection wire (5);
A step of firmly adhering the prefabricated substrate and the top layer green ceramic chip (11) by adopting mechanical axial pressure or liquid isostatic pressure to obtain the LTCC substrate (1);
④ The anode and the cathode of the LED chip (4) are interconnected with the electrical interconnection wire (5) through gold wires (10);
⑤ Sequentially coating a protective adhesive (6) and a fluorescent powder adhesive (7) on the surface of the LED chip (4) by adopting a spin coating, spray coating or printing method;
⑥ And mounting the peripheral optical element (9) on the LTCC substrate (1) to obtain the COB package of the landfill thermal protection IC (2).
7. A landfill according to claim 6a packaging method of a COB package for thermally protecting an IC, the method is characterized in that: the step of firmly pasting the functional green ceramic chips by adopting mechanical axial pressure or liquid isostatic pressing to obtain the prefabricated substrate comprises the following steps:
placing the thermal protection IC (2) and the temperature sensor (3) on the lower surface of the top layer green ceramic chip (11), fixing by using a die bond adhesive, and electrically connecting the thermal protection IC (2) and the temperature sensor (3);
a step of filling the conductive via with a conductive material (8) to form a conductive path;
and (3) firmly adhering the first functional raw ceramic chip (12) and the second functional raw ceramic chip (13) by adopting mechanical shaft pressure or liquid isostatic pressure.
8. A landfill according to claim 7a packaging method of a COB package for thermally protecting an IC, the method is characterized in that: the step of firmly pasting the functional green ceramic chips by adopting mechanical axial pressure or liquid isostatic pressing to obtain the prefabricated substrate comprises the following steps:
Aligning the two ends of the conductive through holes of the first functional raw ceramic chip (12), the third functional raw ceramic chip (14) and the second functional raw ceramic chip (13), and filling the conductive material (8) to form a conductive path;
Placing the thermal protection IC (2) and the temperature sensor (3) in the element placing through hole (94), wherein the thermal protection IC (2) is electrically connected with the temperature sensor (3), and the temperature sensor (3) is positioned at the periphery of the thermal protection IC (2);
and firmly adhering the first functional green ceramic chip (12), the third functional green ceramic chip (14) and the second functional green ceramic chip (13) by adopting mechanical axial pressure or liquid isostatic pressure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178602.6A CN107768366B (en) | 2017-11-23 | 2017-11-23 | COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof |
| PCT/CN2017/114920 WO2019100446A1 (en) | 2017-11-23 | 2017-12-07 | Cob packaging for embedding thermal protection ic and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178602.6A CN107768366B (en) | 2017-11-23 | 2017-11-23 | COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107768366A CN107768366A (en) | 2018-03-06 |
| CN107768366B true CN107768366B (en) | 2024-08-20 |
Family
ID=61278701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711178602.6A Active CN107768366B (en) | 2017-11-23 | 2017-11-23 | COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107768366B (en) |
| WO (1) | WO2019100446A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110275558A (en) * | 2019-06-27 | 2019-09-24 | 北京淳中科技股份有限公司 | A kind of method, apparatus of chip controls, equipment and medium |
| CN110456574A (en) * | 2019-09-20 | 2019-11-15 | 青岛海信电器股份有限公司 | A kind of display device and backlight module |
| CN112416587A (en) * | 2020-11-20 | 2021-02-26 | 北京灵汐科技有限公司 | Temperature control method of on-chip structure and layout method of on-chip structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376697A (en) * | 2010-08-27 | 2012-03-14 | 苏州科医世凯半导体技术有限责任公司 | High color rendering white light LED (Light Emitting Diode) module |
| CN102881602A (en) * | 2012-10-18 | 2013-01-16 | 贵州振华风光半导体有限公司 | Integrating method of working temperature controllable multi-chip component |
| CN207542245U (en) * | 2017-11-23 | 2018-06-26 | 广东金源照明科技股份有限公司 | A kind of COB encapsulation for filling Thermal protection IC |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100397669C (en) * | 2006-08-07 | 2008-06-25 | 陈盈君 | LED light source packaging structure for low-temp. coburning ceramic by thermoelectric separating design |
| CN201995890U (en) * | 2011-02-23 | 2011-10-05 | 牛永立 | Nonradiative electromagnetic dining table |
| US8895998B2 (en) * | 2012-03-30 | 2014-11-25 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components and methods |
| KR101221492B1 (en) * | 2012-02-09 | 2013-01-14 | 주식회사 웨이브인 | Led and led lighting having thermistor for temperature control and the manufacturing method |
| CN202888170U (en) * | 2012-10-18 | 2013-04-17 | 贵州振华风光半导体有限公司 | Multi-chip assembly with controllable operating temperature |
| CN102983123A (en) * | 2012-11-08 | 2013-03-20 | 矽光光电科技（上海）有限公司 | Light-emitting diode (LED) integration module provided with upper and lower electrodes LED chip ceramics substrate and integration technique thereof |
| CN107192470B (en) * | 2017-06-27 | 2023-06-20 | 深圳刷新生物传感科技有限公司 | Integrated thermosensitive circuit and manufacturing method thereof |
-
2017
- 2017-11-23 CN CN201711178602.6A patent/CN107768366B/en active Active
- 2017-12-07 WO PCT/CN2017/114920 patent/WO2019100446A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376697A (en) * | 2010-08-27 | 2012-03-14 | 苏州科医世凯半导体技术有限责任公司 | High color rendering white light LED (Light Emitting Diode) module |
| CN102881602A (en) * | 2012-10-18 | 2013-01-16 | 贵州振华风光半导体有限公司 | Integrating method of working temperature controllable multi-chip component |
| CN207542245U (en) * | 2017-11-23 | 2018-06-26 | 广东金源照明科技股份有限公司 | A kind of COB encapsulation for filling Thermal protection IC |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019100446A1 (en) | 2019-05-31 |
| CN107768366A (en) | 2018-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101049698B1 (en) | Led array module and manufacturing method thereof | |
| TW200923262A (en) | High heat dissipation optic module for light emitting diode and its manufacturing method | |
| KR100977260B1 (en) | High Power LED Package and Manufacturing Method Thereof | |
| CN102388473A (en) | Light-emitting diode package | |
| CN103456729A (en) | LED display screen | |
| CN102162632A (en) | Lighting apparatus | |
| KR101181224B1 (en) | Led package and fabricating method of the same | |
| CN107393911B (en) | Energy-saving RGB-LED packaging body, packaging module and display screen thereof | |
| US20120043886A1 (en) | Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module | |
| JP2005223216A (en) | Light emitting light source, illuminator, and display unit | |
| US20110084612A1 (en) | Hybrid chip-on-heatsink device and methods | |
| CN107768366B (en) | COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof | |
| CN103400833A (en) | Led module and manufacturing method thereof | |
| CN201868429U (en) | Embedded-type encapsulating structure of luminous diode | |
| CN102881806B (en) | Surface mounted device light emitting diode (SMD LED) unit and packaging method thereof | |
| CN201116697Y (en) | Light-emitting diode capable of 360 degree illuminating | |
| CN201149869Y (en) | LED encapsulation structure | |
| CN107785474A (en) | Light-emitting diode device and its preparation method | |
| CN203503708U (en) | Sapphire base LED encapsulation structure | |
| CN103545436B (en) | Process for sapphire-based LED encapsulation structure and method for packing thereof | |
| CN103367346A (en) | Novel high-power LED light source and implementation method thereof | |
| CN207542245U (en) | A kind of COB encapsulation for filling Thermal protection IC | |
| CN209133532U (en) | LED encapsulation module | |
| CN203038968U (en) | LED illumination module | |
| CN102938442B (en) | LED package unit and LED package system having same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 521000 D5-8-3 station of North Station West Road, Chaozhou economic development test area, Chaozhou, Guangdong (1-3) Applicant after: Guangdong Jinyuan solar energy Co.,Ltd. Address before: 521000 D5-8-3 station of North Station West Road, Chaozhou economic development test area, Chaozhou, Guangdong (1-3) Applicant before: GUANGDONG JINYUAN LIGHTING TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |