CN107740041A - Mask plate manufacturing method and mask plate - Google Patents
Mask plate manufacturing method and mask plate Download PDFInfo
- Publication number
- CN107740041A CN107740041A CN201711190767.5A CN201711190767A CN107740041A CN 107740041 A CN107740041 A CN 107740041A CN 201711190767 A CN201711190767 A CN 201711190767A CN 107740041 A CN107740041 A CN 107740041A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 239000011368 organic material Substances 0.000 claims description 25
- 238000002360 preparation method Methods 0.000 claims description 25
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000003848 UV Light-Curing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 abstract description 4
- 230000037303 wrinkles Effects 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 description 10
- 238000001704 evaporation Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 210000003195 fascia Anatomy 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application relates to the technical field of display, in particular to a manufacturing method of a mask plate and the mask plate. The manufacturing method of the mask plate comprises the following steps: obtaining a mask with a plurality of pixel openings, wherein each pixel opening is arranged into at least one rectangular pattern region, and the rectangular pattern region comprises a first region corresponding to a display region of the display panel and a second region except the first region; aligning the mask with a mask frame, and fixing the mask on the mask frame; and blocking each pixel open hole on the second area to form the mask plate. The technical scheme can relieve the condition that wrinkles are easily generated when the mask is stretched, thereby solving the problems of poor color mixing of the display panel and reduction of the product yield caused by the poor color mixing.
Description
Technical field
The application is related to display technology field, more particularly to the preparation method and mask plate of a kind of mask plate.
Background technology
At present, OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) generally use evaporation skill
Art prepares organic luminous layer.In the preparation process of display panel, deposition material is deposited on positioned at evaporation source by high temperature deposition
On the substrate of top, to make deposition material be needed according on design evaporation to specific position below substrate using high accuracy gold
Belong to mask plate, offer multiple pixel perforates on mask plate (i.e. high-precision metal mask plate), deposition material is opened by each pixel
Hole is deposited on TFT (Thin Film Transistor, thin film transistor (TFT)) substrate, to form the organic light emission of display panel
Layer, the organic luminous layer are located at the viewing area of display panel.
During mask plate is made, on mask the area of the pattern of each pixel perforate arrangement generally with required display surface
The viewing area of plate matches, such as：In viewing area during rounded grade profiled shape, the area of the pattern on the mask is also in circle
The profiled shapes such as shape, but there is the mask of special-shaped area of the pattern during throwing the net, the easy stress in edge of special-shaped area of the pattern
Uneven and produce fold, so as to cause the display panel of final molding to occur, colour mixture is bad, and product yield reduces.
The content of the invention
This application provides a kind of preparation method of mask plate and mask plate, can alleviate when mask is thrown the net and easily produce pleat
The situation of wrinkle, so as to solve thus the problem of caused display panel colour mixture is bad, and product yield reduces.
The application first aspect provides a kind of preparation method of mask plate, and the mask plate is used to make display panel,
The preparation method includes：
The mask with multiple pixel perforates is obtained, each pixel perforate is arranged at least one rectangular pattern field,
The rectangular pattern field include first area corresponding with the viewing area of the display panel and except the first area it
Outer second area；
The mask is aligned with solder mask frame, and the mask is fixed in the solder mask frame；
Each pixel perforate of the closure on the second area, to form the mask plate.
The application second aspect provides a kind of mask plate, and it uses the mask board manufacturing method system described in any of the above-described
Into the mask plate includes：
Solder mask frame；
Mask, the opposite end of the mask are fixed in the solder mask frame, and have multiple pixels on the mask
Perforate, each pixel perforate arrangement is at least one rectangular pattern field, and the rectangular pattern field includes and the display
First area corresponding to the viewing area of panel and the second area in addition to the first area；It is each on the second area
Filler is filled with the pixel perforate.
The technical scheme that the application provides can reach following beneficial effect：
The preparation method of mask plate provided herein, multiple pixel perforates, each pixel perforate are offered on mask
Being formed includes the rectangular pattern field of first area and second area, and after mask is fixed in solder mask frame, closure is located at
Each pixel perforate on second area, to form mask plate, the mask plate is used to make to have to be shown with first area identical
The display panel in region.It is rectangular by the way that the area of the pattern on the mask is designed, mask is being fixed on to the mistake of solder mask frame
Cheng Zhong, two sides being oppositely arranged are parallel with the draw direction of mask on the rectangular pattern field, another two sides being oppositely arranged
It is vertical with the draw direction of mask so that rectangular pattern field can be by more uniform tensile force, it is not easy to fold is produced, from
And the bad situation of the display panel colour mixture made by using this mask plate can be alleviated, improve product yield.
It should be appreciated that the general description and following detailed description of the above are only exemplary, this can not be limited
Application.
Brief description of the drawings
Fig. 1 is a kind of structural representation of mask plate provided in an embodiment of the present invention；
Fig. 2 is the structural representation of mask in a kind of mask plate provided in an embodiment of the present invention；
Fig. 3 is that each pixel perforate is blocked on the second area of mask in a kind of mask plate provided in an embodiment of the present invention
Schematic diagram；
Fig. 4 is that each pixel perforate is blocked on the second area of mask in a kind of mask plate provided in an embodiment of the present invention
Enlarged diagram；
Fig. 5 is the structural representation of another mask plate provided in an embodiment of the present invention；
Fig. 6 is a kind of schematic flow sheet of the preparation method of mask plate provided in an embodiment of the present invention；
Fig. 7 is the schematic flow sheet of the preparation method of another mask plate provided in an embodiment of the present invention.
Reference：
10- mask plates；
12- solder mask frames；
120- frame bodies；
122- support rods；
14- masks；
140- pixel perforates；
The hole portions of 140a- first；
The hole portions of 140b- second；
142- rectangular pattern fields；
142a- first areas；
142b- second areas；
16- ink tubes；
160- ink；
18- blocks bar.
Accompanying drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the application
Example, and be used to together with specification to explain the principle of the application.
Embodiment
The application is described in further detail below by specific embodiment and with reference to accompanying drawing.
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with accompanying drawing and implementation
The present invention will be further described for example.However, example embodiment can be implemented in a variety of forms, and it is not understood as limited to
Embodiment set forth herein；On the contrary, these embodiments are provided so that the present invention more comprehensively and completely, and by example embodiment party
The design of formula is comprehensively communicated to those skilled in the art.Identical reference represents same or similar knot in figure
Structure, thus repetition thereof will be omitted.It is described in the present invention expression position and direction word, be using accompanying drawing as
The explanation that example is carried out, but can also make a change as needed, make change and be all contained in the scope of the present invention.The present invention
Accompanying drawing be only used for illustrate relative position relation, the thickness at some positions employs the plotting mode lavished praise on oneself in order to understand, attached
Thickness in figure does not represent the proportionate relationship of actual thickness.
It should be noted that detail is elaborated in the following description in order to fully understand the present invention.But this hair
Bright to be different from other manner described here with a variety of and be implemented, those skilled in the art can be without prejudice in the present invention
Similar popularization is done in the case of culvert.Therefore the present invention is not limited by following public embodiment.Specification is subsequently retouched
State to implement the better embodiment of the present invention, so described is for the purpose of illustrating the rule of the present invention, and is not used to
Limit the scope of the present invention.Protection scope of the present invention is worked as to be defined depending on appended claims institute defender.
The present invention is described in further detail below by specific embodiment and with reference to accompanying drawing.Wherein, in accompanying drawing
The thickness and shape of each part do not reflect the actual proportions of display device, and purpose is schematically illustrate present invention.Need
Bright, in the case where not conflicting, the feature in embodiment and embodiment in the present invention can be mutually combined.
As shown in Figure 1-Figure 3, Fig. 1 is a kind of structural representation of mask plate provided in an embodiment of the present invention, and Fig. 2 is this hair
The structural representation of mask in a kind of mask plate that bright embodiment provides, Fig. 3 is a kind of mask plate provided in an embodiment of the present invention
The schematic diagram that each pixel perforate is blocked on the second area of middle mask, the mask plate 10 can be used for making display panel, and this is aobvious
It can be organic electroluminescence display panel to show panel.Optionally, the mask plate 10 that the application provides is fine metal mask plate (FMM).
Optionally, the mask plate 10 can make the organic luminous layer in the viewing area of organic display panel, referred to herein
Organic luminous layer be organic display panel in be used for display image Organic Light Emitting Diode in luminescent layer.Certainly, at this
In other alternative embodiments of application, other in organic display panel can be made of the mask plate of the application offer as needed
Film layer, such as electron transfer layer, electron injecting layer, hole transmission layer, hole injection layer etc..
The mask plate 10 includes solder mask frame 12 and mask 14, and the mask 14 can be metal mask 14, and solder mask frame 12 can
For metal framework, that is to say, that the mask 14 and solder mask frame 12 can be made of metal material.Alternatively, the mask frame
Frame 12 is made of stainless steel material, and mask 14 is made of stainless steel or dilval Steel material, to improve solder mask frame
12 and the structural strength of mask 14, so as to improve the structural strength of whole mask plate 10.Wherein, solder mask frame 12 is covered for realization
The fixation of film 14, and mask 14 can make luminous organic material evaporation arrive specified location corresponding with array base palte (TFT substrate)
Or with the one-to-one position of pixel in viewing area.Specifically, display panel is included on array base palte and array base palte
Display function layer, multiple corresponding with pixel anodes that display function layer includes setting along the direction away from array base palte (or
Referred to as pixel electrode).Mask can make luminous organic material evaporation arrive position corresponding with anode, organic to be formed on anode
Luminescent layer.
Display panel can also include the pixel defining layer set up positioned at side of the anode away from array base palte, and pixel is fixed
Adopted layer includes the opening of multiple exposed anodes, and mask can be such that luminous organic material evaporation makes into the opening of pixel defining layer
Luminous organic material passes through opening and positive contact.
Specifically, mask 14 can be in list structure, and the opposite end of the mask 14 is fixed in solder mask frame 12.And mask
There are multiple pixel perforates 140 on 14, each pixel perforate 140 for the perforate corresponding with each pixel electrode on array base palte or
With the one-to-one perforate of pixel in viewing area.Arrived specifically, luminous organic material can be deposited by each pixel perforate 140
On each anode, to form organic luminous layer on each anode.
Wherein, each pixel perforate 140 arrangement on mask 14 is at least one rectangular pattern field 142, the rectangular patterns
Region 142 include first area 142a corresponding with the viewing area of display panel (i.e. in Fig. 2 circle or Fig. 3 in oval institute
Collar region) and second area 142b in addition to the 142a of first area；Filled in each pixel perforate 140 on second area 142b
There is filler, to block each pixel perforate 140 on second area 142b.
Specifically, in order to make above-mentioned mask plate 10, a kind of preparation method for mask plate 10 that the embodiment of the present invention provides,
Refer to Fig. 6, the schematic flow sheet of the preparation method of its mask plate 10 provided by the embodiment of the present invention, with reference to Fig. 1, Fig. 2,
Shown in Fig. 3 and Fig. 6, the preparation method includes：
Step 100, the mask 14 with multiple pixel perforates 140 is obtained, each pixel perforate 140 is arranged at least one square
Shape area of the pattern 142, the rectangular pattern field 142 include first area 142a corresponding with the viewing area of display panel and removed
Second area 142b outside the 142a of first area；
Step 102, mask 14 and solder mask frame 12 aligned, and mask 14 is fixed in solder mask frame 12；
Each pixel perforate 140 of step 104, closure on second area 142b, to form above-mentioned mask plate 10.
Because each pixel perforate 140 on the second area 142b of mask plate 10 is blocked, only on the 142a of first area
Each pixel perforate 140 be in connected state, therefore, using the mask plate 10 make display panel when, luminous organic material meeting
It is deposited by each pixel perforate 140 on the 142a of first area in TFT substrate and each phase of pixel perforate 140 on the 142a of first area
On corresponding each pixel electrode, to be formed on each pixel electrode corresponding with each pixel perforate 140 on the 142a of first area
Organic luminous layer, each organic luminous layer are located at the viewing area of display panel, the viewing area and first area 142a shape
It is identical.
Wherein, organic hair on each pixel electrode corresponding with each pixel perforate 140 on the 142a of first area is deposited
The color of luminescent material can be identical, also can be different, and the color of the luminous organic material may include red, green, blueness etc..
It is rectangular by the way that the area of the pattern on the mask 14 is designed, even if mask 14 is used to make circle, abnormity etc. no
The film pattern of regular shape, the area of the pattern on mask 14 are also the pattern of rule, i.e. rectangle.Used using mask 14
When, especially when throwing the net, edge stress is evenly.
In addition, in mask plate 14 in use, being the opposite end that mask 14 is captured by screen-tensioning machine, so that the phase of mask 14
Both ends and solder mask frame are aligned.Wherein, the screen-tensioning machine has multiple clamping parts, is covered using the clamping part crawl of screen-tensioning machine
The opposite end of film 14 is simultaneously stretched, and to ensure that mask 14 fully extends, realizes the contraposition with solder mask frame.By the way that this is covered
Area of the pattern design on film 14 is rectangular, during mask 14 is fixed on into solder mask frame 12, the rectangular pattern field
Two sides being oppositely arranged are parallel with the draw direction of mask 14 on 142.Optionally, another two sides being oppositely arranged and mask 14
Draw direction it is vertical.Therefore the rectangular pattern field 142 can be by more uniform tensile force, it is not easy to produces fold, delays
Solution is because mask fold causes multiple pixel perforates 140 situation corresponding with a pixel electrode in TFT substrate, so as to alleviate
Evaporation has the situation of the luminous organic material of different colours on pixel electrode, reduces the bad situation of display panel colour mixture, carries
High product yield.
In above-mentioned steps 100, the mask 14 with multiple pixel perforates 140 is obtained, is specially：
Mask 14 with multiple pixel perforates 140 is obtained by etching mode, that is to say, that each pixel is opened on mask 14
Hole 140 is formed by etching mode, and the pixel perforate 140 formed by etching mode can have certain oblique cone angle, to reduce
Luminous organic material is blocked, improves evaporation efficiency.
Specifically, as shown in figure 4, on second areas of the Fig. 4 for mask in a kind of mask plate provided in an embodiment of the present invention
The enlarged diagram that each pixel perforate is blocked, wherein, Fig. 4 is the schematic cross-section of mask, and cross-wise direction is perpendicular to mask
The direction of place plane.
Each pixel perforate 140 includes the first hole portion 140a and the second hole portion 140b.
Optionally, the first hole portion 140a is in bowl-shape that its opening size is progressively smaller until and the second hole portion from top to bottom
140b intersects, and is collectively forming evaporation perforate.Specifically, the first hole portion 140a internal face is cambered surface, i.e., refer to along the top surface of mask
To on the direction on another surface of mask, the slope of the first hole portion 140a side walls is less and less.So, it is located at second area in closure
In the case of each pixel perforate 140 on 142b, the cambered surface can reduce ink 160 and drop to the second hole portion from the first hole portion 140a
140b speed, alleviate the situation that ink overflows from each pixel perforate 140 on second area 142b.
Further, the first hole portion 140 has oblique cone angle Φ, specifically, between the top edge and lower edge of the first hole portion 140
Line and mask top surface between angle be oblique cone angle Φ, it is necessary to which explanation, the top surface of the mask 14 is mask in Fig. 4
Towards the face of ink tube 16 on 14；And the second hole portion 140b can be straight hole through hole, or its opening size from top to bottom by
Cumulative big through hole, so design cause the first hole portion 140a opening size to be gradually decrease to that required set is deposited from top to bottom
Count bore size W.It should be understood that in the different section of the first hole portion, same first hole portion has different oblique cone angles
Φ。
It should be noted that the first hole portion 140a can be reduced and luminous organic material is blocked, evaporation efficiency is improved, and
Second hole portion 140b height is smaller to be more advantageous to reduce luminous organic material is blocked, and optimal state is the first hole
Portion 140a directly penetrates whole mask 14.
Certainly, in other alternative embodiments of the present invention, the opening shape of the first hole portion and the second hole portion can be circle
The shapes such as shape, rectangle, chamfering rectangle.The side wall of first hole portion can be tapered plane, in the different section of the first hole portion, side wall
The inclined degree of the tapered plane formed can be different.
With reference to the step 102 shown in figure 6, mask 14 and solder mask frame 12 are aligned, are specially：
The opposite end of mask 14 is captured by screen-tensioning machine, so that the opposite end of mask 14 and solder mask frame 12 are carried out pair
Position.
Wherein, the screen-tensioning machine has multiple clamping parts, and the opposite end of mask 14 is captured simultaneously using the clamping part of screen-tensioning machine
Stretched, to ensure that mask 14 fully extends, realize the contraposition with solder mask frame 12.In the present embodiment, because screen-tensioning machine is grasped
Make simple, easy to use, automaticity is higher, small to the technology dependence of operating personnel, therefore, using screen-tensioning machine to covering
When film 14 is aligned with solder mask frame 12, the screen-tensioning machine can provide mask 14 constant tensile force, to ensure mask 14
Linearity and flatness, alleviate mask 14 and the situation of fold occur, improve the yield of mask plate 10.
In the case of mask 14 and solder mask frame 12 are using made of metal material, in above-mentioned steps 102, by mask 14
It is fixed in solder mask frame 12, is specially：
Mask 14 is fixed in solder mask frame 12 by welding procedure, on the one hand reduces mask 14 and solder mask frame 12
Fixation difficulty, the connective stability between mask 14 and solder mask frame 12 is on the other hand improved, so as to ensure mask plate 10
Structural strength.In above-mentioned steps 104, each pixel perforate 140 of the closure on second area 142b, it is specially：
Each pixel perforate 140 on second area 142b is blocked by printing technology, so design can essence
The first area 142a relative with viewing area really is defined, improves the producing efficiency of mask plate 10.
Specifically, as shown in fig. 7, the flow signal of the preparation method for another mask plate provided in an embodiment of the present invention
Figure, each pixel perforate 140 on second area 142b is blocked, specifically included by printing technology：
Step 1040, organic material dripped in each pixel perforate 140 on second area 142b；
Step 1042, organic material is solidified, so that organic material fills each pixel perforate 140.
So design can alleviate the situation about deforming of mask 14 during closure, and fold is produced so as to alleviate mask 14
Situation, improve the product yield of mask plate 10.In addition, printing device can be aligned and printed with the precision of pixel scale, from
And it can accurately define the profile of viewing area.Therefore, position (i.e. the firstth area of pixel perforate will can really be needed
Domain) with need fill get up pixel perforate (i.e. second area) accurately distinguish.
Alternatively, as shown in Figure 3 and Figure 4, organic material includes ink 160, that is to say, that by by ink tube 16
Ink 160 is dripped in each pixel perforate 140 on second area 142b, is then solidified again so that the oil after solidification
Ink 160 is filled in each pixel perforate 140 on second area 142b, because ink 160 has the characteristics of tack is good, therefore,
The ink 160 can uniformly, be stably filled in pixel perforate 140, in addition, the ink 160 also has the good density of pliability
The characteristics of low, therefore, when blocking each pixel perforate 140 on second area 142b using the ink 160 and it will not cause and cover
The deformation of film 14.
In above-mentioned steps 1042, organic material is solidified, is specially：
Organic material is solidified by UV curing process, UV (ultraviolet) curing process is a kind of low temperature process,
It can at room temperature solidify, reduce the difficulty of organic material solidification, and such a curing mode curing efficiency is fast and environmentally friendly.
As shown in figure 5, for the structural representation of another mask plate provided in an embodiment of the present invention, solder mask frame 12 includes
Frame body 120, the opposite end of mask 14 are fixed on frame body 120, wherein, in order to alleviate due to whole mask 14
The bad situation of display panel colour mixture that thickness thicker belts are come, therefore when making mask 14, generally by mask 14 design compared with
It is thin, but can so cause the self-strength of mask 14 to decline, when the opposite end of mask 14 is fixed on frame body 120,
The center section of the mask 14 can be with respect to mask 14 under the Action of Gravity Field of itself both ends it is sagging, so as to cause on mask 14
Rectangular pattern field 142 deform.Therefore, in order to avoid this case, the solder mask frame 12 in the present embodiment also includes support
Rib 122, the support rod 122 are fixed on frame body 120, to support mask 14, alleviate mask 14 occur it is sagging
Situation, and improve the structural strength of whole mask plate 10.
Alternatively, groove is may be provided with frame body 120, groove (not shown) is fixed in the end of mask 14
It is interior, by setting groove to be easy to position the end of mask 14, so as to improve determining for mask 14 and solder mask frame 12
Position installation effectiveness.
Under normal circumstances, mask 14 is in strip, and solder mask frame 12 is square, therefore in order to improve solder mask frame 12
Utilization rate, above-mentioned mask 14 may be provided with multiple, and each mask 14 is intervally arranged in solder mask frame 12 wherein, by mask frame
Multiple masks 14 are set on frame 12, can also make mask plate 10 that there are more rectangular pattern fields 142, therefore the mask can be improved
Plate 10 makes the efficiency of display panel, realizes the batch production of display panel.
In one embodiment of the application, the mask plate 10 also includes blocking bar 18, and the both ends for blocking bar 18 are fixed
On frame body 120, and block in the mutual stitching portion of each mask 14, for avoiding luminous organic material from being oozed in the stitching portion
Thoroughly.
Alternatively, as shown in Figures 2 and 3, above-mentioned first area 142a at least a portion is located at rectangular pattern field 142
Border on, so design can improve accountings of the first area 142a on rectangular pattern field 142, i.e.,：Increase first area
142a area, to make full use of rectangular pattern field 142 to form the viewing area of display panel.Wherein, in rectangular patterns
In the case that the area in region 142 is certain, first area 142a area increase, then second area 142b area reduce,
That is the quantity of the pixel perforate 140 on second area 142b is reduced, the use of filler can be so reduced, reduces production
Cost, but also the number of operations of each pixel perforate 140 on filler filling second area 142b can be reduced, improve mask
The producing efficiency of plate 10.
It should be noted that the borderline part on the 142a of first area positioned at rectangular pattern field 142 can be point,
It can also be straight line.
As display panel is in mobile unit (fascia), Intelligent worn device and other portable electric appts
The popularization of application, special-shaped display panel are favored by consumer.Compared to conventional display panels, special-shaped display panel it is main
Difference is that non-rectangle special shape is presented in its viewing area.Therefore, can be by the present embodiment in order to make special-shaped display panel
In first area 142a be designed as non-rectangular area, by using first area 142a be non-rectangular area mask plate 10 can
There is the display panel of non-rectangle viewing area at making.
In general, the application of circular display panel is more popularized.In order to prepare circular display panel, above-mentioned first area
142a can be border circular areas, as shown in Fig. 2 can be produced with circle using the mask plate 10 that first area 142a is border circular areas
The display panel of shape viewing area.
Wherein, four edges circle of this border circular areas and rectangular pattern field 142 are tangent, can make full use of rectangular pattern field
142 form the viewing area of display panel.
It should be noted that first area 142a is alternatively elliptic region, as shown in figure 3, and the elliptic region also may be used
It is tangent with four edges circle of rectangular pattern field 142, to make full use of rectangular pattern field 142 to form the display of display panel
Region.
The preferred embodiment of the application is the foregoing is only, is not limited to the application, for the skill of this area
For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair
Change, equivalent substitution, improvement etc., should be included within the protection domain of the application.
Claims (16)
1. a kind of preparation method of mask plate, the mask plate is used to make display panel, it is characterised in that the preparation method
Including：
The mask with multiple pixel perforates is obtained, each pixel perforate is arranged at least one rectangular pattern field, described
Rectangular pattern field includes first area corresponding with the viewing area of the display panel and in addition to the first area
Second area；
The mask is aligned with solder mask frame, and the mask is fixed in the solder mask frame；
Each pixel perforate of the closure on the second area, to form the mask plate.
2. preparation method according to claim 1, it is characterised in that the mask is being fixed on the solder mask frame
During, keep on the rectangular pattern field that at least two sides being oppositely arranged are parallel with the draw direction to the mask.
3. preparation method according to claim 1, it is characterised in that each institute of the closure on the second area
Pixel perforate is stated, is specially：
Each pixel perforate on the second area is blocked by printing technology.
4. preparation method according to claim 3, it is characterised in that described that secondth area will be located at by printing technology
Each pixel perforate on domain is blocked, and is specifically included：
Organic material is dripped in each pixel perforate on the second area；
The organic material is solidified, so that the organic material fills each pixel perforate.
5. preparation method according to claim 4, it is characterised in that
The organic material includes ink.
6. preparation method according to claim 5, it is characterised in that it is described that the organic material is solidified, specifically
For：
The organic material is solidified by UV curing process.
7. preparation method according to claim 1, it is characterised in that it is described to obtain the mask with multiple pixel perforates,
Specially：
Mask with multiple pixel perforates is obtained by etching mode.
8. preparation method according to claim 1, it is characterised in that described to carry out the mask and solder mask frame pair
Position, it is specially：
The opposite end of the mask is captured by screen-tensioning machine, so that the opposite end of the mask is carried out with the solder mask frame
Contraposition.
9. preparation method according to claim 1, it is characterised in that the mask is metal mask, the solder mask frame
For metal framework,
It is described that the mask is fixed in the solder mask frame, be specially：
The mask is fixed in the solder mask frame by welding procedure.
10. preparation method according to claim 1, it is characterised in that the first area is non-rectangular area.
11. preparation method according to claim 10, it is characterised in that the first area is border circular areas.
12. a kind of mask plate, it is characterised in that using the mask board manufacturing method system any one of claim 1 to 11
Into the mask plate includes：
Solder mask frame；
Mask, the opposite end of the mask are fixed in the solder mask frame, and have multiple pixel perforates on the mask,
Each pixel perforate arrangement is at least one rectangular pattern field, and the rectangular pattern field includes and the display panel
First area corresponding to viewing area and the second area in addition to the first area；Each picture on the second area
Filler is filled with plain perforate.
13. mask plate according to claim 12, it is characterised in that the mask be provided with it is multiple, between each mask
Every being arranged in the solder mask frame.
14. mask plate according to claim 12, it is characterised in that at least a portion of the first area is positioned at described
On the border of rectangular pattern field.
15. mask plate according to claim 14, it is characterised in that the first area is border circular areas, the circle
Region and four edges circle of the rectangular pattern field are tangent.
16. mask plate according to claim 12, it is characterised in that the solder mask frame includes frame body and brace rod
Bar, the opposite end of the mask are fixed on the frame body, and the support rod is fixed on the frame body, and
Support the mask.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711190767.5A CN107740041B (en) | 2017-11-24 | 2017-11-24 | Mask plate manufacturing method and mask plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711190767.5A CN107740041B (en) | 2017-11-24 | 2017-11-24 | Mask plate manufacturing method and mask plate |
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| CN107740041A true CN107740041A (en) | 2018-02-27 |
| CN107740041B CN107740041B (en) | 2019-08-02 |
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| CN201711190767.5A Active CN107740041B (en) | 2017-11-24 | 2017-11-24 | Mask plate manufacturing method and mask plate |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108492719A (en) * | 2018-03-20 | 2018-09-04 | 联想(北京)有限公司 | A kind of implementation method of abnormity display screen and special-shaped display screen |
| CN108517489A (en) * | 2018-04-28 | 2018-09-11 | 京东方科技集团股份有限公司 | Mask plate for OLED display panel vapor deposition |
| CN109097730A (en) * | 2018-09-29 | 2018-12-28 | 京东方科技集团股份有限公司 | A kind of mask plate and preparation method thereof |
| CN110117768A (en) * | 2019-05-17 | 2019-08-13 | 京东方科技集团股份有限公司 | Mask device |
| CN111077724A (en) * | 2019-12-06 | 2020-04-28 | Tcl华星光电技术有限公司 | Mask plate and manufacturing method of display panel |
| CN111079261A (en) * | 2019-11-19 | 2020-04-28 | 京东方科技集团股份有限公司 | Simulation prediction method and system for mask plate stretching force and mask plate stretching equipment |
| WO2020113751A1 (en) * | 2018-12-04 | 2020-06-11 | 武汉华星光电半导体显示技术有限公司 | Mask |
| EP3640364A4 (en) * | 2018-03-30 | 2020-10-07 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Mask plate and display panel |
| CN111910150A (en) * | 2020-07-31 | 2020-11-10 | 合肥维信诺科技有限公司 | Mask plate, display panel and preparation method |
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| CN105568217A (en) * | 2016-01-06 | 2016-05-11 | 京东方科技集团股份有限公司 | Metal mask plate and production method thereof |
| CN108666420A (en) * | 2017-03-27 | 2018-10-16 | 京东方科技集团股份有限公司 | Mask plate and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108492719A (en) * | 2018-03-20 | 2018-09-04 | 联想(北京)有限公司 | A kind of implementation method of abnormity display screen and special-shaped display screen |
| EP3640364A4 (en) * | 2018-03-30 | 2020-10-07 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Mask plate and display panel |
| US11066738B2 (en) | 2018-03-30 | 2021-07-20 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Mask plates and display panels |
| CN108517489A (en) * | 2018-04-28 | 2018-09-11 | 京东方科技集团股份有限公司 | Mask plate for OLED display panel vapor deposition |
| CN108517489B (en) * | 2018-04-28 | 2023-05-12 | 京东方科技集团股份有限公司 | Mask plate for evaporation of OLED display panel |
| CN109097730A (en) * | 2018-09-29 | 2018-12-28 | 京东方科技集团股份有限公司 | A kind of mask plate and preparation method thereof |
| WO2020113751A1 (en) * | 2018-12-04 | 2020-06-11 | 武汉华星光电半导体显示技术有限公司 | Mask |
| CN110117768A (en) * | 2019-05-17 | 2019-08-13 | 京东方科技集团股份有限公司 | Mask device |
| CN111079261A (en) * | 2019-11-19 | 2020-04-28 | 京东方科技集团股份有限公司 | Simulation prediction method and system for mask plate stretching force and mask plate stretching equipment |
| CN111079261B (en) * | 2019-11-19 | 2023-12-01 | 京东方科技集团股份有限公司 | Simulation prediction method and system for mask Zhang Wangli and mask net-stretching equipment |
| CN111077724A (en) * | 2019-12-06 | 2020-04-28 | Tcl华星光电技术有限公司 | Mask plate and manufacturing method of display panel |
| CN111910150A (en) * | 2020-07-31 | 2020-11-10 | 合肥维信诺科技有限公司 | Mask plate, display panel and preparation method |
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