CN107462950A - A kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method - Google Patents
A kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method Download PDFInfo
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- CN107462950A CN107462950A CN201710779051.2A CN201710779051A CN107462950A CN 107462950 A CN107462950 A CN 107462950A CN 201710779051 A CN201710779051 A CN 201710779051A CN 107462950 A CN107462950 A CN 107462950A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12019—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes
- G02B6/12021—Comprising cascaded AWG devices; AWG multipass configuration; Plural AWG devices integrated on a single chip
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
- G05D23/32—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature with provision for adjustment of the effect of the auxiliary heating device, e.g. a function of time
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Automation & Control Theory (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The present invention relates to a kind of optical module and wavelength control method, belong to technical field of photo communication, and in particular to a kind of optical module and method for packing that wavelength compensation is carried out based on displacement.Including：Temperature compensation means, including the light path base of several independent subregions compositions and the drive rod for connecting each light path base subregion；AWG chip assemblies, some sub-regions are cut into, are arranged at per sub-regions on a light path base subregion；Wherein, it is provided with module temperature control device on the light path base.Optical mode deblocking temperature is controlled by module temperature control device, actual work temperature scope is divided into two sections or multistage, reduces energy consumption, and be more accurately controlled the compensation rate of optical module wavelength.
Description
Technical field
The present invention relates to a kind of optical module and method for packing, belong to technical field of photo communication, and in particular to a kind of wide warm, low
Power consumption array waveguide grating module and wavelength control method.
Background technology
Array waveguide grating (Arrayed Waveguide Gratings, abbreviation AWG) is the light based on planar optical waveguide
Device, it is made up of input waveguide, input planar waveguide, Waveguide array, output planar waveguide and output waveguide, wherein adjacent array
Waveguide has fixed length difference.AWG is the crucial optical device of dense wavelength division multiplexing system, has integrated level height, number of active lanes
It is more, insertion loss is small, the advantages that being easy to batch automatic production.AWG dense wavelength division multiplexing systems are to multiplexing demultiplexing device part
Sufficient center wavelength accuracy requires higher, and centre wavelength precision needs to control within +/- the 5% of channel spacing, generally exists
In the wavelength-division multiplex system at 100GHz, 50GHz and 25GHz interval, centre wavelength precision is respectively necessary for controlling +/- 0.04nm, +/-
Within 0.02nm and +/- 0.01nm.But traditional silicon substrate AWG chips are more sensitive to temperature, General Central wavelength with temperature
Drift be 0.0118nm/ DEG C, in wavelength-division multiplex system operating ambient temperature (- 40 DEG C to 85 DEG C), the middle cardiac wave of AWG chips
Long drift value is substantially beyond system requirements, can be therefore, it is necessary to control the centre wavelength of AWG modules using measure
Normal work in operating ambient temperature.
Heatless AWG (Athermal AWG, abbreviation AAWG) technology is a kind of conventional centre wavelength control technology, no heat
The technology of AWG module generally use temperature-compensatings keeps the stabilization of wavelength, passes through the driving waveguide of expanding with heat and contract with cold of temperature-driven bar
Relatively move to compensate the drift of wavelength with temperature.After AWG chips are cut into two parts, the change d λ and chip of centre wavelength
Two-part relative displacement dx has following relation：
Wherein R is Rowland circle focal length, nsAnd ncIt is AWG input planar waveguide, output planar waveguide respectively, also cries rowland
Round effective refractive index and the effective refractive index of Waveguide array, ngIt is group index, d is adjacent array waveguide on rowland circumference
Spacing, m is diffraction time.λ is vacuum wavelength.
The thermal coefficient of expansion of drive rod is bigger than the thermal coefficient of expansion of light path base, and when the temperature is changed, drive rod can drive
The first area 101 of light path base and second area 102 produce relative motion, and then drive two parts of AWG chips along cutting
Slot gap 206 relatively moves, so as to which compensating action is played in the drift of the wavelength with temperature to AWG chips.If the length of drive rod 103
Spend for L, the thermal coefficient of expansion with respect to light path pedestal is α, then relative displacement caused by drive rod driving chip two parts is：
Dx=kL α dT (2)
Wherein k is proportionality coefficient, relevant with concrete structure.
If center wavelength variation caused by displacement is d λ ' as caused by drive rod driving chip two parts, with reference to formula (1)
Drawn with formula (2)：
If dx/dT and d λ/dT are equivalent linear changes, centre wavelength directly can be completed by drive rod
For the compensation of temperature change skew, but in practice, the relation of dx/dT and d λ/dT and temperature is nonlinear, low temperature
About 0.04nm is differed to normal temperature (- 40 DEG C~25 DEG C) variable quantity and normal temperature to the variable quantity of high temperature (25 DEG C~85 DEG C).Pass through
Formula (2) and (3) can approximately derive variable quantities of the centre wavelength d λ with temperature T, as shown in formula (4).
D λ=a*dT2+b*dT+c (4)
From formula (4) as can be seen that temperature compensation means 1 can only compensate the first order of center wavelength with temperature change, it is impossible to
Compensate its quadratic term.Because the refractive index of silicon based silicon dioxide wave is varied with temperature with higher order coefficient, warp in practical application
Centre wavelength-temperature curve after overcompensation is the parabola of opening upwards, as shown in Figure 4.If penalty coefficientWith b phases
Deng, then it is symmetrical compensation；If penalty coefficientMore than b, then be overcompensation；If penalty coefficientLess than b, then
It is undercompensation.
The advantages of Heatless AWG is not need power consumption, and shortcoming is needed by each channel center's wavelength essence of 25 DEG C of sacrifices of normal temperature
Spend to meet index request in the range of module total temperature.From fig. 4, it can be seen that the centre wavelength of the Heatless AWG of symmetrical compensation becomes
Change amount is about 0.05nm, therefore this method can only keep the stability of wavelength, such as working environment within the scope of limited temperature
Temperature is in the range of -5 DEG C to 65 DEG C, and centre wavelength precision meets the requirement of 100G systems, and operating ambient temperature expands to -40
During DEG C to 85 DEG C, module wavelength variable quantity>0.1nm, the +/- 0.04nm that centre wavelength precision needs to control is unsatisfactory for completely, and
Wavelength inconsistency caused by each channel wavelength deviates ITUT values influences seriously on important indicators such as module crosstalks.
Obviously, existing Heatless AWG technology wavelength accuracy compensation ability is limited, major embodiment can not meet simultaneously high temperature,
The control of low-temperature region wavelength accuracy requires.Need a kind of scheme so that AWG is in wide (- 40~85 DEG C) work of temperature, not only power consumption
Low and centre wavelength meets the requirement of 50G, 25G even more dense wavelength division multiplexing system.
The content of the invention
The purpose of the present invention is to overcome prior art above-mentioned technological deficiency to be present, there is provided one kind is carried out based on drive displacement
The optical module of wavelength compensation and the method for packing of wavelength control.The method for packing of the module and wavelength control passes through module temperature control
The bulk temperature of device control module processed, operating temperature is divided into two sections or multistage, segment processing is carried out to wavelength control, from
And reduction power consumption is realized, and the envelope of AWG module wavelength compensation amounts is more accurately controlled in more wide industrial temperature range
Dress method.
The technical scheme is that：
A kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method, including：
Temperature compensation means, including the light path base that forms of several independent subregions and for connecting each light path base
The drive rod in region.Described light path bottom plate includes first area, second area, is connected through the hinge between subregion or divides completely
Open；
AWG chip assemblies, some sub-regions are cut into, are arranged at per sub-regions on a light path base subregion；
Wherein, it is provided with module temperature control device on the light path base.
Preferably, above-mentioned one kind wide temperature, low-power consumption array waveguide grating module and wavelength control method, the two of drive rod
End is fixed in two sub-regions of the light path base, and the thermal coefficient of expansion of drive rod is different from the light path base, described
Module temperature control device is located at the bottom of the light path base.
A kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method, including：
AWG chip assemblies are cut into some subregions and are respectively placed in the separate light path base of temperature compensation means
On subregion；
Using drive rod driving light path base subregion relative movement, so as to produce drive between AWG chip assembly subregions
Dynamic displacement, wave length shift is compensated using the drive displacement；
Using module temperature control device, temperature compensation means 1 and AWG chip assemblies 2 are heated or freezed, adjusted
The temperature of drive rod, so as to control drive displacement.
Preferably, above-mentioned one kind wide temperature, low-power consumption array waveguide grating module and wavelength control method, including：Owe to mend
Set-up procedure is repaid,It is applicable during less than b, wherein, during d λ ' are caused by displacement caused by drive rod driving chip two parts
Heart wavelength change, dT are temperature change, and b is the Monomial coefficient that chip center's wavelength X changes function with temperature T；Specially：
25-85 DEG C of high-temperature area is freezed by module temperature control device to temperature compensation means 1 and AWG chip assemblies 2 so that
Module is in controllable calibration temperature in hot environment, has shown as hot AWG technical characteristics.And in other temperature provinces
It is interior, show as Heatless AWG technology.
Preferably, a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method, overcompensation set-up procedure,
It is applicable during more than b, wherein, d λ ' are center wavelength variation caused by displacement caused by drive rod driving chip two parts,
DT is temperature change, and b is the Monomial coefficient that chip center's wavelength X changes function with temperature T；Specially：Low-temperature region-
40-25 DEG C is heated by module temperature control device to temperature compensation means 1 and AWG chip assemblies 2 so that module is low
Controllable calibration temperature is in warm environment, has shown as hot AWG technical characteristics, and in other temperature provinces, show as
Heatless AWG technical characteristic.
Preferably, a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method, including：Symmetrical compensation is adjusted
Synchronizing is rapid,It is applicable when consistent with b, wherein, d λ ' are center caused by displacement caused by drive rod driving chip two parts
Wavelength change, dT are temperature change, and b is the Monomial coefficient that chip center's wavelength X changes function with temperature T；Specially：Low
- 40-5 DEG C of temperature area is integrally heated by module temperature control device to module so that module is in low temperature environment
Controllable calibration temperature, has shown as hot AWG technical characteristics, and in high-temperature area 65-85 DEG C pass through module temperature control dress
Put and temperature compensation means 1 and AWG chip assemblies 2 are freezed so that module is in controllable calibration in hot environment
Temperature, hot AWG technical characteristics are shown as.And -5-65 DEG C of intermediate temperature region, show as Heatless AWG technical characteristic.
Therefore, the invention has the advantages that：
1. the present invention takes wave length shift further control, the control accuracy of wave length shift on the basis of Heatless AWG
It is higher than Heatless AWG, it is more suitable for 100G and even more dense wavelength division multiplexing system demand towards industrial temperature range requirement.
2. module operating temperature range can be divided into two sections or multistage by the present invention, compared to having hot AWG modules in whole work
To the overall mode of heating of module in the range of work, low in energy consumption, stabilization time is short；
3. realizing that the Heatless AWG technology of temperature-compensating is quite ripe using drive rod, the present invention is in prior art
Upper increase module temperature control device, it is easy to implement.
Brief description of the drawings
Fig. 1, AWG of the present invention schematic diagram；
Fig. 2, existing Heatless AWG temperature compensation means schematic diagram；
Fig. 3, AWG chip assemblies schematic diagram of the present invention；
Fig. 4, chip temperature control device schematic diagram of the present invention；
The temperature profile of Fig. 5, existing Heatless AWG under different compensation effects；
Fig. 6 A, first and second embodiment of the invention and Heatless AWG undercompensation situation temperature curve comparison diagram；
Fig. 6 B, first and second embodiment of the invention and Heatless AWG overcompensation situation temperature curve comparison diagram；
Fig. 6 C, first and second embodiment of the invention and Heatless AWG symmetrical compensation situation temperature curve comparison diagram；
Fig. 7, second embodiment of the invention and Heatless AWG symmetrical compensation situation temperature curve comparison diagram；
Fig. 8, third embodiment of the invention and Heatless AWG symmetrical compensation situation temperature curve comparison diagram；
Fig. 9 A, fourth embodiment of the invention and Heatless AWG overcompensation situation temperature curve comparison diagram；
Fig. 9 B, fourth embodiment of the invention and Heatless AWG undercompensation situation temperature curve comparison diagram；
Fig. 9 C, fourth embodiment of the invention and Heatless AWG symmetrical compensation situation temperature curve comparison diagram；
Figure 10, first embodiment of the invention schematic diagram；
Figure 11, second embodiment of the invention schematic diagram；
Figure 12, third embodiment of the invention schematic diagram；
Figure 13 A, fourth embodiment of the invention schematic diagram
Another implementation schematic diagram of Figure 13 B, fourth embodiment of the invention：
Wherein：
1st, temperature compensation means；2nd, AWG chip assemblies；
3rd, chip temperature control device；4th, drive rod temperature control equipment；
5th, module temperature control device；
101st, light path base first area；
102nd, light path base second area；103rd, drive rod；
201st, input unit；202nd, planar waveguide is inputted；
203rd, Waveguide array；204th, planar waveguide is exported；
205th, output device；206th, cutting gap
301 to 302, two regions of chip temperature control device.
Embodiment
Below by embodiment, and with reference to accompanying drawing, technical scheme is described in further detail.
Embodiment：
The invention will be further described with accompanying drawing with reference to embodiments.
The a kind of of the present invention realizes wide temperature, the array waveguide grating of low-power consumption referring to Fig. 1, including temperature compensation means 1,
AWG chip assemblies 2, chip temperature control device 3, drive rod temperature control equipment 4, module temperature control device 5.Temperature-compensating
For device 1 as shown in Fig. 2 including light path base and drive rod 103, light path base is the insensitive material of the coefficient of expansion, can be silicon
Material, heat resistant glass, quartz or invar alloy etc. are made.Light path base is cut into first area 101 and second area 102,
The domain of 101 and second area of first area 102 is connected through the hinge or completely separable, can relatively move therebetween, including
Rotate, move in parallel or increasingly complex mixing move mode.
The both ends of drive rod 103 are separately fixed on first area 101 and second area 102.AWG chip assemblies 2 such as Fig. 3
It is shown, including input unit 201, output device 205, AWG chips, wherein AWG chips are including inputting planar waveguide 202, array
Waveguide 203 and output planar waveguide 204, AWG chips are cut and opened, and cutting produces gap 206, and cutting gap 206 can be located at
Inputting planar waveguide 202, either Waveguide array 203 or output planar waveguide 204 any position, input unit 201 are coupling in
Input on the end face of planar waveguide 202, output device 205 is coupling on the end face of output planar waveguide 204.Chip temperature controls
Device 3 is as shown in figure 3, including two regions 301 and 302.
AWG chip assemblies 2 are fixed on the first area 101 and second area 102 of light path base, two parts point of chip
Wei Yu not be above two regions of light path base.Chip temperature control device 3 is fixed on AWG chip tops, chip temperature control
Two regions 301 and 302 of device 3 correspond to two parts with AWG chips respectively.Drive rod temperature control equipment 4 is arranged on
On drive rod 103.
The thermal coefficient of expansion of light path pedestal in temperature compensation means 1 is equal or near with the thermal coefficient of expansion of AWG chips
Patibhaga-nimitta etc., so, when the temperature is changed, stress and deformation will not be produced on chip because of thermal deformation is inconsistent.
Drive rod temperature control equipment 4 is used for adjusting the temperature of the drive rod in temperature compensation means 1, when drive rod temperature
Change is that its drive displacement dx changes, and the compensation rate of wavelength is also changed.
Chip temperature control device 3 is used for adjusting the temperature of chip, makes its wavelength that certain drift occur.
Module temperature control device 5 is used for adjusting the temperature of whole module so that only in some temperature ranges, module work
Make in temperature constant state.
The present invention is compensated by temperature compensation means to wavelength, then passes through chip temperature control device, drive rod
Temperature control equipment, module temperature control device further reduce change of the wavelength in the range of wide warm (- 40~80 DEG C), realize
To AWG wavelength more precise controls.Chip temperature control device, drive rod temperature control equipment, module temperature control device can
To be used singly or in combination.For a further understanding of apparatus and method of the present invention, the reality of several combinations is given below
Apply example.
In one embodiment：Comprising temperature compensation means 1, drive rod temperature control equipment 4, AWG chip assemblies 2, such as
Shown in Figure 10.Drive rod temperature control equipment 4 can carry out temperature control to drive rod, adjust drive displacement, mended so as to adjust
Repay effect.For example, for undercompensation situation, dx/dTenv is smaller, good in low-temperature region (- 40 to 25 DEG C) compensation effect, but
High-temperature area (25 to 85 DEG C) compensation effect is poor, then, pass through drive rod temperature control equipment 4 in high-temperature area (25 to 85 DEG C)
Drive rod is heated, increase drive displacement dx so that in (25 to 85 DEG C) compensation with similar overcompensation of high-temperature area
Effect, the centre wavelength drift obtained so as to have preferable compensation effect in whole temperature range and the relation of temperature are such as
Shown in Fig. 6 A, the flat and amplitude of variation that wave length shift-temperature curve becomes reduces.Similar, for overcompensation situation, dx/
DTenv is larger, good in high-temperature area (25 to 85 DEG C) compensation effect, but poor in low-temperature region (- 40 to 25 DEG C) compensation effect, that
Drive rod is heated by drive rod temperature control equipment 4 in low temperature temperature area (- 40 to 25 DEG C), reduces drive displacement
Dx so that (- 40 to 25 DEG C) have similar under-compensated compensation effect in low-temperature region, so as to have in whole temperature range
Preferable compensation effect, obtained centre wavelength are drifted about with the relation of temperature as shown in Figure 6B, what wave length shift-temperature curve became
Flat and amplitude of variation reduces.Similarly, for symmetrical compensation situation, low-temperature region (- 40 to -5 DEG C) and high-temperature area (60 to
85 DEG C) wave length shift it is larger, drive rod is heated by drive rod temperature control equipment 4 in the two temperature provinces,
Increase high-temperature area (60 to 85 DEG C) drive displacement, reduce low-temperature region (- 40 to -5 DEG C) drive displacement so that this two
Also there is preferable compensation effect in individual temperature province, obtained centre wavelength is drifted about with the relation of temperature as shown in Figure 6 C, in
The flat and amplitude of variation that cardiac wave length-temperature curve becomes reduces.
In second embodiment：Comprising temperature compensation means 1, chip temperature control device 3, AWG chip assemblies 2, such as scheme
Shown in 11.The embodiment is compensated by temperature compensation means to wavelength, then further by chip temperature control device
Change of the wavelength in the range of wide warm (- 40 to 80 DEG C) is reduced, is realized to AWG wavelength more precise controls.Chip temperature controls
Device 3 can adjust the temperature of AWG chips, so as to which adjusting wavelength drifts about.In the case of symmetrical compensation, wavelength is in high-temperature area
(60 to 85 DEG C) and low-temperature region (- 40 to -5 DEG C) all drift about more to long wave direction.So in intermediate temperature region (such as -5
To 60 DEG C), chip is heated by chip temperature control device so that wavelength drifts about in the temperature province to long wave direction,
So that whole temperature range (- 40 to 85 DEG C) wavelength-range of temperature reduces, obtained centre wavelength drift and temperature
Relation as shown in Figure 6A.It can also pass through in high-temperature area (such as 60 to 85 DEG C) and low-temperature region (such as -40 to -5 DEG C)
Chip temperature control device freezes to chip so that and wavelength drifts about in the two temperature provinces to shortwave direction, so that
Whole temperature range (- 40 to 85 DEG C) wavelength-range of temperature reduces, and obtained centre wavelength drift and the relation of temperature are such as
Shown in Fig. 6 B.For under-compensated situation, wavelength is more towards the drift of long wave direction in high-temperature area (25~85 DEG C), passes through temperature
Control device freezes to chip so that wavelength drifts about in high-temperature area to shortwave direction, obtained centre wavelength drift
With the relation of temperature as shown in Figure 6 C.In the case of overcompensation, wavelength floats in low-temperature region (- 40~25 DEG C) towards long wave direction
Move more, chip is freezed by temperature control equipment so that wavelength drifts about in low-temperature region to shortwave direction, obtains
Centre wavelength drift it is as shown in Figure 7 with the relation of temperature.
In 3rd embodiment：Comprising：Temperature compensation means 1, drive rod temperature control equipment 4, chip temperature control dress
3, AWG chip assemblies 2 are put, as shown in figure 12.In the case of symmetrical compensation, in low-temperature region (- 40~-10 DEG C) and high-temperature region
Domain (60~85 DEG C), is heated by drive rod temperature control equipment to drive rod so that in the two temperature province scopes
Interior wavelength moves towards shortwave direction；At intermediate temperature region (- 10~60 DEG C), chip is added by chip temperature control device
Heat so that wavelength drifts about in the temperature province to long wave direction, so that whole temperature range (- 40~85 DEG C) wavelength-
Range of temperature reduces, and obtained centre wavelength drift is as shown in Figure 8 with the relation of temperature.
In 4th embodiment：Including：Temperature compensation means 1, module temperature control device 5, AWG chip assemblies 2, module
Temperature compensation means 5 carries out temperature control to temperature compensation means 1 and AWG chip assemblies 2, module is reached in certain active section
To constant temperature effect, so as to adjust compensation effect.As shown in figure 13.
Temperature compensation means 1 keeps high temperature overcompensation state, has preferable compensation effect at 25~85 degrees Celsius ,-
40~25 DEG C of compensation effects are poor.When environment temperature is at -40~25 DEG C, by module temperature control device 5 to temperature-compensating
Device 1 and AWG chip assemblies 2 are heated, and module temperature is maintained on 25 DEG C of constant temperature, so that whole temperature range (-
40~85 DEG C) wavelength-range of temperature reduction, obtained centre wavelength drift and the relation of temperature are as shown in Figure 9 A.
Temperature compensation means 1 keeps high temperature undercompensation state, has preferable compensation effect at -40~25 DEG C, 25~
85 DEG C of compensation effects are poor.When environment temperature is at 25~85 DEG C, by module temperature control device 5 to temperature compensation means 1
Freezed with AWG chip assemblies 2, module temperature is maintained under 25 DEG C of constant temperature, so that whole temperature range (- 40~
85 DEG C) wavelength-range of temperature reduction, obtained centre wavelength drift and the relation of temperature are as shown in Figure 9 B.
Temperature compensation means 1 keeps complete warm symmetrical compensation state, has preferable compensation effect at -5~65 DEG C, -40
Compensation effect is poor in~-5 DEG C and 65~85 DEG C of temperature sections.When environment temperature is at -40~-5 DEG C, pass through module temperature control
Device 5 processed heats to temperature compensation means 1 and AWG chip assemblies 2, module temperature is maintained on -5 DEG C of constant temperature；Work as ring
Border temperature is made at 65~85 DEG C, by module temperature control device 5 to temperature compensation means 1 and AWG chip assemblies 2
It is cold, module temperature is maintained under 65 DEG C of constant temperature.So that so that whole temperature range (- 40~85 DEG C) wavelength-temperature
Spend amplitude of variation to reduce, obtained centre wavelength drift and the relation of temperature are as shown in Figure 9 C.
The present invention is controlled by module temperature control device to temperature compensation means and AWG chip assembly temperature,
Actual work temperature is divided into two sections or multistage, it is real so as to reach the change for reducing wavelength in the range of wide warm (- 40 to 80 DEG C)
Now to AWG wavelength more precise controls.
Although the present invention has been illustrated in detail in and has described the specific embodiment reference of correlation, the technology of this area
Personnel can be it should be understood that can make various change in the form and details in without departing substantially from the spirit and scope of the present invention
Become, for example, the change etc. of temperature-controlled zones, the protection domain that these changes are fallen within required by the claim of the present invention.
Claims (7)
1. a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method, it is characterised in that including：
Temperature compensation means (1), including the light path base that several independent subregions are formed；
AWG chip assemblies (2), are cut into some sub-regions, are arranged at per sub-regions on a light path base subregion；
Wherein, module temperature control device (5) is provided with the light path base.
2. a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method according to claim 1, its feature
It is, based on module temperature control device and existing Heatless AWG technology, the module temperature control device (5) is fixed on light path
Correspond to every sub-regions of light path bottom plate below base and comprising some, each part.
3. a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method according to claim 1, its feature
It is, the light path base includes the first area (101) and the secondth area (102) that can relatively move, interregional to lead to
Cross hinge or drive rod connection.
4. a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method, its feature exist,
Including：
AWG chip assemblies (2) are cut into some subregions and are respectively placed in the separate light path base of temperature compensation means
On subregion；
Driven using drive rod (103) driving light path base subregion relative movement so as to be produced between AWG chip assembly subregions
Dynamic displacement, wave length shift is compensated using the drive displacement；
Using module temperature control device (5) control module temperature, so as to adjust the drive relatively moved between light path base subregion
Dynamic displacement.
5. a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method according to claim 4, its feature
It is, including：Overcompensation set-up procedure,It is applicable during more than b, wherein, d λ ' produce for drive rod driving chip two parts
Displacement caused by center wavelength variation, dT is temperature change, and b is the first order that chip center's wavelength X changes function with temperature T
Coefficient；Specially：Module operating temperature range is divided into two sections more, -40-25 DEG C are controlled by module temperature in low-temperature region
Device (5) integrally heats to module, module is presented with hot AWG module status, ring when environment temperature is low-temperature region
Border temperature shows as athermal AWG module state when being normal temperature to high-temperature area.
6. a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method according to claim 4, its feature
It is, including：Undercompensation set-up procedure,It is applicable during less than b, wherein, d λ ' produce for drive rod driving chip two parts
Displacement caused by center wavelength variation, dT is temperature change, and b is the first order that chip center's wavelength X changes function with temperature T
Coefficient；Specially：Module operating temperature range is divided into two sections more, 25-85 DEG C is controlled by module temperature in high-temperature area
Device (5) integrally freezes to module, module is presented with hot AWG module status, ring when environment temperature is high-temperature area
Border temperature shows as athermal AWG module state when being low temperature to normal temperature region.
7. a kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method according to claim 4, its feature
It is, including：Symmetrical compensation set-up procedure,It is applicable when consistent with b, wherein, d λ ' are drive rod driving chip two parts
Center wavelength variation caused by caused displacement, dT are temperature change, and b is that chip center's wavelength X changes the one of function with temperature T
Secondary term coefficient；Specially：
Module operating temperature range is divided into multistage:Environment temperature be 65 DEG C of high-temperature area to 85 DEG C of sections when, pass through mould
Deblocking temperature control device is to module integrally cooling；When environment temperature is -40 DEG C of low-temperature region extremely -5 DEG C of sections, pass through module temperature
Degree control device integrally heats to module, module has been shown as hot AWG module status in this two sections of temperature ranges；
When module is in the medium temperature section that environment temperature is -5 DEG C to -65 DEG C, module temperature control device is stopped so that mould
Block shows as athermal AWG module state in the region.
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| CN201710779051.2A CN107462950A (en) | 2017-08-31 | 2017-08-31 | A kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method |
| PCT/CN2017/118169 WO2019041680A1 (en) | 2017-08-31 | 2017-12-25 | Arrayed waveguide grating module having wide temperature range and low power consumption and wavelength control method |
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