CN107204562A - A kind of high power laser heat abstractor - Google Patents

A kind of high power laser heat abstractor Download PDF

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Publication number
CN107204562A
CN107204562A CN201710457551.4A CN201710457551A CN107204562A CN 107204562 A CN107204562 A CN 107204562A CN 201710457551 A CN201710457551 A CN 201710457551A CN 107204562 A CN107204562 A CN 107204562A
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CN
China
Prior art keywords
laser
cavity
storage box
high power
heat abstractor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710457551.4A
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Chinese (zh)
Inventor
郑立聪
盛磊
刘静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yunnan Jing Jing Liquid Metal Heat Control Technology Research And Development Co Ltd
Original Assignee
Yunnan Jing Jing Liquid Metal Heat Control Technology Research And Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Yunnan Jing Jing Liquid Metal Heat Control Technology Research And Development Co Ltd filed Critical Yunnan Jing Jing Liquid Metal Heat Control Technology Research And Development Co Ltd
Priority to CN201710457551.4A priority Critical patent/CN107204562A/en
Publication of CN107204562A publication Critical patent/CN107204562A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02469Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lasers (AREA)

Abstract

The present invention provides a kind of high power laser heat abstractor, the heat abstractor includes laser, cavity, heating resistor and storage box, phase-change material is equipped with the cavity and storage box, the cavity is contacted with the surface of the laser, the cavity and the storage box are connected with the heating resistor respectively, and the cavity is connected with the storage box by least two pipelines.All heats that the present invention is produced by phase-change material to the laser carry out heat exchange and radiated, by making the cavity and the storage box are connected respectively with the heating resistor, heating and melting can be carried out to the phase-change material of the solidification state in the cavity and the storage box by the heating resistor.The high power laser heat abstractor of the present invention is radiated using phase-change material, and unit heat dissipating mass is small, improves heat exchange efficiency, extends laser service life, improves the use power of laser.

Description

A kind of high power laser heat abstractor
Technical field
The present invention relates to laser technical field of heat dissipation, more particularly, to a kind of high power laser heat abstractor.
Background technology
The species of laser is increasing, develops extremely rapid, its power used also more and more higher, high power laser Many fields of people's social life are had been applied to, such as detects, process, communicate.The master that current high power laser faces It is that the time that laser stabilization works is shorter to want problem, and which greatly limits its practical application.The stabilization of laser Working time is main relevant with the heat dissipation of laser, and due to factors such as conversion efficiencies, the integrated of luminescent device causes hot enrichment, Heat enrichment will cause the junction temperature rise of laser active area, so as to reduce the photoelectric transformation efficiency of laser, make the center of laser Temperature drift occurs for wavelength, and the junction temperature of laser will introduce defect in active area in addition.Therefore the steady operation of high power laser There is direct relation time with junction temperature.
In laser cooling system in the prior art, high power laser works in a pulsed fashion, the heat quilt of generation Semiconductor chilling plate is transported on fin rapidly, recycles fan to be blown against fin so that the heat on fin is with warm The form of convection current carries out heat exchange with air, distributes heat in external environment.Due in this system fan by fin On heat to be exchanged in the form of thermal convection current in air, and air contacts with each other with laser, therefore the heat in air Amount can be also transferred on laser, can so be increased the work load of semiconductor chilling plate, be reduced its refrigerating efficiency, so that directly The stable work time of Optical Maser System is caused to shorten.The structure of existing high power laser radiator is larger, heat transfer efficiency is low, Service life is shorter, it is impossible to meet requirement of the current Optical Maser System to radiating rate, and radiating effect and reliability have one Fixed defect.
The content of the invention
It is an object of the invention to provide a kind of high power laser heat abstractor, radiated with solving existing high power laser The problem of device radiation effect is not good.
Technique according to the invention scheme includes laser there is provided a kind of high power laser heat abstractor, the heat abstractor Phase-change material, the cavity and the laser are equipped with device, cavity, heating resistor and storage box, the cavity and storage box The surface contact of device, the cavity and the storage box are connected with the heating resistor respectively, the cavity and the storage box It is connected by least two pipelines.
As the further preferred scheme of above-mentioned technical proposal, the pipeline includes heat pipe and cold pipe, the cavity and institute State and be connected by heat pipe with cold pipe between storage box.
As the further preferred scheme of above-mentioned technical proposal, one end that the heat pipe is located in the cavity is close described The surface of laser, the heat pipe is located at surface of the other end away from the heating resistor in the storage box;The cold pipe Surface of the one end away from the laser in the cavity, the other end that the cold pipe is located in the storage box is close The surface of the heating resistor.
As the further preferred scheme of above-mentioned technical proposal, at least one described pipeline is connected with electromagnetic pump, the electricity Magnetic pumping and the heating resistor are connected with power supply respectively.
As the further preferred scheme of above-mentioned technical proposal, the outside of the heat abstractor is provided with fin.
As the further preferred scheme of above-mentioned technical proposal, the phase-change material is low-melting-point metal or alloy, i.e. liquid State metal.
As the further preferred scheme of above-mentioned technical proposal, the phase-change material includes gallium, gallium-indium alloy or gallium indium tin Alloy.
As the further preferred scheme of above-mentioned technical proposal, the laser is optical fiber laser, semiconductor laser Or solid state laser.
It is used as the further preferred scheme of above-mentioned technical proposal, the pipeline, the fin, the storage box and the chamber The material of body is using any of copper, aluminium, nickel, stainless steel or graphite or several.
As the further preferred scheme of above-mentioned technical proposal, the material of the heating resistor includes nickel chromium triangle piece.
Based on above-mentioned technical proposal, high power laser heat abstractor proposed by the present invention, by being set in the cavity Phase-change material is put, and is contacted by the cavity wall with the surface of the laser, to cause phase-change material to the laser All heats that device is produced carry out heat exchange and radiated, and the storage box can be used for storing unnecessary phase-change material, also Can be with standby;By making the cavity and the storage box are connected respectively with the heating resistor, the heating resistor can be passed through Heating and melting is carried out to the phase-change material of the solidification state in the cavity and the storage box;By in the cavity and storage box Between at least two pipelines are set, to cause phase-change material to form what is circulated between the cavity, pipeline and storage box Loop, to accelerate the rate of heat dispation of phase-change material.The high power laser heat abstractor of the present invention is dissipated using phase-change material Heat, unit heat dissipating mass is small, improves heat exchange efficiency, extends laser service life, improves the use power of laser.
Brief description of the drawings
Fig. 1 is the structural representation of the high power laser heat abstractor according to the embodiment of the present invention.
In figure, 1. lasers, 2. phase-change materials, 3. cavitys, 4. cold pipes, 5. heating resistors, 6. storage boxes, 7. fins, 8. Heat pipe, 9. power supplys, 10. electromagnetic pumps.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is A part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention and its between be combined, this The every other embodiment that field those of ordinary skill is obtained under the premise of creative work is not made, belongs to the present invention The scope of protection.
Because phase change temperature control is a kind of temperature control technology for having a very high potential, using latent heat of phase change, refrigerant can be non- Larger heat exchange amount is realized under often small mass flow, with very high heat radiation power density;The temperature when working medium is undergone phase transition Keep constant, phase change temperature control also has the ability for eliminating laser temperature vibration.
Phase-change material mainly use gallium-base alloy, the thermal conductivity k=29.28W/ (m DEG C) of gallium, about the 60 of water times, 0.68W/ (m DEG C), higher than paraffin 0.3~0.5W/ of thermal conductivity (m DEG C), less than the thermal conductivity 203W/ (m DEG C) of aluminium, Unit volume latent heat of phase change is big, and Volume Changes are small during phase transformation, and reliability is high.Therefore, liquid metal is particularly suitable for use in temperature control essence Degree requires height, heat flow density height, limited volume, even temperature effect and the occasion high to reliability requirement.
According to one embodiment of present invention, with reference to Fig. 1 there is provided a kind of high power laser heat abstractor, this dissipates Thermal includes being equipped with phase-change material in laser 1, cavity 3, heating resistor 5 and storage box 6, the cavity 3 and storage box 6 2, the cavity 3 is contacted with the surface of the laser 1, the cavity 3 and the storage box 6 respectively with the heating resistor 5 Connection, the cavity 3 is connected with the storage box 6 by least two pipelines.
The heat abstractor of high power laser 1 that the embodiment of the present invention is proposed, by setting phase-change material in the cavity 3 2, and contacted by the side wall of cavity 3 with the surface of the laser 1, to cause 2 pairs of the phase-change material laser 1 to produce All heats heat exchange and radiate, the storage box 6 can be used for storing unnecessary phase-change material 2, can be with It is standby;By making the cavity 3 and the storage box 6 are connected respectively with the heating resistor 5, the heating resistor 5 can be passed through Heating and melting is carried out to the phase-change material 2 of the solidification state in the cavity 3 and the storage box 6;By the cavity 3 and depositing At least two pipelines are set between storage tank 6, to cause phase-change material 2 is formed between the cavity 3, pipeline and storage box 6 to follow The dynamic loop of circulation, to accelerate the rate of heat dispation of phase-change material 2.The high power laser heat abstractor of the embodiment of the present invention is utilized Phase-change material is radiated, and unit heat dissipating mass is small, improves heat exchange efficiency, extends laser service life, improves laser Use power.
When in use, the bottom of phase-change material 2 is with swashing for the high power laser heat abstractor that the embodiment of the present invention is proposed The thermal source of light device 1 is contacted, and absorbs the heat from heat source of laser 1, and phase-change material 2 is changed into liquid from solid-state, absorbs a large amount of latent heat.Liquid Phase-change material 2 flows to storage box 6, and the storage box 6 is used to supplement the amount of phase-change material 2.The heat abstractor The shape of cavity 3 matches with the contact surface of the laser 1, specifically can using flat, column type or other with swash The shape that the surface of light device 1 matches, so that both fully contacts, improve radiating efficiency.The cavity 3, heating resistor 5, storage The position of case 6 and laser 1 can up and down or left and right set, the embodiment of the present invention is with the storage box 6, heating resistor 5, the chamber Body 3, laser 1 are illustrated exemplified by paratactic contact is set successively.
According to one embodiment of present invention, the pipeline includes heat pipe 8 and cold pipe 4, the cavity 3 and described deposits It is connected between storage tank 6 by heat pipe 8 with cold pipe 4.The heat pipe 8 and cold pipe 4 are separately positioned on the cavity 3 and the storage The both sides of case 6, the phase-change material 2 for connecting the cavity 3 and the inside both sides of the storage box 6, are recycled back in order to be formed Road, promotes heat Quick diffusing to go out.By setting the heat pipe 8 and cold pipe 4, the fluid flow of phase-change material 2 can be entered Row control, can also set the components such as flow control valve, in order to adjust fluid circulation rate on pipeline.
According to one embodiment of present invention, the one end of the heat pipe 8 in the cavity 3 is close to the laser The surface of device 1, the heat pipe 8 is located at surface of the other end away from the heating resistor 5 in the storage box 6;The cold pipe 4 Surface of the one end away from the laser 1 in the cavity 3, the cold pipe 4 is located at the other end in the storage box 6 Close to the surface of the heating resistor 5.By the heat pipe 8 and the structure of cold pipe 4 of above-mentioned setting, be conducive to making the cavity 3 and institute The phase-change material 2 stated in storage box 6 is fully circulated, to improve the radiating efficiency of heat abstractor.
According to one embodiment of present invention, at least one described pipeline is connected with electromagnetic pump 10, the electromagnetic pump 10 and the heating resistor 5 be connected respectively with power supply 9.It is that the electromagnetic pump 10 and the heating resistor 5 provide electricity by power supply 9 Pressure, so that the phase-change material 2 of 5 pairs of solidifications of the heating resistor carries out heating and melting, makes the electromagnetic pump 10 drive the phase transformation Material 2 carries out circulation cooling, to form circulation cooling loop.The phase-change material 2 of liquid is delivered to storage box 6 by electromagnetic pump 10, The storage box 6 is used to supplement the amount of phase-change material 2.Moreover, the flowing of phase-change material 2 is driven by electromagnetic pump 10, The operating temperature of laser 1 is accurately controlled, the operating efficiency of laser 1 can be improved by circulating, extend the use of laser 1 Life-span.220V power supplys, the access circuit in parallel with electromagnetic pump 10 of heating resistor 5 can be used in the power supply 9.
According to one embodiment of present invention, the outside of the heat abstractor is provided with fin 7.The fin 7 can be set Put in the overall outer surface of the heat abstractor, the fin 7 is the fin of auxiliary heat conduction, for improving the phase-change material 2 radiating efficiency.As shown in figure 1, the embodiment of the present invention is so that the fin 7 is arranged on the outside of the storage box 6 as an example, by institute State fin 7 to be evenly distributed on the outer wall of the storage box 6, but be not intended as limitation of the present embodiment to fin position.
According to one embodiment of present invention, the material of the fin 7 can use copper, aluminium, nickel, stainless steel or stone Any of ink.
According to one embodiment of present invention, the phase-change material 2 is low-melting-point metal or alloy, i.e. liquid gold Category.
According to one embodiment of present invention, the phase-change material 2 includes gallium, gallium-indium alloy or gallium-indium-tin alloy. The embodiment of the present invention is by the phase-change material 2 using exemplified by gallium-base alloy, and fusing point is in the range of 20 DEG C -70 DEG C, its thermal conductivity k= 13W/ (m DEG C), hence it is evident that higher than the thermal conductivity 0.68W/ (m DEG C) of water, higher than paraffin 0.3~0.5W/ of thermal conductivity (m DEG C), density is 7.564g/cm3.Transition temperature range is in 55~70 DEG C of intervals, and it is 58 DEG C to melt start temperature.
According to one embodiment of present invention, the laser 1 is optical fiber laser, semiconductor laser or solid Laser.The optical fiber laser 1 is high-power type laser, and a such as average output power is 20W single-mode fiber laser The power output of device reaches 140MW/cm2;The solid state laser can reach 100kW magnitudes;The semiconductor laser is with mesh Exemplified by preceding highest, repeatedly the power of battle array is higher, and the power of the single repeatedly battle array of German Dilas companies can reach 8000W.
According to one embodiment of present invention, the material of the pipeline, the storage box 6 and the cavity 3 is used Any of copper, aluminium, nickel, stainless steel or graphite are several.
When the heat pipe 8, cold pipe 4, cavity 3 and storage box 6 material be copper or aluminium, and the phase-change material 2 be gallium and During its alloy, the material of the heat pipe 8 and cold pipe 4 needs to carry out coating processing, to prevent from being corroded by gallium.
When the material of the heat pipe 8, cold pipe 4, cavity 3 and storage box 6 is using aluminium alloy, it is necessary to be carried out on its surface Coating processing, to prevent from being corroded by gallium.
According to one embodiment of present invention, the material of the heating resistor 5 includes nickel chromium triangle piece.
The electromagnetic pump 10 can be surrounded by fin 7, also can individually be placed on the outside of the heat abstractor.Can be according to reality Install and radiating requirements set the position of the electromagnetic pump 10.
Finally it should be noted that:The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that:It still may be used To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic; And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and Scope.

Claims (10)

1. a kind of high power laser heat abstractor, it is characterised in that including laser, cavity, heating resistor and storage box, institute State and phase-change material is equipped with cavity and storage box, the cavity is contacted with the surface of the laser, the cavity and described Storage box is connected with the heating resistor respectively, and the cavity is connected with the storage box by least two pipelines.
2. a kind of high power laser heat abstractor according to claim 1, it is characterised in that the pipeline includes heat pipe With cold pipe, it is connected between the cavity and the storage box by heat pipe with cold pipe.
3. a kind of high power laser heat abstractor according to claim 2, it is characterised in that the heat pipe is located at described One end in cavity is close to the surface of the laser, and the other end of the heat pipe in the storage box is away from the heating The surface of resistance;The cold pipe is located at surface of the one end away from the laser in the cavity, and the cold pipe is located at described The other end in storage box is close to the surface of the heating resistor.
4. a kind of high power laser heat abstractor according to claim 1, it is characterised in that at least one described pipeline Electromagnetic pump is connected with, the electromagnetic pump and the heating resistor are connected with power supply respectively.
5. a kind of high power laser heat abstractor according to claim 1, it is characterised in that outside the heat abstractor Side is provided with fin.
6. a kind of high power laser heat abstractor according to claim 1, it is characterised in that the phase-change material is low Melting point metals or alloy.
7. a kind of high power laser heat abstractor according to claim 6, it is characterised in that the phase-change material includes Gallium, gallium-indium alloy or gallium-indium-tin alloy.
8. a kind of high power laser heat abstractor according to claim 1, it is characterised in that the laser is optical fiber Laser, semiconductor laser or solid state laser.
9. a kind of high power laser heat abstractor according to claim 5, it is characterised in that the pipeline, the rib The material of piece, the storage box and the cavity is using any of copper, aluminium, nickel, stainless steel or graphite or several.
10. a kind of high power laser heat abstractor according to claim 1, it is characterised in that the heating resistor Material includes nickel chromium triangle piece.
CN201710457551.4A 2017-06-16 2017-06-16 A kind of high power laser heat abstractor Pending CN107204562A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111414025A (en) * 2020-04-13 2020-07-14 江苏集萃智能光电系统研究所有限公司 Visual sensor autonomous temperature control device and method for outdoor complex environment
US20200227880A1 (en) * 2019-01-10 2020-07-16 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US10923876B1 (en) 2019-08-09 2021-02-16 Lockheed Martin Corporation Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1601733A (en) * 2004-10-27 2005-03-30 原泽 Active evaporating radiation tech of power semiconductor device or modular
US20140054021A1 (en) * 2010-06-03 2014-02-27 Lockheed Martin Corporation Method and phase-change gain-fiber holder that control temperature rise and uniformity with minimal stress
CN105281198A (en) * 2014-05-30 2016-01-27 中国科学院理化技术研究所 Thermal management device of semiconductor laser

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1601733A (en) * 2004-10-27 2005-03-30 原泽 Active evaporating radiation tech of power semiconductor device or modular
US20140054021A1 (en) * 2010-06-03 2014-02-27 Lockheed Martin Corporation Method and phase-change gain-fiber holder that control temperature rise and uniformity with minimal stress
CN105281198A (en) * 2014-05-30 2016-01-27 中国科学院理化技术研究所 Thermal management device of semiconductor laser

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200227880A1 (en) * 2019-01-10 2020-07-16 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11570411B2 (en) * 2019-01-10 2023-01-31 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US10923876B1 (en) 2019-08-09 2021-02-16 Lockheed Martin Corporation Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof
CN111414025A (en) * 2020-04-13 2020-07-14 江苏集萃智能光电系统研究所有限公司 Visual sensor autonomous temperature control device and method for outdoor complex environment

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Application publication date: 20170926

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