CN106879230B - A kind of cooling system of three-dimensional power amplifier - Google Patents
A kind of cooling system of three-dimensional power amplifier Download PDFInfo
- Publication number
- CN106879230B CN106879230B CN201710121463.7A CN201710121463A CN106879230B CN 106879230 B CN106879230 B CN 106879230B CN 201710121463 A CN201710121463 A CN 201710121463A CN 106879230 B CN106879230 B CN 106879230B
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- China
- Prior art keywords
- power amplifier
- heat
- cooling system
- dimensional power
- radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 41
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 7
- 238000002791 soaking Methods 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000004519 grease Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Amplifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of cooling systems of three-dimensional power amplifier, the c-type radiator of three-dimensional power amplifier periphery can be disposed around after being symmetrical set including two, the outer surface of the c-type radiator is embedded with several first heat pipes, and each first heat pipe is C font and is arranged along the c-type profile of c-type radiator.Not only volume size is small for cooling system of the invention, is easily assembled, and meets cooling requirements, but also can be suitably used for being only capable of in the communication system of monoplane heat dissipation, does biggish change also without to communication system, it is easy to accomplish operation, it is high using compatibility and flexibility.The present invention can be widely applied in communication field as a kind of cooling system of three-dimensional power amplifier.
Description
Technical field
The present invention relates to cooling system more particularly to a kind of heat dissipation systems for being applicable to minimize three-dimensional power amplifier
System.
Background technique
In the field of communications, it in order to realize high-power output, needs to carry out power combing to multichannel pmultiple amplifier.Traditional is flat
Face power combing mode occupies biggish area, and uses the design of three-dimensional power amplifier that can greatly reduce power amplifier
Shared area.As shown in Figure 1, three-dimensional power amplifier can be understood as rolling in planar power amplifier, one is formed
Three-dimensional cylinder, and the power amplifier element in original planar power amplifier is then distributed in the appearance of the cylindrical body.
And this three-dimensional power combing mode is obtained since it is with higher combined coefficient and smaller volume size
To more and more applications.
For above-mentioned three-dimensional power amplifier, problem encountered is internal power device, since it generates heat
The heat source of amount is in distributed in three dimensions in the periphery of cylindrical body, i.e. its heat source distribution is three-dimensional distribution, is then needed so effective
Radiating mode could shed the heat of heat source.For this problem, uses all installed in the outer surface of power amplifier at present
Radiator radiate this mode to solve, but the disadvantage is that this three-dimensional heat dissipation mode is needed in the upper of power amplifier
Radiator is installed on lower left and right surface simultaneously, and the volume size and weight that then will lead to installation in this way increase, while will increase assembly
Complexity.And for being only capable of monoplane heat dissipation and for installation volume size has the communication system of strict demand, this three
The mode of the three-dimensional heat dissipation of dimension seems excessively huge, can not meet the requirement of small size size and heat dissipation simultaneously.
Summary of the invention
In order to solve the above-mentioned technical problem, it is applicable to minimize three-dimensional power amplification the object of the present invention is to provide one kind
The cooling system of device is not only able to satisfy cooling requirements, but also its volume size is small, can greatly save installation placing space.
The technical scheme adopted by the invention is that: a kind of cooling system of three-dimensional power amplifier, including two or so pairs
Claim the c-type radiator that three-dimensional power amplifier periphery can be disposed around after being arranged, the outer surface of the c-type radiator is embedded with several
A first heat pipe, each first heat pipe are C font and are arranged along the c-type profile of c-type radiator.
It further, further include planar heat spreader, embedded with several the second heat on the heat-conducting planar of the planar heat spreader
Pipe, described two c-type radiators are arranged on the heat-conducting planar of planar heat spreader.
Further, covering is provided with graphite flake or indium sheet on the inner wall of described two c-type radiators.
Further, described two c-type radiators are spliced into cube radiator after being symmetrical set.
Further, between the bottom of described two c-type radiators and the heat-conducting planar of planar heat spreader be equipped with graphite flake or
Thermal grease layer.
Further, the outer surface of first heat pipe is flushed with the outer surface of c-type radiator.
Further, the main material of the c-type radiator is aluminium or copper.
Further, first heat pipe is made by soaking plate.
Further, the main material of the planar heat spreader is aluminium or copper.
Further, second heat pipe is made by soaking plate.
The beneficial effects of the present invention are: cooling system of the invention includes that there are two can be disposed around three after being symmetrical set
The c-type radiator for tieing up power amplifier periphery, then will not cause heat that can not conduct because of the direct gap of c-type radiator in this way,
Meanwhile the outer surface of the c-type radiator is embedded with several first heat pipes, and each first heat pipe is for C font and along c-type
The c-type profile of radiator is arranged, therefore the heat of three-dimensional power amplifier can pass through the C of two sides along its cylindrical outer surface
The first heat pipe on type radiator conducts heat to the bottom of c-type radiator, and the heat of c-type radiator bottom can be by logical
Heat dissipation plane in letter system distributes, in this way compared to traditional three-dimensional space heat dissipating method, cooling system of the invention
Not only volume size is small, is easily assembled, and meets cooling requirements, but also can be suitably used for the communication system for being only capable of monoplane heat dissipation
In, biggish change is done also without to communication system, it is easy to accomplish operation, it is high using compatibility and flexibility.
Detailed description of the invention
Fig. 1 is the schematic illustration of conventional three-dimensional power amplifier；
Fig. 2 is a kind of structural schematic diagram of the cooling system of three-dimensional power amplifier of the present invention；
Fig. 3 is the structural decomposition diagram of c-type radiator in a kind of cooling system of three-dimensional power amplifier of the present invention；
Fig. 4 is the structural decomposition diagram of planar heat spreader in a kind of cooling system of three-dimensional power amplifier of the present invention；
Fig. 5 is an a kind of specific embodiment structural schematic diagram of the cooling system of three-dimensional power amplifier of the present invention.
1, c-type radiator；2, the first heat pipe；3, planar heat spreader；4, the second heat pipe；5, graphite flake or indium sheet；6, three-dimensional
Power amplifier.
Specific embodiment
A kind of cooling system of three-dimensional power amplifier, including two be symmetrical set after can be disposed around three-dimensional power and put
The outer surface of the c-type radiator of big device periphery, the c-type radiator is embedded with several first heat pipes, each first heat pipe
It is arranged for C font and along the c-type profile of c-type radiator.
For above-mentioned cooling system, its working principle is that: when assembly, the three-dimensional power with cooling system of the present invention is put
Big device is placed in the heat dissipation plane of communication system, and the heat of three-dimensional power amplifier can pass through along its cylindrical outer surface
The first heat pipe on the c-type radiator of two sides conducts heat to the bottom of c-type radiator, and the heat of the bottom can then pass through
The heat dissipation plane of the communication system distributes.Thus, cooling system of the invention is that a kind of miniaturization space turns plane
Cooling system, radiator is installed simultaneously without lower or so surface on it, it is small in size, while being also able to satisfy cooling requirements, and
And also can be suitably used for being only capable of in the communication system of monoplane heat dissipation, biggish change is done also without to communication system, operates and answers
Compatibility, flexibility are all very high.
It is further used as the preferred embodiment of the present embodiment, further includes planar heat spreader, the thermally conductive of the planar heat spreader is put down
Several second heat pipes are embedded on face, described two c-type radiators are arranged on the heat-conducting planar of planar heat spreader, i.e., and two
The bottom of c-type radiator is provided with planar heat spreader.The heat of two c-type radiator bottoms is dissipated by being mounted on the plane of bottom
Hot device can increase three-dimensional power amplifier and communication system to quickly conducting heat to entire planar heat spreader in this way
Between heat dissipation area, improve heat dissipation performance.
A specific embodiment of the invention
In the present embodiment, the c-type radiator 1 is c-type uniform-temperature radiator, and the planar heat spreader 3 is plane samming
Radiator.
As shown in Figures 2 to 4, a kind of cooling system of three-dimensional power amplifier, including planar heat spreader 3 and two or so
The c-type radiator 1 of three-dimensional 6 periphery of power amplifier can be disposed around after being symmetrical arranged, the outer surface of the c-type radiator 1 is embedded in
There are several the first heat pipes 2, each first heat pipe 2 is C font and is arranged along the c-type profile of c-type radiator 1；
Several second heat pipes 4 are embedded on the heat-conducting planar of the planar heat spreader 3, described two c-type radiators 1 are set
It sets on the heat-conducting planar of planar heat spreader.Wherein, as shown, described two c-type radiators 1 are symmetrical set in three-dimensional
Cube radiator is spliced into behind 6 two sides of power amplifier, the thermally conductive flat of planar heat spreader 3 is arranged in the cube radiator
On face.
Preferably for above-mentioned c-type radiator 1, c-type constructed of aluminium radiating piece is preferably used to realize, such energy
Further mitigate the weight of cooling system, or copper product can be used to realize, to further improve thermal conductivity, mentions
High heat dispersion；
For the first above-mentioned heat pipe 2, the outer surface of c-type radiator 1 is set along the c-type profile of c-type radiator 1
Afterwards, outer surface is flushed with the outer surface of c-type radiator 1, and it can be copper heat pipe, be made by soaking plate；
For above-mentioned planar heat spreader 3, constructed of aluminium radiating piece is preferably used to realize, can further subtracted in this way
The weight of light system, or copper product can be used to realize, to further improve thermal conductivity, improve heat dissipation performance；
For the second above-mentioned heat pipe 4, it can be copper heat pipe, be made by soaking plate.
It is provided with graphite flake or indium sheet 5 as shown in figure 5, covering on the inner wall of described two c-type radiators 1, and described two
Graphite flake or thermal grease layer are equipped between the bottom of a c-type radiator 1 and the heat-conducting planar of planar heat spreader 3.When assembling,
Two c-type radiators 1 are symmetrically mounted on to the two sides of cylindrical three-dimensional power amplifier 6, c-type radiator 1 and three
Improve contact surface thermal resistance by setting graphite flake or indium sheet 5 between dimension power amplifier 6, improves heat dissipation performance；It then will be whole
The three-dimensional power amplifier 6 that a two sides are equipped with c-type radiator is mounted on the heat-conducting planar of planar heat spreader 3, at this point, vertical
It is provided with graphite flake or thermal grease layer between the bottom and planar heat spreader 3 of cube radiator, Lai Gaishan contact surface thermal resistance, most
Afterwards again integral installation in the heat dissipation plane of system.
Additionally preferably, for be only capable of plane heat dissipation communication system, when designing and producing, can by planar heat spreader 3 with
Planar heat spreader in system is fabricated directly into integrated design, can be reduced three-dimensional power amplifier 6 and system radiating device in this way
Between thermal resistance, while can also reduce volume and weight.
It is obtained by above-mentioned, cooling system of the present invention, which has the advantage that, includes:
1, cooling system of the invention is processed using aluminium base, is being guaranteed heat dissipation performance while also being reduced entire cooling system
Weight can satisfy the airborne equal product for having strict demand to weight；
2, cooling system of the invention makes three-dimensional power amplifier be no longer limited to the radiating mode of 3 D stereo, and may be used also
To be directly applied in the plane cooling system of legacy communications system, three-dimensional power amplifier is allow to be directly applied to more pass
Without doing biggish change in system communication system, compatibility and flexibility are high；
3, cooling system of the invention comparison conventional three-dimensional solid radiating mode has smaller installation volume size, can make
The installation of three-dimensional power amplifier is more flexible.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (10)
1. a kind of cooling system of three-dimensional power amplifier, it is characterised in that: can be disposed around after being symmetrical set including two
The outer surface of the c-type radiator of three-dimensional power amplifier periphery, the c-type radiator is embedded with several first heat pipes, each institute
The first heat pipe is stated to be C font and be arranged along the c-type profile of c-type radiator.
2. a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that: further include plane heat dissipation
Device, several second heat pipes are embedded on the heat-conducting planar of the planar heat spreader, and described two c-type radiators are arranged in plane
On the heat-conducting planar of radiator.
3. a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that: described two c-types dissipate
Covering is provided with graphite flake or indium sheet on the inner wall of hot device.
4. a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that: described two c-types dissipate
Hot device is spliced into cube radiator after being symmetrical set.
5. a kind of cooling system of three-dimensional power amplifier according to claim 2, it is characterised in that: described two c-types dissipate
Graphite flake or thermal grease layer are equipped between the bottom of hot device and the heat-conducting planar of planar heat spreader.
6. any one of -5 a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that: described the
The outer surface of one heat pipe is flushed with the outer surface of c-type radiator.
7. any one of -5 a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that: the C
The main material of type radiator is aluminium or copper.
8. any one of -5 a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that: described the
One heat pipe is made by soaking plate.
9. according to a kind of cooling system of three-dimensional power amplifier of claim 2 or 5, it is characterised in that: the plane dissipates
The main material of hot device is aluminium or copper.
10. according to a kind of cooling system of three-dimensional power amplifier of claim 2 or 5, it is characterised in that: second heat
Pipe is made by soaking plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121463.7A CN106879230B (en) | 2017-03-02 | 2017-03-02 | A kind of cooling system of three-dimensional power amplifier |
| PCT/CN2017/084813 WO2018157476A1 (en) | 2017-03-02 | 2017-05-18 | Heat dissipation system for use with three-dimensional power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121463.7A CN106879230B (en) | 2017-03-02 | 2017-03-02 | A kind of cooling system of three-dimensional power amplifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106879230A CN106879230A (en) | 2017-06-20 |
| CN106879230B true CN106879230B (en) | 2019-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710121463.7A Active CN106879230B (en) | 2017-03-02 | 2017-03-02 | A kind of cooling system of three-dimensional power amplifier |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106879230B (en) |
| WO (1) | WO2018157476A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567266A (en) * | 2017-10-25 | 2018-01-09 | 北京无线电测量研究所 | The cooling system and antenna of a kind of antenna |
| CN109471228A (en) * | 2018-11-27 | 2019-03-15 | 武汉光迅科技股份有限公司 | A kind of radiator structure of coaxial packaging optical device |
| CN111836519A (en) * | 2020-07-07 | 2020-10-27 | 广州程星通信科技有限公司 | Heat sink for power device |
| CN113382613B (en) * | 2021-06-25 | 2022-10-25 | 深圳安科高技术股份有限公司 | Detector module assembly and detector |
| CN114841108A (en) * | 2022-03-25 | 2022-08-02 | 中国电子科技集团公司第二十九研究所 | Power amplifier product three-dimensional integrated design method and power amplifier product |
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| CN2777753Y (en) * | 2005-01-19 | 2006-05-03 | 富准精密工业(深圳)有限公司 | Radiator |
| US7215220B1 (en) * | 2004-08-23 | 2007-05-08 | Cap Wireless, Inc. | Broadband power combining device using antipodal finline structure |
| CN101466244A (en) * | 2007-12-21 | 2009-06-24 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN102315506A (en) * | 2010-07-06 | 2012-01-11 | 杨健 | Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| CN203350795U (en) * | 2013-06-08 | 2013-12-18 | 北京立华莱康平台科技有限公司 | Radiator and host comprising same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000040891A (en) * | 1998-07-24 | 2000-02-08 | Fujikura Ltd | Heat sink with heat pipe |
| EP1716045B1 (en) * | 2004-02-19 | 2014-08-27 | Astrium Limited | Payload module |
| CN201278625Y (en) * | 2008-08-28 | 2009-07-22 | 中兴通讯股份有限公司 | Heat radiation apparatus for power amplifier |
| CN204756557U (en) * | 2015-07-22 | 2015-11-11 | 高增军 | Embedded heat pipe cooling system and use its LED lamps and lanterns |
| CN105650613A (en) * | 2016-03-01 | 2016-06-08 | 王念忠 | Cooling device |
-
2017
- 2017-03-02 CN CN201710121463.7A patent/CN106879230B/en active Active
- 2017-05-18 WO PCT/CN2017/084813 patent/WO2018157476A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7215220B1 (en) * | 2004-08-23 | 2007-05-08 | Cap Wireless, Inc. | Broadband power combining device using antipodal finline structure |
| CN2777753Y (en) * | 2005-01-19 | 2006-05-03 | 富准精密工业(深圳)有限公司 | Radiator |
| CN101466244A (en) * | 2007-12-21 | 2009-06-24 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN102315506A (en) * | 2010-07-06 | 2012-01-11 | 杨健 | Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| CN203350795U (en) * | 2013-06-08 | 2013-12-18 | 北京立华莱康平台科技有限公司 | Radiator and host comprising same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018157476A1 (en) | 2018-09-07 |
| CN106879230A (en) | 2017-06-20 |
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Denomination of invention: A Heat Dissipation System of Three-dimensional Power Amplifier Effective date of registration: 20230228 Granted publication date: 20190917 Pledgee: China Co. truction Bank Corp Guangzhou branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2023980033711 |
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Granted publication date: 20190917 Pledgee: China Co. truction Bank Corp Guangzhou branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2023980033711 |
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