CN106710756A - Circuit protection assembly with external electrical test points - Google Patents
Circuit protection assembly with external electrical test points Download PDFInfo
- Publication number
- CN106710756A CN106710756A CN201611183713.1A CN201611183713A CN106710756A CN 106710756 A CN106710756 A CN 106710756A CN 201611183713 A CN201611183713 A CN 201611183713A CN 106710756 A CN106710756 A CN 106710756A
- Authority
- CN
- China
- Prior art keywords
- conductive
- copper
- circuit protection
- copper foil
- positive temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 128
- 239000011889 copper foil Substances 0.000 claims abstract description 81
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 239000002184 metal Substances 0.000 claims abstract description 71
- 230000002277 temperature effect Effects 0.000 claims abstract description 65
- 239000000843 powder Substances 0.000 claims abstract description 52
- 239000002131 composite material Substances 0.000 claims abstract description 36
- 229920000642 polymer Polymers 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000009826 distribution Methods 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 63
- 229910052802 copper Inorganic materials 0.000 claims description 52
- 239000010949 copper Substances 0.000 claims description 52
- -1 bismaleimide modified triazine Chemical class 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 32
- 230000001681 protective effect Effects 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000011135 tin Substances 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 230000001788 irregular Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 229910021332 silicide Inorganic materials 0.000 claims description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000011133 lead Substances 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 2
- 239000003973 paint Substances 0.000 description 14
- 239000011651 chromium Substances 0.000 description 10
- 239000010955 niobium Substances 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- 239000004417 polycarbonate Substances 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910052758 niobium Inorganic materials 0.000 description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 3
- 229930040373 Paraformaldehyde Natural products 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- AZUZXOSWBOBCJY-UHFFFAOYSA-N Polyethylene, oxidized Chemical class OC(=O)CCC(=O)C(C)C(O)CCCCC=O AZUZXOSWBOBCJY-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001912 maleic anhydride grafted polyethylene Polymers 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- 229920006380 polyphenylene oxide Polymers 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical compound C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 2
- OFEAOSSMQHGXMM-UHFFFAOYSA-N 12007-10-2 Chemical compound [W].[W]=[B] OFEAOSSMQHGXMM-UHFFFAOYSA-N 0.000 description 2
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 2
- 229910019855 Cr2GaN Inorganic materials 0.000 description 2
- 229910003842 Hf2InC Inorganic materials 0.000 description 2
- 229910003836 Hf2SnC Inorganic materials 0.000 description 2
- 229910003837 Hf2SnN Inorganic materials 0.000 description 2
- 229910003838 Hf2TlC Inorganic materials 0.000 description 2
- 229910015419 Mo2GaC Inorganic materials 0.000 description 2
- 229910019637 Nb2AlC Inorganic materials 0.000 description 2
- 229910019707 Nb2AsC Inorganic materials 0.000 description 2
- 229910019710 Nb2GaC Inorganic materials 0.000 description 2
- 229910019701 Nb2InC Inorganic materials 0.000 description 2
- 229910019698 Nb2SnC Inorganic materials 0.000 description 2
- 229910004447 Ta2AlC Inorganic materials 0.000 description 2
- 229910004477 Ta2GaC Inorganic materials 0.000 description 2
- 229910004470 Ta4AlC3 Inorganic materials 0.000 description 2
- 229910009594 Ti2AlN Inorganic materials 0.000 description 2
- 229910009930 Ti2GaC Inorganic materials 0.000 description 2
- 229910009925 Ti2GaN Inorganic materials 0.000 description 2
- 229910009926 Ti2GeC Inorganic materials 0.000 description 2
- 229910009927 Ti2InC Inorganic materials 0.000 description 2
- 229910009928 Ti2InN Inorganic materials 0.000 description 2
- 229910009966 Ti2PbC Inorganic materials 0.000 description 2
- 229910010013 Ti2SnC Inorganic materials 0.000 description 2
- 229910010014 Ti2TlC Inorganic materials 0.000 description 2
- 229910009818 Ti3AlC2 Inorganic materials 0.000 description 2
- 229910009821 Ti3GeC2 Inorganic materials 0.000 description 2
- 229910009817 Ti3SiC2 Inorganic materials 0.000 description 2
- 229910009846 Ti4AlN3 Inorganic materials 0.000 description 2
- 229910033181 TiB2 Inorganic materials 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 229910008196 Zr2InC Inorganic materials 0.000 description 2
- 229910008255 Zr2PbC Inorganic materials 0.000 description 2
- 229910008248 Zr2SnC Inorganic materials 0.000 description 2
- 229910008244 Zr2TlC Inorganic materials 0.000 description 2
- 229910008237 Zr2TlN Inorganic materials 0.000 description 2
- 229910007948 ZrB2 Inorganic materials 0.000 description 2
- 229910026551 ZrC Inorganic materials 0.000 description 2
- RYKWKNGQFAVABI-UHFFFAOYSA-N [B].[B].[B].[B].[B].[Mo].[Mo] Chemical compound [B].[B].[B].[B].[B].[Mo].[Mo] RYKWKNGQFAVABI-UHFFFAOYSA-N 0.000 description 2
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 2
- TWRSDLOICOIGRH-UHFFFAOYSA-N [Si].[Si].[Hf] Chemical compound [Si].[Si].[Hf] TWRSDLOICOIGRH-UHFFFAOYSA-N 0.000 description 2
- VGQSEFBWEDYXLE-UHFFFAOYSA-N [Si].[Si].[Si].[Ta].[Ta].[Ta].[Ta].[Ta] Chemical compound [Si].[Si].[Si].[Ta].[Ta].[Ta].[Ta].[Ta] VGQSEFBWEDYXLE-UHFFFAOYSA-N 0.000 description 2
- GNKTZDSRQHMHLZ-UHFFFAOYSA-N [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] Chemical compound [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] GNKTZDSRQHMHLZ-UHFFFAOYSA-N 0.000 description 2
- VKTGMGGBYBQLGR-UHFFFAOYSA-N [Si].[V].[V].[V] Chemical compound [Si].[V].[V].[V] VKTGMGGBYBQLGR-UHFFFAOYSA-N 0.000 description 2
- CFJRGWXELQQLSA-UHFFFAOYSA-N azanylidyneniobium Chemical compound [Nb]#N CFJRGWXELQQLSA-UHFFFAOYSA-N 0.000 description 2
- SKKMWRVAJNPLFY-UHFFFAOYSA-N azanylidynevanadium Chemical compound [V]#N SKKMWRVAJNPLFY-UHFFFAOYSA-N 0.000 description 2
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 2
- MANYRMJQFFSZKJ-UHFFFAOYSA-N bis($l^{2}-silanylidene)tantalum Chemical compound [Si]=[Ta]=[Si] MANYRMJQFFSZKJ-UHFFFAOYSA-N 0.000 description 2
- DFJQEGUNXWZVAH-UHFFFAOYSA-N bis($l^{2}-silanylidene)titanium Chemical compound [Si]=[Ti]=[Si] DFJQEGUNXWZVAH-UHFFFAOYSA-N 0.000 description 2
- LUWOVYQXZRKECH-UHFFFAOYSA-N bis($l^{2}-silanylidene)vanadium Chemical compound [Si]=[V]=[Si] LUWOVYQXZRKECH-UHFFFAOYSA-N 0.000 description 2
- GJIKIPCNQLUSQC-UHFFFAOYSA-N bis($l^{2}-silanylidene)zirconium Chemical compound [Si]=[Zr]=[Si] GJIKIPCNQLUSQC-UHFFFAOYSA-N 0.000 description 2
- UHPOHYZTPBGPKO-UHFFFAOYSA-N bis(boranylidyne)chromium Chemical compound B#[Cr]#B UHPOHYZTPBGPKO-UHFFFAOYSA-N 0.000 description 2
- VDZMENNHPJNJPP-UHFFFAOYSA-N boranylidyneniobium Chemical compound [Nb]#B VDZMENNHPJNJPP-UHFFFAOYSA-N 0.000 description 2
- XTDAIYZKROTZLD-UHFFFAOYSA-N boranylidynetantalum Chemical compound [Ta]#B XTDAIYZKROTZLD-UHFFFAOYSA-N 0.000 description 2
- JEUVAEBWTRCMTB-UHFFFAOYSA-N boron;tantalum Chemical compound B#[Ta]#B JEUVAEBWTRCMTB-UHFFFAOYSA-N 0.000 description 2
- AUVPWTYQZMLSKY-UHFFFAOYSA-N boron;vanadium Chemical compound [V]#B AUVPWTYQZMLSKY-UHFFFAOYSA-N 0.000 description 2
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 2
- 229910021358 chromium disilicide Inorganic materials 0.000 description 2
- ZGHDMISTQPRNRG-UHFFFAOYSA-N dimolybdenum Chemical compound [Mo]#[Mo] ZGHDMISTQPRNRG-UHFFFAOYSA-N 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- MELCCCHYSRGEEL-UHFFFAOYSA-N hafnium diboride Chemical compound [Hf]1B=B1 MELCCCHYSRGEEL-UHFFFAOYSA-N 0.000 description 2
- WHJFNYXPKGDKBB-UHFFFAOYSA-N hafnium;methane Chemical compound C.[Hf] WHJFNYXPKGDKBB-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- JAGQSESDQXCFCH-UHFFFAOYSA-N methane;molybdenum Chemical compound C.[Mo].[Mo] JAGQSESDQXCFCH-UHFFFAOYSA-N 0.000 description 2
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 2
- 229910021343 molybdenum disilicide Inorganic materials 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 229910003468 tantalcarbide Inorganic materials 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 229910021352 titanium disilicide Inorganic materials 0.000 description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910021353 zirconium disilicide Inorganic materials 0.000 description 2
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005442 molecular electronic Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a circuit protection assembly. The circuit protection assembly comprises a copper-foil-coated laminated plate, a protection element with a resistance positive temperature effect, a conducting part and electrical test points. The protection element with the resistance positive temperature effect is arranged in the copper-foil-coated laminated plate and formed by tightly clamping a polymer-based conducting composite layer between two metal electrode slices, the polymer-based conducting composite layer comprises at least one polymer base material and at least one kind of conducting powder with the electrical resistivity smaller than 100 microohm.cm, and the particle size distribution range of the conducting powder is 0.1 microohm to 50 microohms. The protection element with the resistance positive temperature effect and a protected circuit are electrically connected through the conducting part. The electrical characteristics of the protection element with the resistance positive temperature effect can be detected through the electrical test points. The circuit protection assembly can save the installation space of the circuit protection element and has good detectability and environmental reliability.
Description
Technical Field
The invention relates to a circuit protection assembly with an external electrical test point, belonging to a high molecular electronic component, in particular to a circuit protection assembly which is provided with an external electrical test point and has a protection element with resistance positive temperature effect embedded in a copper clad laminate.
Background
The polymer-based conductive composite material can maintain a lower resistance value at normal temperature and has the characteristic of acute response to temperature change, namely, when overcurrent or overtemperature occurs in a circuit, the resistance of the polymer-based conductive composite material is instantly increased to a high resistance value, so that the circuit is in an open circuit state, and the purpose of protecting circuit elements is achieved. Therefore, the protective element prepared by the polymer-based conductive composite material can be connected into a circuit and used as a material of a current sensing element. Such materials have been widely used in electronic circuit protection devices.
With the development of intelligent mobile terminals, the large current and miniaturization of electronic components are the trend of development. However, the conventional circuit protection element mounted on the surface of the circuit board is limited by more and more limited space, and if the performance needs to be further improved, the performance is improved and limited due to the limited space. In addition, the circuit protection element is sealed inside the copper clad laminate, so that the influence of the external environment on the circuit protection element is reduced to a great extent, and the circuit protection element has better environmental reliability. However, when a failure occurs in the circuit, the electrical characteristics of the circuit protection element built in the copper clad laminate cannot be detected, and the failure point cannot be confirmed. In addition, in the process of assembling electronic components, it is sometimes necessary to sort the electrical properties. Therefore, the test points are arranged on the surface of the built-in device, whether the built-in element has a fault or not can be confirmed, and convenience can be brought to the sorting of the electrical performance of the electronic components.
The applicant application No. 2016109037960 provides a circuit protection assembly, which comprises a protection element with resistance positive temperature effect, a copper-clad laminate and a through hole, wherein the protection element is composed of a polymer-based conductive composite material layer tightly clamped between two metal electrode plates and has resistance positive temperature effect; electrically connecting the protective element with the resistance positive temperature effect and a protected circuit through a conductive component; wherein the polymer-based conductive composite layer comprises at least one polymer substrate and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m. The circuit protection assembly can save the installation space of the circuit protection element and has good environmental reliability. But the protection device with resistance positive temperature effect cannot be known immediately.
Disclosure of Invention
The invention aims to: a circuit protection module having external electrical test points is provided to meet the miniaturization requirements of circuit protection devices and to improve the environmental reliability and detectability of the circuit protection devices.
Yet another object of the present invention is to: a method of manufacturing the above-described circuit protection assembly having an external electrical test point is provided.
The purpose of the invention is realized by the following scheme: a circuit protection assembly having an external electrical test point, comprising a protective element having a resistive positive temperature effect formed by tightly clamping a polymer-based conductive composite layer between two metal electrode sheets, and further comprising:
(a) the copper clad laminate is used as a substrate of the circuit protection assembly, the middle part of the copper clad laminate is provided with a containing space of a protection element, the protection element with the resistance positive temperature effect is arranged in the containing space, and the upper part and the lower part of the substrate are compounded with copper foil through adhesive layers;
(b) the protective element with resistance positive temperature effect is arranged in the copper-clad laminate, the polymer-based conductive composite layer comprises at least one polymer base material and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m;
(c) a conductive member electrically connecting the protection element having the resistance positive temperature effect and a protected circuit;
(d) and the electrical test point is arranged on the surface insulating layer of the circuit protection component, is not covered by the insulating layer, or is formed by electroplating, spraying or chemically plating a layer of conductive material on the part which is not covered by the insulating layer and is electrically connected with the protection element with the resistance positive temperature effect.
The circuit protection element is arranged in the copper clad laminate, so that the thickness of the protection element with resistance positive temperature effect can be reduced, the influence of the external environment on the protection element can be reduced, and the circuit protection element has excellent environmental reliability. In addition, the electrical characteristics of the protective element with positive temperature effect arranged in the circuit protection assembly can be conveniently detected through the electrical test points arranged on the surface of the circuit protection assembly. And the protective element with the resistance positive temperature effect is connected in series in a protected circuit through the conductive component to form a conductive path.
On the basis of the scheme, the copper clad laminate is a single-layer, double-layer or multi-layer substrate, the substrate is compounded with copper foil through an adhesive layer, and the substrate is one or a combination of a paper-based copper clad laminate, a glass fiber cloth-based copper clad laminate, a composite-based copper clad laminate, a laminated multi-layer board-based copper clad laminate or a ceramic-based copper clad laminate.
On the basis of the scheme, the adhesive layer adopts one or the combination of phenolic resin, epoxy resin, polyester resin, bismaleimide modified triazine resin, polyimide resin, diphenylene ether resin, maleic anhydride imine-styrene resin, polycyanate resin and polyolefin resin.
In addition to the above, the conductive powder is selected from one or a mixture of two or more of carbon-based conductive powder, metal powder and conductive ceramic powder.
On the basis of the scheme, the carbon-based conductive powder comprises: carbon black, carbon fibers, carbon nanotubes, graphite, graphene, and mixtures thereof;
the metal powder is: one of copper, nickel, cobalt, iron, tungsten, tin, lead, silver, gold, platinum or alloys thereof, and mixtures thereof;
the conductive ceramic powder is: one or a mixture of several of metal nitride, metal carbide, metal boride, metal silicide and ceramic powder with laminated structure;
on the basis of the scheme, the metal boride is one of tantalum boride, tantalum diboride, vanadium boride, vanadium diboride, zirconium diboride, titanium diboride, niobium boride, niobium diboride, dimolybdenum boride, dimolybdenum pentaboride, hafnium diboride, ditungstenboride, tungsten boride, dichromium boride, chromium diboride or chromium pentaboride.
On the basis of the scheme, the metal nitride is one of tantalum nitride, vanadium nitride, zirconium nitride, titanium nitride, niobium nitride or hafnium nitride.
On the basis of the scheme, the metal carbide is one of tantalum carbide, vanadium carbide, zirconium carbide, titanium carbide, niobium carbide, dimolybdenum carbide, hafnium carbide, tungsten carbide, ditungsten carbide or tricomium carbide.
Based on the above scheme, the metal silicide is one of tantalum disilicide, pentatantalum trisilicide, trivanadium silicide, vanadium disilicide, zirconium disilicide, titanium disilicide, pentatitanium trisilicide, niobium disilicide, molybdenum disilicide, hafnium disilicide, tungsten disilicide, chromium trisilicide, or chromium disilicide.
On the basis of the scheme, the ceramic powder with the layered structure is Sc2InC、Ti2AlC、Ti2GaC、Ti2InC、Ti2TlC、V2AlC、V2GaC、Cr2GaC、Ti2AlN、Ti2GaN、Ti2InN、V2GaN、Cr2GaN、Ti2GeC、Ti2SnC、Ti2PbC、V2GeC、Cr2SiC、Cr2GeC、V2PC、V2AsC、Ti2SC、Zr2InC、Zr2TlC、Nb2AlC、Nb2GaC、Nb2InC、Mo2GaC、Zr2InN、Zr2TlN、Zr2SnC、Zr2PbC、Nb2SnC、Nb2PC、Nb2AsC、Zr2SC、Nb2SC、Hf2SC、Hf2InC、Hf2TlC、Ta2AlC、Ta2GaC、Hf2SnC、Hf2PbC、Hf2SnN、Ti3AlC2、V3AlC2、Ta3AlC2、Ti3SiC2、Ti3GeC2、Ti3SnC2、Ti4AlN3、V4AlC3、Ti4GaC3、Nb4AlN3、Ta4AlC3、Ti4SiC3、Ti4GeC3One or a mixture thereof.
On the basis of the scheme, the shape of the conductive component is a point shape, a linear shape, a belt shape, a lamellar shape, a columnar shape, a circular through hole, a semicircular through hole, an arc-shaped through hole, a blind hole, other irregular shapes and a combination of the point shape, the linear shape, the belt shape, the lamellar shape, the columnar shape, the circular through hole, the semicircular through hole, the. The base material of the conductive component is one of nickel, copper, aluminum, zinc, tin, bismuth, indium, silver and gold and the alloy thereof.
On the basis of the scheme, the number of the electric test points is 2 or more than 2, and the selected base material is as follows: one of nickel, copper, aluminum, zinc, tin, bismuth, indium, silver, gold and their alloys.
On the basis of the scheme, the electrical test points are positioned on the same surface or different surfaces of the circuit protection component.
On the basis of the scheme, the shape of the electrical test point is in a round point shape, a linear shape, a belt shape, a triangular shape, a polygonal shape, other irregular shapes and a combination of the round point shape, the linear shape, the belt shape, the triangular shape and the polygonal shape.
On the basis of the scheme, the polymer base material is as follows: polyethylene, chlorinated polyethylene, oxidized polyethylene, polyvinyl chloride, butadiene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycarbonate, polyamide, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polyoxymethylene, phenol resin, polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, polytrifluoroethylene, polyvinyl fluoride, maleic anhydride grafted polyethylene, polypropylene, polyvinylidene fluoride, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-acrylic acid copolymer, and mixtures thereof.
The invention provides a manufacturing method of the circuit protection component, which comprises the following steps:
firstly, a copper-clad laminate is taken as a protective substrate of a protective element with a resistance positive temperature effect, the protective element with the resistance positive temperature effect, which consists of a polymer conductive composite material base layer with the resistance positive temperature effect, a lower metal electrode and an upper metal electrode, is placed in a base material of the copper-clad laminate, a semi-cured adhesive layer is thermally pressed on the surface of the base material of the copper-clad laminate, then a copper foil is pressed on the semi-cured adhesive layer, the copper foil is etched, and at least left and right upper copper foils are formed on the upper surface;
secondly, a protective element with resistance positive temperature effect is arranged in the copper-clad laminate, the polymer-based conductive composite material layer comprises at least one polymer base material and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m;
thirdly, the number of the conductive parts is three, one conductive part electrically connects the upper metal electrode with the upper copper foil on one side, and the other conductive part electrically connects the lower metal electrode with the lower copper foil; the third conductive part electrically connects the lower copper foil and the upper copper foil on the other side;
and fourthly, two electrical test points are arranged on the upper surface of the circuit protection assembly and are electrically connected with the protection element with the resistance positive temperature effect through the left upper copper foil and the right upper copper foil, and the two electrical test points are respectively parts which are not covered by the upper insulating layer on the left upper copper foil and the right upper copper foil and are in the shapes of round points, lines, belts, triangles, multilateral shapes or a combination of the round points, the lines, the belts, the triangles and the polygonal shapes.
Or, the two conductive parts are provided, the lower metal electrode is electrically connected with the upper left copper foil through one conductive part, the upper right metal electrode is electrically connected with the upper right copper foil through the other conductive part, and the protective element with the resistance positive temperature effect is electrically connected with the protected circuit.
Or, the number of the conductive parts is three, the upper metal electrode is electrically connected with the copper foil on one side through one conductive part, the lower metal electrode is electrically connected with the copper foil on the other side through the other conductive part, and the lower copper foil is electrically connected with the upper metal electrode through the third conductive part, so that the protective element with the resistance positive temperature effect is electrically connected with a protected circuit.
The invention has the advantages that: the circuit protection element is arranged in the copper clad laminate, so that the influence caused by the thickness of the circuit protection element can be greatly reduced, and a larger designable space is brought to the area of the circuit protection element. In addition, the circuit protection element is sealed inside the copper clad laminate, so that the influence of the external environment on the circuit protection element is reduced to a great extent, and the circuit protection element has excellent environmental reliability. In addition, the electrical characteristics of the protective element with positive temperature effect arranged in the circuit protection assembly can be conveniently detected through the electrical test points arranged on the surface of the circuit protection assembly.
Drawings
FIG. 1 is a schematic diagram of a protection device with a resistive positive temperature effect according to the present invention;
FIG. 2 is a schematic cross-sectional view of the embodiment 1 of the present invention;
FIG. 3 is a schematic cross-sectional view of the second embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of the embodiment 3 of the present invention;
the reference numbers in the figures illustrate:
in fig. 1:
110 a-lower metal electrode sheet; 110 b-upper metal electrode sheet;
120-conductive composite substrate;
in fig. 2:
210 a-lower metal electrode; 210 b-upper metal electrode;
220-conductive composite substrate;
231a — lower insulating paint layer; 231b — a layer of insulating paint;
232-base material of copper clad laminate;
233a — lower semi-cured adhesive layer; 233 b-upper semi-cured adhesive layer;
240a, 240b, 240c — electrically conductive members one, two, three;
250a, 250b, 250 c-copper foils one, two, three;
260a, 260b — electrical test points one, two;
in fig. 3:
320-conductive composite base layer;
310 a-lower metal electrode; 310 b-upper metal electrode;
331 b-applying a layer of insulating paint; 331a — lower insulating paint layer;
332-copper clad laminate substrate;
333 a-lower semi-cured adhesive layer; 333 b-upper semi-cured adhesive layer;
340a, 340b — conductive members one, two;
350a, 350 b-copper foils one, two;
360a, 360b — Electrical test points one, two;
in fig. 4:
420-conductive composite substrate;
410 a-lower metal electrode; 410 b-upper metal electrode;
431 b-upper insulating paint layer; 431 a-lower insulating paint layer;
432-copper clad laminate substrate;
433a — lower semi-cured adhesive layer; 433 b-upper semi-cured adhesive layer;
440a, 440b, -conductive members one, two, three;
450a, 450b, 450 c-copper foil one, two, three;
460a, 460b — electrical test points one, two.
Detailed Description
The circuit protection component of the invention has the following specific implementation mode:
first, manufacture of protection element with resistance positive temperature effect
The protective element with the resistance positive temperature effect is formed by tightly clamping a polymer-based conductive composite material layer between two metal electrode plates, wherein the polymer-based conductive composite material layer comprises at least one polymer base material and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m.
The polymer base material is: polyethylene, chlorinated polyethylene, oxidized polyethylene, polyvinyl chloride, butadiene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycarbonate, polyamide, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polyoxymethylene, phenol resin, polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, polytrifluoroethylene, polyvinyl fluoride, maleic anhydride grafted polyethylene, polypropylene, polyvinylidene fluoride, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-acrylic acid copolymer, and mixtures thereof.
The conductive powder is selected from one or a mixture of more than two of carbon conductive powder, metal powder and conductive ceramic powder, the conductive powder satisfies the electrical resistivity of less than 100 mu omega cm, and the particle size distribution range is between 0.1 mu m and 50 mu m.
The polymer and the conductive powder are prepared according to the formula of the PTC base material which is commonly used at present. Setting the temperature of an internal mixer to 180 ℃, setting the rotating speed to 30 r/min, firstly adding the polymer for internal mixing for 3 min, then adding the conductive filler, continuously internal mixing for 15 min, and then discharging to obtain the conductive composite material with the resistance positive temperature effect.
The melted and mixed conductive composite material with the resistance positive temperature effect is rolled by an open mill to obtain a conductive composite material base layer 120 with the thickness of 0.20-0.25 mm and the resistance positive temperature effect, as shown in fig. 1.
The conductive composite material base layer 120 having the resistance positive temperature effect is disposed between two metal electrode sheets 110a and 110b as shown in fig. 1, and the rough surfaces of the metal electrode sheets 110a and 110b are tightly combined with the conductive composite material base layer 120 having the resistance positive temperature effect. The three layers are stacked and tightly combined together by a hot pressing method. And (3) carrying out hot pressing at the temperature of 180 ℃ under the pressure of 12 MPa for 10 minutes, and finally carrying out cold pressing on the chip on a cold press for 10 minutes to obtain the chip with the resistance positive temperature effect.
The chip with the resistance positive temperature effect is punched or diced to manufacture the protection element with the resistance positive temperature effect shown in figure 1 with a proper size.
And secondly, manufacturing the circuit protection component.
Example 1
A circuit protection assembly comprises the protection element with resistance positive temperature effect, which is formed by tightly clamping a polymer-based conductive composite material layer between two metal electrode plates, and also comprises: as shown in figure 2 of the drawings, in which,
the circuit protection assembly comprises a first copper clad laminate serving as a substrate of the circuit protection assembly, wherein a containing space of a protection element is arranged in the middle of the substrate, the protection element with the resistance positive temperature effect and composed of a conductive composite material base layer 220 with the resistance positive temperature effect, a lower metal electrode 210a and an upper metal electrode 210b is placed in the containing space in the substrate 232 of the copper clad laminate, semi-cured adhesive layers 233a and 233b are thermally pressed on the upper surface and the lower surface of the substrate 232 of the copper clad laminate, then a copper foil is pressed on the semi-cured layers, and the copper foil is etched to form an upper left copper foil 250c, an upper right copper foil 250b and a lower copper foil 250 a;
secondly, a protective element with resistance positive temperature effect is arranged in the copper-clad laminate, the polymer-based conductive composite material layer comprises at least one polymer base material and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m;
third, a conductive member electrically connecting the protection element having the resistance positive temperature effect and the circuit to be protected, wherein the upper metal electrode 210b is electrically connected to the upper right copper foil 250b through the second conductive member 240b, the lower metal electrode 210a is electrically connected to the lower copper foil 250a through the first conductive member 240a, and the lower copper foil 250a is electrically connected to the upper left copper foil 250c through the third conductive member 240c, and the lower copper foil 250a and the upper right copper foil 250b may be processed into external circuits having various shapes, such as circular through holes, or dot, linear, strip, laminar, columnar, semicircular through holes, arc-shaped through holes, blind holes, other irregular shapes, and combinations thereof;
fourthly, the number of the electric test points is 2, the electric test points are arranged on the upper surface of the circuit protection assembly and are electrically connected with the protection element with the resistance positive temperature effect, and the electric test points are made of the following base materials: one of nickel, copper, aluminum, zinc, tin, bismuth, indium, silver, gold and their alloys. The method for manufacturing the electrical test points comprises the following steps:
the upper and lower surfaces of the circuit protection assembly are respectively covered with an upper insulating paint layer 231b and a lower insulating paint layer 231a to prevent other elements from being in electrical contact with an external circuit, and the first and second electrical test points 260a and 260b are arranged on the upper surface of the circuit protection assembly and are respectively the parts of the left upper copper foil 250c and the right upper copper foil 250b which are not covered by the upper insulating paint layer 231b, and the first and second electrical test points are in a round point shape and can also be in a linear shape, a strip shape, a triangular shape, a polygonal shape, other irregular shapes and combinations thereof. Electrical test point one 260a is electrically connected to the top left copper foil 250c and electrical test point two 260b is electrically connected to the top right copper foil 250 b. The electrical property of the protective element with the resistance positive temperature effect can be detected through the electrical appliance test point.
An identifier may be printed on the layer of insulating paint.
In this embodiment, the copper clad laminate is a single-layer, double-layer or multi-layer substrate, the substrate is compounded with a copper foil through an adhesive layer, and the substrate is one or a combination of a paper-based copper clad laminate, a glass fiber cloth-based copper clad laminate, a composite-based copper clad laminate, a laminated multi-layer board-based copper clad laminate or a ceramic-based copper clad laminate.
The semi-cured adhesive layer is made of one or a combination of phenolic resin, epoxy resin, polyester resin, bismaleimide modified triazine resin, polyimide resin, diphenylene ether resin, maleic anhydride imine-styrene resin, polycyanate resin and polyolefin resin.
The conductive powder is selected from one or a mixture of more than two of carbon conductive powder, metal powder and conductive ceramic powder.
The carbon-based conductive powder is: carbon black, carbon fibers, carbon nanotubes, graphite, graphene, and mixtures thereof.
The metal powder is: one of copper, nickel, cobalt, iron, tungsten, tin, lead, silver, gold, platinum or alloys thereof, and mixtures thereof.
The conductive ceramic powder is: one or a mixture of several of metal nitride, metal carbide, metal boride, metal silicide and ceramic powder with laminated structure. Wherein,
the metal boride is one of tantalum boride, tantalum diboride, vanadium boride, vanadium diboride, zirconium diboride, titanium diboride, niobium boride, niobium diboride, dimolybdenum boride, dimolybdenum pentaboride, hafnium diboride, ditungsten boride, tungsten boride, dichromium boride, chromium diboride or chromium pentaboride.
The metal nitride is one of tantalum nitride, vanadium nitride, zirconium nitride, titanium nitride, niobium nitride or hafnium nitride.
The metal carbide is one of tantalum carbide, vanadium carbide, zirconium carbide, titanium carbide, niobium carbide, dimolybdenum carbide, hafnium carbide, tungsten carbide, ditungsten carbide or tricomium carbide.
The metal silicide is one of tantalum disilicide, pentatantalum trisilicide, trivanadium silicide, vanadium disilicide, zirconium disilicide, titanium disilicide, pentatitanium trisilicide, niobium disilicide, molybdenum disilicide, hafnium disilicide, tungsten disilicide, chromium trisilicide or chromium disilicide.
The ceramic powder with the layered structure is Sc2InC、Ti2AlC、Ti2GaC、Ti2InC、Ti2TlC、V2AlC、V2GaC、Cr2GaC、Ti2AlN、Ti2GaN、Ti2InN、V2GaN、Cr2GaN、Ti2GeC、Ti2SnC、Ti2PbC、V2GeC、Cr2SiC、Cr2GeC、V2PC、V2AsC、Ti2SC、Zr2InC、Zr2TlC、Nb2AlC、Nb2GaC、Nb2InC、Mo2GaC、Zr2InN、Zr2TlN、Zr2SnC、Zr2PbC、Nb2SnC、Nb2PC、Nb2AsC、Zr2SC、Nb2SC、Hf2SC、Hf2InC、Hf2TlC、Ta2AlC、Ta2GaC、Hf2SnC、Hf2PbC、Hf2SnN、Ti3AlC2、V3AlC2、Ta3AlC2、Ti3SiC2、Ti3GeC2、Ti3SnC2、Ti4AlN3、V4AlC3、Ti4GaC3、Nb4AlN3、Ta4AlC3、Ti4SiC3、Ti4GeC3One or a mixture thereof.
The polymer base material is: polyethylene, chlorinated polyethylene, oxidized polyethylene, polyvinyl chloride, butadiene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycarbonate, polyamide, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polyoxymethylene, phenol resin, polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, polytrifluoroethylene, polyvinyl fluoride, maleic anhydride grafted polyethylene, polypropylene, polyvinylidene fluoride, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-acrylic acid copolymer, and mixtures thereof.
Example 2
A circuit protection assembly with external electrical test points, similar to example 1, comprising a protection element with resistive positive temperature effect composed of a conductive composite material base layer 320 with resistive positive temperature effect, a lower metal electrode 310a and an upper metal electrode 310b, as shown in fig. 3:
the circuit protection component comprises a first copper clad laminate, a second copper clad laminate and a protection component, wherein the first copper clad laminate is used as a substrate of the circuit protection component, a containing space of the protection component is arranged in the middle of the substrate 332 of the copper clad laminate, the protection component with the resistance positive temperature effect is placed in the containing space of the substrate 332 of the copper clad laminate, a lower semi-curing adhesive layer 333a and an upper semi-curing adhesive layer 333b are thermally pressed on the surface of the substrate 332 of the copper clad laminate, then a copper foil is pressed on the lower semi-curing adhesive layer 333a and the lower semi-curing adhesive layer 333b, the upper part and the lower part of the substrate are compounded with the copper foil through adhesive layers, the copper foil is etched to form an upper left copper foil 350a and an upper right copper foil 350b, and the upper;
secondly, a protective element with resistance positive temperature effect is arranged in a base material 332 of the copper clad laminate, the polymer-based conductive composite material layer comprises at least one polymer base material and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 mu m and 50 mu m;
thirdly, the lower metal electrode 310a is electrically connected with the left upper copper foil 350a through the first conductive component 340a, the right upper metal electrode 310b is electrically connected with the right upper copper foil 350b through the second conductive component 340b, and the protective element with the resistance positive temperature effect is electrically connected with a protected circuit;
fourthly, the electrical test points are arranged on the surface insulating layer of the circuit protection assembly, the upper surface and the lower surface of the circuit protection assembly are respectively covered with upper insulating paint 331b and lower insulating paint 331a, other elements are prevented from being electrically contacted with an external circuit, identifiers can be printed on the electrical test points, the surfaces of the upper insulating paint layer 331b are exposed out of the electrical test points I, II, 360a and 360b, and the electrical test points I, II, 360a and 360b are respectively column-shaped electrical test points formed by electroplating, spraying and chemically plating a layer of conductive material on the parts, which are not covered by the insulating paint layer, of the left upper copper foil 350a and the right upper copper foil 350b, wherein the electrical test points I360 a and II, 360b are electrically connected with the upper copper foil 350b and are electrically connected with the protective element with.
Example 3
A circuit protection assembly with external electrical test points, similar to example 1, comprising a protection element with resistance positive temperature effect composed of a conductive composite material base layer 420 with resistance positive temperature effect, a lower metal electrode 410a and an upper metal electrode 410b, as shown in fig. 4:
the circuit protection assembly comprises a first copper clad laminate serving as a substrate of the circuit protection assembly, a containing space of a protection element is arranged in the middle of the circuit protection assembly, the protection element with the resistance positive temperature effect is arranged in the containing space of a copper clad laminate base material 432, a lower semi-curing adhesive layer 433a and an upper semi-curing adhesive layer 433b are thermally pressed on the surface of the copper clad laminate base material 432, then the copper clad laminate is compounded with a copper foil, and the copper foil is etched to form a first copper foil, a second copper foil, a third copper foil, a 450a, a 450b and a 450 c;
secondly, a protective element with resistance positive temperature effect is arranged in the copper-clad laminate substrate, the polymer-based conductive composite material layer comprises at least one polymer substrate and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m;
thirdly, the first and second conductive parts 440a, 440b electrically connect the upper metal electrode 410b with the second copper foil 450b through the second conductive part 440b, electrically connect the lower metal electrode 410a with the first copper foil 450a through the first conductive part 440a, and electrically connect the second copper foil 450b with the third copper foil 450c through the third conductive part 440c, so that the protection element with resistance positive temperature effect is electrically connected with the protected circuit;
fourthly, the first, second electrical test points 460a and 460b are disposed on the surface insulation layer of the circuit protection assembly, the surface of the circuit protection assembly is covered with the upper and lower layers 431b and 431a respectively to prevent other components from being electrically contacted with the external circuit, and the identifier can be printed thereon, the surface of the upper layer 431b exposes the first, second electrical test points 460a and 460b, which are formed by electroplating, spraying and chemically plating a layer of conductive material on the portion of the first, second and third copper foils 450a and 450b which is not covered by the upper layer 431b, and are electrically connected with the protective component with the resistance positive temperature effect.
The copper foils one, two, three 450a, 450b, 450c can be processed into external circuits with various shapes.
Wherein the first electrical test point 460a is electrically connected to the first copper foil 450a, and the second electrical test point 460b is electrically connected to the second copper foil 450 b.
Electrical test points one, two 460a, 460b may also be portions of copper foils one, two 450a, 450b, respectively, that are not covered by the insulating varnish.
While the invention has been disclosed in the foregoing description with reference to specific embodiments thereof, the foregoing description is directed to only certain specific embodiments of the invention and many more specific features of the invention may be employed than as disclosed herein. Therefore, the scope of the present invention should not be limited to the disclosure of the embodiments, but should include all combinations of the contents embodied in different parts, and various substitutions and modifications without departing from the present invention, and are covered by the claims of the present invention.
Claims (12)
1. A circuit protection assembly with external electrical test points, comprising a protective element with resistive positive temperature effect formed by tightly clamping a polymer-based conductive composite material layer between two metal electrode sheets, characterized in that: further comprising:
(a) the copper clad laminate is used as a substrate of the circuit protection assembly, the middle part of the copper clad laminate is provided with a containing space of a protection element, the protection element with the resistance positive temperature effect is arranged in the containing space, and the upper part and the lower part of the substrate are compounded with copper foil through adhesive layers;
(b) the protective element with resistance positive temperature effect is arranged in the copper-clad laminate, the polymer-based conductive composite layer comprises at least one polymer base material and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m;
(c) a conductive member electrically connecting the protection element having the resistance positive temperature effect and a protected circuit;
(d) and the electrical test point is arranged on the surface insulating layer of the circuit protection component, is not covered by the insulating layer, or is formed by electroplating, spraying or chemically plating a layer of conductive material on the part which is not covered by the insulating layer and is electrically connected with the protection element with the resistance positive temperature effect.
2. The circuit protection assembly with external electrical test points of claim 1, wherein: the copper clad laminate is a single-layer, double-layer or multi-layer substrate, the substrate is compounded with copper foil through an adhesive layer, and the substrate is one or a combination of a paper-based copper clad laminate, a glass fiber cloth-based copper clad laminate, a composite-based copper clad laminate, a laminated multi-layer board-based copper clad laminate or a ceramic-based copper clad laminate.
3. A circuit protection assembly having an external electrical test point according to claim 1 or 2, wherein: the adhesive layer is made of one or the combination of phenolic resin, epoxy resin, polyester resin, bismaleimide modified triazine resin, polyimide resin, diphenylene ether resin, maleic anhydride imine-styrene resin, polycyanate resin and polyolefin resin.
4. The circuit protection assembly with external electrical test points of claim 1, wherein: the conductive powder is selected from one or a mixture of more than two of carbon conductive powder, metal powder and conductive ceramic powder.
5. The circuit protection assembly with external electrical test points of claim 4, wherein:
the carbon-based conductive powder is: carbon black, carbon fibers, carbon nanotubes, graphite, graphene, and mixtures thereof;
the metal powder is: one of copper, nickel, cobalt, iron, tungsten, tin, lead, silver, gold, platinum or alloys thereof, and mixtures thereof;
the conductive ceramic powder is: one or a mixture of several of metal nitride, metal carbide, metal boride, metal silicide and ceramic powder with laminated structure.
6. The circuit protection assembly with external electrical test points of claim 1, wherein: the shape of the conductive component is punctiform, linear, belt-shaped, lamellar, columnar, circular through hole, semicircular through hole, arc-shaped through hole, blind hole, other irregular shapes and the combination thereof.
7. The circuit protection assembly of claim 1, wherein said number of electrical test points is 2 or more than 2, and the substrate is selected from the group consisting of: one of nickel, copper, aluminum, zinc, tin, bismuth, indium, silver, gold and their alloys.
8. The circuit protection component of claim 1 or 7 having an external electrical test point, wherein said electrical test point is located on the same surface or a different surface of said circuit protection component.
9. The circuit protection assembly of claim 8, wherein said electrical test points are shaped as dots, lines, strips, triangles, polygons, other irregularities, and combinations thereof.
10. A method of manufacturing a circuit protection component with external electrical test points according to any of claims 1 to 9, characterized by the following steps:
firstly, a copper-clad laminate is taken as a protective substrate of a protective element with a resistance positive temperature effect, the protective element with the resistance positive temperature effect, which consists of a polymer conductive composite material base layer with the resistance positive temperature effect, a lower metal electrode and an upper metal electrode, is placed in a base material of the copper-clad laminate, a semi-cured adhesive layer is thermally pressed on the surface of the base material of the copper-clad laminate, then a copper foil is pressed on the semi-cured adhesive layer, the copper foil is etched, and at least left and right upper copper foils are formed on the upper surface;
secondly, a protective element with resistance positive temperature effect is arranged in the copper-clad laminate, the polymer-based conductive composite material layer comprises at least one polymer base material and at least one conductive powder with the resistivity lower than 100 mu omega cm, and the particle size distribution range of the conductive powder is between 0.1 and 50 mu m;
thirdly, the number of the conductive parts is three, one conductive part electrically connects the upper metal electrode with the upper copper foil on one side, and the other conductive part electrically connects the lower metal electrode with the lower copper foil; the third conductive part electrically connects the lower copper foil and the upper copper foil on the other side;
and fourthly, two electrical test points are arranged on the upper surface of the circuit protection assembly and are electrically connected with the protection element with the resistance positive temperature effect through the left upper copper foil and the right upper copper foil, and the two electrical test points are respectively parts which are not covered by the upper insulating layer on the left upper copper foil and the right upper copper foil and are in the shapes of round points, lines, belts, triangles, multilateral shapes or a combination of the round points, the lines, the belts, the triangles and the polygonal shapes.
11. The method of claim 10, wherein the two conductive members are electrically connected to the upper left copper foil through a conductive member and the upper right copper foil through another conductive member, thereby electrically connecting the resistive positive temperature effect protection element and the circuit to be protected.
12. The method of claim 10, wherein the number of conductive members is three, the upper metal electrode is electrically connected to the copper foil on one side through a conductive member, the lower metal electrode is electrically connected to the copper foil on the other side through another conductive member, and the lower copper foil is electrically connected to the upper metal electrode through a third conductive member, thereby electrically connecting the circuit protection component with the positive temperature resistance effect to the circuit to be protected.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183713.1A CN106710756A (en) | 2016-12-20 | 2016-12-20 | Circuit protection assembly with external electrical test points |
| PCT/CN2017/071220 WO2018113059A1 (en) | 2016-12-20 | 2017-01-16 | Circuit protection component with external electrical test point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183713.1A CN106710756A (en) | 2016-12-20 | 2016-12-20 | Circuit protection assembly with external electrical test points |
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| CN106710756A true CN106710756A (en) | 2017-05-24 |
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| CN201611183713.1A Pending CN106710756A (en) | 2016-12-20 | 2016-12-20 | Circuit protection assembly with external electrical test points |
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| CN (1) | CN106710756A (en) |
| WO (1) | WO2018113059A1 (en) |
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| CN109243667A (en) * | 2018-08-17 | 2019-01-18 | 上海长园维安电子线路保护有限公司 | Polymer-based conducing composite material and overflow protecting element |
| JP7477210B2 (en) * | 2020-02-25 | 2024-05-01 | リテルフューズ、インコーポレイテッド | PPTC heater and material having stable resistance behavior - Patents.com |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978914A (en) * | 1988-03-15 | 1990-12-18 | Furukawa Denki Kogyo Kabushiki Kaisha | Laminated board for testing electronic components |
| JP2000235904A (en) * | 1999-02-15 | 2000-08-29 | Murata Mfg Co Ltd | Chip type thermistor and manufacture thereof |
| JP2000277305A (en) * | 1999-03-26 | 2000-10-06 | Murata Mfg Co Ltd | Overcurrent protecting part and circuit |
| US20020140540A1 (en) * | 2001-03-28 | 2002-10-03 | Protectronics Technology Corporation | Surface mountable laminated circuit protection device and method of making the same |
| CN101000817A (en) * | 2006-01-10 | 2007-07-18 | 聚鼎科技股份有限公司 | Surface adhesion type overcurrent protection element |
| TW200847195A (en) * | 2007-05-23 | 2008-12-01 | Polytronics Technology Corp | Manufacturing method of over-current protection device |
| CN102522173A (en) * | 2011-12-31 | 2012-06-27 | 上海长园维安电子线路保护有限公司 | Conducting composite material with resistance positive-temperature effect and overcurrent-protecting element |
| CN103594213A (en) * | 2012-08-14 | 2014-02-19 | 聚鼎科技股份有限公司 | overcurrent protection element |
| CN104681220A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Surface-adhered type over-current protection element and manufacturing method |
| CN104681224A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Large-current over-current over-temperature protection element |
| US20150185087A1 (en) * | 2013-12-26 | 2015-07-02 | Denso Corporation | Electronic device with temperature detecting element |
| CN105427974A (en) * | 2015-12-24 | 2016-03-23 | 上海长园维安电子线路保护有限公司 | High-polymer PTC over-current protection element |
| CN105611713A (en) * | 2015-12-22 | 2016-05-25 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and fabrication method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60321040D1 (en) * | 2002-12-11 | 2008-06-26 | Bourns Inc | CONDUCTIVE POLYMER COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
| CN103247399B (en) * | 2012-02-07 | 2016-11-09 | 聚鼎科技股份有限公司 | Surface tack thermistor element |
| CN104992802B (en) * | 2015-02-04 | 2019-07-23 | 上海长园维安电子线路保护有限公司 | Surface attaching type overcurrent protecting element |
| CN206236493U (en) * | 2016-12-20 | 2017-06-09 | 上海长园维安电子线路保护有限公司 | Circuit protecting assembly with external electrical test point |
-
2016
- 2016-12-20 CN CN201611183713.1A patent/CN106710756A/en active Pending
-
2017
- 2017-01-16 WO PCT/CN2017/071220 patent/WO2018113059A1/en active Application Filing
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978914A (en) * | 1988-03-15 | 1990-12-18 | Furukawa Denki Kogyo Kabushiki Kaisha | Laminated board for testing electronic components |
| JP2000235904A (en) * | 1999-02-15 | 2000-08-29 | Murata Mfg Co Ltd | Chip type thermistor and manufacture thereof |
| JP2000277305A (en) * | 1999-03-26 | 2000-10-06 | Murata Mfg Co Ltd | Overcurrent protecting part and circuit |
| US20020140540A1 (en) * | 2001-03-28 | 2002-10-03 | Protectronics Technology Corporation | Surface mountable laminated circuit protection device and method of making the same |
| CN101000817A (en) * | 2006-01-10 | 2007-07-18 | 聚鼎科技股份有限公司 | Surface adhesion type overcurrent protection element |
| TW200847195A (en) * | 2007-05-23 | 2008-12-01 | Polytronics Technology Corp | Manufacturing method of over-current protection device |
| CN102522173A (en) * | 2011-12-31 | 2012-06-27 | 上海长园维安电子线路保护有限公司 | Conducting composite material with resistance positive-temperature effect and overcurrent-protecting element |
| CN103594213A (en) * | 2012-08-14 | 2014-02-19 | 聚鼎科技股份有限公司 | overcurrent protection element |
| US20150185087A1 (en) * | 2013-12-26 | 2015-07-02 | Denso Corporation | Electronic device with temperature detecting element |
| CN104681220A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Surface-adhered type over-current protection element and manufacturing method |
| CN104681224A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Large-current over-current over-temperature protection element |
| CN105611713A (en) * | 2015-12-22 | 2016-05-25 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and fabrication method thereof |
| CN105427974A (en) * | 2015-12-24 | 2016-03-23 | 上海长园维安电子线路保护有限公司 | High-polymer PTC over-current protection element |
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| WO2018113059A1 (en) | 2018-06-28 |
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Address after: 200083 806, floor 8, No. 125, Liuying Road, Hongkou District, Shanghai Applicant after: Shanghai Wei'an Electronic Co.,Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant before: Shanghai Wei'an Electronic Co.,Ltd. |
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