CN106520050A - Encapsulating material of capacitor - Google Patents
Encapsulating material of capacitor Download PDFInfo
- Publication number
- CN106520050A CN106520050A CN201610944243.XA CN201610944243A CN106520050A CN 106520050 A CN106520050 A CN 106520050A CN 201610944243 A CN201610944243 A CN 201610944243A CN 106520050 A CN106520050 A CN 106520050A
- Authority
- CN
- China
- Prior art keywords
- parts
- attapulgite
- capacitor
- embedding material
- organic silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 38
- 239000003990 capacitor Substances 0.000 title claims abstract description 21
- 229960000892 attapulgite Drugs 0.000 claims abstract description 22
- 229910052625 palygorskite Inorganic materials 0.000 claims abstract description 22
- 239000004814 polyurethane Substances 0.000 claims abstract description 22
- 229920002635 polyurethane Polymers 0.000 claims abstract description 22
- 238000002360 preparation method Methods 0.000 claims abstract description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 27
- 238000003756 stirring Methods 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 238000002156 mixing Methods 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 9
- 239000012467 final product Substances 0.000 claims description 9
- 238000010907 mechanical stirring Methods 0.000 claims description 9
- 239000000017 hydrogel Substances 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000011295 pitch Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 abstract description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 5
- 230000032683 aging Effects 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000499 gel Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides an encapsulating material of a capacitor. The encapsulating material is prepared from raw materials by weight as follows: 3.0-6.0 parts of attapulgite, 8.0-10 parts of polyurethane and 3.0-4.0 parts of an organosilicon flame retardant. A preparation method of the encapsulating material comprises the steps of preparation of attapulgite modified polyurethane and preparation of the encapsulating material. The temperature of the encapsulating material can be changed with change of the temperature of the capacitor, and the temperature requirement in a wide range is met; besides, the material has good weather fastness and ageing-resistant performance and is long in service life, and the service property of the capacitor is greatly improved.
Description
Technical field
The present invention relates to a kind of capacitor area, more particularly to a kind of capacitor Embedding Material and preparation method thereof.
Background technology
Embedding be exactly each several part of components and parts is reasonably arranged on request, is assembled, being bonded, connect with environment every
From to protect all parts of first device.Its effect is the globality for strengthening device, improves external shock, waterproof, etch-proof energy
Power.The Embedding Material of capacitor is mainly epoxy resin and oils, and epoxy resin can not resist cold, and property is crisp, nonelastic, holds
Easily ftracture after high-temperature heating expansion.Oils often contain certain moisture, can progressively penetrate into capacitor body, have a strong impact on electricity
The service life of container.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided a kind of capacitor Embedding Material, its constitutive material
By weight：Attapulgite 3.0 ~ 6.0, pitch 1.0 ~ 2.0, Silica hydrogel 2.0 ~ 4.0, polyurethane 8.0 ~ 10, organic silicon flame-retardant
Agent 3.0 ~ 4.0.Its preparation method is as follows：
（1）Attapulgite is put in high energy ball mill, fine powder is ground to form；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 60 ~ 70 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp
For 70 ~ 80 DEG C, modified polyurethane is obtained；
（3）Organic silicon fibre retardant is sequentially added in modified polyurethane, pitch, Silica hydrogel stir 30min, and mixing speed is
1500r/min, temperature are 70 ~ 80 DEG C, obtain final product Embedding Material.
Beneficial effects of the present invention：Attapulgite because of its unique chain structure, with good water imbibition, big ratio table
Area and higher expansion capacity, can increase the elasticity and restoration of material；Pitch has good resistance to flow and crack resistence
Effect；Silica hydrogel can greatly promote the adhesive ability of material as a kind of binding agent with adsorptivity very.The electric capacity
It is anti-aging, resistance to well that there is device Embedding Material elasticity well and restoration, adaptive temperature wide ranges, and the material to have
High temperature, freeze proof and fire-retardant effect.
Specific embodiment
By the following specific embodiments the present invention is described further.Content therein does not have specified otherwise
It is by weight.
Embodiment 1
A kind of capacitor Embedding Material, its preparation method are as follows：
（1）Take in 3.0 parts of attapulgite input high energy ball mills, grind to form fine powder；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 65 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp is
70 ~ 80 DEG C, obtain modified polyurethane；
（3）8.0 parts of modified polyurethanes are taken, is placed in reactor, sequentially add 3.0 parts of organic silicon fibre retardant, 1.0 parts of pitch, silicon
1.5 parts of gel, stirs 30min, and mixing speed is 1500r/min, and temperature is 70 DEG C, obtains final product Embedding Material.
Embodiment 2
A kind of capacitor Embedding Material, its preparation method are as follows：
（1）Take in 3.5 parts of attapulgite input high energy ball mills, grind to form fine powder；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 65 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp is
70 ~ 80 DEG C, obtain modified polyurethane；
（3）9.0 parts of modified polyurethanes are taken, is placed in reactor, sequentially add 3.5 parts of organic silicon fibre retardant, 1.5 parts of pitch, silicon
2.0 parts of gel, 3.2 parts of organic silicon fibre retardant stir 30min, and mixing speed is 1500r/min, and temperature is 70 DEG C, obtains final product filling
Closure material.
Embodiment 3
A kind of capacitor Embedding Material, its preparation method are as follows：
（1）Take in 4.5 parts of attapulgite input high energy ball mills, grind to form fine powder；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 65 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp is
70 ~ 80 DEG C, obtain modified polyurethane；
（3）9.5 parts of modified polyurethanes are taken, is placed in reactor, sequentially add 3.5 parts of organic silicon fibre retardant, 1.8 parts of pitch, silicon
2.8 parts of gel, 3.5 parts of organic silicon fibre retardant stir 30min, and mixing speed is 1500r/min, and temperature is 70 DEG C, obtains final product filling
Closure material.
Embodiment 4
A kind of capacitor Embedding Material, its preparation method are as follows：
（1）Take in 6.0 parts of attapulgite input high energy ball mills, grind to form fine powder；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 65 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp is
70 ~ 80 DEG C, obtain modified polyurethane；
（3）10 parts of modified polyurethanes are taken, is placed in reactor, sequentially add 4.0 parts of organic silicon fibre retardant, 2.0 parts of pitch, silicon coagulate
3.0 parts of glue, 3.5 parts of organic silicon fibre retardant stir 30min, and mixing speed is 1500r/min, and temperature is 70 DEG C, obtains final product embedding
Material.
Comparative example 1
A kind of capacitor Embedding Material, its preparation method are as follows：
（1）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 65 DEG C, after stirring 30min, 9.5 parts of modified polyurethanes is taken, is placed in reactor, sequentially adds organic silicon flame-retardant
30min is stirred in 3.5 parts of agent, 1.8 parts of pitch, 2.8 parts of Silica hydrogel, 3.5 parts of organic silicon fibre retardant, and mixing speed is 1500r/
Min, temperature are 70 DEG C, obtain final product Embedding Material.
Comparative example 2
A kind of capacitor Embedding Material, its preparation method are as follows：
（1）Take in 4.5 parts of attapulgite input high energy ball mills, grind to form fine powder；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 65 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp is
70 ~ 80 DEG C, obtain modified polyurethane；
（3）9.5 parts of modified polyurethanes are taken, is placed in reactor, sequentially add 3.5 parts of organic silicon fibre retardant, 1.8 parts of pitch is stirred
30min is mixed, mixing speed is 1500r/min, and temperature is 70 DEG C, obtains final product Embedding Material.
The various embodiments described above and comparative example are carried out into gel time test, viscosity test, tensile elongation and elongation at break
Test and flame retardant test.
Comparative example 3
A kind of capacitor Embedding Material, its preparation method are as follows：
（1）Take in 4.5 parts of attapulgite input high energy ball mills, grind to form fine powder；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 65 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp is
70 ~ 80 DEG C, obtain modified polyurethane；
（3）9.5 parts of modified polyurethanes are taken, is placed in reactor, sequentially add 3.5 parts of organic silicon fibre retardant, organic silicon fibre retardant
3.5 parts, 30min is stirred, mixing speed is 1500r/min, and temperature is 70 DEG C, obtains final product Embedding Material.
The various embodiments described above and comparative example are carried out into gel time test, viscosity test, tensile elongation and elongation at break
Test and flame retardant test.
Table 1 tests acquired results
As can be seen from the table, the break-draw rate and tensile strength and flame retardant rating of each embodiment has obvious advantage,
Illustrate that the capacitor Embedding Material of present invention offer has good application prospect.
Claims (3)
1. a kind of capacitor Embedding Material, it is characterised in that its constitutive material is by weight：Attapulgite 3.0 ~ 6.0, drip
Blue or green 1.0 ~ 2.0, Silica hydrogel 1.5 ~ 3.0, polyurethane 8.0 ~ 10, organic silicon fibre retardant 3.0 ~ 4.0.
2. a kind of capacitor Embedding Material according to claim 1, it is characterised in that its constitutive material is by weight：
4.5 parts of attapulgite, pitch 1.8, Silica hydrogel 2.8,9.5 parts of polyurethane, 3.5 parts of organic silicon fibre retardant.
3. a kind of capacitor Embedding Material according to claim 1 and claim 2, it is characterised in that its preparation method
It is as follows：
（1）Attapulgite is put in high energy ball mill, fine powder is ground to form；
（2）Ethylene glycol and cyanate are taken, is sequentially added in mechanical stirring kettle, is at the uniform velocity stirred, mixing speed is 3000r/min, instead
Kettle temperature degree is answered for 60 ~ 70 DEG C, after stirring 30min, the attapulgite being ground into powder is added, continues stirring 1h, whipping temp
For 70 ~ 80 DEG C, modified polyurethane is obtained；
（3）Organic silicon fibre retardant is sequentially added in modified polyurethane, pitch, Silica hydrogel stir 30min, and mixing speed is
1500r/min, temperature are 70 ~ 80 DEG C, obtain final product Embedding Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610944243.XA CN106520050A (en) | 2016-10-26 | 2016-10-26 | Encapsulating material of capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610944243.XA CN106520050A (en) | 2016-10-26 | 2016-10-26 | Encapsulating material of capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106520050A true CN106520050A (en) | 2017-03-22 |
Family
ID=58292796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610944243.XA Pending CN106520050A (en) | 2016-10-26 | 2016-10-26 | Encapsulating material of capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106520050A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003277473A (en) * | 2002-03-26 | 2003-10-02 | Japan Epoxy Resin Kk | Epoxy resin composition for sealant of led, and led device |
| CN1809934A (en) * | 2003-04-30 | 2006-07-26 | 美商克立股份有限公司 | High powered light emitter packages with compact optics |
| CN101443924A (en) * | 2006-05-17 | 2009-05-27 | 3M创新有限公司 | Method of making light emitting device with multilayer silicon-containing encapsulant |
| CN101768418A (en) * | 2010-01-21 | 2010-07-07 | 江苏工业学院 | Preparation method of attapulgite/aqueous polyurethane compound binder |
| CN102516713A (en) * | 2011-11-18 | 2012-06-27 | 常州南京大学高新技术研究所 | Organic silicon-series clay base compound fire retardant used for epoxy resin and preparation method thereof |
| CN103937228A (en) * | 2014-04-22 | 2014-07-23 | 无锡宏广电容器有限公司 | Elastic filling material for capacitor encapsulation and preparation method thereof |
| CN104629671A (en) * | 2015-02-25 | 2015-05-20 | 孙高雷 | Modified polyurethane sealant |
| CN105385402A (en) * | 2015-12-28 | 2016-03-09 | 青岛文晟汽车零部件有限公司 | Polyurethane sealant with good water resistance |
| CN105906873A (en) * | 2016-06-23 | 2016-08-31 | 安徽荣达阀门有限公司 | Attapulgite-modified hydrophilic expansion waterproof rubber sealing material and preparation method thereof |
-
2016
- 2016-10-26 CN CN201610944243.XA patent/CN106520050A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003277473A (en) * | 2002-03-26 | 2003-10-02 | Japan Epoxy Resin Kk | Epoxy resin composition for sealant of led, and led device |
| CN1809934A (en) * | 2003-04-30 | 2006-07-26 | 美商克立股份有限公司 | High powered light emitter packages with compact optics |
| CN101443924A (en) * | 2006-05-17 | 2009-05-27 | 3M创新有限公司 | Method of making light emitting device with multilayer silicon-containing encapsulant |
| CN101768418A (en) * | 2010-01-21 | 2010-07-07 | 江苏工业学院 | Preparation method of attapulgite/aqueous polyurethane compound binder |
| CN102516713A (en) * | 2011-11-18 | 2012-06-27 | 常州南京大学高新技术研究所 | Organic silicon-series clay base compound fire retardant used for epoxy resin and preparation method thereof |
| CN103937228A (en) * | 2014-04-22 | 2014-07-23 | 无锡宏广电容器有限公司 | Elastic filling material for capacitor encapsulation and preparation method thereof |
| CN104629671A (en) * | 2015-02-25 | 2015-05-20 | 孙高雷 | Modified polyurethane sealant |
| CN105385402A (en) * | 2015-12-28 | 2016-03-09 | 青岛文晟汽车零部件有限公司 | Polyurethane sealant with good water resistance |
| CN105906873A (en) * | 2016-06-23 | 2016-08-31 | 安徽荣达阀门有限公司 | Attapulgite-modified hydrophilic expansion waterproof rubber sealing material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 北京航天光华电子技术有限公司: "《航天电子产品装接工培训教材》", 30 April 2009, 中国宇航出版社 * |
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Application publication date: 20170322 |
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