CN106159423B - Integrated anti-interference closed wire and preparation method thereof - Google Patents
Integrated anti-interference closed wire and preparation method thereof Download PDFInfo
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- CN106159423B CN106159423B CN201610635924.8A CN201610635924A CN106159423B CN 106159423 B CN106159423 B CN 106159423B CN 201610635924 A CN201610635924 A CN 201610635924A CN 106159423 B CN106159423 B CN 106159423B
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- 239000000463 material Substances 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 26
- 239000000696 magnetic material Substances 0.000 claims abstract description 22
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/04—Screened antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Coils Or Transformers For Communication (AREA)
- Details Of Aerials (AREA)
Abstract
The invention relates to an integrated anti-interference closed electric wire, which is characterized in that: the closed electric wire comprises a three-dimensional circuit substrate and a three-dimensional circuit arranged on a single side surface or two side surfaces of the three-dimensional circuit substrate, and injection molding layers are wrapped on the outer surfaces of the three-dimensional circuit substrate and the three-dimensional circuit; the three-dimensional circuit means that the antenna disc is arranged on the three-dimensional circuit substrate, and the two ends of the antenna are respectively provided with electrodes. The invention aims to improve the traditional closed anti-interference inductance manufacturing mode, effectively reduce the manufacturing cost and the complex method, manufacture various inductance circuits by using three-dimensional circuit plastic with metal activation characteristics and adopting an injection molding mode, and generate the needed circuit stack by using an addition method mode, wherein the generation mode can add the circuit stack according to different electronic requirement characteristics so as to meet different current and impedance requirements. And then, plastic with magnetic materials is used for secondary injection molding to form an inductance closed loop design, so that the material cost waste is greatly reduced.
Description
Technical Field
The invention relates to the technical field of circuits, in particular to an integrated anti-interference closed wire and a preparation method thereof.
Background
The old type inductance antenna is manufactured by using a glass fiber substrate such as FR4 or a flexible FPC circuit board to manufacture an inductance electronic circuit in a chemical etching mode, and besides the manufacturing mode of the method causes serious environmental pollution and complex manufacturing process, the manufacturing mode also needs different shapes of the PCB circuit board to manufacture cutting dies for blanking, and the manufacturing mode is the basic of material cost loss, so that the manufacturing is not easy and the cost is high.
In addition, the old PCB can only be used for etching the PCB circuit, then performing solder mask ink coating, then performing contact tin spraying, and finally attaching the soft magnetic material, thereby causing the problems of film cutting, alignment, material loss and the like. Meanwhile, soft magnetic materials are not corrosion-resistant because of the need of back adhesive for bonding, and particularly, the cost loss of the old PCB double-sided circuit board is remarkable, and the difficulty in bonding and alignment of the soft magnetic shielding materials is a great problem.
At present, a magnetic material bracket is adopted for the power inductor and copper wires are used for winding, but under the requirement that the volume is smaller, the wire diameter is thinner and thinner, and the power inductor causes a bottleneck for carrying a high-current micro-power inductor, so that the manufacturing cost is high.
Disclosure of Invention
The invention aims to provide an improved integrated anti-interference closed wire and a preparation method thereof, which can overcome the defects of high manufacturing cost, environmental pollution and incapability of bearing large flow in the prior art.
In order to achieve the above object, the technical scheme of the present invention is as follows: an integrated anti-interference closed electric wire is characterized in that: the closed electric wire comprises a three-dimensional circuit substrate and a three-dimensional circuit arranged on a single side surface or two side surfaces of the three-dimensional circuit substrate, and injection molding layers are wrapped on the outer surfaces of the three-dimensional circuit substrate and the three-dimensional circuit; the three-dimensional circuit is characterized in that the antenna disc is arranged on the three-dimensional circuit substrate, and electrodes are respectively arranged at two ends of the antenna.
Further, the three-dimensional circuit means that the antennas are arranged on the three-dimensional circuit substrate in a disc mode by an addition method, wherein the antennas arranged on the three-dimensional circuit substrate in a disc mode are of a single-layer structure, and the distance between the adjacent antennas is 0.1-1.5mm; and the antennas arranged on the three-dimensional circuit substrate in a coiled manner are of a multi-layer structure, and the multi-layer antennas are mutually overlapped to form a circuit stack.
A preparation method of an integrated anti-interference closed wire is characterized by comprising the following steps: the preparation method comprises the following steps: a. injection molding a three-dimensional circuit substrate, and performing single-sided or double-sided activation treatment on the three-dimensional circuit substrate; b. manufacturing an inductance circuit on one side or two sides of a three-dimensional circuit substrate by adopting an injection molding method, and simultaneously generating a through hole on the inductance circuit and electrodes at two ends of the inductance circuit; c. generating a circuit stack on one side or two sides of a three-dimensional circuit substrate by adopting a three-dimensional circuit addition method; d. and (3) performing secondary injection molding on the two sides of the three-dimensional circuit substrate by using plastic with magnetic materials to form an inductance closed loop.
When in use, the invention provides an integrated circuit anti-interference closed inductance technology, aims to improve the traditional closed anti-interference inductance manufacturing mode, and effectively reduces the manufacturing cost and the complex method. And then, plastic with magnetic materials is used for secondary injection molding to form an inductance closed loop design, so that the material cost waste of the traditional design and manufacture is greatly reduced. And the complex manufacturing process of the soft magnetic back adhesive film can be reduced.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a further embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a three-dimensional circuit substrate with a three-dimensional circuit on a single side.
Fig. 4 is a schematic structural diagram of a three-dimensional circuit substrate with three-dimensional circuits on both sides.
FIG. 5 is a process flow diagram of a method of making the present invention.
Detailed Description
The invention is further described below with reference to the drawings and examples.
The reference numerals of the drawings are as follows:
1 three-dimensional circuit substrate, 2 antennas, 3 injection molding layers and 4 electrodes.
The invention mainly comprises an integrated anti-interference closed wire, which is different from the prior art in that: the closed electric wire comprises a three-dimensional circuit substrate and a three-dimensional circuit arranged on a single side surface or two side surfaces of the three-dimensional circuit substrate, and injection molding layers are wrapped on the outer surfaces of the three-dimensional circuit substrate and the three-dimensional circuit; the three-dimensional circuit is characterized in that the antenna disc is arranged on the three-dimensional circuit substrate, and electrodes are respectively arranged at two ends of the antenna. Further, the three-dimensional circuit refers to a mode that an antenna is arranged on a three-dimensional circuit substrate in a disc mode by an addition method, and one mode is as follows: the antennas coiled on the three-dimensional circuit substrate are of a single-layer structure, the spacing between adjacent antennas is 0.1-1.5mm, and the preferred spacing is 0.5-1.0mm;
another way is: the antenna coiled on the three-dimensional circuit substrate is of a multi-layer structure, the multi-layer antenna is mutually overlapped to form a circuit stack, the minimum wire diameter of the generated circuit stack can reach 0.001mm so as to meet the application requirements of different occasions, the inductor can increase the current resistance capacity, the inductor is directly formed by using the circuit stack of different material addition methods, the addition circuits are made thicker and mutually compensate the defects in transmission, and the thicker circuit stack can carry larger current capacity.
Preferably, the injection molding layer is of a closed structure, and is formed by plastic with magnetic materials through plastic coating, so that the inductor forms a closed inductor current loop under the shielding of the magnetic materials, and the inductor is not interfered by external signals; the three-dimensional circuit substrate is formed by plastic through one-step injection molding, so that the problem of redundant waste material manufacture can be reduced, meanwhile, the chemical etching method used by the old circuit PCB reduction method is avoided, the pollution and chemical waste material heavy metal emission problems are avoided, and the materials and the cost are saved.
The plastic base material is suitable for common plastic base materials such as ABS, PC, TPU, nylon … … and the like, the component proportion of mechanical property and chemical property can be regulated according to different material characteristics, the conductive materials with the conductive properties of iron, zinc, nickel, copper and silver are only required to be added into the plastic base material, the addition proportion reaches 10-25% of the mass percent of the magnetic materials, the surface of the plastic base material is exposed out of the metal conductive layer in a surface activation mode, the thickness limit of the plastic base material can be as thin as 0.4-0.5mm, and the inductor forms a closed inductance current loop under shielding of the magnetic materials such as iron, zinc, nickel, manganese zinc or alloys thereof and the like and is not interfered by external signals.
Preferably, manganese zinc accounting for 16 percent of the mass of the ABS material is added into the ABS material, the surface of the ABS material is exposed out of the metal conductive layer in a surface activation mode, and the thickness of the injection molding layer can be as thin as 0.5mm, so that the optimal shielding and anti-interference effects are achieved.
Optionally, nickel zinc accounting for 22% of the mass of the PC material is added into the PC material, the surface of the PC material is exposed out of the metal conductive layer in a surface activation mode, and the thickness limit of the injection molding layer can be as thin as 0.45mm, so that the best shielding and anti-interference effects are achieved.
Further, the antenna is orderly arranged on the three-dimensional circuit substrate in a disc manner in a square, elliptic or arc-shaped structure, a sealing layer is arranged at the side edge of the three-dimensional circuit substrate, and the sealing layer is used for fixing the antenna in the middle of the three-dimensional circuit substrate.
Furthermore, the closed circuit adopts magnetic materials to perform closed loop, the closed single side can be used as a special antenna signal shielding or reinforcing function, and the closed double side can be used as a special anti-interference three-dimensional or plane inductor.
The preparation method comprises the following steps: a. injection molding a three-dimensional circuit substrate, and performing single-sided or double-sided activation treatment on the three-dimensional circuit substrate; b. manufacturing an inductance circuit on one side or two sides of a three-dimensional circuit substrate by adopting an injection molding method, and simultaneously generating a through hole on the inductance circuit and electrodes at two ends of the inductance circuit; c. generating a circuit stack on one side or two sides of a three-dimensional circuit substrate by adopting a three-dimensional circuit addition method; d. and (3) performing secondary injection molding on the two sides of the three-dimensional circuit substrate by using plastic with magnetic materials to form an inductance closed loop.
The metal characteristics of the metal can be exposed in the step a through a laser method, namely the adhesive or the plastic coating layer is removed, the surface of the metal is metallized, the exposed metal area of the surface of the metal reaches more than 45%, and the metal oxide of the metal is removed by using an activating agent or a catalyst after the metal is activated, so that the metal has a good surface activation effect.
The plastic with the magnetic material means that the magnetic material accounting for 10-25% of the total mass of the plastic is added into the plastic material, wherein the magnetic material refers to iron, zinc, nickel, copper or silver materials. And the magnetic material and the epoxy resin glue are required to be used for sealing and packaging according to the flowing characteristic of the glue, so that the modularization effect of a closed loop is achieved, the flowing property of the mixed slurry, the sealing anti-interference property of the magnetic material, the controllability of yield, the mass production and the cost efficiency are required to be paid attention to, if the common sealing injection molding cannot be completed under any condition, the common sealing injection molding cannot be completed, and even the activation of the sealing injection molding process and the impact fracture, the short circuit or the open circuit of the added circuit are required to be carried out. The anti-interference performance can obtain higher anti-interference characteristic due to the matching and characteristics of magnetic powder with different proportions.
The technical scheme has the following advantages:
1. the three-dimensional circuit technology is utilized to replace the old PCB circuit board substrate, and injection molding is utilized to perform one-time injection molding, so that the problem of manufacturing the PCB by using excessive waste materials is avoided, the closed inductors of various molded curved surfaces can be molded by plastic injection molding, and the problem of shielding interference is achieved;
2. the three-dimensional circuit technology is utilized to generate the addition method circuit generation technology, the chemical etching method utilized by the old circuit PCB reduction method is replaced, the pollution and the heavy metal emission problem of chemical waste are avoided, the materials and the cost are saved, the line refinement degree is high, and the line width is smaller than 100um;
3. the circuit, the electrode and the through hole can be once in place by utilizing the plastic once-through hole technology and the addition method circuit generation, so that the problems of the traditional single-sided and double-sided board such as cost and complex procedures are solved;
4. the antenna (inductance) circuit is integrally formed by utilizing the plastic injection molding bag with the magnetic material, so that the inductance forms a closed inductance current loop under the shielding of the magnetic material, and the closed inductance current loop is not interfered by external signals;
5. the inductor can increase current resistance, is formed by stacking circuits by directly utilizing different materials by an addition method, thickens the addition circuits and compensates for the defects of transmission, and the thickened circuit stack can bear larger current;
6. the integrated technology can reduce and make up for the complex process and material cost loss of the traditional process, and various magnetic base frames can be manufactured;
7. the technology can be widely applied to NFC near field communication antennas, radio frequency antenna tags, high-current power inductors and various communication and consumer electronic inductor applications.
Example 1
Firstly, a hollow three-dimensional circuit substrate is formed by one-time injection molding (see fig. 1), when various inductance antenna specification discs are arranged on one side or two sides of the three-dimensional circuit substrate, the end parts of the antennas are arranged along the shape of the circuit substrate from the middle part or the inner side of the circuit substrate, and the arrangement mode can be a mode of gradually diffusing from inside to outside (the gradually diffusing means that the antennas of the inner ring are tightly arranged, the antenna arrangement gaps of the outer ring are larger and larger along with the layer-by-layer outward arrangement of the antennas, and the gap ratio of the adjacent three antennas from inside to outside is 1:1.05 or 1:1.088) or a mode of uniformly arranging from inside to outside (see fig. 1). The arrangement mode enables the performance of the inductance circuit to be more, and meets the requirements of different electronic performances. The antenna specification has different wire diameters, wire widths, frame areas, coil turns, circuit layer thicknesses or frequencies according to different design inductance and Q values (quality factors), common frequencies are applicable to low frequency, high frequency and ultrahigh frequency, inductance can be from microhenry level to millihenry level even to henry level according to different designs, and single-layer or multi-layer coil effect can be achieved in the through holes.
After the antenna arrangement is completed, firstly, the arranged antenna is subjected to circuit activation, a motor and through holes are arranged at two ends of the activated circuit, and then a required circuit stack is generated in an addition method, wherein the generation method can be used for adding the circuit stack according to different electronic requirement characteristics, so that different current and impedance requirements are met.
Example 2
Firstly, injection molding a three-dimensional circuit substrate, wherein the circuit substrate can be of a square structure (see fig. 2), round chamfers are arranged on the periphery of the square structure of the circuit substrate, and then single-sided or double-sided activation treatment is carried out on the three-dimensional circuit substrate; secondly, manufacturing an inductance circuit on one side or two sides of the three-dimensional circuit substrate by adopting an injection molding method, and simultaneously generating a through hole on the inductance circuit and electrodes at two ends of the inductance circuit. The through holes only play a role in connecting an upper layer of circuit and a lower layer of circuit, and the precision requirement below 0.05mm can be met by utilizing processes such as injection molding, micro drilling and the like.
When the inductance circuit is of a single-layer structure, the spacing between adjacent antennas is 0.5-0.8mm
When the inductance circuit is of a multilayer superposition structure, a three-dimensional circuit addition method is adopted to generate a circuit stack on one side or two sides of the three-dimensional circuit substrate.
And finally, performing secondary injection molding on the two sides of the three-dimensional circuit substrate by using plastic with magnetic materials to form an inductance closed loop.
Furthermore, the technical method can replace the common conventional manufacturing process of antennas or inductors of FPC flexible circuit boards, FR4 hard circuit boards and various single-layer and multi-layer boards, and particularly can achieve the effects of thinness, lower cost, more elasticity in design and the like when applied to the antenna inductors used by the radio frequency RFID identification technology and the like when consumer electronic mobile phone near field communication (mobile phone payment) and WPC wireless charging antennas are carried out.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described above. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (4)
1. An integrated anti-interference closed electric wire is characterized in that: the closed electric wire comprises a three-dimensional circuit substrate and a three-dimensional circuit arranged on a single side surface or two side surfaces of the three-dimensional circuit substrate, and injection molding layers are wrapped on the outer surfaces of the three-dimensional circuit substrate and the three-dimensional circuit; the three-dimensional circuit is characterized in that an antenna disc is arranged on a three-dimensional circuit substrate, and electrodes are respectively arranged at two ends of the antenna; the injection molding layer is of a closed structure, is formed by coating plastic with magnetic materials, and has the thickness of 0.4-0.5mm; the injection molding layer is made of the following materials: adding 16% of manganese zinc into the ABS material; or adding 22% nickel zinc into PC material; the three-dimensional circuit substrate is formed by plastic through one-step injection molding.
2. An integrated tamper-resistant closure wire according to claim 1, wherein: the three-dimensional circuit is characterized in that the antennas are arranged on the three-dimensional circuit substrate in a disc mode in an additive mode, the antennas arranged on the three-dimensional circuit substrate in a disc mode are of a single-layer structure, and the distance between adjacent antennas is 0.1-1.5mm; the antenna coiled on the three-dimensional circuit substrate is of a multi-layer structure, and the multi-layer antennas are mutually overlapped to form a circuit stack.
3. An integrated tamper-resistant closure wire according to claim 2, wherein: the antenna is orderly arranged on the three-dimensional circuit substrate in a coiled manner in a square, elliptic or arc-shaped structure, a sealing layer is arranged at the side edge of the three-dimensional circuit substrate, and the sealing layer is used for fixing the antenna in the middle of the three-dimensional circuit substrate.
4. The method for manufacturing the integrated anti-interference closed electric wire according to claim 1, wherein the method comprises the following steps: the preparation method comprises the following steps: a. injection molding a three-dimensional circuit substrate, and performing single-sided or double-sided activation treatment on the three-dimensional circuit substrate; b. manufacturing an inductance circuit on one side or two sides of a three-dimensional circuit substrate by adopting an injection molding method, and simultaneously generating a through hole on the inductance circuit and electrodes at two ends of the inductance circuit; c. generating a circuit stack on one side or two sides of a three-dimensional circuit substrate by adopting a three-dimensional circuit addition method; d. carrying out secondary injection molding on two sides of the three-dimensional circuit substrate by using plastic with magnetic materials to form an inductance closed loop; the metal characteristics of the metal can be exposed in the step a by a laser method, namely the adhesive or the plastic coating layer is removed to metalize the surface, and the metal oxide is removed by an activating agent or a catalyst on the surface after the activation to achieve the surface activation effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610635924.8A CN106159423B (en) | 2016-08-05 | 2016-08-05 | Integrated anti-interference closed wire and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610635924.8A CN106159423B (en) | 2016-08-05 | 2016-08-05 | Integrated anti-interference closed wire and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106159423A CN106159423A (en) | 2016-11-23 |
| CN106159423B true CN106159423B (en) | 2024-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610635924.8A Active CN106159423B (en) | 2016-08-05 | 2016-08-05 | Integrated anti-interference closed wire and preparation method thereof |
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| CN107578898B (en) * | 2017-09-29 | 2024-08-02 | 东翔电子（东莞）有限公司 | Transformer framework with built-in multilayer circuit and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW457624B (en) * | 2000-07-07 | 2001-10-01 | Aoba Technology Co Ltd | Manufacturing method of etching-type single-layer and stacked-layer chip inductor |
| CN1808764A (en) * | 2005-01-19 | 2006-07-26 | 诠欣股份有限公司 | Minitype chip antenna manufacturing method |
| CN101350447A (en) * | 2008-07-05 | 2009-01-21 | 中山市达华智能科技有限公司 | Line-imbedding type UHF frequency band line-establishing antennae and UHF electronic label using the same |
| CN102299403A (en) * | 2010-06-28 | 2011-12-28 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN102478170A (en) * | 2011-07-27 | 2012-05-30 | 深圳市日上光电有限公司 | LED module of moulding is moulded to full package |
| CN202282456U (en) * | 2011-09-08 | 2012-06-20 | 柏腾科技股份有限公司 | Three-dimensional circuit structure |
| CN202333136U (en) * | 2011-12-02 | 2012-07-11 | 惠州硕贝德无线科技股份有限公司 | Small-sized radio-frequency antenna molded through three-dimensional printing |
-
2016
- 2016-08-05 CN CN201610635924.8A patent/CN106159423B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW457624B (en) * | 2000-07-07 | 2001-10-01 | Aoba Technology Co Ltd | Manufacturing method of etching-type single-layer and stacked-layer chip inductor |
| CN1808764A (en) * | 2005-01-19 | 2006-07-26 | 诠欣股份有限公司 | Minitype chip antenna manufacturing method |
| CN101350447A (en) * | 2008-07-05 | 2009-01-21 | 中山市达华智能科技有限公司 | Line-imbedding type UHF frequency band line-establishing antennae and UHF electronic label using the same |
| CN102299403A (en) * | 2010-06-28 | 2011-12-28 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN102478170A (en) * | 2011-07-27 | 2012-05-30 | 深圳市日上光电有限公司 | LED module of moulding is moulded to full package |
| CN202282456U (en) * | 2011-09-08 | 2012-06-20 | 柏腾科技股份有限公司 | Three-dimensional circuit structure |
| CN202333136U (en) * | 2011-12-02 | 2012-07-11 | 惠州硕贝德无线科技股份有限公司 | Small-sized radio-frequency antenna molded through three-dimensional printing |
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| CN106159423A (en) | 2016-11-23 |
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