CN106098641B - A kind of integrated circuit package structure of heat dissipation - Google Patents
A kind of integrated circuit package structure of heat dissipation Download PDFInfo
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- CN106098641B CN106098641B CN201610455196.2A CN201610455196A CN106098641B CN 106098641 B CN106098641 B CN 106098641B CN 201610455196 A CN201610455196 A CN 201610455196A CN 106098641 B CN106098641 B CN 106098641B
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- bearing seat
- plate
- integrated circuit
- metallic heat
- radiating
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of integrated circuit package structures of heat dissipation, it is fixed with metallic heat radiating plate on its support plate that insulate, the radiating frame of several " time " fonts is formed on the outside of metallic heat radiating plate, the bearing seat for being fixedly arranged in the middle of rectangle of metallic heat radiating plate, the center of bearing seat forms the placement hole of rectangle, and IC chip plugged and fixed is in the placement hole of bearing seat and is resisted against on metallic heat radiating plate；It is molded on the radiating frame of metallic heat radiating plate two opposite sides fluted, extension board is formed on the side of bearing seat, one group of opposite extension board of bearing seat is plugged on the groove of radiating frame and forms side plate, side plate is fixed on insulation support plate and is resisted against on the outer wall of radiating frame of metallic heat radiating plate outer layer, and another group of opposite extension board of bearing seat is plugged in the radiating frame of heat dissipation metal inner cord.The structure that the present invention is combined using the metallic heat radiating plate of special shape with integrated antenna package, high efficiency and heat radiation can be realized by realizing in integrated circuit operation.
Description
Technical field：
The present invention relates to the technical fields of integrated circuit, more specifically to a kind of integrated antenna package knot of heat dissipation
Structure.
Background technology：
Electronic industry constantly reduces the size of electronic component, and is continuing to increase function in electronic component so that integrated electricity
The function and complexity on road are constantly promoted.And this trend also drives the encapsulation technology of integrated circuit component towards small size, height
The direction of foot number and high electricity/thermal efficiency is developed, and meets scheduled industrial standard.Since high-effect integrated circuit component generates more
High heat, and existing compact package technology only provides designer fraction of cooling mechanism, it is therefore desirable to it is small-sized at its
Radiator structure is designed on encapsulating structure in order to realize high efficiency and heat radiation, extends the service life of integrated circuit.
Invention content：
The purpose of the present invention and provides a kind of integrated antenna package knot of heat dissipation aiming at the deficiency of the prior art
Structure, so as to realize high efficiency and heat radiation, indirectly extends integrated circuit to add radiator structure on the encapsulating structure of integrated circuit
Service life.
To achieve the above object, the technical solution adopted by the present invention is as follows：
A kind of integrated circuit package structure of heat dissipation, including insulation support plate, insulate support plate on be fixed with metallic heat radiating plate, gold
Belong to the radiating frame that several " time " fonts are formed on the outside of heat sink, metallic heat radiating plate is fixedly arranged in the middle of holding for rectangle
Carry seat, the center of bearing seat forms the placement hole of rectangle, IC chip plugged and fixed in the placement hole of bearing seat simultaneously
It is resisted against on metallic heat radiating plate；Be molded on the radiating frame of metallic heat radiating plate two opposite sides it is fluted, on the side of bearing seat
Extension board is formed, one group of opposite extension board of bearing seat is plugged on the groove of radiating frame and forms side plate, and side plate is fixed
On insulation support plate and it is resisted against on the outer wall of radiating frame of metallic heat radiating plate outer layer, another group of opposite extension board of bearing seat
It is plugged in the radiating frame of heat dissipation metal inner cord, several cooling fins is formed on the radiating frame of heat dissipation metal inner cord；
It is fixed with dry contact if being set on the bearing seat of IC chip both sides, several stitch, stitch and contact are fixed on side plate
It is electrically connected.
The bearing seat uses isolation material, and the stitch and contact on bearing seat are on the identical two sides of bearing seat.
If forming dry contact on the upper surface of the IC chip, contact passes through the contact on conducting wire and bearing seat
It is electrically connected.
The bottom surface of the extension board of the bearing seat side is located in the same horizontal plane, and the bottom surface of bearing seat is less than extension board
Bottom surface.
Several heat emission hole a are formed on the radiating frame and bearing seat of the metallic heat radiating plate both sides.
The stitch or contact is linearly evenly distributed on bearing seat or side plate respectively.
The beneficial effects of the present invention are：It uses the metallic heat radiating plate of special shape to be combined with integrated antenna package
Structure, high efficiency and heat radiation can be realized by realizing in integrated circuit operation, so as to extend the service life of integrated circuit.
Description of the drawings：
Fig. 1 is the three-dimensional structural schematic diagram of invention；
Fig. 2 is the structural schematic diagram that invention is overlooked；
Fig. 3 is the structural schematic diagram of invention section view；
Fig. 4 is the structural schematic diagram of invention metallic heat radiating plate.
In figure：1, insulate support plate；2, metallic heat radiating plate；21, radiating frame；211, groove；22, cooling fin；3, bearing seat；
31, placement hole；32, extension board；33, side plate；4, contact；5, stitch；6, IC chip；61, contact；A, heat emission hole.
Specific implementation mode：
Embodiment：See shown in Fig. 1 to 4, a kind of integrated circuit package structure of heat dissipation, including insulation support plate 1, insulate support plate
It is fixed with metallic heat radiating plate 2 on 1, the radiating frame 21 of several " time " fonts, metal are formed on the outside of metallic heat radiating plate 2
The center of the bearing seat 3 for being fixedly arranged in the middle of rectangle of heat sink 2, bearing seat 3 forms the placement hole 31 of rectangle, ic core
6 plugged and fixed of piece is in the placement hole 31 of bearing seat 3 and is resisted against on metallic heat radiating plate 2；2 two opposite sides of metallic heat radiating plate dissipate
It is molded fluted 211 in hot framework 21, extension board 32, one group of opposite extension of bearing seat 3 are formed on the side of bearing seat 3
Plate 32 is plugged on the groove 211 of radiating frame 21 and forms side plate 33, and side plate 33 is fixed on insulation support plate 1 and is resisted against gold
On the outer wall for belonging to the radiating frame 21 of 2 outer layer of heat sink, another group of opposite extension board 32 of bearing seat 3 is plugged on metallic heat radiating plate
In the radiating frame 21 of 2 internal layers, several cooling fins 22 are formed on the radiating frame 21 of 2 internal layer of metallic heat radiating plate；Integrated circuit
It is fixed with dry contact 4 if being set on the bearing seat 3 of 6 both sides of chip, several stitch 5, stitch 5 and contact 4 are fixed on side plate 33
It is electrically connected.
The bearing seat 3 uses isolation material, and the stitch 5 and contact 4 on bearing seat 3 are in 3 identical two sides of bearing seat
On.
If forming dry contact 61 on the upper surface of the IC chip 6, contact 61 passes through on conducting wire and bearing seat 3
Contact 4 be electrically connected.
The bottom surface of the extension board 32 of 3 side of the bearing seat is located in the same horizontal plane, and the bottom surface of bearing seat 3 is less than extension
The bottom surface of plate 32.
Several heat emission hole a are formed on the radiating frame 21 and bearing seat 3 of 2 both sides of the metallic heat radiating plate.
The stitch 5 or contact 4 is linearly evenly distributed on respectively on bearing seat 3 or side plate 33.
Operation principle：The present invention is the encapsulating structure of integrated circuit, adds metallic heat radiating plate 2 and radiates to increase, and
Metallic heat radiating plate 2 opens up the radiating frame 21 and cooling fin 22 of " returning " character form structure of multilayer, improves radiating efficiency, opens simultaneously
It is real if the channel for heat dissipation of the radiating frame 21 of 3 unplugged " time " character form structure of bearing seat of heat emission hole a and its encapsulating structure
Existing air circulation, realizes high efficiency and heat radiation.
Claims (6)
1. a kind of integrated circuit package structure of heat dissipation, including insulation support plate (1), it is characterised in that：It is fixed on insulation support plate (1)
There is metallic heat radiating plate (2), the radiating frame (21) of several " time " fonts, metal are formed on the outside of metallic heat radiating plate (2)
The center of the bearing seat (3) for being fixedly arranged in the middle of rectangle of heat sink (2), bearing seat (3) forms the placement hole (31) of rectangle, collection
It in the placement hole (31) of bearing seat (3) and is resisted against on metallic heat radiating plate (2) at circuit chip (6) plugged and fixed；Metal dissipates
It is molded fluted (211) on the radiating frame (21) of hot plate (2) two opposite sides, extension is formed on the side of bearing seat (3)
Plate (32), one group of opposite extension board (32) of bearing seat (3) are plugged on the groove (211) of radiating frame (21) and form side plate
(33), side plate (33) is fixed on insulation support plate (1) and is resisted against the outer wall of the radiating frame (21) of metallic heat radiating plate (2) outer layer
On, another group of opposite extension board (32) of bearing seat (3) is plugged in the radiating frame (21) of metallic heat radiating plate (2) internal layer, gold
Belong to and forms several cooling fins (22) on the radiating frame (21) of heat sink (2) internal layer；The carrying of IC chip (6) both sides
Seat (3) if on set and be fixed with dry contact (4), be fixed with several stitch (5) on side plate (33), stitch (5) and contact (4) mutually electricity
Connection.
2. a kind of integrated circuit package structure of heat dissipation according to claim 1, it is characterised in that：The bearing seat (3)
Using isolation material, the stitch (5) and contact (4) on bearing seat (3) are on the identical two sides of bearing seat (3).
3. a kind of integrated circuit package structure of heat dissipation according to claim 1, it is characterised in that：The ic core
Piece (6) if upper surface on form dry contact (61), contact (61) are mutually electric with the contact (4) on bearing seat (3) by conducting wire
Connection.
4. a kind of integrated circuit package structure of heat dissipation according to claim 1, it is characterised in that：The bearing seat (3)
The bottom surface of the extension board (32) of side is located in the same horizontal plane, and the bottom surface of bearing seat (3) is less than the bottom surface of extension board (32).
5. a kind of integrated circuit package structure of heat dissipation according to claim 1, it is characterised in that：The metallic heat radiating plate
(2) several heat emission holes (a) are formed on the radiating frame (21) and bearing seat (3) of both sides.
6. a kind of integrated circuit package structure of heat dissipation according to claim 1, it is characterised in that：The stitch (5)
Or contact (4) is linearly evenly distributed on respectively on bearing seat (3) or side plate (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610455196.2A CN106098641B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610455196.2A CN106098641B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106098641A CN106098641A (en) | 2016-11-09 |
| CN106098641B true CN106098641B (en) | 2018-09-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610455196.2A Active CN106098641B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of heat dissipation |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993990A (en) * | 2017-12-12 | 2018-05-04 | 王孝裕 | A kind of 16 pin high-density integrated circuit package structures |
| CN108538891B (en) * | 2018-04-23 | 2020-10-27 | 北京蜃景光电科技有限公司 | Micro-display device, display system and cooling fin manufacturing method |
| CN110010568B (en) * | 2019-04-16 | 2020-11-27 | 常州信息职业技术学院 | Microelectronic packaging structure |
| CN110970377B (en) * | 2019-12-18 | 2021-07-20 | 若瑞(上海)文化科技有限公司 | Packaging device convenient for packaging integrated circuit chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4323914A (en) * | 1979-02-01 | 1982-04-06 | International Business Machines Corporation | Heat transfer structure for integrated circuit package |
| US5885853A (en) * | 1990-06-22 | 1999-03-23 | Digital Equipment Corporation | Hollow chip package and method of manufacture |
| JP2004072113A (en) * | 2002-08-05 | 2004-03-04 | Texas Instruments Inc | Thermally strengthened integrated circuit package |
| CN203553132U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Thin carrier tape-type integrated circuit package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6407333B1 (en) * | 1997-11-04 | 2002-06-18 | Texas Instruments Incorporated | Wafer level packaging |
-
2016
- 2016-06-20 CN CN201610455196.2A patent/CN106098641B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4323914A (en) * | 1979-02-01 | 1982-04-06 | International Business Machines Corporation | Heat transfer structure for integrated circuit package |
| US5885853A (en) * | 1990-06-22 | 1999-03-23 | Digital Equipment Corporation | Hollow chip package and method of manufacture |
| JP2004072113A (en) * | 2002-08-05 | 2004-03-04 | Texas Instruments Inc | Thermally strengthened integrated circuit package |
| CN203553132U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Thin carrier tape-type integrated circuit package |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106098641A (en) | 2016-11-09 |
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Effective date of registration: 20180808 Address after: 315400 22 Xingshun Road, Zhongyi Ningbo ecological park, Yuyao, Ningbo, Zhejiang. Applicant after: Ningbo silicon electronics (Ningbo) Limited by Share Ltd Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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