CN105992501B - A kind of camera - Google Patents
A kind of camera Download PDFInfo
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- CN105992501B CN105992501B CN201510081847.1A CN201510081847A CN105992501B CN 105992501 B CN105992501 B CN 105992501B CN 201510081847 A CN201510081847 A CN 201510081847A CN 105992501 B CN105992501 B CN 105992501B
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- metal
- pcb board
- metal fin
- fin
- camera bracket
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Abstract
The invention discloses a kind of cameras, fixed frame including installation elements, the pcb board component and camera bracket for being installed on fixed frame, the camera bracket is metallic support, and the pcb board component joint has metal fin, and the metal fin connects the camera bracket.Metal fin of the present invention by fitting PCB circuit board, the heat derives that circuit is generated, and be dispersed into atmosphere by metal camera bracket, calorific value is small, energy consumption bottom, and protects circuit element non-aging, extends element service life.
Description
Technical field
The present invention relates to electric terminal equipment more particularly to a kind of cameras.
Background technique
Camera can generate heat in use, temperature is caused to rise as a kind of electronic equipment, i.e. waste energy
Source, and influence service life of equipment.The study found that the element for most easily producing heat is the PCB circuit board in camera.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of cameras that can spread in time the heat of generation.
In order to solve the above-mentioned technical problems, the present invention provides a kind of cameras, fixed frame, installation including installation elements
In the pcb board component and camera bracket of fixed frame, the camera bracket is metallic support, and the pcb board component joint has
Metal fin, the metal fin connect the camera bracket.
Further, the metal fin is bonded the pcb board component by high thermal conductive silicon film.
Further, the pcb board component includes main PCB plate, bluetooth pcb board and the infrared pcb board of stacking installation, described
Heat dissipation metal plate includes the first metal fin between main PCB plate and bluetooth pcb board, and be located at bluetooth pcb board with it is red
The second metal fin between outer pcb board;First metal fin is bonded with the second metal fin in same end,
Second metal fin connects the camera bracket.
Further, first metal fin is raised in opposite directions in the end being bonded with the second metal fin, so that
First metal fin and the non-fitting part of the second metal fin form installation space, and the bluetooth pcb board is located at institute
State installation space.
Further, second metal fin is equipped in the end being bonded with the first metal fin and extends vertically,
It is described to extend vertically the connection camera bracket.
It further, further include having heat radiating metal connector, it is described to extend vertically through the heat radiating metal connector company
Connect camera bracket.
Further, the fixed frame is frame-like structure, one end of the fixed frame and the metal connecting piece shape
Match and connect the metal connecting piece, the fixed frame is extended vertically being equipped with described in accommodating with the connecting pin of metal connecting piece
Groove.
Further, substantially v-shaped lower cover, the metal are equipped between the metal connecting piece and camera bracket
Connector is sunken in the cavity of the lower cover.
Further, the high thermal conductive silicon film includes first high between main PCB plate and the first metal fin
Heat-conducting silica gel sheet, the second high thermal conductive silicon film between the first metal fin and bluetooth pcb board, and it is located at the second metal
Third high thermal conductive silicon film between cooling fin and infrared pcb board.
Further, the 4th high thermal conductive silicon film that extends vertically through connects the heat radiating metal connector.
Metal fin of the present invention by fitting PCB circuit board, the heat derives that circuit is generated, and taken the photograph by metal
As head bracket is dispersed into atmosphere, calorific value is small, energy consumption bottom, and protects circuit element non-aging, extends element service life.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Fig. 1 is primary structure perspective view of the explosion of the present invention.
Fig. 2 is assembling section of the present invention.
In figure: 1, main PCB plate;2, the first high thermal conductive silicon film;3, screw;4, the first metal fin;401, it is bonded end;
402, installation space;5, the second high thermal conductive silicon film;6, bluetooth pcb board;7, the second metal fin;701, it is bonded end;702,
It extends vertically;8, the 4th high thermal conductive silicon film;9, third high thermal conductive silicon film;10, fixed frame;1001, connecting pin;1002, recessed
Slot;11, infrared pcb board;12, metal connecting piece;13, lower cover;1301, the cavity of lower cover;14, camera bracket.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It better understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
As depicted in figs. 1 and 2, a kind of camera of the present invention, fixed frame 10 including installation elements are installed on fixed frame 10
Pcb board component and camera bracket 14, camera bracket is metallic support, and pcb board component joint has metal fin, metal
Cooling fin connects camera bracket.It, can be by metal fin to prevent the metal fin conduction being bonded with pcb board from causing short circuit
Pcb board component is bonded by high thermal conductive silicon film.
The above is only general structure of the invention, in the preferred embodiment of offer of the invention, pcb board component includes layer
Main PCB plate 1, bluetooth pcb board 6 and the infrared pcb board 11 of folded installation, heat dissipation metal plate include being located at main PCB plate and bluetooth pcb board
Between the first metal fin 4, and the second metal fin 7 between bluetooth pcb board and infrared pcb board;First gold medal
Belong to cooling fin 4 to be bonded with the second metal fin 7 in same end, fitting end (401,701) is fixed by screw 3, the second gold medal
Belong to cooling fin 7 and connects camera bracket 14.Since bluetooth pcb board 6 is mounted on the first metal fin 4 and the second metal fin
Among 7, for convenience of installing, also to keep stress between element uniform, the first metal fin 4 and the second metal fin 7 are in patch
The end of conjunction is raised in opposite directions, so that the first metal fin 4 and the non-fitting part of the second metal fin 7 form installation space
402, bluetooth pcb board 6 is located at installation space.So that the heat that main PCB plate 1 generates is transmitted by the first metal fin 4
Pass to the camera bracket 14 of metal material to the second metal fin 7, then by the second metal fin 7, so arrange to
Atmosphere can be equipped with vertical prolong in the end being bonded with the first metal fin in the second metal fin 7 to keep combination more abundant
702 are stretched, this extends vertically connection camera bracket.
It should be pointed out that the second metal fin is directly connected to camera branch since the second metal fin 7 is bonded pcb board
14 meeting of frame is easy to damage pcb board when bracket is by external force so that pcb board is affected, therefore in preferred embodiment, this
Invention extends vertically 702 by the connection camera bracket 14 of heat radiating metal connector 12 for the second metal fin 7.More preferably
In embodiment, fixed frame 10 of the invention is frame-like structure, and one end of fixed frame 10 is matched with 12 shape of metal connecting piece
And metal connecting piece 12 is connected, fixed frame 10 is extending vertically 702 equipped with accommodating with the connecting pin 1001 of metal connecting piece 12
Groove 1002.The second metal fin 7 so may make to play the role of transmitting the effect of heat, and guaranteeing will not be because of external force
And it shakes.Aesthetically, in a kind of embodiment, between metal connecting piece 12 and camera bracket 14 be equipped with substantially be in
The lower cover 13 of " V " shape, metal connecting piece 12 are sunken in the cavity 1301 of lower cover 13.
In another preferred embodiment, high thermal conductive silicon film have it is multiple, including be located at main PCB plate 1 and the first heat dissipation metal
The first high thermal conductive silicon film 2 between piece 4, the second high thermal conductive silicon between the first metal fin 4 and bluetooth pcb board 6
Film 5, and the third high thermal conductive silicon film 9 between the second metal fin 7 and infrared pcb board 11.In addition, extending vertically
702 connect heat radiating metal connector 12 by the 4th high thermal conductive silicon film 8.
It should be strongly noted that being only that the present invention embodies novelty and creative necessity disclosed in embodiment of above
Structure, unquestionably, the present invention should also include the structures such as camera lens, shell, LED light.Heat dissipation metal plate of the invention can for gold,
The manufacture of the metal materials such as silver, copper, aluminium.
Third high thermal conductive silicon film 9 and the 4th high thermal conductive silicon film 8 are pasted on heat dissipation metal plate 7 by the present invention, by band
There is the heat dissipation metal plate 7 of high thermal conductive silicon film to be packed on pcb board fixed frame 10, heat radiating metal connector 12 be packed into lower cover 13,
It is mounted on pcb board fixed frame 10 again, high thermal conductive silicon film 8 therein is bonded with heat radiating metal connector 12, by bluetooth pcb board
6 are placed on pcb board fixed frame 10.High thermal conductive silicon film 2 and high thermal conductive silicon film 5 are pasted on heat dissipation metal plate 4, placed
Above bluetooth pcb board component 6, two panels metal fin is fastened using countersunk head fastening screw 3, wherein with high thermal conductivity silica gel
Sheet metal effect is to prevent 6 component of bluetooth pcb board from shaking, and silica gel piece can prevent element and the direct contact short circuit of sheet metal, and
High heat is exported.Main PCB component 1 is placed on above heat dissipation metal plate, by fixed frame using fastened by screw in heat radiating metal
On connector, wherein heat radiating metal connector exports interior metal cooling fin to camera bracket 14, camera bracket
Effect is support integral product and absorption heat rejecting heat amount.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indication or suggestion relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more of the features.In the description of the present invention,
The meaning of " plurality " is two or more, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect
It connects, is also possible to be electrically connected;It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (1)
1. a kind of camera, fixed frame including installation elements is installed on the pcb board component of fixed frame and is installed on fixed frame
Camera bracket, which is characterized in that the camera bracket is metallic support, and the pcb board component joint has metal fin,
The metal fin connects the camera bracket;
The metal fin is bonded the pcb board component by high thermal conductive silicon film;
The pcb board component includes main PCB plate, bluetooth pcb board and the infrared pcb board of stacking installation, the heat dissipation metal plate packet
The first metal fin between main PCB plate and bluetooth pcb board is included, and between bluetooth pcb board and infrared pcb board
Second metal fin;First metal fin is bonded with the second metal fin in same end, second metal
Cooling fin connects the camera bracket;
First metal fin is raised in opposite directions in the end being bonded with the second metal fin, so that first metal dissipates
Backing and the non-fitting part of the second metal fin form installation space, and the bluetooth pcb board is located at the installation space;
Second metal fin is equipped in the end being bonded with the first metal fin and extends vertically, the company of extending vertically
Connect the camera bracket;
It further include having heat radiating metal connector, it is described to extend vertically through the heat radiating metal connector connection camera bracket;
The fixed frame is frame-like structure, and one end of the fixed frame matches and connect with the heat radiating metal connector shape
The heat radiating metal connector, the fixed frame is described vertically extending equipped with accommodating with the connecting pin of heat radiating metal connector
Groove;
Substantially v-shaped lower cover, the heat radiating metal connection are equipped between the heat radiating metal connector and camera bracket
Part is sunken in the cavity of the lower cover;
The high thermal conductive silicon film includes the first high thermal conductive silicon film between main PCB plate and the first metal fin, position
The second high thermal conductive silicon film between the first metal fin and bluetooth pcb board, and be located at the second metal fin with it is infrared
Third high thermal conductive silicon film between pcb board;
The 4th high thermal conductive silicon film that extends vertically through connects the heat radiating metal connector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510081847.1A CN105992501B (en) | 2015-02-12 | 2015-02-12 | A kind of camera |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510081847.1A CN105992501B (en) | 2015-02-12 | 2015-02-12 | A kind of camera |
Publications (2)
Publication Number | Publication Date |
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CN105992501A CN105992501A (en) | 2016-10-05 |
CN105992501B true CN105992501B (en) | 2019-06-21 |
Family
ID=57042545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510081847.1A Active CN105992501B (en) | 2015-02-12 | 2015-02-12 | A kind of camera |
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CN (1) | CN105992501B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106817883B (en) * | 2017-02-28 | 2019-05-31 | 北京奇虎科技有限公司 | A kind of radiator and cam device of camera control mainboard |
CN106851069A (en) * | 2017-03-10 | 2017-06-13 | 深圳电航空技术有限公司 | Device for image and head |
CN107105145A (en) * | 2017-05-23 | 2017-08-29 | 武汉雷微视达科技有限公司 | It is a kind of to strengthen the camera of heat sinking function |
CN112311978B (en) * | 2020-02-27 | 2022-03-25 | 北京字节跳动网络技术有限公司 | A installed part and camera subassembly for fixing camera |
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US6462781B1 (en) * | 1998-04-07 | 2002-10-08 | Pitcos Technologies, Inc. | Foldable teleconferencing camera |
CN1968594A (en) * | 2005-11-14 | 2007-05-23 | 株式会社日立制作所 | Portable electronic apparatus |
EP2393277A1 (en) * | 2010-06-07 | 2011-12-07 | Ricoh Company, Ltd. | Imaging apparatus |
KR20120005783A (en) * | 2010-07-09 | 2012-01-17 | 이영모 | Cctv having removal foreign body and light shielding function |
CN102692810A (en) * | 2011-03-24 | 2012-09-26 | 株式会社拓普康 | Omni-directional camera |
CN103119925A (en) * | 2010-07-27 | 2013-05-22 | 菲力尔系统公司 | Infrared camera architecture systems and methods |
CN203086582U (en) * | 2013-01-30 | 2013-07-24 | 梅斯·马塞尔·彼得·杰拉德 | Network camera |
CN203840432U (en) * | 2014-05-13 | 2014-09-17 | 亚忆电子(深圳)有限公司 | Network high-definition monitoring image pick-up device |
CN203840430U (en) * | 2014-05-09 | 2014-09-17 | 梅斯·马塞尔·彼得·杰拉德 | Shark type outdoor webcam |
CN204466131U (en) * | 2015-02-12 | 2015-07-08 | 广州世荣电子有限公司 | A kind of camera |
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Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6462781B1 (en) * | 1998-04-07 | 2002-10-08 | Pitcos Technologies, Inc. | Foldable teleconferencing camera |
CN1968594A (en) * | 2005-11-14 | 2007-05-23 | 株式会社日立制作所 | Portable electronic apparatus |
EP2393277A1 (en) * | 2010-06-07 | 2011-12-07 | Ricoh Company, Ltd. | Imaging apparatus |
KR20120005783A (en) * | 2010-07-09 | 2012-01-17 | 이영모 | Cctv having removal foreign body and light shielding function |
CN103119925A (en) * | 2010-07-27 | 2013-05-22 | 菲力尔系统公司 | Infrared camera architecture systems and methods |
CN102692810A (en) * | 2011-03-24 | 2012-09-26 | 株式会社拓普康 | Omni-directional camera |
CN203086582U (en) * | 2013-01-30 | 2013-07-24 | 梅斯·马塞尔·彼得·杰拉德 | Network camera |
CN203840430U (en) * | 2014-05-09 | 2014-09-17 | 梅斯·马塞尔·彼得·杰拉德 | Shark type outdoor webcam |
CN203840432U (en) * | 2014-05-13 | 2014-09-17 | 亚忆电子(深圳)有限公司 | Network high-definition monitoring image pick-up device |
CN204466131U (en) * | 2015-02-12 | 2015-07-08 | 广州世荣电子有限公司 | A kind of camera |
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CB02 | Change of applicant information |
Address after: 510000 2 floor, 232 Pearl Road, Science City, Guangzhou economic and Technological Development Zone, Guangdong Applicant after: Seyoung Electronics Inc. Address before: 510000 2 floor, 232 Pearl Road, Science City, Guangzhou economic and Technological Development Zone, Guangdong Applicant before: GUANGZHOU SHIRONG ELECTRONICS CO., LTD. |
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