CN105423195B - Ligthing paraphernalia - Google Patents
Ligthing paraphernalia Download PDFInfo
- Publication number
- CN105423195B CN105423195B CN201510511198.4A CN201510511198A CN105423195B CN 105423195 B CN105423195 B CN 105423195B CN 201510511198 A CN201510511198 A CN 201510511198A CN 105423195 B CN105423195 B CN 105423195B
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- CN
- China
- Prior art keywords
- substrate
- heat dissipation
- dissipation path
- path body
- luminescent device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Possess with the ligthing paraphernalia (100) for being embedded into the state of structure member and being set：Luminescent device (101), there is the light-emitting component (112) using semiconductor；Substrate (102), there is the Wiring pattern (121) being connected with light-emitting component (112), in the substrate (102) installation luminescent device (101)；And heat dissipation path body (104), it is set with the state spread out between the outer peripheral edge of luminescent device (101) and substrate (102), the thermal conductivity of the heat dissipation path body (104) is higher than the thermal conductivity of substrate (102), and the area of heat dissipation path body (104) is bigger than the area of Wiring pattern (121).
Description
Technical field
The present invention relates to the light-emitting component that possesses LED (Light Emitting Diode) etc. is employed, to be embedded into knot
The state of structure part and the ligthing paraphernalia being set.
Background technology
In the past known has Down lamp, and Down lamp is the illumination to be embedded into the state for the structure member for being formed ceiling and be set
Utensil.In such ligthing paraphernalia, heat that light source is sent, the fin that is set by the rear portion of ligthing paraphernalia main body dissipates
Heat arrives the ceiling back side.
On the other hand, the difference at the position being embedded into according to ligthing paraphernalia etc., the rear portion of embedded ligthing paraphernalia, it is adiabatic
Part is covered or covered in itself by structure member, can be gone out so the heat for sending light source from the rear of ligthing paraphernalia carries out radiating
Existing difficulty.
As the ligthing paraphernalia being embedded at such position, such as following ligthing paraphernalia is proposed, as described in patent document 1
Ligthing paraphernalia it is the same, the part for the device framework exposed from structure member is set as stairstepping, makes the surface area of ingress of air
Increase, so as to promote to be radiated from the part for the utensil framework exposed.
The ligthing paraphernalia as described in patent document 2 is also proposed, the heat that light source is sent, passes through planar heat pipe, Heat transmission
To the part exposed of utensil framework, the radiating of exposed portion can be promoted.
(prior art literature)
(patent document)
Patent document 1：Japanese Unexamined Patent Publication 2013-065456 publications
Patent document 2：Japanese Unexamined Patent Publication 2013-222542 publications
For example, in order to from untill utensil framework, efficiently carrying out Heat transmission as the light source of pyrotoxin, it may be considered that another
The method of the heat transfer components of exterior graphitic sheet, heat pipe etc..But, in ligthing paraphernalia assemble heat transfer components in addition, then
Increase number of devices, in addition, the construction of ligthing paraphernalia becomes complicated, hinder the easiness of assembling, cause the production of ligthing paraphernalia
Efficiency reduces.
The content of the invention
The present invention in view of described problem and propose, although its object is to provide a kind of simple structure, can be efficiently
The ligthing paraphernalia of Heat transmission is carried out untill utensil framework from the pyrotoxin of ligthing paraphernalia.
In order to achieve the above object, ligthing paraphernalia of the present invention, it is set with being embedded into the state of structure member,
The ligthing paraphernalia possesses：Luminescent device, there is the light-emitting component for employing semiconductor；Substrate, in the interarea portion of the substrate
With the Wiring pattern electrically connected with the light-emitting component, the luminescent device is installed in the substrate；Utensil framework, store institute
State luminescent device and the substrate；And heat dissipation path body, in the interarea portion of the substrate, with the luminescent device
The state that is spread out between the outer peripheral edge of the substrate and be set, the heat of the thermal conductivity of the heat dissipation path body than the substrate
Conductance is high, the area of the heat dissipation path body on the face parallel with the interarea portion, than the institute being connected with the light-emitting component
The area for stating Wiring pattern is big.
In addition, the luminescent device can possess：With the light source framework of light-emitting component insulation, the heat dissipation path
Body, it is connected with the light source framework.
In addition, the heat dissipation path body can be connected with the Wiring pattern.
In addition, the heat dissipation path body can spread out setting between the luminescent device and the substrate.
In addition, the substrate can be formed by resin.
In addition, the material of the heat dissipation path body can be identical with the species of the material of the Wiring pattern.
By means of the invention it is possible to provide, a kind of number of devices is few and easy assembling, the thermal insulation construction but high illumination of thermal diffusivity
Utensil.
Brief description of the drawings
Fig. 1 is the oblique view for the profile for representing ligthing paraphernalia.
Fig. 2 is the sectional view of the ligthing paraphernalia for the state for representing to be embedded into structure member.
Fig. 3 is the top view for the interarea portion for representing the substrate that embodiment 1 is related to.
Fig. 4 is the oblique view for representing the luminescent device in substrate installation that embodiment 1 is related to.
Fig. 5 is the top view for the interarea portion for representing the substrate that embodiment 2 is related to.
Fig. 6 is to represent heat dissipation path body, the oblique view of Wiring pattern that embodiment 2 is related to.
Fig. 7 is the top view for the interarea portion for representing the substrate that embodiment 3 is related to.
Fig. 8 is to represent heat dissipation path body, the oblique view of Wiring pattern that embodiment 3 is related to.
Fig. 9 is the top view for the other configurations state that luminescent device is represented together with substrate.
Figure 10 is the top view for the other configurations state that luminescent device is represented together with substrate.
Embodiment
Below, embodiments of the present invention are described with reference to the attached figures.It is not rigorous also, each figure is ideograph
Diagram.
In addition, embodiment described below is all to show a currently preferred specific example.Following embodiment party
Numerical value, shape, material, inscape, the allocation position of inscape and type of attachment for being shown in formula etc., all it is the present invention
An example, purport be not limitation the present invention.Also, in the inscape of following embodiment, upper concept is shown
Independent claims in do not have record inscape, it may be said that bright is arbitrary inscape.
(embodiment 1)
Fig. 1 is the oblique view for the profile for representing ligthing paraphernalia.
Fig. 2 is the sectional view of the ligthing paraphernalia for the state for representing to be embedded into structure member.
In addition, in ligthing paraphernalia 100, the side of irradiation light is designated as front side (front), is embedded into the side of structure member
It is designated as rear side (rear).
As shown in these figures, ligthing paraphernalia 100 is set with being embedded into the state of structure member 200, to structural portion
The utensil of the front irradiation light of part 200, possess luminescent device 101, substrate 102, utensil framework 103, heat dissipation path body 104.
Utensil framework 103 is the box-like part of storage light-emitting device 101 and substrate 102.In present embodiment, utensil
Framework 103 is the part of general cylindrical shape, and it possesses first Room 131 at the rear of storage power circuit 109 and storage substrate
The second Room 132 in 102 front.In addition, setting through hole between the first Room 131 and second Room 132, the through hole is used to make
The electric wire of power supply passes through.
The front portion of utensil framework 103 has opening, for making the light from the releasing of luminescent device 101 installed in substrate 102
Release forwards.In addition, the anterior opening of utensil framework 103, is blocked by cover 108, the cover 108 protection luminescent device 101
With substrate 102, and the cover 108 be used for through from luminescent device 101 release light.
In addition, cover 108 not exclusively simple transparent flat boards or lens or diffuser plate etc..
In addition, in utensil framework 103, the exposed division 133 for the flange shape stretched out outward from the opening portion in front is provided with.
Exposed division 133 is that utensil framework 103 is embedded into the state of structure member 200 in the portion that outer side space (such as indoor) exposes
Point.In the present embodiment, exposed division 133 is made to reach foreign side, so that utensil framework 103 is not overall to be embedded into structure member
200, played a role as fixture, also, increase the contact area of air, increase radiating effect.
The material of utensil framework 103 is not particularly limited, the preferably metal of the strong iron of thermal conductivity and aluminium etc., or contain
These alloy etc..In addition, utensil framework 103, which can also be PBT (polybutylene terephthalate) etc., has an insulating properties
Synthetic resin etc. or the material that insulation processing is implemented on the surface of metal matrix.
In addition, the shape of utensil framework 103 is not particularly limited, such as can be the barrel shape of rectangle etc., in addition, also may be used
To be the shape that multiple fin are formd in exposed division 133.
Power circuit 109 is the device that direct current is provided for luminescent device 101, and it possesses for alternating current to be converted to
Circuit of direct current etc..
Fig. 3 is the top view for the interarea portion for representing substrate.
Fig. 4 is to represent the oblique view in the luminescent device of substrate installation.
Luminescent device 101 is the electronic device to be played a role as light source, is known as the surface installing type electricity of LED bags etc.
Sub- device (SMD: Surface Mount Device).
Specifically, such as luminescent device 101 possesses：The light source framework 111 of insulating properties, installed in the bottom of depressed part
LED etc. light-emitting component 112 and wavelength convert part 113, the light source framework 111 possess the depressed part 119 of referred to as cavity,
Wavelength convert part 113 is the resin containing fluorophor, is filled into depressed part.By the light released from light-emitting component 112, with
And the light released according to the light from fluorophor, luminescent device 101 turn into the device for the light that can release random color.For example, hair
Optical element 112 is the LED for releasing blueness, and fluorophor is the combination of yellow fluorophor or red-emitting phosphors and green-emitting phosphor
In the case of, luminescent device 101 can release white light.
In this case, the opening shape of depressed part 119 is circular that light-emitting component 112 is arranged on bias
Position on.In addition, luminescent device 101, in a manner of the light-emitting component 112 of bias is closest to the outer peripheral edge of substrate 102, configuration
On substrate 102.Thus, it is possible to using as the light-emitting component 112 of pyrotoxin, the exposed division in utensil framework 103 is configured as far as possible
Near 133.
In addition, in present embodiment, luminescent device 101, in the case where substrate 102 is mounted with luminescent device 101, with base
The opposed surface of plate 102 is provided with anode with the electrode 114 with negative electrode.Light-emitting component 112 configure a side electrode 114 it
On.
In addition, the color that the light-emitting component 112 that luminescent device 101 possesses is released is not limited to blueness.Can also possess
Release the light-emitting component 112 of ultraviolet and receive ultraviolet and light respectively as the fluorophor group of three primary colors (red, green, blueness)
The luminescent device 101 of conjunction.In addition, luminescent device 101 can possess the wavelength convert part beyond fluorophor.As wavelength convert
Part, can possess the light for such as semiconductor, metal complex, organic dyestuff, pigment, absorbing some wavelength, send and inhale
The material of the light of the different wavelength of the light of receipts.
In addition, in described embodiment 1, as light-emitting component 112 exemplified with LED, but, LED species not by
Limit, can be organic electroluminescent (Electro Luminescence) or inorganic EL etc..
Substrate 102 is to install one or more luminescent devices 101 to form the part of light emitting module, and in substrate 102
Interarea portion 122 there is the Wiring pattern 121 that is electrically connected with the light-emitting component 112 of luminescent device 101.
In this case, substrate 102 is discoidal part, on interarea portion 122 (surface), luminescent device
101 are mounted with the state circumferentially configured at equal intervals.In addition, the outer peripheral edge of substrate 102 is provided with recess everywhere, this is recessed
Portion and bolt for installation into utensil framework 103 etc. engage.
In addition, the material of substrate 102 is not particularly limited, the pottery of aluminum oxide, aluminium nitride etc. can be used as substrate 102
The resin substrate of the metal substrate of porcelain substrate, aluminium, copper etc., glass epoxide (CEM3, FR4 etc.), phenol etc., or there is metal and tree
Metal bottom substrate of the stepped construction of fat etc..Especially resin substrate, because the thermal conductivity of substrate 102 itself is poor, more
The effect of the Heat transmission by heat dissipation path body 104 can be enjoyed.
Wiring pattern 121 is in the portion of electric conductivity that is set as the pattern of film (paper tinsel) of interarea portion 122 of substrate 102
Part, it is the part that the light-emitting component 112 of luminescent device 101 with being installed in substrate 102 electrically connects.For example, in the master of substrate 102
The conductive film that face 122 is integrally formed copper etc., formed in the part of the needs on the surface of conductive film etchant resist pattern it
Afterwards, unwanted conductive film is removed by etching etc., so as to form Wiring pattern 121.
On Wiring pattern 121, specific diagram is eliminated, but, and from the power circuit for being accommodated in utensil framework 103
The electric wire connection of 109 extensions, the mode powered to each light-emitting component 112 form pattern.
Heat dissipation path body 104, it is set with the state spread out between the outer peripheral edge of luminescent device 101 and substrate 102, is
The heat sent from luminescent device 101 can be directed to utensil framework 103, near luminescent device 101 or its, to positioned at
Part existing for the outer peripheral edge extension of substrate 102 near utensil framework 103.In addition, the thermal conductivity ratio of heat dissipation path body 104
The thermal conductivity of substrate 102 is high.
It is identical with the species of the material of Wiring pattern 121 in present embodiment, the material of heat dissipation path body 104.In addition,
Heat dissipation path body 104, formed simultaneously with Wiring pattern 121.Specifically, such as when Wiring pattern 121 are formed, answering
The surface for turning into the part of heat dissipation path body 104 forms etchant resist, is not etched by etc. removing, so as to form heat dissipation path body
104.So as to, in present embodiment, heat dissipation path body 104, be with Wiring pattern 121 identical type film (paper tinsel) shape.
The shape of heat dissipation path body 104, is not particularly limited, and in present embodiment, the shape of substrate 102 is circle, because
For luminescent device 101, circumferentially assortment configures, heat dissipation path body 104, as shown in figure 3, turning into fan shape.In addition, for one
The corresponding heat dissipation path body 104 of individual luminescent device 101, in order that heat dissipation path body corresponding with adjacent luminescent device 101
104 are not connected with each other, and there is provided clearance G.Heat dissipation path body 104 is set as such shape, can in the substrate 102 of circle
Ensure big area.In addition, insulation distance D is provided between the outer peripheral edge of heat dissipation path body 104 and substrate 102.Thus, it is possible to
Enough ensure the security of electricity.
In addition, the area on the face parallel with interarea portion 122 of heat dissipation path body 104, than what is be connected with light-emitting component 112
The area of Wiring pattern 121 is big.
In present embodiment, heat dissipation path body 104 is connected with Wiring pattern 121.Thus, heat dissipation path body 104 is with lighting
Element 112 is directly connected to, and can efficiently be carried out Heat transmission hence for the heat of the light-emitting component 112 as pyrotoxin and be dissipated
Heat.
Here, the Wiring pattern 121 being connected with heat dissipation path body 104, when being conceived to each of luminescent device 101, with
Any one party of anode and negative electrode connects.For example, a luminescent device in luminescent device 101, the distribution being connected with anode
This (is designated as " anode pattern " by pattern 121 below in the case of being connected with heat dissipation path body 104.), because anode pattern by regarding
To be identical with heat dissipation path body 104, so the comparison of the area of heat dissipation path body 104 and the area of Wiring pattern 121, turns into sun
The comparison of pole figure case (heat dissipation path body 104) and the area of cathode pattern (Wiring pattern 121 being connected with negative electrode).In addition, with
The example on the contrary, cathode pattern is considered as identical with heat dissipation path body 104, sometimes with the anode pattern as Wiring pattern 121
Carry out Area comparison.
In addition, heat dissipation path body 104, spreads out setting, positioned at light-emitting component 112 between luminescent device 101 and substrate 102
The part folded with substrate 102.It is the heat dissipation path body for being nearby configured with very big area of light-emitting component 112 in pyrotoxin
104, so as to efficiently conduct heat and radiate.In addition, heat dissipation path body 104 also with state of insulation storage light-emitting element
112 light source framework 111 connects.Thus, Heat transmission is also carried out to the heat transmitted via light source framework 111, it is possible to increase radiating
Efficiency.
More than, according to ligthing paraphernalia 100 of the present embodiment, by the surface of substrate 102 and Wiring pattern 121
The heat dissipation path body 104 that (same processes) are formed simultaneously, can be to the near of the exposed division 133 as close possible to utensil framework 103
The heat of luminescent device 101 is transmitted untill side.In addition, expand heat dissipation path body 104, so as to transmit heat in wide scope.So as to such as
Shown in Fig. 2, ligthing paraphernalia 100 is embedded into the structure member 200 of ceiling etc., in addition, luminaire is covered by heat insulating member 201 etc.
In the case of the rear of tool 100, efficiently radiated from the exposed division 133 of utensil framework 103.Furthermore it is possible to provide a kind of thermal insulation
Working ligthing paraphernalia 100, so the high output of utensil 100 can be illuminated, and the ligthing paraphernalia 100 is although device count
Product is reduced amount than ever, shortens manufacturing lead time, and cost is low, and is also able to maintain that high dissipate in embedded state
It is hot.
(embodiment 2)
Illustrate the other embodiment of ligthing paraphernalia 100 below.In addition, the mechanism, construction and the work(that illustrate with embodiment 1
Energy identical mechanism, construction and function assign identical coding, and the description thereof will be omitted.
Fig. 5 is the top view for the interarea portion for representing substrate of the present embodiment.
Fig. 6 is to represent heat dissipation path body of the present embodiment, the oblique view of Wiring pattern.
As shown in these figures, in the case where luminescent device 101 is connected in series, Wiring pattern 121 and a luminescent device
The electrode 114 of the electrode 114 of 101 anode and the negative electrode of another luminescent device 101 connects.In addition, heat dissipation path body
104, it is connected with Wiring pattern 121, heat dissipation path body 104 and Wiring pattern 121, turns into the film (paper tinsel) of a fan shape, its point
Boundary can not differentiate by visual observation.In that case, shortest path is passed through according to electric current, it will be considered that be that the part that electric current passes through is used
Straight line connects, and is connected between the part that the energization in other words as the electrode 114 of two luminescent devices 101 is contributed with straight line, will
As Wiring pattern 121, the part beyond it is set to compare as heat dissipation path body 104, the area of heat dissipation path body 104 for the part
The area of Wiring pattern 121 is big.
In addition, in the case where luminescent device 101 is connected in series, the distribution that is connected with the anode of a luminescent device 101
Pattern 121 is connected with the negative electrode of another luminescent device 101, it may be considered that the Wiring pattern 121 of two luminescent devices 101 of connection
Half be Wiring pattern 121 corresponding with a luminescent device 101, be heat dissipation path body 104.In other words, it is short shown in Fig. 5
Wiring pattern 121 in scribe area A is Wiring pattern 121 corresponding with a luminescent device 101 with heat dissipation path body 104,
And heat dissipation path body 104.
By so, the anode-side of heat dissipation path body 104 and luminescent device 101 and the Wiring pattern 121 of cathode side
Both sides connect respectively, can efficiently carry out Heat transmission to the heat of the light-emitting component 112 as pyrotoxin.
(embodiment 3)
Illustrate the other embodiment of ligthing paraphernalia 100 below.In addition, the mechanism illustrated with above-mentioned embodiment, construction
And function identical mechanism, construction and function assign identical coding, and the description thereof will be omitted.
Fig. 7 is the top view for the interarea portion for representing substrate of the present embodiment.
Fig. 8 is to represent heat dissipation path body of the present embodiment, the oblique view of Wiring pattern.
As shown in these figures, heat dissipation path body 104 is not connected with Wiring pattern 121.In addition, heat dissipation path body 104 into
For the toroidal concentric with substrate 102, it is connected with the light source framework 111 of multiple luminescent devices 101.Thus, it is not necessary to dissipating
Gap is set on hot path body 104, in interarea portion 122 area of heat dissipation path body 104 can be made to become wider.In addition, sending out
In the case that optical device 101 possesses heat-conducting pad, heat dissipation path body 104 can be connected with the heat-conducting pad.
By configuring the heat dissipation path body 104 between the outer peripheral edge of luminescent device 101 and substrate 102 with toroidal,
The heat that luminescent device 101 can be sent, equably spreads to the outside of substrate 102.Thereby, it is possible to efficiently proceed to utensil
Heat transfer untill the exposed division 133 of framework 103, it is possible to increase from thermal diffusivity of the exposed division 133 into the air of interior.
In addition, heat dissipation path body 104 possesses extension 141, the extension 141 relative to luminescent device 101 extend to
The outer peripheral edge opposite side of substrate 102.Thus, while ensuring the insulation distance from the outer peripheral edge of substrate 102, and can, which expands, to be dissipated
The area of hot path body 104, it is possible to increase thermal diffusion effect (temperature decreasing effect).
Configuration is spread out between luminescent device 101 and substrate 102 in addition, having in heat dissipation path body 104, and is lighted
The part that element 112 clips with substrate 102.Thus, it is not direct to be connected with light-emitting component 112, it can but make heat dissipation path body 104
As close possible to the light-emitting component as pyrotoxin to 112, it can efficiently conduct heat and radiate.
In addition, the present invention is not limited by the embodiment.For example, it can will be combined the structure of this specification record
Into key element, or the other embodiment for excluding several inscapes and realizing, as embodiments of the present invention.It is in addition, right
In the embodiment, the purport of the present invention is not being departed from, i.e., in the range of the meaning shown in sentence that claims are recorded
Variation obtained from implementing the various modifications that the art person is found out is also contained in this case invention.
For example, substrate 102 is circular plate shape in the embodiment, luminescent device 101, with light-emitting component 112 towards base
The mode in the outer peripheral edge direction of plate 102 configures circumferentially, but, the shape of substrate 102 and the configuration of luminescent device 101, does not have
It is particularly limited to.For example, as shown in figure 9, the shape of substrate 102 can be rectangle, luminescent device 101 can be along substrate
102 periphery and configure.
In addition, between the outer peripheral edge of luminescent device 101 and substrate 102, other luminescent devices 101 can be configured.At this
In the case of individual, in the luminescent device 101 that the inner side of substrate 102 configures, heat dissipation path body 104 can also be set.Specifically, example
As shown in fig. 10, luminescent device 101 can be only fitted on multiple concentric circles.Even such configuration, can also be provided with
Configure heat dissipation path body 104 corresponding to each luminescent device 101 in inner side.
In addition it is also possible to which heat dissipation path body 104 is formed with the high part of the thermal conductivity of metallic plate etc., and it is installed to substrate
102.Thereby, it is possible to which the thickness of heat dissipation path body 104 is thickening, Heat transmission can be efficiently carried out.
Symbol description
100 ligthing paraphernalias
101 luminescent devices
102 substrates
103 utensil frameworks
104 heat dissipation path bodies
108 covers
109 power circuits
111 light source frameworks
112 light-emitting components
113 wavelength convert parts
114 electrodes
119 depressed parts
121 Wiring patterns
122 interarea portions
Room 131 first
132 second Rooms
133 exposed divisions
141 extensions
200 structure members
201 heat insulating members
Claims (6)
1. a kind of ligthing paraphernalia, it is set with being embedded into the state of structure member,
The ligthing paraphernalia possesses：
Luminescent device, there is the light-emitting component for employing semiconductor；
Substrate, there is the Wiring pattern electrically connected with the light-emitting component in the interarea portion of the substrate, installed in the substrate
The luminescent device；
Utensil framework, store the luminescent device and the substrate；And
Heat dissipation path body, in the interarea portion of the substrate, between the outer peripheral edge of the luminescent device and the substrate
The state that spreads out and be set, the thermal conductivity of the heat dissipation path body is higher than the thermal conductivity of the substrate,
The area of the heat dissipation path body on the face parallel with the interarea portion, than matching somebody with somebody described in being connected with the light-emitting component
The area of line pattern is big.
2. ligthing paraphernalia as claimed in claim 1,
The luminescent device possesses：The light source framework to be insulated with the light-emitting component,
The heat dissipation path body, it is connected with the light source framework.
3. ligthing paraphernalia as claimed in claim 1 or 2,
The heat dissipation path body, is connected with the Wiring pattern.
4. ligthing paraphernalia as claimed in claim 1 or 2,
The heat dissipation path body, setting is spread out between the luminescent device and the substrate.
5. ligthing paraphernalia as claimed in claim 1,
The substrate is formed by resin.
6. ligthing paraphernalia as claimed in claim 1,
The material of the heat dissipation path body is identical with the species of the material of the Wiring pattern.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-185449 | 2014-09-11 | ||
| JP2014185449A JP2016058315A (en) | 2014-09-11 | 2014-09-11 | Lighting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105423195A CN105423195A (en) | 2016-03-23 |
| CN105423195B true CN105423195B (en) | 2017-12-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510511198.4A Expired - Fee Related CN105423195B (en) | 2014-09-11 | 2015-08-19 | Ligthing paraphernalia |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2016058315A (en) |
| CN (1) | CN105423195B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7411947B2 (en) * | 2019-02-18 | 2024-01-12 | パナソニックＩｐマネジメント株式会社 | lighting equipment |
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| CN103363500A (en) * | 2013-07-08 | 2013-10-23 | 福建永德吉灯业股份有限公司 | Heat radiation structure of LED lamp |
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|---|---|---|---|---|
| CN101709857B (en) * | 2008-09-16 | 2012-01-25 | 东芝照明技术株式会社 | Light source unit and lighting apparatus using same |
| JP2012146834A (en) * | 2011-01-13 | 2012-08-02 | Toshiba Lighting & Technology Corp | Light emitting device and lighting device |
| JP5557162B2 (en) * | 2011-01-26 | 2014-07-23 | 東芝ライテック株式会社 | Light emitting device and lighting apparatus |
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2014
- 2014-09-11 JP JP2014185449A patent/JP2016058315A/en active Pending
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2015
- 2015-08-19 CN CN201510511198.4A patent/CN105423195B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101963295A (en) * | 2010-07-07 | 2011-02-02 | 杨东佐 | LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part |
| CN103363500A (en) * | 2013-07-08 | 2013-10-23 | 福建永德吉灯业股份有限公司 | Heat radiation structure of LED lamp |
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| Publication number | Publication date |
|---|---|
| JP2016058315A (en) | 2016-04-21 |
| CN105423195A (en) | 2016-03-23 |
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