CN105258055A - Three-dimensional packing illuminating source and preparation method thereof - Google Patents
Three-dimensional packing illuminating source and preparation method thereof Download PDFInfo
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- CN105258055A CN105258055A CN201510649498.9A CN201510649498A CN105258055A CN 105258055 A CN105258055 A CN 105258055A CN 201510649498 A CN201510649498 A CN 201510649498A CN 105258055 A CN105258055 A CN 105258055A
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- dimension packaging
- plume
- led chip
- illuminating source
- lens case
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- 238000012856 packing Methods 0.000 title abstract 13
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- 238000003466 welding Methods 0.000 claims description 20
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
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- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
- F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a three-dimensional packing illuminating source and a preparation method thereof. The three-dimensional packing illuminating source comprises a lens shell, a three-dimensional packing thermal column and printed circuit boards (PCBs) (base plates for short) provided with light-emitting diode (LED) chips (chips for short). The three-dimensional packing thermal column is arranged in the lens shell, and the base plates are fixed to the three-dimensional packing thermal column through sticking pieces. The base plates are fixed to all the planes of the three-dimensional packing thermal column through the sticking pieces, and the base plates and the three-dimensional packing thermal column are attached tightly with the utilization of a hot-pressing technology. The lens shell with an arc-shaped top is prepared, and a layer of reflecting materials is coated on the outer surface of the top. The packed chips and the three-dimensional packing thermal column are placed into the lens shell for glue filling and packing, and the three-dimensional packing illuminating source is obtained finally. According to the preparation method, the packing technology is simple and easy to implement, the manufacturing cost of a lamp can be lowered greatly, the three-dimensional illuminating source emits light in all directions of a space, and the packing density and integration level of the LED chips are improved greatly; at the same time, the LED chips are attached to a hot sink directly, and the heat-dissipation efficiency is extremely high.
Description
Technical field
The present invention relates to light source and preparation technology, particularly relate to a kind of three-dimension packaging illuminating source and preparation method thereof.
Background technology
Existing automobile front great majority are metal halid lamp, metal halid lamp inefficiency, energy consumption is comparatively large, along with the continuous maturation of LED technology, current LED has been deep into the every aspect of daily life, LED automobile headlight also arises at the historic moment, and it is high that LED car lamp has luminous efficiency, efficient energy-saving, environmental protection, the advantages such as the life-span is long, easy to control, are just becoming the main trend of automobile front.
And at present, the manufacture of LED automobile headlight, still be mainly the conventional method such as the manufacture of two-dimentional substrate integration packaging and the laminating of lamp pearl, in view of single LED lamp pearly-lustre flux is low and the high request of headlight illumination, it is little invariably to there is lighting angle in the automobile front provided in the market, integrated level is low, the shortcoming such as the low and cooling system of packaging density is huge, this is unfavorable for the development of automobile front, in addition because LED chip 33 is welded on the one side of substrate, effectively cannot utilize the spatial area of substrate, cause LED chip 33 packaging density low, integrated level is low, the radiating mode of this car light also only utilizes the convection heat transfer' heat-transfer by convection of air, radiating efficiency is comparatively low.
Summary of the invention
The object of the invention is to the shortcoming and defect overcoming above-mentioned prior art, a kind of three-dimension packaging illuminating source and preparation method thereof is provided.
The present invention is achieved through the following technical solutions:
A kind of three-dimension packaging illuminating source, comprises lens case 51, three-dimension packaging plume 13, is provided with the pcb board 11 of LED chip 33 array; Three-dimension packaging plume 13 is placed in lens case 51, and pcb board 11 is fixed on three-dimension packaging plume 13 by sticking tablet 12.
Described three-dimension packaging plume 13 is hollow polyhedron structure, and this polyhedral structure has at least 3 planes; Pcb board 11 offers the open slot for holding LED chip 33, LED chip 33 is directly contacted with three-dimension packaging plume 13 by this open slot.
Silica gel, silicones or epoxy resin is perfused with in described lens case 51.
Described lens case 51 material is PMMA, PC or crystalline ceramics; Described lens case 51 surface has fluorescence coating.
The preparation method of described three-dimension packaging illuminating source is as follows: utilize photoetching or silk-screen, the line layer of processing PCB plate 11, and surface treatment; By sticking tablet 12, pcb board 11 is fixed in each plane of three-dimension packaging plume 13, utilizes heat pressing process that pcb board 11 and three-dimension packaging plume 13 are fitted tightly; By LED chip 33 by required array arrangement mode, realize between LED chip 33 and LED chip 33 by welding and the electric interconnection of LED chip 33 and pcb board 11 line layer; Complete the encapsulation of LED chip 33 and three-dimension packaging plume 13; Prepare the lens case 51 at an arc-shaped top, then apply one deck reflecting material at outer surface of cupular part; The three-dimension packaging plume 13 of packaged LED chip 33 is placed in lens case 51 and carries out encapsulating encapsulation, finally obtain three-dimension packaging illuminating source.Concrete steps are as follows:
Three-dimension packaging plume 13 is fixed on bottom base 14, and on three-dimension packaging plume 13, place sticking tablet 12 and pcb board 11 successively, utilize top base 10 pairs of bottom bases 14 to apply 0.1 ~ 10Mpa pressure simultaneously, heating 50 ~ 100 DEG C is carried out to top base 10 and bottom base 14 simultaneously, after heat-insulation pressure keeping 3 ~ 5min, the applying pressure of release top base 10, stops heating top base 10 and bottom base 14 simultaneously; Complete pcb board 11 to combine closely with three-dimension packaging plume 13;
By LED chip 33 by necessary requirement, arrangement is fixed on the side of three-dimension packaging plume 13; First, utilize automatic bonder at the installation site of LED chip 33 point crystal-bonding adhesive, then LED chip 33 is placed on crystal-bonding adhesive, rotate the not ipsilateral of three-dimension packaging plume 13, repeat above process, until all faces of three-dimension packaging plume 13 all place LED chip 33, the three-dimension packaging plume 13 laying LED chip 33 is placed in high temperature die bond stove;
(4) welding procedure is utilized to realize LED chip 33 and LED chip 33, and the electric interconnection of LED chip 33 and PCB line layer;
(5) utilize spraying equipment, spray one deck reflecting material at lens case 51 outer surface of cupular part;
(6) packaged three-dimension packaging plume 13 is placed in lens case 51 carries out encapsulating encapsulation, finally obtain three-dimension packaging illuminating source.
Described three-dimension packaging plume 13 material is copper or aluminium, and high reverse--bias process is carried out on surface.
LED chip 33 is fixed on the surface of three-dimension packaging plume 13 by the open slot of the line layer of pcb board, and LED chip 33 directly contacts with three-dimension packaging plume 13 surface.
Described be welded as ultrasonic wave gold wire ball welding method or aluminum steel welding.
Described lens case 51 surface configuration is free form surface or plane; Side is smooth or with the micro-structural spread for light.
The present invention, relative to prior art, has following advantage and effect:
The present invention can realize the luminescence of 360 °, light fixture space, the packaging density of very big raising LED chip 33 and integrated level, LED chip 33 is directly fitted heat sink, radiating efficiency is very efficient, simultaneously this manufacture method adopt hot pressing, die bond, gold thread welding and the packaging technology such as encapsulating simple, greatly can reduce the manufacturing cost of light fixture, and enhance productivity.
Accompanying drawing explanation
Fig. 1 is three-dimension packaging illuminating source structural representation of the present invention.
Fig. 2 is three-dimension packaging illuminating source preparation technology schematic diagram of the present invention.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is more specifically described in detail.
Embodiment
As illustrated in fig. 1 and 2.A kind of three-dimension packaging illuminating source of the present invention, comprises lens case 51, three-dimension packaging plume 13, is provided with the pcb board 11 of LED chip 33 array; Three-dimension packaging plume 13 is placed in lens case 51, and pcb board 11 is fixed on three-dimension packaging plume 13 by sticking tablet 12.
Described three-dimension packaging plume 13 is hollow polyhedron structure, and this polyhedral structure has at least 3 planes; Pcb board 11 offers the open slot for fixed L ED chip 33.
Silica gel, silicones or epoxy resin is perfused with in described lens case 51.
Described lens case 51 material is PMMA, PC or crystalline ceramics; Described lens case 51 surface has fluorescence coating.
The preparation method of described three-dimension packaging illuminating source is as follows: utilize photoetching or silk-screen, the line layer of processing PCB plate 11, and surface treatment; By sticking tablet 12, pcb board 11 is fixed in each plane of three-dimension packaging plume 13, utilizes heat pressing process that pcb board 11 and three-dimension packaging plume 13 are fitted tightly; By LED chip 33 by required array arrangement mode, realize between LED chip 33 and LED chip 33 by welding and the electric interconnection of LED chip 33 and pcb board 11 line layer, complete the encapsulation of LED chip 33 and three-dimension packaging plume 13; Prepare the lens case 51 at an arc-shaped top, then apply one deck reflecting material at outer surface of cupular part; The three-dimension packaging plume 13 of packaged LED chip 33 is placed in lens case 51 and carries out encapsulating encapsulation, finally obtain three-dimension packaging illuminating source.
Below procedure of processing is illustrated:
As shown in Figure 2.Three-dimension packaging plume 13 is fixed on bottom base 14, and on three-dimension packaging plume 13, place sticking tablet 12 and pcb board 11 successively, utilize top base 10 pairs of bottom bases 14 to apply 0.1 ~ 10Mpa pressure simultaneously, heating 50 ~ 100 DEG C is carried out to top base 10 and bottom base 14 simultaneously, after heat-insulation pressure keeping 3 ~ 5min, the applying pressure of release top base 10, stops heating top base 10 and bottom base 14 simultaneously; Complete pcb board 11 to combine closely with three-dimension packaging plume 13;
By LED chip 33 by necessary requirement, arrangement is fixed on the side of three-dimension packaging plume 13, and each side is by 7 strings 3 and arrange, and have 21 chips, chip size size is 10 μm * 30 μm, and every chips watt level is 0.2W; First, utilize automatic bonder at the installation site of LED chip 33 point crystal-bonding adhesive, then LED chip 33 is placed on crystal-bonding adhesive, rotate the not ipsilateral of three-dimension packaging plume 13, repeat above process, until all faces of three-dimension packaging plume 13 all place LED chip 33, the three-dimension packaging plume 13 laying LED chip 33 is placed in high temperature die bond stove;
(4) welding procedure is utilized to realize LED chip 33 and LED chip 33, and the electric interconnection of LED chip 33 and PCB line layer; Specifically utilize automated ultrasonic gold wire bonder to realize LED chip 33 to be connected with the gold thread of LED chip 33 electrode, automatic welding machine specific works flow process is: 1. line sending: first the gold thread on gold thread cylinder is delivered to above LED chip 33 electrode by bonding machine; 2. burn ball bonding to connect: the sparking lever system on automatic welding machine, by electric discharge, makes spun gold end sinter balling-up, simultaneously under the effect of ultrasonic energy and temperature, gold thread and solder side soften, and form molecule chimeric alloy mutually; 3. wire drawing two is welded: automatic welding machine pulls the gold thread on gold thread cylinder by mechanism, and completes second time welding process at the electrode of another chip; 4. broken string burns ball: automatic welding machine cuts off welding gold thread, and in second time welding position, gold thread is sintered balling-up.Repeat above four steps, complete the electric interconnection of the line layer of LED chip 33 and LED chip 33 and LED chip 33 and pcb board;
(5) utilize spraying equipment, spray one deck reflecting material at lens case 51 outer surface of cupular part;
(6) packaged three-dimension packaging plume 13 is placed in lens case 51 carries out encapsulating encapsulation, finally obtain three-dimension packaging illuminating source.1. phosphor gel configuration: first, choose the PS-7040-A/B silica gel of Guangzhou Huigu Chemical Co., Ltd, wherein, 7040A and 7040B presses 1:1 configuration, and configuration obtains 7040 silica gel, choose the aluminate fluorescent powder SMD-B that Grirem Advance Materials Co., Ltd produces, wherein, the allocation ratio of SMD-B yellow fluorescent powder and 7040 silica gel is 1.6:2, in layoutprocedure, need constantly to stir phosphor gel, thus fluorescent powder grain is fully mixed with silica gel; 2. vacuum defoamation: putting into vacuum chamber by configuring the phosphor gel obtained, after utilizing vavuum pump to extract the gas of casing, forming certain vacuum in casing.In fluorescent powder colloid, bubble is under suction function, rises to surface from colloid inside, expands and breaks, finally departing from colloid, until surface no longer includes bubble effusion, de-aeration is complete; 3. encapsulating: lens case 51 is inverted, fix the relative position of three-dimension packaging pillar 50 and lens case 51, during fixed position, the both positive and negative polarity of pcb board end needs to expose lens case 51 housing, to realize light source and extraneous electric interconnection below, utilize automatic glue-pouring equipment, the phosphor gel that above-mentioned configuration obtains is filled into lens case 51; 4. solidify: put into baking box by whole for the three-dimension packaging light source of having filled phosphor gel, in low temperature 100 DEG C of baking ovens, carry out precuring 10 minutes, then oven temperature is brought up to 150 DEG C and toast and solidify completely for 3 hours.Finally obtain three-dimension packaging illuminating source.
Described three-dimension packaging plume 13 material is copper or aluminium, and high reverse--bias process is carried out on surface.
LED chip 33 is fixed on the surface of three-dimension packaging plume 13 by the open slot of pcb board, and LED chip 33 directly contacts with three-dimension packaging plume 13 surface.High thermal conductivity heat pipe can be nested with at three-dimension packaging plume 13 hollow structure, be conducive to the heat radiation of three-dimension packaging illuminating source.
Described be welded as ultrasonic wave gold wire ball welding method or aluminum steel welding.
Described lens case 51 surface configuration is free form surface or plane; Side is smooth or with the micro-structural spread for light, outer surface of cupular part coating reflecting material, as being titanium dioxide, zinc oxide, calcium carbonate, aluminium oxide, silica, barium sulfate and their combination; The material of described encapsulating encapsulation is silica gel, silicones or epoxy resin; Fluorescent material can be coated in surface of shell, can mix with case material, also can mix with encapsulating material; During encapsulating, lens housing stands upside down and places, and utilize gravity to eliminate bubble, end strips electrode part exposes lens case 51.
As mentioned above, just the present invention can be realized preferably.
Embodiments of the present invention are not restricted to the described embodiments; other are any do not deviate from Spirit Essence of the present invention and principle under do change, modification, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (9)
1. a three-dimension packaging illuminating source, is characterized in that, comprises lens case (51), three-dimension packaging plume (13), is provided with the pcb board (11) of LED chip (33) array; Three-dimension packaging plume (13) is placed in lens case (51), and pcb board (11) is fixed on three-dimension packaging plume (13) by sticking tablet (12).
2. three-dimension packaging illuminating source according to claim 1, is characterized in that, described three-dimension packaging plume (13) is hollow polyhedron structure, and this polyhedral structure has at least 3 planes; Pcb board (11) offers the open slot for holding LED chip (33), LED chip (33) is directly contacted with three-dimension packaging plume (13) by this open slot.
3. three-dimension packaging illuminating source according to claim 1 and 2, is characterized in that, described lens case is perfused with silica gel, silicones or epoxy resin in (51).
4. three-dimension packaging illuminating source according to claim 3, is characterized in that, described lens case (51) material is PMMA, PC or crystalline ceramics; Described lens case (51) surface has fluorescence coating.
5. the preparation method of three-dimension packaging illuminating source according to any one of Claims 1-4, is characterized in that comprising the steps:
Utilize photoetching or silk-screen, the line layer of processing PCB plate (11), and surface treatment; By sticking tablet (12), pcb board (11) is fixed in each plane of three-dimension packaging plume (13), utilizes heat pressing process that pcb board (11) and three-dimension packaging plume (13) are fitted tightly; By LED chip (33) by required array arrangement mode, realize between LED chip (33) and LED chip (33) by welding and the electric interconnection of LED chip (33) and pcb board (11) line layer, complete the encapsulation of LED chip (33) and three-dimension packaging plume (13); Prepare the lens case (51) at an arc-shaped top, then apply one deck reflecting material at outer surface of cupular part; The three-dimension packaging plume (13) of packaged LED chip (33) is placed in lens case (51) and carries out encapsulating encapsulation, finally obtain three-dimension packaging illuminating source.
6. the preparation method of three-dimension packaging illuminating source according to claim 5, is characterized in that: concrete preparation method realizes as follows:
Three-dimension packaging plume (13) is fixed on bottom base (14), and on three-dimension packaging plume (13), place sticking tablet (12) and pcb board (11) successively, utilize top base (10) to apply 0.1 ~ 10Mpa pressure to bottom base (14) simultaneously, heating 50 ~ 100 DEG C is carried out to top base (10) and bottom base (14) simultaneously, after heat-insulation pressure keeping 3 ~ 5min, the applying pressure of release top base (10), stops top base (10) and bottom base (14) heating simultaneously; Complete pcb board (11) to combine closely with three-dimension packaging plume (13);
By LED chip (33) by necessary requirement, arrangement is fixed on the side of three-dimension packaging plume (13), first, utilize automatic bonder at the installation site point crystal-bonding adhesive of LED chip (33), then LED chip (33) is placed on crystal-bonding adhesive, rotate the not ipsilateral of three-dimension packaging plume (13), repeat above process, until three-dimension packaging plume (13) all faces all place LED chip (33), the three-dimension packaging plume (13) laying LED chip (33) is placed in high temperature die bond stove and realizes die bond;
After die bond completes, welding procedure is utilized to realize LED chip (33) and LED chip (33), and the electric interconnection of LED chip (33) and PCB line layer; Utilize spraying equipment, spray one deck reflecting material at lens case (51) outer surface of cupular part;
Packaged three-dimension packaging plume (13) is placed in lens case (51) and carries out encapsulating encapsulation, finally obtain three-dimension packaging illuminating source.
7. the preparation method of three-dimension packaging illuminating source according to claim 5, is characterized in that: described three-dimension packaging plume (13) material is copper or aluminium, and high reverse--bias process is carried out on surface.
8. the preparation method of three-dimension packaging illuminating source according to claim 5, is characterized in that: described in be welded as ultrasonic wave gold wire ball welding method or aluminum steel welding.
9. the preparation method of three-dimension packaging illuminating source according to claim 5, is characterized in that: described lens case (51) surface configuration is free form surface or plane.
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