CN105120643B - A kind of thermoplasticity electromagnetic shielding film for rapid processing - Google Patents
A kind of thermoplasticity electromagnetic shielding film for rapid processing Download PDFInfo
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- CN105120643B CN105120643B CN201510381360.5A CN201510381360A CN105120643B CN 105120643 B CN105120643 B CN 105120643B CN 201510381360 A CN201510381360 A CN 201510381360A CN 105120643 B CN105120643 B CN 105120643B
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- 238000012545 processing Methods 0.000 title claims abstract description 33
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 65
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 65
- 239000010410 layer Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000012790 adhesive layer Substances 0.000 claims abstract description 24
- 229910021485 fumed silica Inorganic materials 0.000 claims abstract description 22
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 21
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 20
- 239000011241 protective layer Substances 0.000 claims abstract description 19
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 18
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000004952 Polyamide Substances 0.000 claims abstract description 13
- 229920002647 polyamide Polymers 0.000 claims abstract description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- 239000006185 dispersion Substances 0.000 claims description 15
- 229920005749 polyurethane resin Polymers 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 150000003949 imides Chemical class 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 241000555268 Dendroides Species 0.000 claims description 10
- 239000004962 Polyamide-imide Substances 0.000 claims description 10
- 229920002312 polyamide-imide Polymers 0.000 claims description 10
- 238000001771 vacuum deposition Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 8
- 239000012046 mixed solvent Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 239000004576 sand Substances 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 238000007738 vacuum evaporation Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000009396 hybridization Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 241000790917 Dioxys <bee> Species 0.000 claims 1
- 229910003978 SiClx Inorganic materials 0.000 claims 1
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- 210000001787 dendrite Anatomy 0.000 claims 1
- -1 hydroxy Ester Chemical class 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 7
- 150000002466 imines Chemical class 0.000 abstract description 2
- 229920002635 polyurethane Polymers 0.000 abstract description 2
- 239000004814 polyurethane Substances 0.000 abstract description 2
- 238000005057 refrigeration Methods 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 12
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 12
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- 230000007423 decrease Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
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- 229920001187 thermosetting polymer Polymers 0.000 description 4
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- 238000003475 lamination Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003277 amino group Polymers 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of thermoplasticity electromagnetic shielding films for rapid processing; the electromagnetic shielding film includes substrate, release layer, insulating protective layer, metal layer and thermoplastic conductive glue-line, and the thermoplastic conductive glue-line is made of hydridization type polyamide thermoplastic imines, thermoplastic hydroxy polyurethane, thermoplastic acrylic resin, fumed silica, conductive metal powder, antioxidant.The present invention has the advantage that conductive adhesive layer has thermoplasticity, stored under refrigeration is not needed, adapts to that there is excellent attachment fastness, ground connection fillibility and step fillibility in rapid processing to flexible connection circuit.
Description
Technical field
The present invention relates to the screened film field of electronic circuit package, in particular to a kind of thermoplasticity electricity for rapid processing
Magnetic wave screened film.
Background technique
It is inside the electronic building brick caused with the high frequency of the lightening demand of electronic product and communication system and outer
The electromagnetic interference problem in portion is gradually serious, and electromagnetic shielding becomes inevitable.3C Product, small-size multifunction electrically want electromagnetic shielding
It asks and is also being continuously improved.
Currently, for circuit board, including flexible circuit board, hardboard, realize that electromagnetism interference practicability and operability have both
Mode be fitting electromagnetic shielding film, especially ultra-thin circuit, fitting electromagnetic shielding film have it is lightening, high shield effectiveness it is excellent
Gesture.Electromagnetic wave disclosed in the Chinese patent literature of Publication No. CN101176388A, CN102047777A and CN101772996A
Screened film has good shield effectiveness, but the major functions such as its conductive adhesive layer coating is all using heat cured coating, especially
Be it is heat-resisting in order to improve, preferentially use curable epoxide class material.180 DEG C or so, after lamination in 3 minutes are needed, using 160 DEG C,
Solidification in 30 minutes, thermosetting property conducting resinl could have and have excellent attachment stickiness and conductive fill with flexible circuit board,
The connection resistance requirement that conductive fill requires is less than 1000 m Ω, and thermosetting property conductive adhesive layer is under the conditions of rapid processing, connection electricity
Resistance is big, and conductive fill is insufficient, and attachment fastness is insufficient, is unable to rapid processing and is applied on flexible circuit board.And it is existing known
Heat cured electromagnetic shielding film the conductive adhesive layer pot-life is short at normal temperature, need it is stored refrigerated, increase storage, transport
Cost shortens the time of user's application, increases the cost of application.And with the multi-functional 3C such as tablet computer, smart phone
The development of product, the increase in demand of shielded flexible connection, lower processing efficiency and higher cost impact are produced in 3C
Application on product.
Summary of the invention
The technical problem to be solved by the present invention is to places in view of the shortcomings of the prior art, provide a kind of for quickly adding
The thermoplasticity electromagnetic shielding film of work.
In order to solve the above technical problems, the technical solution adopted by the present invention is that:
A kind of thermoplasticity electromagnetic shielding film for rapid processing, the electromagnetic shielding film include substrate, release layer,
Insulating protective layer, metal layer and thermoplastic conductive glue-line composition, prepare each component and its weight of the thermoplastic conductive glue-line
Number are as follows: 5-10 parts of polyamide thermoplastic imide resin of hydridization type, 10-15 parts of thermoplastic hydroxy polyurethane resin, thermoplasticity third
5-10 parts of olefin(e) acid resin, 5-10 parts of fumed silica, 20-30 parts of conductive metal powder, 2-5 parts of antioxidant, solvent 40-53
Part.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the hydridization type polyamide thermoplastic imide resin
The polyamide thermoplastic imide resin of preferential silicon hybridization type.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the thermoplastic hydroxy polyurethane resin are preferably soft
Change point in the polyurethane resin of 60-90 DEG C of hydroxyl.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the thermoplastic acrylic resin are preferred molecules
Amount is between 150000-300000, acrylic copolymer resin of the Tg value at 40-60 DEG C.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the fumed silica are that specific surface area exists
100-200m2Fumed silica between/g.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the conductive metal powder are that average grain diameter is 5-10 μm
Dendroid silver-coated copper powder.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the release layer are surface roughness in 0.3-0.6 μ
The frosted matt release layer of m, glossiness 15-30Gs.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the insulating protective layer is with a thickness of 2-3 μm.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the metal layer are Vacuum Deposition silver layer or copper plate,
With a thickness of 80-120nm.
The above-mentioned thermoplasticity electromagnetic shielding film for rapid processing, the thermoplastic conductive bondline thickness are 5-12 μm.
Compared with prior art, the present invention abandons individual curing process by using thermoplastic conductive adhesive layer, thus
Process velocity is improved, the requirement of rapid processing is adapted to.
Conductive adhesive layer in the present invention uses three kinds of combinations of thermoplastic resins, and passes through the optimization ratio between control resin
Example, forms the thermoplastic conductive glue-line of heat resistance, while guaranteeing heat resistance and electric conductivity, ensure that electromagnetic shielding film
Attachment fastness and connection resistance long-time stability.Thermoplasticity electromagnetic shielding film of the invention reduces the cost using processing,
The application range of electromagnetic shielding film is widened.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of electromagnetic shielding film of the present invention.
Each label indicates in figure are as follows: 1, substrate, 2, release layer, 3, insulating protective layer, 4, metal layer, 5, thermoplastic conductive glue
Layer.
Specific embodiment
Thermoplasticity electromagnetic shielding film provided by the invention with rapid processing by substrate, release layer, insulating protective layer,
Metal layer and thermoplastic conductive glue-line composition.The thermoplastic conductive glue-line component are as follows: hydridization type polyamide thermoplastic imines tree
5-10 parts of rouge, 10-15 parts of thermoplastic hydroxy polyurethane, 5-10 parts of thermoplastic acrylic resin, 5-10 parts of fumed silica,
20-30 parts of conductive metal powder, 2-5 parts of antioxidant, 40-53 parts of solvent.
It is to guarantee that the heat resistance of conducting resinl is full that the hydridization type polyamide thermoplastic imide resin acts in conductive adhesive layer
The requirement of the processing such as sufficient subsequent reflow weldering, the preferably polyamideimide resin of silicon hybridization type, are applicable in polyamide-imide of the invention
Resin includes but is not limited to the H901-2, H903 etc. of the waste river chemistry of Japan.
Effect of the thermoplastic hydroxy polyurethane resin in conductive adhesive layer is to provide fast activating adhesion characteristic, provides
The attachment fastness of conductive adhesive layer and flexible circuit board PI film, and there is excellent dispersibility to metal.It is preferred that softening point is in 60-90
DEG C hydroxyl polyurethane resin.It include but is not limited to the desmocoll of Bayer suitable for polyurethane resin of the invention
540/4,540/5 etc..
The thermoplastic acrylic resin is to provide between resin system and metal powder in the main function in conductive adhesive layer
Dispersion and attachment, and improve the attachment of conductive adhesive layer and the coat of metal.In the present invention, the preferred molecule of thermoplastic acrylic resin
Amount is between 150000-300000, acrylic copolymer resin of the Tg value at 40-60 DEG C.Molecular weight less than 150000, resin
Toughness and intensity are insufficient, will cause the decline of conductive adhesive layer intensity, and molecular weight is greater than 300000, and resin viscosity is big, and coating is uniform
Property decline it is obvious.It is suitable for the invention the B48N etc. that thermoplastic acrylic resin includes but is not limited to ROHM AND HAAS.
Three kinds of resin combinations use in the present invention, and select the rational proportion of three kinds of resins, can combine metal powder
Dispersion and attachment, the performances such as heat resistance and rapid processing.
The fumed silica is specific surface area in 100-200m2Fumed silica between/g.Gas phase titanium dioxide
The effect of silicon is to reduce the sinking speed of metal powder in conducting resinl, and guarantee to wind in manufacturing process and not after-tack, improves storage
Stability.Being suitable for the invention fumed silica includes but is not limited to R972, the R202 for winning wound Degussa, wacker chemicals
H15, H17 etc..
The conductive metal powder is the dendroid silver-coated copper powder that average grain diameter is 5-10 μm.Dendroid silver-coated copper powder it is main
Effect is to provide excellent connection resistance, and reinforcement shield effectiveness.Include but is not limited to suitable for dendritic metal powder of the invention
The ACAX-225 dendroid silver-coated copper powder of Industrial Co., Ltd, Mitsui Metal Co., Ltd..
The antioxidant is general antioxidant, and mainly raising conductive adhesive layer is steady in storage and process
It is qualitative, such as BASF B900,168.
The solvent is the mixed solvent of N-methyl pyrrolidones, dimethylbenzene, cyclohexanone and butanone.
The effect of the release layer is to remove substrate after processing, and provides the surface of stable peeling effect and frosted matt
Effect.To reach this effect, the surface roughness of release layer will be controlled at 0.3-0.6 μm, glossiness 15-30Gs.Release layer
Using melamine resin system or fluororesin system, and using the compounded mix of titanium dioxide and silica, it is applied to basement membrane
0.3-0.6 μm of roughness of upper formation, the release layer of glossiness 15-30Gs.
The insulating protective layer is mainly provided in electromagnetic shielding film processed and applied to route, and the insulation and protection on surface are made
With.Insulating protective layer is made of resin resistant to high temperature and carbon black filler.Being applicable in fire resistant resin of the present invention is with excellent flexible
The resin of property and surface hardness, such as polyimide resin, polyurethane-modified amino resins, polyurethane-modified ultra-violet curing acrylic acid
Resin etc..The effect of carbon black is to provide the apparent of black, and reduces the insulation resistance on surface, plays the role of antistatic.Insulation
Protective layer with a thickness of 2-3 μm, be lower than 2 μm, wearability and protective effect are insufficient, be greater than 3 μm, flexibility decline, bending resistance
It is bad.
The effect of the metal layer is to provide the shield effectiveness of electromagnetic wave shielding, and metal layer of the invention is Vacuum Deposition silver layer
Or copper plate, preferably Vacuum Deposition silver layer are less than 80nm with a thickness of 80-120nm, preferably 100-110 nm, shield effectiveness is less than
45dB is greater than 120nm, and bending resistance is insufficient, and shield effectiveness decline is obvious after test.
The conductive adhesive layer with a thickness of 5-12 μm, preferentially at 8-10 μm, for thickness less than 5 μm, connection resistance is insufficient, conductive
Layer coating homogeneity is insufficient.Thickness is greater than 12 μm, and the bending resistance of electromagnetic shielding film declines, connected after bend test resistance,
Shield effectiveness decline is greater than 30%.
In the present invention, to substrate without especially control, it is preferable to use with a thickness of 38~75 μm of PET film.
It can be prepared by the following method provided by the present invention for the thermoplasticity electromagnetic shielding film of rapid processing:
Thermoplastic conductive glue is prepared first, by mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic
Resin dissolves after mixing in stirring and dissolving slot, puts into and fumed silica is added in dispersion slot, disperses 30-50 minutes
3-5 is sanded after by sand mill afterwards, material is added in rotation-revolution blender, dendritic metal powder is added, vacuumizes
After being stirred 60-90 minutes, antioxidant is added and is stirred for 20-30 minutes, conduction releasing is used for applying conductive glue-line.
It is coated with release layer in PET base material, after solidification, is coated with insulating protective layer in release layer surface, is protected in insulation
Vacuum evaporation metal layer on sheath, then coating thermoplastic conductive adhesive layer on the metal layer, obtain the thermoplasticity for rapid processing
Electromagnetic shielding film.
Coating method uses well known method.
When electromagnetic shielding film is used for flexible circuit board, it can be quickly laminated by high temperature or boiling hot mode is worked into flexibility
On the PI film of plate.Finally throw off the substrate with release layer.
Below with reference to embodiment, the present invention will be further described.
Embodiment 1
Conducting resinl is prepared first, and the proportion of thermoplastic conductive glue is as follows:
5 parts of polyamide thermoplastic imide resin H901-2
54,0/4 10 parts of thermoplastic polyurethane resin desmocoll
5 parts of thermoplastic acrylic resin B48N
5 parts of fumed silica R972
20 parts of dendroid silver-coated copper powder ACAX-225
2 parts of antioxidant B900
8 parts of N-methyl pyrrolidones
15 parts of dimethylbenzene
20 parts of cyclohexanone
10 parts of butanone；
Mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin is molten in stirring and dissolving slot
Solution after mixing, is put into and fumed silica is added in dispersion slot, and 3-5 is sanded by sand mill after dispersion 30-50 minutes
After, material is added in rotation-revolution blender, dendritic metal powder is added, vacuumizes after being stirred 60-90 minutes,
Antioxidant is added to be stirred for 20-30 minutes, conduction releasing is used for applying conductive glue-line.
It is coated with release layer on 50 microns of PET film, insulating protective layer that coating thickness is 2 μm, vacuum evaporation 100nm
Vacuum Deposition silver layer, the conductive adhesive layer for being coated with 5 μm, preparation are used for the thermoplasticity electromagnetic shielding film of rapid processing.
After the simulation accelerated aging of electromagnetic shielding film high temperature and humidity 1 year, quickly flexible circuit board is arrived within lamination (30 seconds)
On, it is tested for the property.
Embodiment 2
Conducting resinl is prepared first, and the proportion of thermoplastic conductive glue is as follows:
5 parts of polyamide thermoplastic imide resin H903
54,0/5 15 parts of thermoplastic polyurethane resin desmocoll
5 parts of thermoplastic acrylic resin B48N
10 parts of fumed silica R202
20 parts of dendroid silver-coated copper powder ACAX-225
168 5 parts of antioxidant
10 parts of N-methyl pyrrolidones
10 parts of dimethylbenzene
15 parts of cyclohexanone
5 parts of butanone；
Mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin is molten in stirring and dissolving slot
Solution after mixing, is put into and fumed silica is added in dispersion slot, and 3-5 is sanded by sand mill after dispersion 30-50 minutes
After, material is added in rotation-revolution blender, dendritic metal powder is added, vacuumizes after being stirred 60-90 minutes,
Antioxidant is added to be stirred for 20-30 minutes, conduction releasing is used for applying conductive glue-line.
It is coated with release layer on 50 microns of PET film, insulating protective layer that coating thickness is 3 μm, vacuum evaporation 80nm
Vacuum Deposition silver layer, the conductive adhesive layer for being coated with 8 μm, preparation are used for the thermoplasticity electromagnetic shielding film of rapid processing.
After the simulation accelerated aging of electromagnetic shielding film high temperature and humidity 1 year, quickly it is laminated on (30 seconds) to flexible circuit board,
It is tested for the property.
Embodiment 3
Conducting resinl is prepared first, and the proportion of thermoplastic conductive glue is as follows:
7 parts of polyamide thermoplastic imide resin H901-2
54,0/4 10 parts of thermoplastic polyurethane resin desmocoll
10 parts of thermoplastic acrylic resin B48N
5 parts of fumed silica R972
23 parts of dendroid silver-coated copper powder ACAX-225
3 parts of antioxidant B900
7 parts of N-methyl pyrrolidones
10 parts of dimethylbenzene
15 parts of cyclohexanone
10 parts of butanone；
Mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin is molten in stirring and dissolving slot
Solution after mixing, is put into and fumed silica is added in dispersion slot, and 3-5 is sanded by sand mill after dispersion 30-50 minutes
After, material is added in rotation-revolution blender, dendritic metal powder is added, vacuumizes after being stirred 60-90 minutes,
Antioxidant is added to be stirred for 20-30 minutes, conduction releasing is used for applying conductive glue-line.
Release layer, insulating protective layer, vacuum evaporation 120nm of the coating thickness for 2.5 μm are coated on 50 microns of PET film
Vacuum Deposition silver layer, be coated with 12 μm of conductive adhesive layer, preparation is used for the thermoplasticity electromagnetic shielding film of rapid processing.
After the simulation accelerated aging of electromagnetic shielding film high temperature and humidity 1 year, quickly it is laminated on (30 seconds) to flexible circuit board,
It is tested for the property.
Embodiment 4
Conducting resinl is prepared first, and the proportion of thermoplastic conductive glue is as follows:
5 parts of polyamide thermoplastic imide resin H901-2
54,0/4 10 parts of thermoplastic polyurethane resin desmocoll
6 parts of thermoplastic acrylic resin B48N
6 parts of fumed silica H17
30 parts of dendroid silver-coated copper powder ACAX-225
3 parts of antioxidant B900
8 parts of N-methyl pyrrolidones
14 parts of dimethylbenzene
10 parts of cyclohexanone
8 parts of butanone；
Mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin is molten in stirring and dissolving slot
Solution after mixing, is put into and fumed silica is added in dispersion slot, and 3-5 is sanded by sand mill after dispersion 30-50 minutes
After, material is added in rotation-revolution blender, dendritic metal powder is added, vacuumizes after being stirred 60-90 minutes,
Antioxidant is added to be stirred for 20-30 minutes, conduction releasing is used for applying conductive glue-line.
Release layer, insulating protective layer, vacuum evaporation 100nm of the coating thickness for 2.5 μm are coated on 75 microns of PET film
Vacuum Deposition silver layer, be coated with 10 μm of conductive adhesive layer, preparation is used for the thermoplasticity electromagnetic shielding film of rapid processing.
After the simulation accelerated aging of electromagnetic shielding film high temperature and humidity 1 year, quickly it is laminated on (30 seconds) to flexible circuit board,
It is tested for the property.
Embodiment 5
Conducting resinl is prepared first, and the proportion of thermoplastic conductive glue is as follows:
10 parts of polyamide thermoplastic imide resin H901-2
54,0/4 12 parts of thermoplastic polyurethane resin desmocoll
7 parts of thermoplastic acrylic resin B48N
6 parts of fumed silica R972
22 parts of dendroid silver-coated copper powder ACAX-225
168 2 parts of antioxidant
10 parts of N-methyl pyrrolidones
16 parts of dimethylbenzene
5 parts of cyclohexanone
10 parts of butanone；
Mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin is molten in stirring and dissolving slot
Solution after mixing, is put into and fumed silica is added in dispersion slot, and 3-5 is sanded by sand mill after dispersion 30-50 minutes
After, material is added in rotation-revolution blender, dendritic metal powder is added, vacuumizes after being stirred 60-90 minutes,
Antioxidant is added to be stirred for 20-30 minutes, conduction releasing is used for applying conductive glue-line.
It is coated with release layer on 38 microns of PET film, insulating protective layer that coating thickness is 2 μm, vacuum evaporation 100nm
Vacuum Deposition silver layer, the conductive adhesive layer for being coated with 8 μm, preparation are used for the thermoplasticity electromagnetic shielding film of rapid processing.
After the simulation accelerated aging of electromagnetic shielding film high temperature and humidity 1 year, quickly it is laminated on (30 seconds) to flexible circuit board,
It is tested for the property.
Comparative example
It is influenced to compare thermoplastic conductive glue-line to the performance of electromagnetic shielding film, using the electricity of thermosetting property conductive adhesive layer
Magnetic wave screened film compares experiment.The insulating protective layer of release layer, 3 μm, 100nm are respectively coated on 50 microns of PET strip bases
Vacuum Deposition silver layer, be coated with 10 μm of thermosetting property conductive adhesive layer, be prepared into well known electromagnetic shielding film.
After the simulation accelerated aging of electromagnetic shielding film high temperature and humidity 1 year, quickly it is laminated on (30 seconds) to flexible circuit board,
It is tested for the property.
| Embodiment | Shield effectiveness | Attachment fastness | Connect resistance | It is poor to adapt to section |
| 1 | 55dB | It is qualified | 342 mΩ | Adhere at segment difference good |
| 2 | 51dB | It is qualified | 571 mΩ | Adhere at segment difference good |
| 3 | 58dB | It is qualified | 293 mΩ | Adhere at segment difference good |
| 4 | 55dB | It is qualified | 318 mΩ | Adhere at segment difference good |
| 5 | 54dB | It is qualified | 279 mΩ | Adhere at segment difference good |
| Comparative example | 53dB | It is unqualified | 5826 mΩ | Metal layer and conductive adhesive layer layering at segment difference |
In table, the test method of properties is as follows:
1. shield effectiveness: KEC method.Shield effectiveness >=45dB.
2. attachment fastness: after sample accelerated ageing (high temperature and humidity accelerated ageing simulating storage 1 year), using cross-hatching,
With 3M adhesive tape test.
3. connecting resistance: 1mm connection diameter, the test of four pin type milliohmmeters.Connect 1000 m Ω of resistance <.
4. step filled-type: electromagnetic shielding film is hot-pressed onto the flexible circuit board PI that thickness steps difference is 300 microns
On film, observes junction coverage condition and test attachment fastness.
Claims (6)
1. a kind of thermoplasticity electromagnetic shielding film for rapid processing, which is characterized in that the electromagnetic shielding film includes base
Material, release layer, insulating protective layer, metal layer and thermoplastic conductive glue-line, the thermoplastic conductive glue-line component are as follows: hydridization type heat
5-10 parts of plastic polyamide imide resin, 10-15 parts of thermoplastic hydroxy polyurethane resin, 5-10 parts of thermoplastic acrylic resin,
5-10 parts of fumed silica, 20-30 parts of conductive metal powder, 2-5 parts of antioxidant, 40-53 parts of solvent；
The hydridization type polyamide thermoplastic imide resin is the polyamideimide resin of silicon hybridization type；
The thermoplastic hydroxy polyurethane resin is hydroxyl polyurethane resin of the softening point at 60-90 DEG C；
The thermoplastic acrylic resin is molecular weight between 150000-300000, and Tg value is total in 40-60 DEG C of acrylate
Poly resin；
Preparation carries out as follows:
Thermoplastic conductive glue is prepared first, by mixed solvent, hydridization type polyamide thermoplastic imide resin, the poly- ammonia of thermoplastic hydroxy
Ester resin and thermoplastic acrylic resin dissolve after mixing in stirring and dissolving slot, put into addition gas phase dioxy in dispersion slot
SiClx is sanded 3-5 after by sand mill after dispersion 30-50 minutes, material is added in rotation-revolution blender, tree is added
Dendrite powder vacuumizes after being stirred 60-90 minutes, and antioxidant is added and is stirred for 20-30 minutes, conduction is released and is used
In applying conductive glue-line；
It is coated with release layer in PET base material, after solidification, insulating protective layer is coated in release layer surface, in insulating protective layer
Upper vacuum evaporation metal layer, then coating thermoplastic conductive adhesive layer on the metal layer obtain the thermoplasticity electromagnetism for rapid processing
Wave screened film.
2. electromagnetic shielding film according to claim 1, which is characterized in that the fumed silica is that specific surface area exists
100-200m2Fumed silica between/g；
The conductive metal powder is the dendroid silver-coated copper powder that average grain diameter is 5-10 μm；
The release layer is surface roughness at 0.3-0.6 μm, the frosted matt release layer of glossiness 15-30Gs.
3. electromagnetic shielding film according to claim 2, which is characterized in that the insulating protective layer is with a thickness of 2-3 μm；Institute
Stating metal layer is Vacuum Deposition silver layer or copper plate, with a thickness of 80-120nm.
4. electromagnetic shielding film according to claim 3, which is characterized in that the metal layer thickness is 100-110nm.
5. electromagnetic shielding film according to claim 4, which is characterized in that the thermoplastic conductive bondline thickness is 5-12
μm。
6. electromagnetic shielding film according to claim 5, which is characterized in that the thermoplastic conductive bondline thickness is 8-10
μm。
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| CN107353777A (en) * | 2017-08-16 | 2017-11-17 | 苏州城邦达力材料科技有限公司 | It is electromagnetically shielded the preparation method of membrane coat and electromagnetic shielding film |
| JP6863908B2 (en) * | 2018-01-12 | 2021-04-21 | タツタ電線株式会社 | Electromagnetic wave shield film |
| CN108274838B (en) * | 2018-02-02 | 2024-04-16 | 福州恒美光电材料有限公司 | Punching-free electromagnetic shielding film and preparation method and application thereof |
| CN108282990A (en) * | 2018-03-14 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film of base material reinforcement and preparation method thereof, application |
| CN109130383B (en) * | 2018-07-25 | 2019-09-10 | 深圳市弘海电子材料技术有限公司 | A kind of bilayer electromagnetic shielding film and preparation method thereof |
| CN109068554B (en) * | 2018-07-25 | 2020-04-07 | 深圳市弘海电子材料技术有限公司 | Reflection-type electromagnetic shielding film for FPC and preparation method thereof |
| CN110725497B (en) * | 2019-10-22 | 2021-03-26 | 江山欧派门业股份有限公司 | Carbon-plastic heating decorative plate and application thereof |
| CN113133291A (en) * | 2019-12-31 | 2021-07-16 | 广州宏庆电子有限公司 | Electromagnetic shielding covering film and preparation method thereof |
| JP6690801B1 (en) * | 2020-01-21 | 2020-04-28 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet, and electromagnetic wave shielding wiring circuit board |
| CN111154337A (en) * | 2020-01-22 | 2020-05-15 | 广东南海启明光大科技有限公司 | Normal-temperature self-drying writing type conductive ink and preparation method and application thereof |
| CN111669957B (en) * | 2020-06-15 | 2022-08-02 | 江苏百旭电子新材料科技有限公司 | FPC hot-pressing shielding film and production method thereof |
| CN112391125A (en) * | 2020-11-19 | 2021-02-23 | 铠博新材料(天津)有限公司 | Conductive adhesive film |
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| JP6240376B2 (en) * | 2012-07-13 | 2017-11-29 | タツタ電線株式会社 | Shield film and shield printed wiring board |
| JP2014112576A (en) * | 2012-11-28 | 2014-06-19 | Tatsuta Electric Wire & Cable Co Ltd | Shield film |
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