CN105081565A - System and method for material processing by shaped light beams - Google Patents
System and method for material processing by shaped light beams Download PDFInfo
- Publication number
- CN105081565A CN105081565A CN201510485493.7A CN201510485493A CN105081565A CN 105081565 A CN105081565 A CN 105081565A CN 201510485493 A CN201510485493 A CN 201510485493A CN 105081565 A CN105081565 A CN 105081565A
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- laser
- shaping
- light beam
- beams
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention is suitable for the field of laser microprocessing, and provides a system and method for material curved-surface processing by shaped light beams. The system comprises a laser device, a spatial light modulator, a beam expanding mirror, a focusing mirror, a processing piece and a moving platform. The method comprises the following steps: light-beam shaping is performed on lasers emitted by the laser device by the spatial light modulator, and diffraction beams of which the energy meets a Gaussian distribution function are changed into diffraction-free beams transmitted along a curve; after the Gaussian light beams are focused, oval punctiform light spots are formed; the light spots formed after the diffraction-free beams transmitted along the curve are in a curve shape; coaxial beam expansion is performed on the shaped light beams by the beam expanding mirror; the shaped laser beams and the expanded laser beams enter the focusing mirror and focus on the processing piece; the moving platform drives the processing piece to move according a processing feature, so that the curved-surface processing is realized. According to the method, material processing is performed through light beam shaping. When a target surface is a curved surface, the curved surface can be formed one time by curved light spots without the utilization of layer-by-layer formation of 2.5D, so that the efficiency is greatly improved.
Description
Technical field
The invention belongs to Laser Micro-Machining field, particularly relate to the system and method that a kind of shaping light beam carries out materials processing.
Background technology
In Laser Micro-Machining, in order to meet the high request to machining accuracy, a kind of mode mainly taked at present with focus lamp, hot spot is focused into several microns of sizes to process.But because focal beam spot is similar to point-like, so it is very shallow to remove the degree of depth, efficiency is low, limits use.
Along with the fast development of the consumer electronics industry, increasing parts move towards miniaturized and high-endization, get more and more to micro-machined demand; The update of consumption electronic product is also original faster simultaneously, also very high to capacity requirements.And laser is as manufacturing process advanced in modern industry, all the more the attention of industry-by-industry is subject to, realize micro-machined feasibility by laser and practicality is also more and more verified, but appointing the efficiency of right Laser Micro-Machining to appoint in many applications is so difficult to improve.
In order to provide more efficient Laser Micro-Machining, more direct efficient system is beam shaping, such as square focus spot, strip light spots, be illustrated in figure 1 in prior art the index path adopting Gauss's focused beam to carry out materials processing, but this is all in the Energy distribution of change hot spot on cross section.Want the efficiency improving some processing, must carry out shaping on the direction of propagation of light beam, this is realized by diffraction optics.The diffraction optics method adopted in the industrial production at present has multifocal, bessel beam etc., relies on the area increasing disposable processing to improve working (machining) efficiency.But these methods can not change the transmission direction of laser, and light can only linearly be propagated (bessel beam).
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of shaping light beam to carry out the system of materials processing, to solve the problem of prior art.
The embodiment of the present invention is achieved in that a kind of shaping light beam carries out the system of materials processing, and described system comprises: laser instrument 1, spatial light modulator 2, beam expanding lens 3, focus lamp 4, workpiece 5 and motion platform 6;
The laser that described laser instrument 1 sends is through described Airy lens 2, and diffracted beam energy being met gauss of distribution function changes into the Beams along curve transmission;
Shaping light beam after described shaping entered beam expanding lens 3 pairs of light beams and coaxially expanded;
Expand rear light beam and enter described focus lamp 4, focus on described workpiece 5, drive described workpiece 5 according to graphics processing campaign by described motion platform 6, realize Machining of Curved Surface.
Further, described spatial light modulator 2 course of work is: the parameter determining light beam after described shaping according to the process requirements Surface Parameters of described workpiece 5, liquid crystal molecule sensing is changed by changing the voltage be carried on the inner liquid crystal cell of spatial light modulator 2, thus change birefringence, realize the phase-modulation to incident beam, conversion incident beam wavefront, in the optical field distribution of far field reproduction demands, produces and meets light beam after the described shaping of parameter request.
Further, picosecond laser or the femto-second laser of described laser instrument 1 to be wavelength be 255-1550nm.
Further, described beam expanding lens 3 is Zooming expander, reduces the angle of divergence of beam propagation, improves the collimation of light beam, and controls the final focal beam spot size of laser, obtain desirable spot size.
A kind of shaping light beam carries out the method for materials processing, comprise: diffractive beam shaper energy being met high speed distribution function is the Beams along curve transmission, according to the parameter of light beam after the process requirements Surface Parameters determination shaping of workpiece, Machining of Curved Surface is carried out to described workpiece.
Further, utilize spatial light modulator energy to be met the diffractive beam shaper of high speed distribution function for the Beams along curve transmission, its process comprises:
Liquid crystal molecule sensing is changed by changing the voltage be carried on the inner liquid crystal cell of described spatial light modulator, thus change birefringence, realize the phase-modulation to incident beam, conversion incident beam wavefront, in the optical field distribution of far field reproduction demands, produce and meet light beam after the described shaping of parameter request.
The beneficial effect that a kind of shaping light beam that the embodiment of the present invention provides carries out the system and method for materials processing comprises:
A kind of shaping light beam that the embodiment of the present invention provides carries out the system of materials processing, meet the light (Airy function) of other functions, show in time dependent process and do not expand and the Strange properties of autoacceleration, namely from bending transmission, when target face is curved surface, by the hot spot one-shot forming bent, and can not need to utilize 2.5D processing successively shaping, substantially increase efficiency; Spatial light modulator is controlled for specific processing curve, makes flexure plane and the processing request SURFACES MATCHING of hot spot, can arbitrary surface be processed in theory; The effective depth of time processing increases greatly, and working (machining) efficiency significantly improves.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the index path adopting Gauss's focused beam to carry out materials processing in prior art;
Fig. 2 is the structural representation that a kind of shaping light beam that the embodiment of the present invention provides carries out the system of materials processing;
Fig. 3 is the index path that employing shaping light beam that the embodiment of the present invention provides carries out materials processing;
Wherein: 1 is laser instrument, 2 is spatial light modulator, and 3 is beam expanding lens, and 4 is focus lamp, and 5 is workpiece, and 6 is motion platform.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
In order to technical solutions according to the invention are described, be described below by specific embodiment.
Embodiment one
Embodiment one provided by the invention is the embodiment that a kind of shaping light beam provided by the invention carries out the system of materials processing, be illustrated in figure 1 the structural representation that a kind of shaping light beam provided by the invention carries out the embodiment of the system of materials processing, described system comprises: laser instrument 1, spatial light modulator 2, beam expanding lens 3, focus lamp 4, workpiece 5 and motion platform 6.
The laser that described laser instrument 1 sends is through described Airy lens 2, and diffracted beam energy being met gauss of distribution function changes into the Beams along curve transmission;
Shaping light beam after described shaping entered beam expanding lens 3 pairs of light beams and coaxially expanded;
Expand rear light beam and enter described focus lamp 4, focus on described workpiece 5, drive described workpiece 5 according to graphics processing campaign by described motion platform 6, realize Machining of Curved Surface;
Described spatial light modulator 2 operation principle is: the parameter determining described shaping light beam according to the process requirements Surface Parameters of described workpiece 5, liquid crystal molecule sensing is changed by changing the voltage be carried on the inner liquid crystal cell of spatial light modulator 2, thus change birefringence, realize the phase-modulation to incident beam, conversion incident beam wavefront, finally in the optical field distribution of far field reproduction demands, produce the described shaping light beam meeting parameter request.
Diffraction is the fundamental characteristics of light beam.Due to face diffraction, laser beam is in transmitting procedure, and hot spot increases gradually, and energy disperses gradually.The continuous expansion of applying in fields such as processing, communication, military affairs along with laser and in-depth, human connection more and more wishes to eliminate diffraction, and the transmission reducing laser beam dissipates.Thus, a new research field is arisen at the historic moment------Beams.Beams carries infinitely-great energy in theory, does not therefore in fact exist strictly.What we obtained in an experiment cannot keep absolute salt free ligands to propagate without light beam of looking familiar, but in certain transmission range, compares Gaussian beam, and they still have good non-diffraction beam.The Beams linearly transmitted of most representative is Bezier (Bessel) light beam, and the Beams along curve transmission of most representative is Airy (Airy) light beam of popular research recently.
The basic exercise equation describing particle and ripple under quantum mechanics is Schrodinger equation, and its one dimension form is:
Wherein i represents imaginary part, and t is the time, and Ψ is wave function, and x is the displacement of the one dimension variable point of wave function,
for reduced Planck constant, m is the quality of particle.
With Airy function: Ψ (x, 0)=Ai (Bx/h
2/3) for initial condition time, wherein B is arbitrary constant, and h is Planck's constant, and Ai is first kind Airy function, tries to achieve its strict solution to be in conjunction with Schrodinger equation:
From solution's expression, the mould square of its wave function is:
| Ψ (x, t) |
2=Ai
2(ax-bt
2); Wherein, a and b is constant.
Along with time t increases, waveform remains unchanged, but overall in accelerated motion, therefore shows salt free ligands and autoacceleration character (propagating along curve).
A kind of shaping light beam that the embodiment of the present invention provides carries out the system of materials processing, utilize the Beams (most representative for Airy beam) along curve transmission to show in time dependent process not expand and the Strange properties of autoacceleration, namely from bending transmission, when the target face of processing is curved surface, can by the hot spot one-shot forming bent, and it is successively shaping not need to utilize 2.5D to process, substantially increase efficiency; Spatial light modulator is controlled for specific processing curve, makes flexure plane and the processing request SURFACES MATCHING of hot spot, can arbitrary surface be processed in theory; The effective depth of time processing increases greatly, and working (machining) efficiency significantly improves.
Further, picosecond laser or the femto-second laser of laser instrument 1 to be wavelength be 255-1550nm.
Beam expanding lens 3 is Zooming expander, reduces the angle of divergence of beam propagation, improves the collimation of light beam, and controls the final focal beam spot size of laser within the specific limits, obtains desirable spot size, realizes the object that laser stablizes processing.
Embodiment two
Embodiment two provided by the invention is the embodiment that a kind of shaping light beam provided by the invention carries out the method for materials processing, comprise: diffractive beam shaper energy being met high speed distribution function is the Beams along curve transmission, according to the parameter of light beam after the process requirements Surface Parameters determination shaping of workpiece, Machining of Curved Surface is carried out to workpiece.
Utilize spatial light modulator energy to be met the diffractive beam shaper of high speed distribution function for the Beams along curve transmission, its process comprises:
Liquid crystal molecule sensing is changed by changing the voltage be carried on the inner liquid crystal cell of spatial light modulator, thus change birefringence, realize the phase-modulation to incident beam, conversion incident beam wavefront, in the optical field distribution of far field reproduction demands, produce and meet light beam after the described shaping of parameter request.
Utilize the Beams (most representative for Airy beam) along curve transmission to show in time dependent process not expand and the Strange properties of autoacceleration, namely from bending transmission, when the target face of processing is curved surface, can by the hot spot one-shot forming bent, and it is successively shaping not need to utilize 2.5D to process, substantially increase efficiency; Spatial light modulator is controlled for specific processing curve, makes flexure plane and the processing request SURFACES MATCHING of hot spot, can arbitrary surface be processed in theory; The effective depth of time processing increases greatly, and working (machining) efficiency significantly improves.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. carry out a system for materials processing with shaping light beam, it is characterized in that, described system comprises:
Laser instrument (1), spatial light modulator (2), beam expanding lens (3), focus lamp (4), workpiece (5) and motion platform (6);
The laser that described laser instrument (1) sends carries out shaping through described spatial light modulator (2) to light beam, and diffracted beam energy being met high speed distribution function changes into the Beams along curve transmission;
After shaping, light beam coaxially expands light beam through described beam expanding lens (3);
Described focus lamp (4) is entered by the laser beam of described beam expanding lens (3), focus on described workpiece (5), drive described workpiece (5) according to graphics processing campaign by described motion platform (6), realize Machining of Curved Surface.
2. the system as claimed in claim 1, it is characterized in that, described spatial light modulator (2) course of work is: the parameter determining light beam after described shaping according to the process requirements Surface Parameters of described workpiece (5), liquid crystal molecule sensing is changed by changing the voltage be carried on described spatial light modulator (2) inner liquid crystal cell, thus change birefringence, realize the phase-modulation to incident beam, conversion incident beam wavefront, in the optical field distribution of far field reproduction demands, produce and meet light beam after the described shaping of parameter request.
3. the system as claimed in claim 1, is characterized in that, picosecond laser or the femto-second laser of described laser instrument (1) to be wavelength be 255-1550nm.
4. the system as claimed in claim 1, is characterized in that, described beam expanding lens (2) is Zooming expander, reduces the angle of divergence of beam propagation, improves the collimation of light beam, and controls the final focal beam spot size of laser, obtain desirable spot size.
5. one kind is carried out the method for materials processing with shaping light beam, it is characterized in that, described method comprises: diffractive beam shaper energy being met high speed distribution function is the Beams along curve transmission, according to the parameter of light beam after the process requirements Surface Parameters determination shaping of workpiece, Machining of Curved Surface is carried out to described workpiece.
6. method as claimed in claim 5, it is characterized in that, utilize spatial light modulator energy to be met the diffractive beam shaper of high speed distribution function for the Beams along curve transmission, its process comprises:
Liquid crystal molecule sensing is changed by changing the voltage be carried on the inner liquid crystal cell of described spatial light modulator, thus change birefringence, realize the phase-modulation to incident beam, conversion incident beam wavefront, in the optical field distribution of far field reproduction demands, produce and meet light beam after the described shaping of parameter request.
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| CN108526696A (en) * | 2018-02-26 | 2018-09-14 | 大族激光科技产业集团股份有限公司 | A kind of method and apparatus carrying out stamp mark to silicon rod using laser |
| CN109079318A (en) * | 2018-08-22 | 2018-12-25 | 湖北工业大学 | A kind of the femtosecond laser preparation system and method for silicon photonic crystal waveguide device |
| CN111830695A (en) * | 2020-07-31 | 2020-10-27 | 北京兆维电子(集团)有限责任公司 | OLED display panel bright spot defect correction system |
| CN113219674A (en) * | 2020-01-21 | 2021-08-06 | 朗美通经营有限责任公司 | Graded-index fiber and phase element for beam shaping and transformation in fiber |
| CN113649595A (en) * | 2021-08-17 | 2021-11-16 | 广西大学 | Annular light spot optical system for metal SLM printing and printing method |
| CN114364484A (en) * | 2019-07-01 | 2022-04-15 | 康宁股份有限公司 | Method for laser machining transparent workpieces using curved quasi-non-diffractive laser beams |
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| CN109079318B (en) * | 2018-08-22 | 2020-04-24 | 湖北工业大学 | Femtosecond laser preparation system and method for silicon photonic crystal waveguide device |
| CN114364484A (en) * | 2019-07-01 | 2022-04-15 | 康宁股份有限公司 | Method for laser machining transparent workpieces using curved quasi-non-diffractive laser beams |
| CN113219674A (en) * | 2020-01-21 | 2021-08-06 | 朗美通经营有限责任公司 | Graded-index fiber and phase element for beam shaping and transformation in fiber |
| CN111830695A (en) * | 2020-07-31 | 2020-10-27 | 北京兆维电子(集团)有限责任公司 | OLED display panel bright spot defect correction system |
| CN113649595A (en) * | 2021-08-17 | 2021-11-16 | 广西大学 | Annular light spot optical system for metal SLM printing and printing method |
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Application publication date: 20151125 |