CN104992938A - A flip integrated LED light source - Google Patents
A flip integrated LED light source Download PDFInfo
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- CN104992938A CN104992938A CN201510426032.2A CN201510426032A CN104992938A CN 104992938 A CN104992938 A CN 104992938A CN 201510426032 A CN201510426032 A CN 201510426032A CN 104992938 A CN104992938 A CN 104992938A
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Abstract
The invention provides a flip integrated LED light source comprising a plurality of flip integrated LED chips. The flip integrated LED chips are first connected in parallel in groups and the groups are connected in series. Specifically, the connection mode is characterized in that the LED chips are evenly divided into a plurality of groups; the LED chips in each group are connected in parallel; the groups of the LED chips are then connected in series. In both the constant voltage driving mode and the constant current driving mode, when one LED chip is in an open circuit state, the other LED chips can maintain normal work.
Description
Technical field
The present invention relates to LED technology field, especially relate to upside-down mounting integrated LED light source.
Background technology
Existing upside-down mounting integrated LED light source comprises many upside-down mounting integrated LED chips, and LED chip adopts series, parallel or traditional series-parallel connection mode to connect.As shown in Figure 1, the upside-down mounting integrated LED light source adopting series system to connect is together in series together by all LED chips, and the LED chip then this be together in series is connected with the load end of drive circuit.As shown in Figure 2, the upside-down mounting integrated LED light source adopting parallel way to connect is that all LED chips is in parallel together, and the LED chip then this be together in parallel is connected with the load end of drive circuit.As shown in Figure 3, the upside-down mounting integrated LED light source adopting traditional series-parallel connection mode to connect divides equally for many groups by all LED chips, be connected in series between LED chip in each group, be connected in parallel between each group, the upside-down mounting integrated LED chip after parallel connection is connected with the load end of drive circuit.
In the prior art, for the upside-down mounting integrated LED light source adopting series system to connect, on the one hand, drive according to constant pressure type, then need drive circuit to export high voltage; On the other hand, when a certain LEDs chip generation open circuit, no matter adopt constant pressure type to drive, or constant current mode drives, whole upside-down mounting integrated LED light source all cannot normally work.
For the upside-down mounting integrated LED light source adopting parallel way to connect, its drive current is for flowing through each LED chip electric current sum, and in the more situation of LED chip quantity, drive current becomes excessive.
At present, the upside-down mounting integrated LED light source on market adopts traditional series-parallel connection mode to connect mostly.For the upside-down mounting integrated LED light source adopting this mode to connect, when a certain LEDs chip generation open circuit, what no matter adopt is that constant pressure type drives, or constant current mode drives, all the other LED chips in the branch road at this open circuit LED chip place all cannot normally work, and meanwhile, the electric current that should flow through this branch road is assigned to other branch roads, cause other branch currents to increase, likely cause other branch roads to damage because electric current is excessive.
Therefore, how to design a kind of upside-down mounting integrated LED light source, meet and no matter adopt constant pressure type to drive, or constant current mode drives, when a certain LEDs chip open circuit, all the other LED chips still can normally work, and being has technical problem to be solved.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of upside-down mounting integrated LED light source, meets and no matter adopts constant pressure type to drive, or constant current mode drives, and when a certain LEDs chip open circuit, all the other LED chips still can normally work.
For solving this technical problem, the technical solution used in the present invention is: a kind of upside-down mounting integrated LED light source, comprises many upside-down mounting integrated LED chips, and the connected mode of described many upside-down mounting integrated LED chips is parallel connection of first dividing into groups, rear each group of series connection; Concrete connected mode is: all LED chips are equally divided into some groups, is connected in parallel between the LED chip in each group, is connected in series between each group LED chip again.
Further, the group number of described LED chip is more than 2 groups.
Further, the quantity of the LED chip in each group is more than 4.
Further, this upside-down mounting integrated LED light source also comprises substrate, substrate connections, substrate cabling, and described substrate adopts to be made with the thermal coefficient of expansion ceramic material all closely of wafer, plastic cement and elargol; The front of described substrate is divided into crystal bonding area and frontier district, and crystal bonding area is positioned at the centre of substrate, and frontier district is then in the periphery of crystal bonding area; Described substrate cabling designs by described LED chip specification and circuit requirements, and substrate cabling is positioned at the crystal bonding area of described substrate; Described LED chip is also positioned at the crystal bonding area of described substrate, and each LED chip is connected by described substrate cabling; Described substrate connections comprises positive pole solder joint and negative pole solder joint, and positive and negative electrode solder joint is all arranged on the back side of described substrate, and is electrically connected with described substrate cabling; Described substrate is also provided with multiple substrate fixed bit, described substrate fixed bit is circular bolt holes.
Good effect of the present invention is: no matter this upside-down mounting integrated LED light source is satisfied adopts constant pressure type to drive, or constant current mode drives, and when a certain LEDs chip open circuit, all the other LED chips still can normally work.Constant pressure type no matter is adopted to drive, or cross-flow type drives, when a certain LEDs chip generation open circuit, the electric current that should flow through this open circuit LED chip is assigned on all the other LED chips, jointly shared by all the other LED chips, thus, the electric current recruitment of each LED chip is little, therefore all can normally work.
Accompanying drawing explanation
Fig. 1 is the circuit diagram of the upside-down mounting integrated LED light source adopting series system to connect in prior art.
Fig. 2 is the circuit diagram of the upside-down mounting integrated LED light source adopting parallel way to connect in prior art.
Fig. 3 is the circuit diagram of the upside-down mounting integrated LED light source adopting traditional series-parallel connection mode to connect in prior art.
Fig. 4 is the circuit diagram of embodiments of the invention one.
Fig. 5 is the circuit diagram of embodiments of the invention two.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.
Embodiment one
Embodiments of the invention one comprise substrate, substrate connections, substrate cabling and 24 flip LED chips.Substrate adopts to be made with the thermal coefficient of expansion ceramic material all closely of wafer, plastic cement and elargol, and the back side of substrate is silver-plated.The front of substrate is divided into crystal bonding area and frontier district, and crystal bonding area is positioned at the centre of substrate, and frontier district, then in the periphery of crystal bonding area, is provided with multiple wafer fixed bit in crystal bonding area, places wafer and complete eutectic, box dam, sealing program in crystal bonding area.Substrate cabling presses flip LED chips specification and circuit requirements designs, and it is positioned at the crystal bonding area of substrate, and 24 flip LED chips are also positioned at the crystal bonding area of substrate, and line up specific array by design configuration, and each flip LED chips is connected by substrate cabling.Described 24 flip LED chips comprise two pieces of measure-alike supports, conductive adhesive is scribbled at the near-end of two pieces of supports, described conductive adhesive is used for connection bracket and PN junction, PN junction is provided with sapphire, described sapphire bottom end face is connected with the end face of PN junction, and on sapphire top, end face scribbles layer of fluorescent powder.The conductive adhesive of the present embodiment is alloy tin cream, and it is Halogen and lead not, at high temperature can not produce pollutant, more environmental protection.The size of substrate is 40mm × 46mm × 0.5mm, and crystal bonding area specification is 26.4mm × 26.4mm.Substrate connections comprises positive pole solder joint and negative pole solder joint, and positive and negative electrode solder joint is all arranged on the back side of substrate, and is electrically connected with substrate cabling.Substrate is also provided with multiple substrate fixed bit, substrate fixed bit is circular bolt holes.In order to more convenient, more firmly installation base plate, the present embodiment adopts multiple circular bolt holes as substrate fixed bit.Like this by conventional set bolt, just can firmly substrate be fixed on the position of needs installation.
As shown in Figure 4, described 24 upside-down mounting integrated LED chips are equally divided into 6 groups, and each group has 4 LEDs chips, is connected in parallel between the LED chip in each group, are connected in series between 6 groups of LED chips.This 24 LEDs chips all are connected with the load end of constant voltage drive circuit as the load of constant voltage drive circuit by positive and negative electrode solder joint.
Embodiment two
Embodiments of the invention two comprise substrate, substrate connections, substrate cabling and 49 flip LED chips.Substrate is aluminium base, and the back side of substrate is silver-plated.The front of substrate is divided into crystal bonding area and frontier district, and crystal bonding area is positioned at the centre of substrate, and frontier district, then in the periphery of crystal bonding area, is provided with multiple wafer fixed bit in crystal bonding area, places wafer and complete eutectic, box dam, sealing program in crystal bonding area.Substrate cabling presses flip LED chips specification and circuit requirements designs, and it is positioned at the crystal bonding area of substrate, and 49 flip LED chips are also positioned at the crystal bonding area of substrate, and line up specific array by design configuration, and each flip LED chips is connected by substrate cabling.The size of substrate is 60mm × 51mm × 0.8mm, and crystal bonding area specification is 42.4mm × 42.4mm.Substrate connections comprises positive pole solder joint and negative pole solder joint, and positive and negative electrode solder joint is all arranged on the back side of substrate, and is electrically connected with substrate cabling.Substrate is also provided with multiple substrate fixed bit, substrate fixed bit is circular bolt holes.In order to more convenient, more firmly installation base plate, the present embodiment adopts multiple circular bolt holes as substrate fixed bit.Like this by conventional set bolt, just can firmly substrate be fixed on the position of needs installation.
As shown in Figure 5, described 49 upside-down mounting integrated LED chips are equally divided into 7 groups, and each group has 7 LEDs chips, is connected in parallel between the LED chip in each group, are connected in series between 7 groups of LED chips.This 49 LEDs chips all are connected with the load end of constant-current drive circuit as the load of constant-current drive circuit by positive and negative electrode solder joint.
Below in conjunction with embodiment, the principle producing Advantageous Effects of the present invention is described further.
As shown in Figure 4, if the electric current flowing through each LEDs chip time initial is 350mA, then when a certain LEDs chip generation open circuit, originally the electric current flowing through this open circuit LED chip will be shared jointly by all the other LED chips, cause the electric current increase about 15.2mA of remaining each LEDs chip, each LEDs chip current increase about 4%, this is still in LED chip can tolerance range, thus, remaining 23 LEDs chips all still can normally work.
As shown in Figure 5, if the electric current flowing through each LEDs chip time initial is 350mA, then when a certain LEDs chip generation open circuit, originally the electric current flowing through this open circuit LED chip will be shared jointly by all the other LED chips, cause the electric current increase about 7.3mA of remaining each LEDs chip, each LEDs chip current increase about 2%, this is still in LED chip can tolerance range, thus, remaining 48 LEDs chips all still can normally work.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, obviously, those skilled in the art can carry out various change modification to the present invention and not depart from the spirit and scope of the present invention.If belong within the scope of the claims in the present invention and equivalent technologies thereof these amendments of the present invention and modification, all belong to protection scope of the present invention.
Claims (4)
1. a upside-down mounting integrated LED light source, comprises many upside-down mounting integrated LED chips, it is characterized in that, the connected mode of described many upside-down mounting integrated LED chips is parallel connection of first dividing into groups, rear each group of series connection; Concrete connected mode is: all LED chips are equally divided into some groups, is connected in parallel between the LED chip in each group, is connected in series between each group LED chip again.
2. upside-down mounting integrated LED light source according to claim 1, is characterized in that, the group number of described LED chip is more than 2 groups.
3. upside-down mounting integrated LED light source according to claim 1 and 2, is characterized in that, the quantity of the LED chip in each group is more than 4.
4. upside-down mounting integrated LED light source according to claim 3, is characterized in that, also comprises substrate, substrate connections, substrate cabling, and described substrate adopts to be made with the thermal coefficient of expansion ceramic material all closely of wafer, plastic cement and elargol; The front of described substrate is divided into crystal bonding area and frontier district, and crystal bonding area is positioned at the centre of substrate, and frontier district is then in the periphery of crystal bonding area; Described substrate cabling designs by described LED chip specification and circuit requirements, and substrate cabling is positioned at the crystal bonding area of described substrate; Described LED chip is also positioned at the crystal bonding area of described substrate, and each LED chip is connected by described substrate cabling; Described substrate connections comprises positive pole solder joint and negative pole solder joint, and positive and negative electrode solder joint is all arranged on the back side of described substrate, and is electrically connected with described substrate cabling; Described substrate is also provided with multiple substrate fixed bit, described substrate fixed bit is circular bolt holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510426032.2A CN104992938A (en) | 2015-07-20 | 2015-07-20 | A flip integrated LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510426032.2A CN104992938A (en) | 2015-07-20 | 2015-07-20 | A flip integrated LED light source |
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| CN104992938A true CN104992938A (en) | 2015-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510426032.2A Pending CN104992938A (en) | 2015-07-20 | 2015-07-20 | A flip integrated LED light source |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113448074A (en) * | 2020-03-25 | 2021-09-28 | 北京威斯顿亚太光电仪器有限公司 | Illumination light source of disposable hard tube mirror |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1901189A (en) * | 2006-06-30 | 2007-01-24 | 广州南科集成电子有限公司 | Plane flip-chip LED integrated chip and producing method |
| CN101093849A (en) * | 2002-08-29 | 2007-12-26 | 首尔半导体股份有限公司 | Light emitting device having multiple light emitting elements |
| CN203836687U (en) * | 2014-04-30 | 2014-09-17 | 浙江亿米光电科技有限公司 | Inverted LED integrated substrate |
| WO2015093180A1 (en) * | 2013-12-19 | 2015-06-25 | 株式会社タムラ製作所 | Light-emitting device |
| CN204966491U (en) * | 2015-07-20 | 2016-01-13 | 深圳市君和光电子有限公司 | Integrated LED light source of flip -chip |
-
2015
- 2015-07-20 CN CN201510426032.2A patent/CN104992938A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093849A (en) * | 2002-08-29 | 2007-12-26 | 首尔半导体股份有限公司 | Light emitting device having multiple light emitting elements |
| CN1901189A (en) * | 2006-06-30 | 2007-01-24 | 广州南科集成电子有限公司 | Plane flip-chip LED integrated chip and producing method |
| WO2015093180A1 (en) * | 2013-12-19 | 2015-06-25 | 株式会社タムラ製作所 | Light-emitting device |
| CN203836687U (en) * | 2014-04-30 | 2014-09-17 | 浙江亿米光电科技有限公司 | Inverted LED integrated substrate |
| CN204966491U (en) * | 2015-07-20 | 2016-01-13 | 深圳市君和光电子有限公司 | Integrated LED light source of flip -chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113448074A (en) * | 2020-03-25 | 2021-09-28 | 北京威斯顿亚太光电仪器有限公司 | Illumination light source of disposable hard tube mirror |
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