CN104899637B - A kind of production technology of intelligent electronic label - Google Patents
A kind of production technology of intelligent electronic label Download PDFInfo
- Publication number
- CN104899637B CN104899637B CN201510318916.6A CN201510318916A CN104899637B CN 104899637 B CN104899637 B CN 104899637B CN 201510318916 A CN201510318916 A CN 201510318916A CN 104899637 B CN104899637 B CN 104899637B
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- Prior art keywords
- storage chip
- electronic label
- intelligent electronic
- audio connector
- leg
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Abstract
A kind of production technology of intelligent electronic label, comprises the following steps：1) metal sleeve with leg is made, metal sleeve is respectively fitted over to the welding position of audio Connector, and compressed by machine, 2) by steel mesh to monoblock circuit scrubbing brush tin cream, 3) storage chip is pasted on the circuit board for brushed tin cream, 4) circuit board for having pasted storage chip is welded by Refolw, 5) leg of audio Connector is inserted into the welding hole of circuit board, 6) the above-mentioned circuit board with storage chip and audio Connector is completed intelligent electronic label and made by automatic tin welding machine.Intelligent electronic label of the invention using this process program is cheap, contact reliability is high, service life length.
Description
【Technical field】
The present invention relates to electronic tag field, more particularly to a kind of production technology of intelligent electronic label.
【Background technology】
Intelligent ODN industries continued to develop under the common promotion of national standardization association and three big operators in recent years,
The relevant criterion of the industry is also constantly ripe and perfect.But the technical scheme that intelligent ODN products use at present mainly has
Using Maxim monobus storage chip and RFID storage chip two schemes.The scheme of monobus is because be that exclusive patent is deposited
Chip cost is stored up more than 3.5 yuan, it is relatively high, and be also difficult to reduce cost on long terms.RFID storage chip technical sides
The cost of case read write line is also higher, and reliability is poor.It is difficult to promote so causing whole intelligent ODN industries, industry
Standard and the standard of three big operators also slowly can not be issued formally.
There was only the 10% of Maxim monobus storage chips using the EEPROM storage chip costs of I2C agreements.And producer
It is numerous, it is widely used, is a kind of ripe storage chip but problem is that the storage chip needs at least four to contact pin, reliably
Property than only need 2 contact pins monobus Maxim storage chips it is less better, with the storage chip produce electronic chip work
Skill is complicated, and cost is higher, is unfavorable for popularization and application.
【The content of the invention】
Present invention seek to address that above mentioned problem and the production of intelligent electronic label a kind of simple in construction, cheap is provided
Technique.
To achieve the above object, the invention provides a kind of production technology of intelligent electronic label, it comprises the following steps：
A, audio connector is made：
1) spacing plastic cement is not stayed with 4 section audio Connectors, the welding position of the audio Connector afterbody,
2) three metal sleeves with leg are made,
3) three metal sleeves with leg are respectively fitted over to the welding position of the audio Connector, and pass through machine pressure
Tightly,
B, PCBA is made：
1) in one group of pad, three leg jacks and the PCB sides weldering for welding storage chip of PCB frontal designs
Disk,
2) storage chip is attached on PCB on the pad of storage chip by STM paster techniques,
3) PBCA for having pasted storage chip completes to weld by Refolw,
C, intelligent electronic label is made：
1) PBCA for posting storage chip is installed on the audio connector with leg by automation process,
2) welding and PCB sides pad and the audio of three legs and three leg jacks are completed by automatic tin welding machine
Welding between Section four of joint, complete intelligent electronic label and make.
A kind of production technology of intelligent electronic label, is characterised by, comprises the following steps：
A, PCBA is made：
1) in one group of pad for being used to weld EEPROM storage chips of PCB frontal designs, 4 pads are designed in PBC reverse side,
2) storage chip is attached on PCB on the pad of storage chip by STM paster techniques,
3) PBCA for having pasted storage chip completes to weld by Refolw,
B, intelligent electronic label is made：
1) audio Connectors are saved from 4,
2) manually the PCBA for posting storage chip most one, edge pads are directly welded with audio connector first segment,
3) manually other three section of the other three pad on PCBA respectively with audio connector is welded by wire
Connection, complete intelligent electronic label and make.
The storage chip is the EEPROM storage chips using I2C agreements.
The audio Connector is 2.5mm audio Connector.
Compared with prior art, its advantage is a kind of production technology of intelligent electronic label of the present invention：
1st, it is cheap using the intelligent electronic label of this technique.It is low using the EEPROM storage chip prices of I2C agreements
Honest and clean, average at 0.25 yuan or so, audio connector is cheap, and price is advantageous to the popularization and application in market at 0.35 yuan or so.
2nd, it is high using the intelligent electronic label contact reliability of this technique, usage time length.
【Brief description of the drawings】
Fig. 1 is the stereogram of the product audio Connector of the embodiment of the present invention 1.
Fig. 2 is that the product of the embodiment of the present invention 1 completes the stereogram after welding.
Fig. 3 is that the product of the embodiment of the present invention 2 completes the stereogram after welding.
【Embodiment】
The following example is further explanation of the present invention, and the present invention is not limited in any way.
Embodiment 1
As shown in figure 1, a kind of intelligent electronic label of the present invention includes circuit board 11, storage chip 12 and audio Connector
13.Circuit board 11 is a miniature multi-layer PCB board, and the pcb board size is more bigger than storage chip 12, and the front of circuit board 11 is provided with
8 pads corresponding with storage chip, 3 welding holes, a rectangular pads are provided with simultaneously in the edge of circuit board 11.This hair
Bright storage chip 12 is using by EEPROM storage chip of producer's customization with 4 pad I2C agreements, storage chip encapsulation
Form can be any one of DFN8, TSSOP8, SOT23-5 chip.
As shown in figure 1, audio Connector of the audio Connector 13 using 4 section 2.5mm of customization, audio Connector afterbody
Welding position does not stay spacing plastic cement, and welding position is cylinder, and it is respectively first, second, third and the from fine to coarse
Four sections.The technical specification of audio Connector 13 should meet《YD/T 1885-2009 GSM CDMA wired earphone interface technologies
It is required that and method of testing》Requirement.2.5mm audio connectors are that have 4 contact pins, with being deposited using the EEPROM of I2C agreements
Storage chip is applied in intelligent ODN products together can solve the problems, such as the problem of contact reliability and cost.
The production technology of the intelligent electronic label of the present embodiment, comprises the following steps：
A, audio connector is made：
1) three metal sleeves with leg 131 are made, ensure metal sleeve on the same axis, leg and metal sleeve
Axis is vertical, and three metal sleeve diameters are corresponding with three welding positions of audio Connector, three metal sleeve height phases
Together, metal sleeve includes an annulus and the cuboid column being fixedly connected with the annulus, circle diameter and audio Connector
Welding position it is corresponding, cuboid column is metal sleeve leg.
2) metal sleeve of the major diameter with leg is enclosed on Section of three welding position of audio Connector, and passes through machine pressure
Tightly.
3) metal sleeve of the middle diameter with leg is enclosed on the second section welding position of audio Connector, and passes through machine pressure
Tightly.
4) metal sleeve of the minor diameter with leg is enclosed on the first segment welding position of audio Connector, and passes through machine pressure
Tightly.
B, PCBA is made：
1) in one group of pad, three leg jacks and the PCB sides weldering for welding storage chip of PCB frontal designs
Disk 111,
2) lead-free tin cream is stirred, the tin cream being stirred with scraper on steel mesh with coating, starts screen printer
To monoblock circuit scrubbing brush tin cream, whether the tin cream on visual inspection circuit board meets specification, does not meet such as, should be adjusted,
3) circuit board for having brushed tin cream is placed in SMT machines, storage chip 12 is pasted on circuit boards, guarantee is not pasted
Piece defect,
4) circuit board for having pasted storage chip 12 is welded by Refolw, and visual inspection after welding, the leg of defect should
Reprocess by hand,
C, intelligent electronic label is made：
1) leg 131 of audio Connector 13 is inserted into 3 welding holes of circuit board by automation process, makes leg
131 stretch out circuit board 0.8-1.5mm, ensure 132 phases of Section 4 of welding position of the pad 111 and audio connector of PCBA lateral edges
Contact,
2) welding and the PCB sides pad 111 of three legs 131 and three leg jacks are completed by automatic tin welding machine
With the welding between Section 4 132 of audio connector welding position, complete intelligent electronic label and make.
Embodiment 2
The present embodiment 2 is circuit board 11 and the structure of audio Connector 13 with the difference of embodiment 1.In the present embodiment, it is electric
Road plate 11 is not the structure using welding hole, but 4 pads are provided with circuit board 11, and audio Connector 13 uses common
4 section 2.5mm audio Connector, welding position is cylinder, and it is respectively first, second, third and Section four from fine to coarse.
It is to be welded to connect by 3 wires 111 between circuit board 11 and audio Connector 13, i.e., A, L, D pad are respectively by leading
Second, third and Section four of the welding position of line and audio Connector 13 weld.1 pad of outermost edge on circuit board 11
Welded with the welding position first segment of audio Connector 13.
The production technology of the intelligent electronic label of the present embodiment, comprises the following steps：
A, PCBA is made：
1) in one group of pad for being used to weld EEPROM storage chips of PCB frontal designs, 4 pads are designed in PBC reverse side,
Wherein three are A, L, D pad and a PCB edge pad,
2) lead-free tin cream is stirred, the tin cream being stirred with scraper on steel mesh with coating, starts screen printer
To monoblock circuit scrubbing brush tin cream, whether the tin cream on visual inspection circuit board meets specification, does not meet such as, should be adjusted,
3) circuit board for having brushed tin cream is placed in SMT machines, storage chip 12 is pasted on circuit boards, guarantee is not pasted
Piece defect,
4) circuit board for having pasted storage chip 12 is welded by Refolw, and visual inspection after welding, the leg of defect should
Reprocess by hand,
B, intelligent electronic label is made：
1) 4 section 2.5mm audio Connectors are selected,
2) it is manually that PCBA most one, the edge pads and audio connector welding position first segment that post storage chip is direct
Welding,
3) manually by wire other A, L, D pad on the PCBA welding position second with audio connector, respectively
Section three and the 4th, be welded to connect, and is completed intelligent electronic label and is made.
Although being disclosed by above example to the present invention, protection scope of the present invention is not limited thereto,
Under conditions of without departing from present inventive concept, each component is done to more than deformation, replacements etc. will fall into right of the invention
In claimed range.
Claims (4)
1. a kind of production technology of intelligent electronic label, it is characterised in that comprise the following steps：
A, audio connector is made：
1) spacing plastic cement is not stayed from 4 section audio Connectors, the welding position of the audio Connector afterbody,
2) three metal sleeves with leg are made, ensure metal sleeve on the same axis, leg hangs down with metal sleeve axis
Directly, three metal sleeves are highly identical, and metal sleeve includes an annulus and the cuboid column being fixedly connected with the annulus,
Cuboid column is metal sleeve leg,
3) three metal sleeves with leg are respectively fitted over to the welding position of the audio Connector, and compressed by machine,
B, PCBA is made：
1) it is used for the pad, three leg jacks and a PCB sides pad for welding storage chip in one group of PCB frontal designs,
2) storage chip is attached on PCB on the pad of storage chip by STM paster techniques,
3) PBCA for having pasted storage chip completes to weld by Refolw,
C, intelligent electronic label is made：
1) PBCA for posting storage chip is installed on the audio connector with leg by automation process,
2) welding of three legs and three leg jacks is completed by automatic tin welding machine and PCB lateral edges pad connects with audio
Welding between first Section four, complete intelligent electronic label and make.
2. a kind of production technology of intelligent electronic label, it is characterised in that comprise the following steps：
A, PCBA is made：
1) in one group of pad for being used to weld EEPROM storage chips of PCB frontal designs, 4 pads are designed in PCB reverse side, wherein
Three are A, L, D pad and a PCB most edge pads,
2) storage chip is attached on PCB on the pad of storage chip by STM paster techniques,
3) PBCA for having pasted storage chip completes to weld by Refolw,
B, intelligent electronic label is made：
1) audio Connectors are saved from 4,
2) manually the PCBA for posting storage chip most one, edge pads are directly welded with audio connector first segment,
3) manually other three section of the other three pad on PCBA respectively with audio connector is welded to connect by wire,
Intelligent electronic label is completed to make.
3. the production technology of intelligent electronic label as claimed in claim 1 or 2, it is characterised in that the storage chip is use
The EEPROM storage chips of I2C agreements.
4. the production technology of intelligent electronic label as claimed in claim 1 or 2, it is characterised in that the audio Connector is
2.5mm audio Connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510318916.6A CN104899637B (en) | 2015-06-11 | 2015-06-11 | A kind of production technology of intelligent electronic label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510318916.6A CN104899637B (en) | 2015-06-11 | 2015-06-11 | A kind of production technology of intelligent electronic label |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104899637A CN104899637A (en) | 2015-09-09 |
| CN104899637B true CN104899637B (en) | 2018-04-03 |
Family
ID=54032291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510318916.6A Active CN104899637B (en) | 2015-06-11 | 2015-06-11 | A kind of production technology of intelligent electronic label |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107301447A (en) * | 2017-06-09 | 2017-10-27 | 深圳市科信通信技术股份有限公司 | Intelligent electronic label, programmed algorithm and the management system of compatible two kinds of different chips |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045125A (en) * | 2009-10-26 | 2011-05-04 | 华为技术有限公司 | Optical splitter as well as optical splitter port identification method and device |
| CN102142411A (en) * | 2010-02-01 | 2011-08-03 | 华为终端有限公司 | Chip packaging component of printed circuit board assembly (PCBA) and welding component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2463809A1 (en) * | 2010-12-07 | 2012-06-13 | NagraID S.A. | Electronic card with electric contact including an electronic unit and/or an antenna |
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2015
- 2015-06-11 CN CN201510318916.6A patent/CN104899637B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045125A (en) * | 2009-10-26 | 2011-05-04 | 华为技术有限公司 | Optical splitter as well as optical splitter port identification method and device |
| CN102142411A (en) * | 2010-02-01 | 2011-08-03 | 华为终端有限公司 | Chip packaging component of printed circuit board assembly (PCBA) and welding component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104899637A (en) | 2015-09-09 |
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