CN104299937B - A kind of fixing device applied to silicon corrosion - Google Patents

A kind of fixing device applied to silicon corrosion Download PDF

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Publication number
CN104299937B
CN104299937B CN201310295832.6A CN201310295832A CN104299937B CN 104299937 B CN104299937 B CN 104299937B CN 201310295832 A CN201310295832 A CN 201310295832A CN 104299937 B CN104299937 B CN 104299937B
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intermediate plate
connection sheet
horse
silicon chip
clamping close
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CN104299937A (en
Inventor
张忠华
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Shenzhen Founder Microelectronics Co Ltd
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Peking University Founder Group Co Ltd
Shenzhen Founder Microelectronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Weting (AREA)

Abstract

The invention discloses a kind of fixing device applied to silicon corrosion, the fixing device includes the first horse and the second horse and the attachment means for connecting first horse and second horse, the first clamping close device is connected with the inside of first horse, the second clamping close device is connected with the inside of second horse, the lower end of first clamping close device has the first female parts, the lower end of second clamping close device has the second female parts, when silicon chip is fastened in first clamping close device and second clamping close device, silicon chip described in the holding space for holding being made up of first female parts and second female parts, to reduce the contact area of the silicon chip and first clamping close device and second clamping close device.

Description

A kind of fixing device applied to silicon corrosion
Technical field
The present invention relates to field of computer technology, more particularly to a kind of fixing device applied to silicon corrosion.
Background technology
With the development of semiconductor technology, existing multiple semiconductor product is due to the radiating of chip, the requirement of encapsulation volume Technique for thinning back side will be carried out, thickness there are 100~400 microns by customer requirement after being thinned.Existing technique for thinning back side It is general that machine is thinned silicon chip to be thinned using abrasive wheel, in this way, causing silicon chip surface to remain substantial amounts of silicon bits, Er Qiecun In serious loss layer so that the silicon chip can have more serious warpage and internal stress because of damaging layer, at this moment just need to use Silicon etching process, repair crystal column surface by silicon corrosion while play the purpose for eliminating internal stress and reducing warpage.
When using silicon etching process corrosion of silicon, carry out device silicon chip generally by common Teflon horse, so that The silicon chip carries out surface clean and corrosion.
But present inventor has found above-mentioned technology extremely during inventive technique scheme in realizing the embodiment of the present application Following technical problem less be present:
Due in the prior art when silicon chip housed by common this accommodating device of Teflon horse, it is rotten carrying out silicon During etching technique, the internal layer intermediate plate and silicon slice corrosion face contact area of Teflon horse are larger so that the silicon chip and the internal layer The technical problem that the contact portion of intermediate plate can not be completely impregnated with and can not be corroded by acid solution so that the silicon chip integral thickness is uneven It is even, at the same the silicon chip erosional surface can remain the horse intraformational bed horse print, cause the second-rate of the silicon chip, The problem of qualification rate is low.
The content of the invention
The embodiment of the present application is by providing a kind of fixing device corroded applied to silicon, for solving entering in the prior art During row silicon etching process, silicon chip and accommodating device contact area are larger, and the contact portion of the silicon chip and the accommodating device is not The technical problem that can be completely impregnated with and can not be corroded by acid solution, and the silicon chip brought therefrom are second-rate, and qualification rate is low Problem.
The embodiment of the present application provides a kind of fixing device applied to silicon corrosion, and the fixing device includes the first horse It is solid on the inside of first horse with the second horse and for connecting the attachment means of first horse and second horse The first clamping close device is connected to, the second clamping close device, the lower end tool of first clamping close device are connected with the inside of second horse There are the first female parts, the lower end of second clamping close device has the second female parts, and first card is fastened in silicon chip Attach together when putting with second clamping close device, be made up of first female parts and second female parts accommodating Space houses the silicon chip, to reduce the silicon chip and first clamping close device and the contact surface of second clamping close device Product.
Optionally, first female parts are first contacted by obtaining the silicon chip with first clamping close device Parameter, determined based on first parameter.
Optionally, second female parts are second contacted by obtaining the silicon chip with second clamping close device Parameter, determined based on second parameter.
Optionally, first clamping close device comprises at least first intermediate plate and second intermediate plate, and the first intermediate plate includes the A connecting piece, first connection sheet are fixed in the top of first horse, first connection sheet and first horse The first foundation form the first breach, the second intermediate plate includes the second connection sheet, and second connection sheet is fixed in described the The top of one horse, second connection sheet and the first foundation of first horse form the second breach, pass through described first Breach and second breach form first female parts.
Optionally, second clamping close device comprises at least the 3rd intermediate plate and the 4th intermediate plate, and the 3rd intermediate plate includes the Three connection sheets, the 3rd connection sheet are fixed in the top of second horse, the 3rd connection sheet and second horse The second foundation form the 3rd breach, the 4th intermediate plate includes the 4th connection sheet, and the 4th connection sheet is fixed in institute The top of the second horse is stated, the 4th connection sheet and the second foundation of second horse form the 4th breach, by described 3rd breach and the 4th breach form second female parts.
Optionally, the first intermediate plate also includes the 5th connection sheet, and the 5th connection sheet is fixed in first horse Lower end and mutually corresponding with first connection sheet, first connection sheet have the 5th breach, institute with the 5th connection sheet Stating second intermediate plate also includes the 6th connection sheet, and the 6th connection sheet is fixed in the lower end of first horse and with described second Connection sheet is mutually corresponding, and second connection sheet and the 6th connection sheet have the 6th breach, the 5th breach with it is described 6th breach is mutually corresponding, and first female parts are formed by the 5th breach and the 6th breach.
Optionally, the 3rd intermediate plate also includes the 7th connection sheet, and the 7th connection sheet is fixed in second horse Lower end and mutually corresponding with the 3rd connection sheet, the 3rd connection sheet has the 7th breach with the 7th connection sheet, 4th intermediate plate also includes the 8th connection sheet, and the 8th connection sheet is fixed in the lower end of second horse and with described Four connection sheets are mutually corresponding, and the 8th connection sheet has the 8th breach, the 7th breach and institute with the 4th connection sheet It is mutually corresponding to state the 8th breach, second female parts are formed by the 7th breach and the 8th breach.
Optionally, the first support meanss are connected with the outside of first horse, second is connected with the outside of second horse Support meanss, so that the fixing device keeps stable when carrying out silicon slice corrosion.
Optionally, first support meanss comprise at least the 5th intermediate plate and the 6th intermediate plate, the 5th intermediate plate and described 6th intermediate plate is affixed with the intermediate plate at least first intermediate plate and second intermediate plate respectively, and the 5th intermediate plate and described the The first spacing between six intermediate plates is more than the second spacing between the first intermediate plate and the second intermediate plate.
Optionally, the first support device comprises at least the 7th intermediate plate and the 8th intermediate plate, the 7th intermediate plate and described 8th intermediate plate is affixed with the intermediate plate at least the 3rd intermediate plate and the 4th intermediate plate respectively, and the 7th intermediate plate and described the The 3rd spacing between eight intermediate plates is more than the 4th spacing between the 3rd intermediate plate and the 4th intermediate plate.
Optionally, first foundation has the first inclination angle with horizontal plane, and second foundation has second with horizontal plane Inclination angle, first inclination angle and second inclination angle are mutually corresponding, so that the fixing device tilts to side.
The one or more technical schemes provided in the embodiment of the present application, have at least the following technical effects or advantages:
One, the first clamping close device is connected with the inside of first horse due to the embodiment of the present application, described second The second clamping close device is connected with the inside of horse, the lower end of first clamping close device has the first female parts, second card Attaching together the lower end put has the second female parts, is fastened in silicon chip in first clamping close device and second clamping close device When, silicon chip described in the holding space for holding that is made up of first female parts and second female parts, so so that When the silicon chip is placed in the fixing device, the silicon chip is to be contained in close to the part of fixing device lower end both sides In the holding space for holding be made up of first female parts and second female parts, so as to solve in the prior art When carrying out silicon etching process, silicon chip and accommodating device contact area are larger, the contact site of the silicon chip and the accommodating device The technical problem that point can not be completely impregnated with and can not be corroded by acid solution, realize and reduce connecing for the silicon chip and the fixing device Contacting surface is accumulated so that the silicon chip can be corroded completely by acid solution, it is possible to increase the quality and qualification rate of the silicon chip.
Secondly, be fixed in described due to the first intermediate plate in first clamping close device of the embodiment of the present application and second intermediate plate The top of one horse so that the first intermediate plate and the second intermediate plate and the first foundation of first horse constitute first Female parts, the 3rd intermediate plate and the 4th intermediate plate in the second clamping close device are fixed in the top of second horse so that described Second foundation of the 3rd intermediate plate and the 4th intermediate plate and second horse constitutes the second female parts, in the silicon chip card When closing in first clamping close device and second clamping close device, the silicon chip and the fixed dress can be further reduced The contact area put, further such that the silicon chip can be corroded completely by acid solution, improve the quality and qualification rate of the silicon chip.
Thirdly, due to being connected with the first support meanss on the outside of the first horse described in the embodiment of the present application, and described The second support meanss are connected with the outside of second horse, first support meanss comprise at least the 5th intermediate plate and the 6th intermediate plate, institute State the first spacing between the 5th intermediate plate and the 6th intermediate plate is more than between the first intermediate plate and the second intermediate plate the Two spacing, the second support device comprise at least the 7th intermediate plate and the 8th intermediate plate, and the 7th intermediate plate and the described 8th folder The 3rd spacing between piece is more than the 4th spacing between the 3rd intermediate plate and the 4th intermediate plate, so so that carrying out During silicon slice corrosion, acid solution mobility between the silicon chip is effectively improved, causes the silicon slice corrosion uniform, improves the matter of the silicon chip Amount and qualification rate.
Four, because the first foundation described in the embodiment of the present application and horizontal plane have the first inclination angle, second foundation There is the second inclination angle with horizontal plane, first inclination angle and second inclination angle are mutually corresponding, so that the fixing device is to one Roll it is oblique, in this way, when carrying out silicon slice corrosion, when the silicon slice corrosion being faced into the opposite side of inclined side putting, such as institute When stating fixing device and tilting to the right, the silicon slice corrosion is facing to left side so that the silicon chip Action of Gravity Field to it is described Fixing device incline direction is consistent so that the silicon slice corrosion face and the fixing device incomplete contact between, further reduces institute The contact area of silicon chip and the fixing device is stated, further such that the silicon chip can be corroded completely by acid solution, described in raising The quality and qualification rate of silicon chip.
Brief description of the drawings
Fig. 1 is the structure chart for the fixing device for being applied to silicon corrosion in the embodiment of the present application;
Fig. 2 is the amplification assumption diagram of the first horse in Fig. 1;
Fig. 3 is the amplification assumption diagram of the second horse in Fig. 1;
Fig. 4 is the amplification assumption diagram of the first clamping close device in Fig. 2;
Fig. 5 is the amplification assumption diagram of the second clamping close device in Fig. 3;
Fig. 6 is that silicon chip is put into structure chart in the first clamping close device and the second clamping close device;
Fig. 7 is the structure chart that the first clamping close device is not provided with the first female parts;
Fig. 8 is the structure chart that the second clamping close device is not provided with the second female parts;
Fig. 9 is the structure chart for implementing the first clamping close device in two;
Figure 10 is the structure chart of the second clamping close device in embodiment two;
Figure 11 is the structure chart of the first support meanss in embodiment three;
Figure 12 is the structure chart of the second support meanss in embodiment three;
Figure 13 is the structure chart of the first horse in example IV;
Figure 14 is the structure chart of the second horse in example IV;
Figure 15 is the structure chart of the first support meanss in Figure 13;
Figure 16 is the structure chart of the second support meanss in Figure 14;
Figure 17 is the structure chart of the first horse in embodiment five;
Figure 18 is the structure chart of the second horse in embodiment five.
Embodiment
The embodiment of the present application is by providing a kind of fixing device corroded applied to silicon, for solving entering in the prior art During row silicon etching process, silicon chip and accommodating device contact area are larger, and the contact portion of the silicon chip and the accommodating device is not The technical problem that can be completely impregnated with and can not be corroded by acid solution, and the silicon chip brought therefrom are second-rate, and qualification rate is low Problem.
The technical scheme of the embodiment of the present application is in order to solve the above technical problems, general thought is as follows:
The first clamping close device is connected with the inside of first horse, the second engaging is connected with the inside of second horse Device, the lower end of first clamping close device have the first female parts, and the lower end of second clamping close device has in second Recess point, when silicon chip is fastened in first clamping close device and second clamping close device, passes through first inner fovea part Divide silicon chip described in the holding space for holding formed with second female parts, so so that the silicon chip is placed on described solid When determining in device, the silicon chip close to the part of fixing device lower end both sides be contained in by first female parts and In the holding space for holding of the second female parts composition, so as to solve in the prior art when carrying out silicon etching process, Silicon chip and accommodating device contact area are larger, and the contact portion of the silicon chip and the accommodating device can not be impregnated with completely by acid solution And the technical problem that can not corrode, realize and reduce the silicon chip and the contact area of the fixing device so that the silicon chip It can be corroded completely by acid solution, it is possible to increase the quality and qualification rate of the silicon chip.
In order to be better understood from above-mentioned technical proposal, below in conjunction with Figure of description and specific embodiment to upper Technical scheme is stated to be described in detail.
Embodiment one
Referring to Fig. 1, the embodiment of the present application provides a kind of fixing device applied to silicon corrosion, and fixing device 10 includes the One horse 20 and the second horse 30 and the attachment means for connecting the first horse 20 and the second horse 30, the attachment means Including the first connector 40 and the second connector 41.
Wherein, the inner side of the first horse 20 is connected with the first clamping close device 50, and the inner side of the second horse 30 is connected with the second engaging Device 60, the lower end of the first clamping close device 50 have the first female parts 51, and the lower end of the second clamping close device 60 has in second Recess point 61.
Referring to Fig. 2, the first horse 20 includes the first framework 21 and is fixed on the first foundation 22 of the lower end of the first framework 21 With the first upper prop 23 for being fixed on the top of the first framework 21, the middle part of the first framework 21 is connected with first crossbeam 24, and first The inner side of horse 20 is connected with the first clamping close device 50, and the first clamping close device 50 includes first intermediate plate 52 and the grade of second intermediate plate 53 is pressed from both sides Piece.Wherein, the length of the first foundation 22 and the length of the first upper prop 23 can be arranged to identical length, can also be arranged to not Same length.
Referring to Fig. 3, the second horse 30 includes the second framework 31 and is fixed on the second foundation 32 of the lower end of the second framework 31 With the second upper prop 33 for being fixed on the top of the second framework 31, the middle part of the second framework 31 is connected with second cross beam 34, and second The inner side of horse 30 is connected with the second clamping close device 60, and the second clamping close device 60 includes the 3rd intermediate plate 62 and the grade of the 4th intermediate plate 63 is pressed from both sides Piece.Wherein, the length of the second foundation 32 and the length of the second upper prop 33 can be arranged to identical length, can also be arranged to not Same length.
Wherein, the length of the first foundation 22 is identical with the length of the second foundation 32, in the length and second of the first upper prop 23 The length of post 33 is identical, and connects the first framework 21 and the second framework respectively by the first connector 40 and the second connector 41 31, so that fixing device 10 forms a prismatoid structure.The first opening being made up of the first upper prop 23 and the second upper prop 33, The second opening being made up of the first foundation 22 and the second foundation 32, wherein, the area of first opening is more than described second The area of opening, and silicon chip is put into fixing device 10 by the described first opening, so as to facilitate the silicon chip to be put into fixation In device 10, and the silicon chip is stopped by the first foundation 22 and the second foundation 32, so that the silicon chip is fixed on fixed dress Put in 10.Wherein, the distance between the first foundation 22 and the second foundation 32 are determined according to the size of silicon chip, to cause first The foundation 32 of foundation 22 and second can stop the silicon chip.
First clamping close device 50 includes N number of intermediate plate, wherein, the N is the integer not less than 2, i.e. the first clamping close device is extremely Include first intermediate plate and second intermediate plate less.First intermediate plate 52 and second intermediate plate 53 are only included with the first clamping close device 50 in Fig. 2 Exemplified by, referring to Fig. 4, first intermediate plate 52 includes the first connection sheet 54, and the first connection sheet 54 is fixed in the top of the first horse 20, the The foundation 22 of a connecting piece 54 and first forms the first breach 55;Second intermediate plate 53 includes the second connection sheet 56, the second connection sheet 56 The top of the first horse 20 is fixed in, the second connection sheet 56 and the first foundation 22 form the second breach 57, pass through the first breach 55 The first female parts 51 are formed with the second breach 57, an interlayer are formed by first intermediate plate 52 and second intermediate plate 53, so that institute Silicon chip is stated to be fastened in the first clamping close device 50, wherein, the distance between first intermediate plate 52 and second intermediate plate 53 are according to the silicon The thickness of piece determines that if the thickness than silicon chip is 100 microns, the distance between first intermediate plate 52 and second intermediate plate 53 can Between thinking 200 microns to 1 centimetre so that the silicon chip be fixed on it is more stable in the interlayer.Similarly, in the first clamping close device 50 when being connected with the intermediate plate of more than 2, and the structure of each intermediate plate is pressed from both sides with first intermediate plate 52 and second in the intermediate plate of described more than 2 The structure of piece 53 is identical, and the distance between two neighboring intermediate plate is also identical.
Wherein, the middle part of the first framework 21 is connected with first crossbeam 24, the first connection sheet 54 respectively with the first upper prop 23 and first crossbeam 24 it is affixed, to promote the first connection sheet 54 can be more firm;Second connection sheet 56 respectively with the first upper prop 23 It is affixed with first crossbeam 24, with promote the second connection sheet 56 more firmly, promote the silicon chip it is more stable be fastened on the first cartridge In device 50.
Second clamping close device 60 includes M intermediate plate, wherein, the M is the integer not less than 2, i.e. the second clamping close device is extremely Include the 3rd intermediate plate and the 4th intermediate plate less.3rd intermediate plate 62 and the 4th intermediate plate 63 are only included with the second clamping close device 60 in Fig. 3 Exemplified by, referring to Fig. 5, the second clamping close device 60 includes the 3rd intermediate plate 62 and the 4th intermediate plate 63, and the 3rd intermediate plate 62 includes the 3rd connection Piece 64, the 3rd connection sheet 64 are fixed in the top of the second horse 30, and the 3rd connection sheet 64 and the second foundation 32 form the 3rd breach 65, the 4th intermediate plate 63 includes the 4th connection sheet 66, and the 4th connection sheet 66 is fixed in the top of the second horse 30, the 4th connection The foundation 32 of piece 66 and second forms the 4th breach 67, and the second female parts 61 are formed by the 3rd breach 65 and the 4th breach 67, One interlayer is formed by the intermediate plate 63 of second intermediate plate 62 and the 3rd, so that the silicon chip is fastened in the second clamping close device 60, its In, the distance between the 3rd intermediate plate 62 and the 4th intermediate plate 63 determine according to the thickness of the silicon chip, if the thickness than silicon chip For 300 microns when, the distance between the 3rd intermediate plate 62 and the 4th intermediate plate 63 can be 500 microns to 1 centimetre between so that described Silicon chip is fixed on more stable in the interlayer.Similarly, when the second clamping close device 60 is connected with the intermediate plate of more than 2, described 2 The structure of each intermediate plate is identical with the 3rd intermediate plate 62 and the structure of the 4th intermediate plate 63 in intermediate plate above, and between two neighboring intermediate plate Distance it is also identical.
Wherein, the middle part of the second framework 31 is connected with second cross beam 34, the 3rd connection sheet 64 respectively with the second upper prop 33 and second cross beam 34 it is affixed, to promote the 3rd connection sheet 64 can be more firm;4th connection sheet 66 respectively with the second upper prop 33 It is affixed with second cross beam 34, with promote the 4th connection sheet 66 more firmly, promote the silicon chip it is more stable be fastened on the first cartridge In device 50.
Referring to Fig. 6, structure chart in the first clamping close device and the second clamping close device is put into for silicon chip.It is put into the silicon chip solid When determining in device 10, because the distance between the first foundation 22 and the second foundation 32 are determined according to the size of silicon chip 70, make Silicon chip 70 can be stopped by obtaining the first foundation 22 and the second foundation 32, and pass through the first female parts 51 and the second female parts 61 The holding space for holding silicon chip 70 of composition, so so that when silicon chip 70 is placed in fixing device 10, silicon chip 70 fills close to fixed The part for putting 10 lower end both sides is contained in the accommodation space being made up of the first female parts 51 and the second female parts 61, from And reduce the contact area of the clamping close device 50 of silicon chip 70 and first and the second clamping close device 60.
Wherein, the first female parts 51 are the first parameters contacted by obtaining silicon chip 70 with the first clamping close device 50, base Determined in first parameter;Second female parts 61 are contacted by obtaining silicon chip 70 with the second clamping close device 60 Two parameters, determined based on second parameter.
Specifically, it is the structure chart that the first clamping close device is not provided with the first female parts referring to Fig. 7, and referring to figure 8, the structure chart of the second female parts is not provided with for the second clamping close device.Silicon chip 70 is clipped in by first intermediate plate 52 and second intermediate plate 53 Silicon chip 70 is clipped in the middle by centre, the 3rd intermediate plate 62 and the 4th intermediate plate 63, obtains silicon chip 70 and first intermediate plate 52 and second intermediate plate 53 contact area and contact position, based on first parameter, determines first intermediate plate 52 and second as first parameter The minimal-contact area that intermediate plate 53 can fix silicon chip 70, so, it may be determined that by 57 groups of the first breach 55 and the second breach Into the first female parts 51 house silicon chip 70, the first female parts 51 are that dotted line marks part in Fig. 7, i.e. described first Female parts are determined based on first parameter;Obtain the contact surface of the intermediate plate 62 of silicon chip 70 and the 3rd and the 4th intermediate plate 63 Product and contact position, based on second parameter, determine that the 3rd intermediate plate 62 and the 4th intermediate plate 63 can as second parameter The minimal-contact area that silicon chip 70 is fixed, so, it may be determined that by the 3rd breach 65 and the 4th breach 67 form second in Recess divides 61 to house silicon chip 70, and the first female parts 51 are that dotted line mark part is that dotted line marks part in Fig. 8 in Fig. 7, i.e. Second female parts are determined based on second parameter.
In actual application, when the silicon chip is put into fixing device 10, be by area it is larger first The silicon chip is put into fixing device 10 by opening 70, to facilitate the silicon chip to be put into fixing device 10, passes through first intermediate plate 52 and second intermediate plate 53 interlayer that is formed fix the silicon chip, and pass through the folder that the 3rd intermediate plate 62 and the 4th intermediate plate 63 are formed Layer fixes the silicon chip, because the first connection sheet 54 of first intermediate plate 52 and second connection sheet 56 of second intermediate plate 53 are all solid It is scheduled on the top of the first horse 20 so that the part of the first connection sheet 54 and the second connection sheet 56 only above and the silicon chip Contacted, for fixing the silicon chip, and the 4th connection of the 3rd connection sheet 64 of the 3rd intermediate plate 62 and the 4th intermediate plate 63 Piece 66 is all integrally fixed at the top of the second horse 30, so so that the 3rd connection sheet 64 and the 4th connection sheet 66 only have above It is a part of to be contacted with the silicon chip, for fixing the silicon chip, and pass through the first female parts 51 and the second inner fovea part The accommodation space being grouped houses the silicon chip, then stops the silicon by the first foundation 22 and the second foundation 32 again Piece, so as to promote the silicon chip to be fixed in fixing device 10, and the silicon chip and the contact area of fixing device 10 It is minimum so that the silicon chip can be corroded completely by acid solution, effectively improve the quality and qualification rate of the silicon chip.
The one or more technical schemes provided in the embodiment of the present application, have at least the following technical effects or advantages:
One, the first clamping close device is connected with the inside of first horse due to the embodiment of the present application, described second The second clamping close device is connected with the inside of horse, the lower end of first clamping close device has the first female parts, second card Attaching together the lower end put has the second female parts, is fastened in silicon chip in first clamping close device and second clamping close device When, silicon chip described in the holding space for holding that is made up of first female parts and second female parts, so so that When the silicon chip is placed in the fixing device, the silicon chip is to be contained in close to the part of fixing device lower end both sides In the holding space for holding be made up of first female parts and second female parts, so as to solve in the prior art When carrying out silicon etching process, silicon chip and accommodating device contact area are larger, the contact site of the silicon chip and the accommodating device The technical problem that point can not be completely impregnated with and can not be corroded by acid solution, realize and reduce connecing for the silicon chip and the fixing device Contacting surface is accumulated so that the silicon chip can be corroded completely by acid solution, it is possible to increase the quality and qualification rate of the silicon chip.
Secondly, be fixed in described due to the first intermediate plate in first clamping close device of the embodiment of the present application and second intermediate plate The top of one horse so that the first intermediate plate and the second intermediate plate and the first foundation of first horse constitute first Female parts, the 3rd intermediate plate and the 4th intermediate plate in the second clamping close device are fixed in the top of second horse so that described Second foundation of the 3rd intermediate plate and the 4th intermediate plate and second horse constitutes the second female parts, in the silicon chip card When closing in first clamping close device and second clamping close device, the silicon chip and the fixed dress can be further reduced The contact area put, further such that the silicon chip can be corroded completely by acid solution, improve the quality and qualification rate of the silicon chip.
Embodiment two
The difference of the embodiment of the present application two and embodiment one is the knot of the first clamping close device and the second clamping close device Structure is different.Succinct for specification, the embodiment of the present application two may be referred to example one with implementing one something in common, herein Do not repeating.The embodiment of the present application two and the difference of implementation one are described in detailed below, are specifically included:
First clamping close device 50 includes N number of intermediate plate, wherein, the N is the integer not less than 2, i.e. the first clamping close device is extremely Include first intermediate plate and second intermediate plate less.Referring to Fig. 9, first intermediate plate 52 and second intermediate plate 53 are only included with the first clamping close device 50 Exemplified by.First intermediate plate 52 includes the first connection sheet 54 and the 5th connection sheet 58, and the 5th connection sheet 58 is fixed under the first horse 20 Hold and mutually corresponding with the first connection sheet 54, the first connection sheet 54 and the 5th connection sheet 58 have the 5th breach 59, second intermediate plate 53 include the second connection sheet 56 and the 6th connection sheet 500, and the 6th connection sheet 500 is fixed in the lower end of the first horse 20 and with second Connection sheet 56 is mutually corresponding, and the second connection sheet 56 and the 6th connection sheet 500 have the 6th breach 501, the 5th breach 59 and the 6th Breach 501 is mutually corresponding, and the first female parts 51 are formed by the 5th breach 59 and the 6th breach 501.Similarly, in the first engaging When device 50 is connected with the intermediate plate of more than 2, the structure of each intermediate plate and first intermediate plate 52 and the in the intermediate plate of described more than 2 The structure of two intermediate plate 53 is identical, and the distance between two neighboring intermediate plate is also identical.
Wherein, the 5th connection sheet 58 is fixed in the upper end of the first foundation 22, so that the 5th connection sheet 58 can be stronger It is fixed on the lower end of the first horse 20;6th connection sheet 500 is fixed in the upper end of the first foundation 22, so that the energy of the 6th connection sheet 500 It is enough stronger to be fixed on the lower end of the first horse 20.
Secondly, the first connection sheet 54 and the 5th connection sheet 58 are mutually corresponding, and the second connection sheet 56 and the 6th connection sheet 500 is mutually corresponding, when making the silicon chip be put into fixing device 10, passes through the first connection sheet 54 and the 5th connection sheet 58 and second The connection sheet 500 of connection sheet 56 and the 6th forms the lower end point of an interlayer, the lower end of the first connection sheet 54 and the second connection sheet 56 Do not contacted with the silicon chip, the 5th connection sheet 58 and the 6th connection sheet 500 also contact with the silicon chip respectively, so that the silicon chip Stronger it can be fixed in the interlayer.
Second clamping close device 60 includes M intermediate plate, wherein, the M is the integer not less than 2, i.e. the second clamping close device is extremely Include the 3rd intermediate plate and the 4th intermediate plate less.Referring to Figure 10, the 3rd intermediate plate 62 and the 4th intermediate plate are only included with the second clamping close device 60 Exemplified by 63.3rd intermediate plate 62 includes the 3rd connection sheet 64 and the 7th connection sheet 68, and the 7th connection sheet 68 is fixed in the second horse 30 Lower end and mutually corresponding with the 3rd connection sheet 64, the 3rd connection sheet 64 and the 7th connection sheet 68 have the 7th breach 69, the 4th folder Piece 63 includes the 4th connection sheet 66 and the 8th connection sheet 600, and the 8th connection sheet 600 is fixed in the lower end of the second horse 30 and with Four connection sheets 66 are mutually corresponding, and the 4th connection sheet 66 and the 8th connection sheet 600 have the 8th breach 601, the 7th breach 69 and the Eight breach 601 are mutually corresponding, and the second female parts 61 are formed by the 7th breach 69 and the 8th breach 601.Similarly, in the second card Attach together when putting intermediate plate that 60 are connected with more than 2, in the intermediate plate of described more than 2 structure of each intermediate plate and the 3rd intermediate plate 62 and The structure of 4th intermediate plate 63 is identical, and the distance between two neighboring intermediate plate is also identical.
Wherein, the 7th connection sheet 68 is fixed in the upper end of the second foundation 32, so that the 7th connection sheet 68 can be stronger It is fixed on the lower end of the second horse 30;8th connection sheet 600 is fixed in the upper end of the second foundation 32, so that the energy of the 8th connection sheet 600 It is enough stronger to be fixed on the lower end of the second horse 30.
Secondly, the 3rd connection sheet 64 and the 7th connection sheet 68 are mutually corresponding, and the 4th connection sheet 66 and the 8th connection sheet 600 is mutually corresponding, when making the silicon chip be put into fixing device 10, passes through the 3rd connection sheet 64 and the 7th connection sheet 68 and the 4th The connection sheet 600 of connection sheet 66 and the 8th forms an interlayer, the lower end of the 3rd connection sheet 64 and the lower end of the 4th connection sheet 66 point Do not contacted with the silicon chip, the 7th connection sheet 68 and the 8th connection sheet 600 also contact with the silicon chip respectively, so that the silicon chip Stronger it can be fixed in the interlayer.
In actual application, when the silicon chip is put into fixing device 10, be by area it is larger first The silicon chip is put into fixing device 10 by opening 70, to facilitate the silicon chip to be put into fixing device 10, passes through the 3rd connection The connection sheet 68 of piece 64 and the 7th and the 4th connection sheet 66 and the 8th connection sheet 600 form an interlayer, first intermediate plate 52 and second The interlayer that intermediate plate 53 is formed is fixed to fix the silicon chip, and by the 3rd intermediate plate 62 and the interlayer of the 4th intermediate plate 63 formation The silicon chip, and also contacted respectively with the silicon chip by five connection sheets 58 and the 6th connection sheet 500, for fixing the silicon Piece, and a folder is formed by the 3rd connection sheet 64 and the 7th connection sheet 68 and the 4th connection sheet 66 and the 8th connection sheet 600 Layer, the lower end of the 3rd connection sheet 64 and the lower end of the 4th connection sheet 66 contact with the silicon chip respectively, the 7th connection sheet 68 and the Eight connection sheets 600 also contact with the silicon chip respectively, for fixing the silicon chip;And pass through the 5th breach 59 and the 6th breach 501 the first female parts 51 of composition and the appearance that the second female parts 61 composition is made up of the 7th breach 69 and the 8th breach 601 The silicon chip is housed between being empty, the silicon chip is then stopped by the first foundation 22 and the second foundation 32 again, so as to promote The silicon chip can be fixed in fixing device 10, and the silicon chip and the contact area of fixing device 10 are also minimum so that institute State silicon chip by acid solution completely to be corroded, effectively improve the quality and qualification rate of the silicon chip.
The one or more technical schemes provided in the embodiment of the present application, have at least the following technical effects or advantages:
Because the embodiment of the present application is connected with the first clamping close device on the inside of first horse, in second horse Side is connected with the second clamping close device, and the lower end of first clamping close device has the first female parts, second clamping close device Lower end there are the second female parts, when silicon chip is fastened in first clamping close device and second clamping close device, lead to Silicon chip described in first female parts and the holding space for holding of second female parts composition is crossed, so so that described When silicon chip is placed in the fixing device, the silicon chip close to the part of fixing device lower end both sides is contained in by institute State in the first female parts and the holding space for holding of second female parts composition, entering in the prior art so as to solve During row silicon etching process, silicon chip and accommodating device contact area are larger, and the contact portion of the silicon chip and the accommodating device is not The technical problem that can be completely impregnated with and can not be corroded by acid solution, realize and reduce the silicon chip and the contact surface of the fixing device Product so that the silicon chip can be corroded completely by acid solution, it is possible to increase the quality and qualification rate of the silicon chip.
Embodiment three
The difference of the embodiment of the present application three and embodiment one is to be connected with the first support on the outside of first horse Device, the second horse outside is connected with the second support meanss, so that fixing device holding when carrying out silicon slice corrosion It is stable.Succinct for specification, the embodiment of the present application three may be referred to example one with implementing one something in common, herein just not Repeating.The embodiment of the present application three and the difference of implementation one are described in detailed below, are specifically included:
First support meanss include N number of intermediate plate, wherein, the N is the integer not less than 2, i.e. the first support meanss Including at least the 5th intermediate plate and the 6th intermediate plate.Referring to Figure 11, so that the first support meanss include the 5th intermediate plate and the 6th intermediate plate as an example. The outside of first horse 20 is connected with the first support meanss 80, and the first support device 80 includes the 5th intermediate plate 81 and the 6th intermediate plate 82。
Wherein, the 5th intermediate plate 81 includes the first upper clip 83 and the first lower clamping piece 84, the first upper clip 83 and first time folder The position of piece 84 is mutually corresponding, and one end of the first upper clip 83 is fixed on the first upper prop 23, and the other end is fixed in first crossbeam On 24;One end of first lower clamping piece 84 is fixed on the first foundation 22, and the other end is fixed on first crossbeam 24;6th intermediate plate 82 Including the second upper clip 85 and the second lower clamping piece 86, the position of the second upper clip 85 and the second lower clamping piece 86 is mutually corresponding, and second One end of upper clip 85 is fixed on the first upper prop 23, and the other end is fixed on first crossbeam 24;One end of second lower clamping piece 86 It is fixed on the first foundation 22, the other end is fixed on first crossbeam 24.
Secondly, the 5th intermediate plate 81 is fixed in the position between first intermediate plate 52 and second intermediate plate 53, and the 6th intermediate plate 82 is affixed Position after second intermediate plate 53, and the distance between the 5th intermediate plate 81 and the 6th intermediate plate 82 are more than first intermediate plate 52 and second The distance of intermediate plate 53, to promote the silicon chip, the mobility of corrosive liquid is more preferable in corrosion process, so as to effectively improve The corrosion rate of the silicon chip, additionally it is possible to ensure that the silicon slice corrosion is uniform.Wherein, the 6th intermediate plate 82 can be with the first card It is affixed integral to attach together a certain intermediate plate put in 50 after second intermediate plate 53, can also be fixed in as the 5th intermediate plate 81 Between two intermediate plates in first clamping close device 50.
Second support arrangement includes M intermediate plate, wherein, the M is the integer not less than 2, i.e. the second support meanss are extremely Include the 7th intermediate plate and the 8th intermediate plate less.Referring to Figure 12, so that the second support meanss only include the 7th intermediate plate and the 8th intermediate plate as an example. The outside of second horse 30 is connected with the second support meanss 90, and the second support device 90 includes the 7th intermediate plate 91 and the 8th intermediate plate 92。
Wherein, the 7th intermediate plate 91 includes the 3rd upper clip 93 and the 3rd lower clamping piece 94, the 3rd upper clip 93 and the three times folders The position of piece 94 is mutually corresponding, and one end of the 3rd upper clip 93 is fixed on the second upper prop 33, and the other end is fixed in second cross beam On 34;One end of 3rd lower clamping piece 94 is fixed on the second foundation 32, and the other end is fixed on second cross beam 34;8th intermediate plate 92 Including the 4th upper clip 95 and the 4th lower clamping piece 96, the position of the 4th upper clip 95 and the 4th lower clamping piece 96 is mutually corresponding, and the 4th One end of upper clip 95 is fixed on the second upper prop 33, and the other end is fixed on second cross beam 34;One end of 4th lower clamping piece 96 It is fixed on the second foundation 32, the other end is fixed on second cross beam 34.
Secondly, the 7th intermediate plate 91 is fixed in the position between the 3rd intermediate plate 62 and the 4th intermediate plate 63, and the 8th intermediate plate 92 is affixed Position after the 4th intermediate plate 63, and the distance between the 7th intermediate plate 91 and the 8th intermediate plate 92 are more than the 3rd intermediate plate 62 and the 4th The distance of intermediate plate 63, to promote the silicon chip, the mobility of corrosive liquid is more preferable in corrosion process, so as to effectively improve The corrosion rate of the silicon chip, additionally it is possible to ensure that the silicon slice corrosion is uniform.Wherein, the 8th intermediate plate 92 can be with the second card It is affixed integral to attach together a certain intermediate plate put in 60 after the 4th intermediate plate 63, can also be fixed in as the 7th intermediate plate 91 Between two intermediate plates in second clamping close device 60.
The one or more technical schemes provided in the embodiment of the present application, have at least the following technical effects or advantages:
One, the first clamping close device is connected with the inside of first horse due to the embodiment of the present application, described second The second clamping close device is connected with the inside of horse, the lower end of first clamping close device has the first female parts, second card Attaching together the lower end put has the second female parts, is fastened in silicon chip in first clamping close device and second clamping close device When, silicon chip described in the holding space for holding that is made up of first female parts and second female parts, so so that When the silicon chip is placed in the fixing device, the silicon chip is to be contained in close to the part of fixing device lower end both sides In the holding space for holding be made up of first female parts and second female parts, so as to solve in the prior art When carrying out silicon etching process, silicon chip and accommodating device contact area are larger, the contact site of the silicon chip and the accommodating device The technical problem that point can not be completely impregnated with and can not be corroded by acid solution, realize and reduce connecing for the silicon chip and the fixing device Contacting surface is accumulated so that the silicon chip can be corroded completely by acid solution, it is possible to increase the quality and qualification rate of the silicon chip.
Secondly, due to being connected with the first support meanss on the outside of the first horse described in the embodiment of the present application, and described The second support meanss are connected with the outside of second horse, first support meanss comprise at least the 5th intermediate plate and the 6th intermediate plate, institute State the first spacing between the 5th intermediate plate and the 6th intermediate plate is more than between the first intermediate plate and the second intermediate plate the Two spacing, the second support device comprise at least the 7th intermediate plate and the 8th intermediate plate, and the 7th intermediate plate and the described 8th folder The 3rd spacing between piece is more than the 4th spacing between the 3rd intermediate plate and the 4th intermediate plate, so so that carrying out During silicon slice corrosion, acid solution mobility between the silicon chip is effectively improved, causes the silicon slice corrosion uniform, improves the matter of the silicon chip Amount and qualification rate.
Example IV
The difference of the embodiment of the present application four and embodiment one is the structure of first horse and the second horse not Together, and on the outside of first horse the first support meanss are connected with, the second support is connected with the outside of second horse Device.Succinct for specification, the embodiment of the present application four may be referred to embodiment one with implementing one something in common, herein Do not repeating.The embodiment of the present application four and the difference of implementation one are described in detailed below, are specifically included:
As shown in figure 13, the first horse 20 is provided with the 3rd crossbeam 25, and the 3rd crossbeam 25 is arranged on the upper of first crossbeam 24 Side, one end of the 3rd crossbeam 25 is fixed on the first frame 26 of the first horse 20, and the other end is fixed in the of the first horse 20 On two frames 27.
Wherein, the outside of the first horse 20 is connected with the first support meanss 80, wherein, the first support meanss 80 include multiple Intermediate plate, the intermediate plate in the multiple intermediate plate in each intermediate plate and the first clamping close device 50 set integral, dotted line in Figure 12 For the intermediate plate in the first clamping close device 50.
Wherein, by taking the 5th intermediate plate 81 and the 6th intermediate plate 82 that the first support meanss 80 include as an example, to illustrate the first support The relation of intermediate plate in device 80 and the intermediate plate in the first clamping close device 50, it is specific as follows:
5th intermediate plate 81 includes the lower clamping piece 85 of intermediate plate 84 and the 5th in the 5th upper clip 83 and first, the 5th upper clip 83 One end is fixed on the first upper prop 23, and the other end is fixed on the 3rd crossbeam 25;It is horizontal to be fixed in the 3rd for the one end of intermediate plate 84 in first On beam 25, the other end is fixed on first crossbeam 24;One end of 5th lower clamping piece 85 is fixed on first crossbeam 24, and the other end is solid It is connected on the first foundation 22.Wherein, the lower clamping piece 85 of intermediate plate 84 and the 5th is mutually corresponding in the 5th upper clip 83 and first, to be formed One entirety.
6th intermediate plate 82 includes the lower clamping piece 88 of intermediate plate 87 and the 6th in the 6th upper clip 86 and second, the 6th upper clip 86 One end is fixed on the first upper prop 23, and the other end is fixed on the 3rd crossbeam 25;It is horizontal to be fixed in the 3rd for the one end of intermediate plate 87 in second On beam 25, the other end is fixed on first crossbeam 24;One end of 6th lower clamping piece 88 is fixed on first crossbeam 24, and the other end is solid It is connected on the first foundation 22.Wherein, the lower clamping piece 88 of intermediate plate 87 and the 6th is mutually corresponding in the 6th upper clip 86 and second, to be formed One entirety.
Wherein, second intermediate plate in left side sets integral, the 6th intermediate plate in the 5th intermediate plate 81 and the first clamping close device 50 82 and first right side in clamping close device 50 the 4th intermediate plate set it is integral, so so that the 5th intermediate plate 81 and the 6th intermediate plate The distance between 82 be 2 times of two adjacent clips distances in the first clamping close device 50, to promote the silicon chip in corrosion process In, the mobility of corrosive liquid is more preferable, so as to effectively improve the corrosion rate of the silicon chip, additionally it is possible to ensure the silicon chip Corrosion is uniform.
Wherein, other intermediate plates are identical with the structure of the 5th intermediate plate 81 and the 6th intermediate plate 82 in the first support meanss 80, are Specification it is succinct, herein just repeat no more.
Referring to Figure 14, the second horse 30 is provided with the 4th crossbeam 35, and the 4th crossbeam 35 is arranged on the top of second cross beam 34, One end of 4th crossbeam 35 is fixed on the first frame 36 of the second horse 30, and the other end is fixed in the second side of the second horse 30 On frame 37.
Wherein, the outside of the second horse 30 is connected with the second support meanss 90, wherein, the second support meanss 90 include multiple Intermediate plate, the intermediate plate in the multiple intermediate plate in each intermediate plate and the second clamping close device 60 set integral, dotted line in Figure 13 For the intermediate plate in the second clamping close device 60.
Wherein, by taking the 7th intermediate plate 91 and the 8th intermediate plate 92 that the second support meanss 90 include as an example, to illustrate the second support The relation of intermediate plate in device 90 and the intermediate plate in the second clamping close device 60, it is specific as follows:
7th intermediate plate 91 includes the lower clamping piece 95 of intermediate plate 94 and the 7th in the 7th upper clip 93 and the 3rd, the 7th upper clip 93 One end be fixed on the second upper prop 33, the other end is fixed on the 4th crossbeam 35;The one end of intermediate plate 94 is fixed in the 4th in 3rd On crossbeam 35, the other end is fixed on second cross beam 34;One end of 7th lower clamping piece 95 is fixed on second cross beam 34, the other end It is fixed on the second foundation 32.Wherein, the lower clamping piece 95 of intermediate plate 94 and the 7th is mutually corresponding in the 7th upper clip 93 and the 3rd, with shape Into an entirety.
8th intermediate plate 92 includes the lower clamping piece 98 of intermediate plate 97 and the 8th in the 8th upper clip 96 and the 4th, the 8th upper clip 96 One end is fixed on the second upper prop 33, and the other end is fixed on the 4th crossbeam 35;It is horizontal to be fixed in the 4th for the one end of intermediate plate 97 in 4th On beam 35, the other end is fixed on second cross beam 34;One end of 8th lower clamping piece 98 is fixed on second cross beam 34, and the other end is solid It is connected on the second foundation 32.Wherein, the lower clamping piece 98 of intermediate plate 97 and the 8th is mutually corresponding in the 8th upper clip 96 and the 4th, to be formed One entirety.
Wherein, second intermediate plate in left side sets integral, the 8th intermediate plate in the 7th intermediate plate 91 and the second clamping close device 60 92 and second right side in clamping close device 60 the 4th intermediate plate set it is integral, so so that the 7th intermediate plate 91 and the 8th intermediate plate The distance between 92 be 2 times of two adjacent clips distances in the second clamping close device 60, to promote the silicon chip in corrosion process In, the mobility of corrosive liquid is more preferable, so as to effectively improve the corrosion rate of the silicon chip, additionally it is possible to ensure the silicon chip Corrosion is uniform.
Wherein, other intermediate plates are identical with the structure of the 7th intermediate plate 91 and the 8th intermediate plate 92 in the second support meanss 90, are Specification it is succinct, herein just repeat no more.
First support meanss 80 also include the 3rd support meanss, and the 3rd support meanss include at least one intermediate plate, institute Each intermediate plate at least one intermediate plate is stated to be arranged between the first upper prop 23 and the 3rd crossbeam 25.Referring to Figure 15, the 3rd support dress Putting 100 includes multiple intermediate plates, to come exemplified by the 9th upper clip 101 and the tenth upper clip 102 that are positioned close to the second frame 27 Illustrate the structure of the 3rd support meanss 100.
Wherein, one end of the 9th upper clip 101 is fixed on the first upper prop 23, and the other end is fixed on the 3rd crossbeam 25, And the 9th left side in intermediate plate 101 and the first clamping close device 50 first intermediate plate set it is integral;One end of tenth upper clip 102 It is fixed on the first upper prop 23, the other end is fixed on the 3rd crossbeam 25, and in the tenth upper clip 102 and the first clamping close device 50 3rd intermediate plate in left side sets integral.Because the first support meanss 80 also include the 3rd support meanss 100, in the silicon chip In corrosion process, the balance of fixing device 10 can be further ensured that, so as to cause the silicon chip to be fixed on fixing device It is more stable in 10.
Certainly, the 3rd support meanss can also only include an intermediate plate, and the intermediate plate can also be with the described first card The intermediate plate attached together in putting staggers, and is not provided with integral.When the 3rd support meanss include multiple intermediate plates, the multiple intermediate plate In each intermediate plate can stagger with the intermediate plate in first clamping close device, can also be by some in the multiple intermediate plate Intermediate plate staggers with the intermediate plate in first clamping close device, and remaining intermediate plate is arranged to the intermediate plate in first clamping close device One.Such as the 3rd support meanss be provided with 6 intermediate plates, wherein having 2 or 3 intermediate plates and the folder in first clamping close device Piece staggers, corresponding, and still remaining 4 or 3 intermediate plates set integral with the intermediate plate in first clamping close device.
Second support meanss 90 also include the 4th support meanss, and the 4th support meanss include at least one intermediate plate, institute Each intermediate plate at least one intermediate plate is stated to be arranged between the second upper prop 33 and the 4th crossbeam 35.Referring to Figure 16, the 3rd support dress Putting 200 includes multiple intermediate plates, is to be positioned close to the 11st upper clip 201 of the 4th frame 37 and the 12nd upper clip 202 Example illustrates the structure of the 4th support meanss 200.
Wherein, one end of the 11st upper clip 201 is fixed on the second upper prop 33, and the other end is fixed in the 4th crossbeam 35 On, and first intermediate plate in left side is set integrally in the 11st intermediate plate 201 and the second clamping close device 60;12nd upper clip 202 one end is fixed on the second upper prop 33, and the other end is fixed on the 4th crossbeam 35, and the 12nd upper clip 202 and second The 3rd intermediate plate in left side sets integral in clamping close device 60.Because the second support meanss 90 also include the 4th support meanss 200, in the silicon chip in corrosion process, the balance of fixing device 10 can be further ensured that, so as to cause the silicon chip It is fixed on more stable in fixing device 10.
Certainly, the 4th support meanss can also only include an intermediate plate, and the intermediate plate can also be with the described second card The intermediate plate attached together in putting staggers, and is not provided with integral.When the 4th support meanss include multiple intermediate plates, the multiple intermediate plate In each intermediate plate can stagger with the intermediate plate in second clamping close device, can also be by some in the multiple intermediate plate Intermediate plate staggers with the intermediate plate in second clamping close device, and remaining intermediate plate is arranged to the intermediate plate in second clamping close device One.Such as the 4th support meanss be provided with 8 intermediate plates, wherein having 2 or 4 intermediate plates and the folder in second clamping close device Piece staggers, corresponding, and still remaining 6 or 4 intermediate plates set integral with the intermediate plate in second clamping close device.
The one or more technical schemes provided in the embodiment of the present application, have at least the following technical effects or advantages:
One, the first clamping close device is connected with the inside of first horse due to the embodiment of the present application, described second The second clamping close device is connected with the inside of horse, the lower end of first clamping close device has the first female parts, second card Attaching together the lower end put has the second female parts, is fastened in silicon chip in first clamping close device and second clamping close device When, silicon chip described in the holding space for holding that is made up of first female parts and second female parts, so so that When the silicon chip is placed in the fixing device, the silicon chip is to be contained in close to the part of fixing device lower end both sides In the holding space for holding be made up of first female parts and second female parts, so as to solve in the prior art When carrying out silicon etching process, silicon chip and accommodating device contact area are larger, the contact site of the silicon chip and the accommodating device The technical problem that point can not be completely impregnated with and can not be corroded by acid solution, realize and reduce connecing for the silicon chip and the fixing device Contacting surface is accumulated so that the silicon chip can be corroded completely by acid solution, it is possible to increase the quality and qualification rate of the silicon chip.
Secondly, due to being connected with the first support meanss on the outside of the first horse described in the embodiment of the present application, and described The second support meanss are connected with the outside of second horse, first support meanss comprise at least the 5th intermediate plate and the 6th intermediate plate, institute State the first spacing between the 5th intermediate plate and the 6th intermediate plate is more than between the first intermediate plate and the second intermediate plate the Two spacing, the second support device comprise at least the 7th intermediate plate and the 8th intermediate plate, and the 7th intermediate plate and the described 8th folder The 3rd spacing between piece is more than the 4th spacing between the 3rd intermediate plate and the 4th intermediate plate, so so that carrying out During silicon slice corrosion, acid solution mobility between the silicon chip is effectively improved, causes the silicon slice corrosion uniform, improves the matter of the silicon chip Amount and qualification rate.
Embodiment five
The embodiment of the present application five and the difference of example one are the structure of first horse and second horse It is different.Succinct for specification, the embodiment of the present application five may be referred to embodiment one with implementing one something in common, herein Do not repeating.The embodiment of the present application five and the difference of implementation one are described in detailed below, are specifically included:
As shown in figure 17, it is the structure chart of first horse.The lower end of first horse 20 is provided with the 3rd foundation 28, the The first inclined-plane 29 and horizontal plane of three foundation 28 form the first inclination angle 203, and the first inclination angle 203 is 15 °.Certainly, the first inclination angle 203 can be arranged between 5 °~60 ° angles, for example, the first inclination angle 203 can be 10 °, 20 °, 30 °, 45 ° angularly.
As shown in figure 18, it is the structure chart of second horse.The lower end of second horse 30 is provided with the 4th foundation 38, the The second inclined-plane 39 and horizontal plane of four foundation 38 form the second inclination angle 300, and the second inclination angle 300 is 15 °.Certainly, the second inclination angle 300 can be arranged between 5 °~60 ° angles, for example, the second inclination angle 300 can be 10 °, 20 °, 30 °, 45 ° angularly.
Wherein, because the first inclination angle 203 is identical with the angle at the second inclination angle 300 so that fixing device 10 can roll to the right Oblique 15 °, the center of gravity of fixing device 10 can also tilt to the right, when carrying out silicon slice corrosion, make that the silicon chip needs corrode one Face is placed on left side, promotes the silicon chip because Action of Gravity Field can tilt to the right, so that it may so that silicon slice corrosion face and the first card The intermediate plate incomplete contact between put with the left of the second clamping close device is attached together, further reduces the erosional surface and fixing device of the silicon chip 10 contact area can ensure that silicon chip very stable can be placed in horse again, further such that the silicon chip can be by acid solution Corrosion completely, and the quality and qualification rate of the silicon chip can be effectively improved.
Wherein, while first inclination angle is identical with the angle at second inclination angle, also need to promote described first to incline Angle and second inclination angle are mutually corresponding, for example first inclination angle is to be tilted to the right 20 °, then, the second inclination angle also should be to the right 20 ° are tilted, in this way, promoting fixing device 10 to be tilted to side by first inclination angle and second inclination angle.
In addition, it is Part I to implement one and implement two, it is Part II to implement three and implement four, and it is the 3rd to implement five Point, the Part I and the Part II and Part III can be with random combines.Such as by embodiment one and it can implement Example three is combined, and can also be combined embodiment two and embodiment three, by embodiment two and embodiment three and can also be implemented Example four is combined, and can be solved in the prior art when carrying out silicon etching process, and silicon chip and accommodating device contact area are larger, The technical problem that the contact portion of the silicon chip and the accommodating device can not be completely impregnated with and can not be corroded by acid solution.
Technical scheme in above-mentioned the embodiment of the present application, at least has the following technical effect that or advantage:
One, the first clamping close device is connected with the inside of first horse due to the embodiment of the present application, described second The second clamping close device is connected with the inside of horse, the lower end of first clamping close device has the first female parts, second card Attaching together the lower end put has the second female parts, is fastened in silicon chip in first clamping close device and second clamping close device When, silicon chip described in the holding space for holding that is made up of first female parts and second female parts, so so that When the silicon chip is placed in the fixing device, the silicon chip is to be contained in close to the part of fixing device lower end both sides In the holding space for holding be made up of first female parts and second female parts, so as to solve in the prior art When carrying out silicon etching process, silicon chip and accommodating device contact area are larger, the contact site of the silicon chip and the accommodating device The technical problem that point can not be completely impregnated with and can not be corroded by acid solution, realize and reduce connecing for the silicon chip and the fixing device Contacting surface is accumulated so that the silicon chip can be corroded completely by acid solution, it is possible to increase the quality and qualification rate of the silicon chip.
Secondly, be fixed in described due to the first intermediate plate in first clamping close device of the embodiment of the present application and second intermediate plate The top of one horse so that the first intermediate plate and the second intermediate plate and the first foundation of first horse constitute first Female parts, the 3rd intermediate plate and the 4th intermediate plate in the second clamping close device are fixed in the top of second horse so that described Second foundation of the 3rd intermediate plate and the 4th intermediate plate and second horse constitutes the second female parts, in the silicon chip card When closing in first clamping close device and second clamping close device, the silicon chip and the fixed dress can be further reduced The contact area put, further such that the silicon chip can be corroded completely by acid solution, improve the quality and qualification rate of the silicon chip.
Thirdly, due to being connected with the first support meanss on the outside of the first horse described in the embodiment of the present application, and described The second support meanss are connected with the outside of second horse, first support meanss comprise at least the 5th intermediate plate and the 6th intermediate plate, institute State the first spacing between the 5th intermediate plate and the 6th intermediate plate is more than between the first intermediate plate and the second intermediate plate the Two spacing, the second support device comprise at least the 7th intermediate plate and the 8th intermediate plate, and the 7th intermediate plate and the described 8th folder The 3rd spacing between piece is more than the 4th spacing between the 3rd intermediate plate and the 4th intermediate plate, so so that carrying out During silicon slice corrosion, acid solution mobility between the silicon chip is effectively improved, causes the silicon slice corrosion uniform, improves the matter of the silicon chip Amount and qualification rate.
Four, because the first foundation described in the embodiment of the present application and horizontal plane have the first inclination angle, second foundation There is the second inclination angle with horizontal plane, first inclination angle and second inclination angle are mutually corresponding, so that the fixing device is to one Roll it is oblique, in this way, when carrying out silicon slice corrosion, when the silicon slice corrosion being faced into the opposite side of inclined side putting, such as institute When stating fixing device and tilting to the right, the silicon slice corrosion is facing to left side so that the silicon chip Action of Gravity Field to it is described Fixing device incline direction is consistent so that the silicon slice corrosion face and the fixing device incomplete contact between, further reduces institute The contact area of silicon chip and the fixing device is stated, further such that the silicon chip can be corroded completely by acid solution, described in raising The quality and qualification rate of silicon chip.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation Property concept, then can make other change and modification to these embodiments.So appended claims be intended to be construed to include it is excellent Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies Within, then the present invention is also intended to comprising including these changes and modification.

Claims (10)

1. a kind of fixing device applied to silicon corrosion, the fixing device includes the first horse and the second horse and for even Connect the attachment means of first horse and second horse, it is characterised in that be connected with first on the inside of first horse Clamping close device, the second horse inner side are connected with the second clamping close device, and the lower end of first clamping close device has in first Recess point, the lower end of second clamping close device has the second female parts, silicon chip be fastened on first clamping close device with When in second clamping close device, pass through first female parts and the holding space for holding of second female parts composition The silicon chip, to reduce the contact area of the silicon chip and first clamping close device and second clamping close device;
First horse includes the first foundation, and first foundation has the first inclination angle with horizontal plane;Second horse includes the second bottom Post, second foundation have the second inclination angle with horizontal plane, and first inclination angle and second inclination angle are mutually corresponding, so that institute Fixing device is stated to tilt to side.
2. fixing device as claimed in claim 1, it is characterised in that first female parts are by obtaining the silicon chip The first parameter contacted with first clamping close device, determined based on first parameter.
3. fixing device as claimed in claim 1, it is characterised in that second female parts are by obtaining the silicon chip The second parameter contacted with second clamping close device, determined based on second parameter.
4. fixing device as claimed in claim 1, it is characterised in that first clamping close device comprise at least first intermediate plate and Second intermediate plate, the first intermediate plate include the first connection sheet, and first connection sheet is fixed in the top of first horse, institute To state the first connection sheet and the first foundation of first horse forms the first breach, the second intermediate plate includes the second connection sheet, Second connection sheet is fixed in the top of first horse, second connection sheet and the first foundation of first horse The second breach is formed, first female parts are formed by first breach and second breach.
5. fixing device as claimed in claim 1, it is characterised in that second clamping close device comprise at least the 3rd intermediate plate and 4th intermediate plate, the 3rd intermediate plate include the 3rd connection sheet, and the 3rd connection sheet is fixed in the top of second horse, institute To state the 3rd connection sheet and the second foundation of second horse forms the 3rd breach, the 4th intermediate plate includes the 4th connection sheet, 4th connection sheet is fixed in the top of second horse, the 4th connection sheet and the second foundation of second horse The 4th breach is formed, second female parts are formed by the 3rd breach and the 4th breach.
6. fixing device as claimed in claim 1, it is characterised in that first clamping close device comprise at least first intermediate plate and Second intermediate plate, the first intermediate plate also include the 5th connection sheet, the 5th connection sheet be fixed in the first horse lower end and Mutually corresponding with the first connection sheet, first connection sheet has the 5th breach, the second intermediate plate with the 5th connection sheet Also include the 6th connection sheet, the 6th connection sheet is fixed in the lower end of first horse and mutually right with the second connection sheet Should, second connection sheet has the 6th breach with the 6th connection sheet, and the 5th breach and the 6th breach are mutual It is corresponding, first female parts are formed by the 5th breach and the 6th breach.
7. fixing device as claimed in claim 1, it is characterised in that second card device comprises at least the 3rd intermediate plate and the Four intermediate plates, the 3rd intermediate plate also include the 7th connection sheet, the 7th connection sheet be fixed in the lower end of second horse and Mutually corresponding with the 3rd connection sheet, the 3rd connection sheet has the 7th breach, the 4th intermediate plate with the 7th connection sheet Also include the 8th connection sheet, the 8th connection sheet is fixed in the lower end of second horse and mutually right with the 4th connection sheet Should, the 8th connection sheet has the 8th breach with the 4th connection sheet, and the 7th breach and the 8th breach are mutual It is corresponding, second female parts are formed by the 7th breach and the 8th breach.
8. fixing device as claimed in claim 1, it is characterised in that the first support dress is connected with the outside of first horse Put, the second support meanss are connected with the outside of second horse, so that the fixing device keeps steady when carrying out silicon slice corrosion It is fixed.
9. fixing device as claimed in claim 8, it is characterised in that first support meanss comprise at least the 5th intermediate plate and 6th intermediate plate, the 5th intermediate plate and the 6th intermediate plate are affixed with the intermediate plate in first intermediate plate and second intermediate plate respectively, and The first spacing between 5th intermediate plate and the 6th intermediate plate is more than between the first intermediate plate and the second intermediate plate Second spacing;Wherein, the first intermediate plate and the second intermediate plate are first clamping close devices.
10. fixing device as claimed in claim 8, it is characterised in that second support meanss comprise at least the 7th intermediate plate With the 8th intermediate plate, the 7th intermediate plate and the 8th intermediate plate are affixed with the intermediate plate in the 3rd intermediate plate and the 4th intermediate plate respectively, And the 3rd spacing between the 7th intermediate plate and the 8th intermediate plate is more than between the 3rd intermediate plate and the 4th intermediate plate The 4th spacing;Wherein, the 3rd intermediate plate and the 4th intermediate plate are second clamping close devices.
CN201310295832.6A 2013-07-15 2013-07-15 A kind of fixing device applied to silicon corrosion Active CN104299937B (en)

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Application Number Priority Date Filing Date Title
CN201310295832.6A CN104299937B (en) 2013-07-15 2013-07-15 A kind of fixing device applied to silicon corrosion

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011041A (en) * 1988-09-14 1991-04-30 Kakizaki Mfg. Co., Ltd. Basket for processing thin plates
US5725101A (en) * 1995-06-26 1998-03-10 Kakizaki Manufacturing Co., Ltd. Thin-plate supporting container
EP1193737A1 (en) * 2000-09-21 2002-04-03 Infineon Technologies AG Method for transporting wafers
CN102834908A (en) * 2010-01-22 2012-12-19 Lg矽得荣株式会社 Cassette jig for wafer cleaning apparatus and cassette assembly having the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011041A (en) * 1988-09-14 1991-04-30 Kakizaki Mfg. Co., Ltd. Basket for processing thin plates
US5725101A (en) * 1995-06-26 1998-03-10 Kakizaki Manufacturing Co., Ltd. Thin-plate supporting container
EP1193737A1 (en) * 2000-09-21 2002-04-03 Infineon Technologies AG Method for transporting wafers
CN102834908A (en) * 2010-01-22 2012-12-19 Lg矽得荣株式会社 Cassette jig for wafer cleaning apparatus and cassette assembly having the same

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