CN104175002A - Cutting method of resign board pasted at glass substrate - Google Patents
Cutting method of resign board pasted at glass substrate Download PDFInfo
- Publication number
- CN104175002A CN104175002A CN201410144034.8A CN201410144034A CN104175002A CN 104175002 A CN104175002 A CN 104175002A CN 201410144034 A CN201410144034 A CN 201410144034A CN 104175002 A CN104175002 A CN 104175002A
- Authority
- CN
- China
- Prior art keywords
- laser beam
- resin plate
- glass substrate
- cutting
- polarizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Polarising Elements (AREA)
Abstract
The present invention relates to a cutting method of a resign board which is pasted on a glass substrate. The cutting method is capable of inhibiting thermal destroy for the glass substrate, and making a cutting surface of the resign board which is pasted at the surface of the glass substrate sharper. According to the cutting method, a laser beam (B) is irradiated on the resign board (2) which is pasted on the glass substrate (1) to cut off the resign board (2), so that the laser beam (B) is allowed to irradiate with the focusing point (P) defocuses above the resign board (2), a shielding board (3) for shielding the laser beam (B) is configured along a cutting preset line (S) of a mother base board (A), and the cutting preset line (S) exposes, and therefore the laser beam is only allowed to irradiate on the cutting preset line (S) at a peak portion (B1) in light intensity distribution at the surface of the resign board (2), and the other portion (B2) are shielded by the shielding board (3).
Description
Technical field
The present invention relates to a kind of cutting-off method that the resin plate being pasted on glass substrate is cut off by the irradiation of laser beam.For example, the present invention is utilized cutting-off method when Polarizer is cut off with laser beam as the display panels (LCD) that is pasted with resinous Polarizer on glass substrate.
Background technology
The existing known display panels that is pasted with the Polarizer (polarizing film) being formed by PET resin etc. in the one or two sides of glass substrate that has.The method of manufacturing such display panels, for example, be disclosed in patent documentation 1.In the method disclosing at this patent documentation 1, first, the large-area liquid crystal mother substrate that is formed with a plurality of unit panel from patterning cuts out each unit panel, then this unit panel respectively is respectively pasted to the Polarizer that a slice makes in addition.
In above-mentioned method, owing to must constituent parts panel being pasted to Polarizer, therefore suitable spended time in this step.In addition, must to glass substrate correctly locate make itself and its for the Polarizer of same size, pasted, need like this time and be required the precision of location, and easily produce the unfavorable condition causing because of position skew.
Therefore, in patent documentation 2, disclose just like following method: first it paste Polarizer at whole of large-area liquid crystal mother substrate, afterwards, along cutting off preset lines, utilize laser beam to cut off Polarizer.Accordingly, can make the glass substrate of Polarizer and unit panel match and precision is good and can once be pasted in a plurality of unit panel.In addition,, by making ITO film between glass substrate and Polarizer, can, by ITO film folded light beam when light beam irradiates, suppress the heat damage to glass substrate.
Patent documentation 1: TOHKEMY 2002-023151 communique
Patent documentation 2: TOHKEMY 2011-178636 communique
Summary of the invention
The situation of generally making laser beam scanning, Polarizer being cut off is that laser beam is scanned with set intensity distributions.The light intensity distributions of illumination beam, as shown in Fig. 5 (a), for optical axis center portion is compared with the distribution (Gaussian distribution) of weak mountain shape of strong its outside.Laser beam also can form toroidal light beam spot, in addition, also can form there is set major axis footpath, the elliptoid light beam spot of short shaft diameter.
Therefore, when the focus that makes laser beam is irradiated being positioned at the surface of the Polarizer 12 that is pasted on glass substrate 11, as shown in Fig. 5 (b), because of melting or degrade the reversion shape that (ablation) formed groove 13 roughly becomes above-mentioned light intensity distributions (distributing same with the calorific intensity of shadow surface).Afterwards, substrate is transported toward next step, when glass substrate 11 being divided while being broken into unit panel along groove 13 center, as shown in Fig. 5 (c), the section of Polarizer 12 becomes inclined plane.Its result is that, near the end face of glass substrate 11, the thickness of slab of the Polarizer 12 gradually tilting zone of attenuation forms with set width L1.
Yet when the unit panel through disjunction is made to goods, the width L1 that is preferably tilting zone should be as far as possible little.Also, being preferably the cut-out end face of Polarizer 12 should be as far as possible in the position disjunction that approaches the cut-out end face of glass substrate 11.
As with so that the method that the width L1 of tilting zone diminishes, have the method for the light beam spot path that makes to be positioned at Polarizer 12 surfaces.Laser beam becomes precipitous light intensity distributions by making its optically focused Cheng Geng little.As above-mentioned, groove 13 is owing to becoming the reversion shape of respective light intensities distribution, so result is for obtaining the width L1 of narrower tilting zone.But then, due in light beam spot, be with stronger luminous intensity centrality irradiate, can give heat damage to the glass substrate 11 under Polarizer 12.To the heat damage of glass substrate 11, owing to causing glass substrate 11 strength decreaseds own, can undermine widely goods and be worth, therefore must do one's utmost to avoid.
In order to obtain high-quality unit panel, be preferably: in the situation that glass substrate not being brought to heat damage, make as far as possible the width L1 of above-mentioned tilting zone diminish, specifically make L1 become below 50 μ m.
Because such problem, in above-mentioned patent documentation 2, is to make ITO film between glass substrate and Polarizer, and by ITO film, make its reflection when laser beam irradiation, thereby suppress the heat damage of laser beam to glass substrate.
But if will group enter ITO film, the formation that has a liquid crystal panel complicates and has also increased the manufacturing step of ITO evaporation etc. and had the problem that cost is uprised.
Present inventor is not give the mode of heat damage to being positioned at glass substrate under Polarizer, defocus (defocus) in the position with away from focus adds man-hour, the inclination steepening that prevents from finding toward the irradiation of Polarizer the section of Polarizer by the peripheral part (the delineation both sides of line or one-sided) that covers laser beam, completes the present invention whereby.
The object of the invention is to, overcome prior art defect, and a kind of new cutting-off method being pasted on such as the resin plate of glass substrate etc. is provided, technical problem to be solved is to make it utilize laser beam to cut off being pasted on the resin plate of glass substrate, this cutting-off method can omit the step of utilizing ITO film to form reflecting layer, and can suppress the heat damage that glass substrate is caused because of laser beam, and, can make to be pasted on the tilting zone steepen of width L1 of resin plate of the Polarizer etc. of glass baseplate surface.
The object of the invention to solve the technical problems realizes by the following technical solutions.The cutting-off method of a kind of resin plate proposing according to the present invention, is to being pasted on the resin plate of the bottom substrate of glass etc., makes laser beam one edge cut off preset lines and relatively moves, irradiates on one side and cut off the method for this resin plate.
Wherein, the light intensity distributions of the laser beam that this resin plate is irradiated near the optical axis center of light beam for the peak value part of some strength roughly be the tail-end value part gently decaying in its outside, the state defocusing toward short transverse from the surface of this resin plate with the focus of this laser beam irradiates.
Further, by covering, irradiate in the shading member of the laser beam of this resin plate so that the state that this cut-out preset lines is exposed to configure along the adjacent mode of this cut-out preset lines, in this laser beam, the laser beam of this peak value part is irradiated this cut-out preset lines, and the laser beam of this tail-end value part is interdicted by this shading member.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The cutting-off method of aforesaid resin plate, wherein said laser beam is CO
2laser.
The cutting-off method of aforesaid resin plate, wherein this resin plate is the Polarizer that is pasted on the glass substrate of display panels.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, the cutting-off method that the present invention is pasted on the resin plate of glass substrate at least has following advantages and beneficial effect: the present invention is irradiated laser beam in resin plate (Polarizer) owing to being defocus condition, therefore compare with the position of beam condenser, it is lower that the peak value of light intensity distributions relatively becomes, and compare with the processing of position at light beam institute optically focused, more can be suppressed at the heat damage of giving glass substrate while cutting off Polarizer.On the other hand, when laser beam irradiation, tail-end value part in the light intensity distributions of laser beam is interdicted by shield, and the cut-out end face of the Polarizer therefore cutting out along shield end becomes precipitous inclined plane, thereby can obtain the high-quality goods of the cut-out end face with near vertical.
In sum, the invention relates to a kind of cutting-off method being pasted on such as the resin plate of glass substrate etc., it can suppress the heat damage to glass substrate, and makes to be as far as possible pasted on the section steepen of the resin plate of glass baseplate surface.The present invention is irradiated laser beam and cuts off the method for resin plate the resin plate being pasted on such as glass substrate etc., so that the state that the focus of laser beam defocuses above resin plate irradiates, the shield of laser beam will be covered, along the cut-out preset lines of mother substrate and so that cut off the state configuration that preset lines is exposed, be configured to and only make the peak value part in the light intensity distributions on resin plate surface of laser beam irradiate cutting off preset lines, other parts are interdicted by shield.The present invention has significant progress technically, has obvious good effect, is really a new and innovative, progressive, practical new design.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 (a) and Fig. 1 (b) mean the schematic diagram of an embodiment of cutting-off method of the present invention.
Fig. 2 (a) and Fig. 2 (b) mean the schematic diagram of the processing example of the situation of not using shield.
Fig. 3 is key diagram 1(a) and Fig. 1 (b) shown in the schematic diagram of step of cutting-off method.
Fig. 4 means the schematic diagram of other embodiment of cutting-off method of the present invention.
Fig. 5 (a) means by the schematic diagram of the kenel of the existing known formed groove of laser beam irradiation method to Fig. 5 (c).
[symbol description]
A: liquid crystal mother substrate
A1: unit panel
B: laser beam
C: groove
P: the focus of laser beam
1: glass substrate
2: Polarizer (resin plate)
3: shield
The specific embodiment
For further setting forth the present invention, reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, its specific embodiment of cutting-off method, method, step, feature and effect thereof to the resin plate proposing according to the present invention, be described in detail as follows.
Fig. 1 (a) mean glass substrate 1 in the liquid crystal mother substrate A cutting out before unit panel, with the profile that is pasted on the Polarizer 2 above it, be wherein to take this liquid crystal mother substrate A by laser beam B from the situation cutting off preset lines S and divide the unit panel A1, the A1 that are broken into left and right as example describes.
As shown in Fig. 1 (a), to become, make to suppress to the focus P of the laser beam B of the heat damage of glass substrate 1 mode toward the defocus condition of top (or below) skew of liquid crystal mother substrate A, laser optical system (diagram is outer) is configured in to the top that cuts off preset lines S.In the situation of the present embodiment, Polarizer 2 is with formation such as PET resins, and the thickness of glass substrate 1 is 0.7mm left and right, and the thickness of Polarizer 2 is 0.2mm left and right.In addition, by the position of the focus P of the laser beam B defocusing, be also that the distance H above of focus P and Polarizer 2 is set into about 2mm.
As the laser beam B being used, be preferably and use for the good wavelength of Polarizer 2 absorption efficiencies, for example there is the CO of the wavelength of 9.4 μ m or 10.6 μ m
2laser.
And, as shown in Fig. 1 (b), make to cut off preset lines S near under the state that exposes of part, along cutting off preset lines S in its both sides or one-sided configuration is covered the shield (shading member) 3 of laser beam B.Shield 3 is to use the CO such as glass plate or pad winding (shim tape)
2the material that laser cannot see through.
For convenience of explanation, the machining state when not using shield 3 describes simply.Fig. 2 (a) and Fig. 2 (b) mean the laser beam B irradiating with defocus condition, the schematic diagram of machining state when direct irradiation is in Polarizer 2 in the situation that not using shield 3.
The position of irradiating laser beam B above Polarizer 2 and be focus P is downside comparatively, the state namely defocusing, and also beam diameter is wide compared with focus P.Therefore, light intensity distributions on Polarizer 2, as as shown in Fig. 2 (b), become that to take the optical axis center of laser beam B be peak value part, and be compared to focus P (with reference to Fig. 5 (a)), draw the form (Gaussian distribution on gentle slope) of the mountain shape of the tail-end value (tail) that periphery is gently decayed toward the outer side.Once this laser beam B is irradiated in Polarizer 2, the groove C1 forming at Polarizer 2, as shown in Fig. 2 (a) as, become the shape that makes light intensity distributions reversion.Therefore, along the section that cuts off preset lines S and divide the Polarizer 2 of having no progeny, forming the inclined plane on gentle slope, is not state preferably as the disjunction quality of Polarizer 2.Although also according to the article shape of minute having no progeny and opinion, generally speaking, this inclined plane more near vertical is more high-quality.
In the present invention, as as shown in Fig. 3 (a), by shield 3 (shading member) so that cut off state that near the part of preset lines S exposes and along cutting off preset lines S configuration, only to make the irradiation of the peak value part B1 optical axis center in light intensity distributions near in the mode of cutting off preset lines S, by other tail-end value part B2 by shield 3 blockings.The end face of shield 3 and the interval L that cuts off preset lines S, be preferably 10～200 μ m left and right, is more preferred from 20～100 μ m left and right.
By make laser beam move along cutting off preset lines S in mode described above, and at Polarizer 2 the groove C as forming as shown in Fig. 3 (b).Laser beam is only with peak value part B1 in light intensity distributions, to irradiate the cut-out preset lines S part between the shield 3,3 of left and right, and tail-end value part B2 is by shield 3 blockings.Irradiate in the laser beam that cuts off preset lines S, because being irradiates with defocus condition, therefore with as while making focus be positioned at irradiating of Polarizer 2 above as, through the higher laser beam of the peak value of the luminous intensity of optically focused, compare, luminous intensity is weakened and is some strength roughly, can suppress the heat damage to glass substrate 1.In cutting off preset lines S, irradiate the laser beam of this peak value part B1, can or degrade and form groove C by melting.
In addition, at shadow surface, the tail-end value part B2 of the light intensity distributions of laser beam is interdicted by shield 3, by luminous intensity, be that the irradiation of peak value part B1 of roughly some strength is in Polarizer 2, therefore illuminated portion complete utilization roughly uniformly light energy process uniformly (degrading or melting), and the groove C after processing forms left and right sidewall through cutting straight precipitous inclined plane as shown in Fig. 3 (c).Therefore,, while glass substrate being broken into unit panel A1, A1 in 1 minute along cut-out preset lines S in next step, the end face of Polarizer 2 forms precipitous inclined plane, can make the width L1 of tilting zone diminish.Also, according to the present invention, can suppress to form precipitous inclined plane to the heat damage of glass substrate and at Polarizer.In the past, this effect only can be reached with contrary each other condition (defocusing or optically focused), but according to the present invention, can utilize scanning once to reach the processing result that in the past cannot make the best of both worlds.
Herein, for using concrete processing example of the present invention to describe.The liquid crystal mother substrate that the thickness of slab that is 0.7mm and resinous Polarizer 2 at the thickness of slab of glass substrate 1 is 0.2mm, the shield 3 that installation thickness of slab is 0.5mm, the end face of shield 3 is set as to 50 μ m with the interval L that cuts off preset lines S, the distance H defocusing above of the focus P of laser and Polarizer 2 is set as to 2mm, and with CO
2laser cutting Polarizer 2.
Its result is to make the width L1 of tilting zone be improved to the 38 μ ms less compared with 50 μ m of target.
In addition, in order to compare, carried out the result of same Ear Mucosa Treated by He Ne Laser Irradiation shield 3 is not installed, the width L1 of tilting zone is more than 80 μ m.
Then, for the second embodiment, describe.Fig. 4 means the situation that the Polarizer 2 of the state stickup with from the end face of glass substrate 1 overhanging (overhang) is cut off.
This situation, as shown in Fig. 4 (a), the end material part 2a cutting off from Polarizer 2 will be dropped, and therefore, shield 3 is only disposed at along glass substrate 1 side of the cut-out preset lines S of the end face of glass substrate 1.Then, with above-described embodiment similarly, laser beam B is irradiated on Polarizer 2 along cutting off preset lines S with defocus condition.Accordingly, the sidewall of the groove C ' forming at Polarizer 2, as shown in Fig. 4 (b), the side that has shield 3 in mounting, peripheral part (tail-end value part) B2 in similarly calorific intensity being distributed with last embodiment is by shield 3 blockings, therefore form precipitous inclined plane, opposition side forms the inclined plane on gentle slope.Using the Polarizer of the side on the inclined plane on this gentle slope 2 as end material 2a, abandon.
Whereby, as shown in Fig. 4 (c), can make to be pasted on the cut-out end face of the Polarizer 2 of glass substrate 1, the state consistent with the end face with glass substrate 1 cuts off, and can make the width L1 of tilting zone of the cut-out end face of Polarizer 2 diminish.
Above, though be illustrated for representational embodiment of the present invention, the present invention might not be specific to the above embodiments.For example, as the resin plate that should cut off, though disclose, there is the Polarizer of the glass substrate that is pasted on display panels, even become the substrate beyond the substrate glass of bottom, for also can utilize the present invention by what bear heat damage when irradiating laser beam.In addition in the present invention, can, reaching its object, not departing from the scope of claim, suitably revise, change.
The present invention uses when the resin plate that is pasted on glass substrate to as the Polarizer of display panels cuts off.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (3)
1. a cutting-off method for resin plate, is to being pasted on the resin plate of bottom substrate, makes laser beam one edge cut off preset lines and relatively moves, irradiates on one side and cut off this resin plate, it is characterized in that:
The light intensity distributions of the laser beam that this resin plate is irradiated near the optical axis center of light beam for the peak value part of some strength roughly be the tail-end value part gently decaying in its outside, the state defocusing toward short transverse from the surface of this resin plate with the focus of this laser beam irradiates, the shading member irradiating in the laser beam of this resin plate will be covered, so that the state that this cut-out preset lines is exposed to configure along the adjacent mode of this cut-out preset lines;
In this laser beam, the laser beam of this peak value part is irradiated this cut-out preset lines, and make the laser beam of this tail-end value part by this shading member blocking.
2. the cutting-off method of resin plate according to claim 1, is characterized in that wherein this laser beam is CO
2laser.
3. the cutting-off method of resin plate according to claim 1 and 2, is characterized in that wherein this resin plate is the Polarizer that is pasted on the glass substrate of display panels.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-106047 | 2013-05-20 | ||
| JP2013106047A JP6166587B2 (en) | 2013-05-20 | 2013-05-20 | Cutting method of resin plate attached to glass substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104175002A true CN104175002A (en) | 2014-12-03 |
Family
ID=51956499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410144034.8A Pending CN104175002A (en) | 2013-05-20 | 2014-04-10 | Cutting method of resign board pasted at glass substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6166587B2 (en) |
| KR (1) | KR20140136861A (en) |
| CN (1) | CN104175002A (en) |
| TW (1) | TWI581885B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110506307A (en) * | 2017-06-23 | 2019-11-26 | 日东电工株式会社 | The manufacturing method of image display device and pass through the resulting image display device of the manufacturing method |
| US20210181397A1 (en) * | 2017-04-28 | 2021-06-17 | Samsung Display Co., Ltd. | Polarizing layer, display device with the same, and fabricating method for the display device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160126175A (en) * | 2015-04-22 | 2016-11-02 | 삼성디스플레이 주식회사 | Method of cutting a substrate and method of manufacturing a display apparatus |
| KR102286476B1 (en) * | 2019-05-23 | 2021-08-06 | 코닝 인코포레이티드 | Glass substrate cutting method and light guide plate manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1145611A (en) * | 1966-04-08 | 1969-03-19 | Philips Electronic Associated | Improvements in or relating to methods of drilling a hole in a workpiece with the aid of a high-energy beam of rays |
| CN1294540A (en) * | 1999-02-25 | 2001-05-09 | 精工爱普生株式会社 | Method for machining work by laser beam |
| JP2002023151A (en) * | 2000-07-12 | 2002-01-23 | Toshiba Corp | Method and device for manufacture of liquid crystal display device having polarizing plate |
| JP2004314155A (en) * | 2003-04-18 | 2004-11-11 | Murata Mfg Co Ltd | Laser beam machining method |
| JP2012076090A (en) * | 2010-09-30 | 2012-04-19 | Mitsuboshi Diamond Industrial Co Ltd | Laser beam machining device, method for machining workpiece, and method for dividing workpiece |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3742182A (en) * | 1971-12-27 | 1973-06-26 | Coherent Radiation | Method for scanning mask forming holes with a laser beam |
| JPH01321087A (en) * | 1988-06-21 | 1989-12-27 | Matsushita Electric Ind Co Ltd | Laser beam machining method and its machine for organic film |
| JPH04251688A (en) * | 1991-01-23 | 1992-09-08 | Fanuc Ltd | Laser beam machine |
| JPH1158748A (en) * | 1997-08-12 | 1999-03-02 | Brother Ind Ltd | Method and apparatus for manufacturing ink jet head |
| US6278078B1 (en) * | 1999-06-02 | 2001-08-21 | Lockheed Martin Corporation | Laser soldering method |
| JP4093891B2 (en) * | 2002-04-02 | 2008-06-04 | シャープ株式会社 | Liquid crystal panel, liquid crystal panel manufacturing method and liquid crystal panel manufacturing apparatus |
| JP2005138126A (en) * | 2003-11-05 | 2005-06-02 | Mitsubishi Heavy Ind Ltd | Welding system |
| JP2005152966A (en) * | 2003-11-27 | 2005-06-16 | Fuji Photo Film Co Ltd | Laser beam machining method, and blank transfer method |
| US8035901B2 (en) * | 2008-04-30 | 2011-10-11 | Corning Incorporated | Laser scoring with curved trajectory |
| JP2010050175A (en) * | 2008-08-20 | 2010-03-04 | Disco Abrasive Syst Ltd | Laser processing method and laser processing device |
| JP2010105016A (en) * | 2008-10-30 | 2010-05-13 | Toray Advanced Film Co Ltd | Laser beam machining method and apparatus |
| WO2011071886A1 (en) * | 2009-12-07 | 2011-06-16 | J.P. Sercel Associates, Inc. | Laser machining and scribing systems and methods |
-
2013
- 2013-05-20 JP JP2013106047A patent/JP6166587B2/en not_active Expired - Fee Related
-
2014
- 2014-01-09 TW TW103100795A patent/TWI581885B/en not_active IP Right Cessation
- 2014-01-28 KR KR20140010405A patent/KR20140136861A/en not_active Application Discontinuation
- 2014-04-10 CN CN201410144034.8A patent/CN104175002A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1145611A (en) * | 1966-04-08 | 1969-03-19 | Philips Electronic Associated | Improvements in or relating to methods of drilling a hole in a workpiece with the aid of a high-energy beam of rays |
| CN1294540A (en) * | 1999-02-25 | 2001-05-09 | 精工爱普生株式会社 | Method for machining work by laser beam |
| JP2002023151A (en) * | 2000-07-12 | 2002-01-23 | Toshiba Corp | Method and device for manufacture of liquid crystal display device having polarizing plate |
| JP2004314155A (en) * | 2003-04-18 | 2004-11-11 | Murata Mfg Co Ltd | Laser beam machining method |
| JP2012076090A (en) * | 2010-09-30 | 2012-04-19 | Mitsuboshi Diamond Industrial Co Ltd | Laser beam machining device, method for machining workpiece, and method for dividing workpiece |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210181397A1 (en) * | 2017-04-28 | 2021-06-17 | Samsung Display Co., Ltd. | Polarizing layer, display device with the same, and fabricating method for the display device |
| CN110506307A (en) * | 2017-06-23 | 2019-11-26 | 日东电工株式会社 | The manufacturing method of image display device and pass through the resulting image display device of the manufacturing method |
| CN110506307B (en) * | 2017-06-23 | 2022-09-20 | 日东电工株式会社 | Method for manufacturing image display device and image display device obtained by the manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201444630A (en) | 2014-12-01 |
| KR20140136861A (en) | 2014-12-01 |
| JP6166587B2 (en) | 2017-07-19 |
| JP2014226671A (en) | 2014-12-08 |
| TWI581885B (en) | 2017-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104364209B (en) | Method and arrangement for creating bevels on the edges of flat glass | |
| WO2014030519A1 (en) | Workpiece cutting method | |
| CN104175002A (en) | Cutting method of resign board pasted at glass substrate | |
| TWI637922B (en) | Chamfering method of glass substrate and laser processing device | |
| US9500781B2 (en) | Optical system and laser processing apparatus | |
| WO2017055576A1 (en) | Method and device for laser processing of transparent materials | |
| WO2014030520A1 (en) | Workpiece cutting method | |
| JP2014041925A (en) | Method for cutting workpiece | |
| KR101407993B1 (en) | Method for cutting substrate | |
| JP5030871B2 (en) | Resin welding method | |
| KR102548869B1 (en) | Flexible display device and manufacturing method thereof | |
| JP5490808B2 (en) | Solar cell module manufacturing method and solar cell module manufacturing apparatus | |
| KR20130058604A (en) | Method for scribing brittle material substrate and device for scribing brittle material substrate | |
| CN110625270A (en) | Ultrafast laser processing method | |
| WO2014030517A1 (en) | Workpiece cutting method | |
| KR102536286B1 (en) | Coating Layer Removal Method using Laser | |
| JP2007029952A (en) | Laser beam machining apparatus, and laser beam machining method | |
| JP2010142829A (en) | Laser processing method | |
| KR20130076440A (en) | Laser cutting apparatus and laser cutting method | |
| KR100690338B1 (en) | The method and the device for cutting the flat display glass panel, which use the laser | |
| KR200407370Y1 (en) | The device for cutting the flat display glass panel, which use the laser | |
| JP6673689B2 (en) | Laser processing apparatus, laser processing method, and manufacturing method of bonded body | |
| JP2012000622A (en) | Laser scribing method for brittle material substrate | |
| US20240042545A1 (en) | Techniques and apparatuses for bonding laminate structures | |
| KR101163153B1 (en) | Method for forming a pattern using a plurality of spots |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141203 |