Large scale display screen and manufacture method thereof
Technical field
The invention belongs to Display Technique field, particularly a kind of large scale display screen and manufacture method thereof.
Background technology
At present, in Display Technique field, grow with each passing day for the demand of large screen display, in various demonstration skillsArt is as in PDP, LCD, OLED technology, and the size of display device self is all difficult to do greatly, makes to obtain simultaneouslyLarge screen display to low cost, rate of good quality rate is very difficult, thereby has affected high-performance, giant-screen is aobviousShow the development of technology, limited the application of Display Technique in fields such as meeting room, home theater, outdoor advertisings.
In order to obtain large-sized display screen, prior art adopts splicing more, directly by super narrow framePolylith display screen splicing, but due to the existence of the row/column scan drive circuit at display screen edge, cannot be realRealize " seamless " splicing.
In order to eliminate splicing gap, existing another kind of method is to use optical lens array that image is amplified toMosaic screen frame region, to realize seamless display, and a large amount of uses and the exactitude position of optical lens have increasedThe manufacturing cost of display screen, and the contraposition of optical lens certainly exists error, has inevitably reducedYields, makes the preparation technology of large display device more complicated.
Summary of the invention
The object of the present invention is to provide a kind of large scale display screen, be intended to solve traditional large scale display screenSplicing gap larger problem, and make manufacturing cost controlled and improve yields.
The present invention is achieved in that a kind of large scale display screen, comprises display front plate and the thin film transistor (TFT) back of the bodyPlate, described thin film transistor (TFT) backboard is provided with horizontal scanning line, the column scan line for driving described display front plateAnd thin film transistor (TFT) array, described thin film transistor (TFT) backboard is formed by multiple thin film transistor (TFT) backboard unit spliceds,Each described thin film transistor (TFT) backboard unit all offer with described horizontal scanning line and column scan line one to oneVia;
Horizontal scanning line on the each described thin film transistor (TFT) backboard unit of splicing and column scan line are all by right mutuallyThe via of answering is guided the back of described thin film transistor (TFT) backboard into and is electrically connected.
Another object of the present invention is to provide a kind of method of manufacturing large scale display screen, comprise the steps:
Prepare the thin film transistor (TFT) backboard unit with horizontal scanning line and column scan line to be spliced, described thinThe splicing edge place of film transistor backboard unit offers the conducting corresponding with described horizontal scanning line and column scan lineHole;
Guide described horizontal scanning line and column scan line into described thin film transistor (TFT) backboard list by corresponding viaThe back of unit;
By the horizontal scanning line of pre-splicing thin film transistor (TFT) backboard unit and column scan line respectively at described film crystalline substanceThe back of body pipe backboard unit is electrically connected, and obtains the thin film transistor (TFT) backboard of splicing;
Obtain the display front plate of monomer structure, described display front plate and thin film transistor (TFT) backboard assembled,Form large scale display screen.
A further object of the present invention is to provide the another kind of method of manufacturing large scale display screen, comprises following stepRapid:
Preparation is with the thin film transistor (TFT) backboard unit of horizontal scanning line and column scan line, at described thin film transistor (TFT)The splicing edge place of backboard unit offers the via corresponding with described horizontal scanning line and column scan line;
Guide described horizontal scanning line and column scan line into described thin film transistor (TFT) backboard list by corresponding viaThe back of unit;
Obtain display front plate unit, and described display front plate unit and thin film transistor (TFT) backboard unit are assembled intoDisplay unit body;
By the horizontal scanning line of pre-splicing described display unit body and column scan line respectively at described thin film transistor (TFT)The back of backboard unit is electrically connected, and forms large scale display screen.
The present invention, by offering via on the thin film transistor (TFT) backboard at display screen, sweeps horizontal scanning line and rowRetouch line and guide the back of thin film transistor (TFT) backboard by via into, and be electrically connected at its back, avoid accounting forWith the space in thin film transistor (TFT) backboard front, eliminate the splicing gap being caused by row, column scanning circuit, enterAnd realize the seamless spliced of large scale display screen. And complexity and the cost of its manufacture method obtainEffective control, compared with the method for eliminating splicing gap with traditional employing optical lens system, simplifiedManufacturing process, has reduced cost, and owing to having avoided the impact of lens aligning accuracy, makes the good of productProduct rate is improved, and then has improved production efficiency, is applicable to batch production.
Brief description of the drawings
Fig. 1 is the sectional view of the first structure of the large scale display screen that provides of first embodiment of the invention;
Fig. 2 is the solid of thin film transistor (TFT) backboard in the large scale display screen that provides of first embodiment of the inventionFigure;
Fig. 3 is thin film transistor (TFT) backboard and pixel in the large scale display screen that provides of first embodiment of the inventionFront view;
Fig. 4 is that the front of thin film transistor (TFT) backboard in the large scale display screen that provides of first embodiment of the invention is lookedFigure;
Fig. 5 is that the back side of thin film transistor (TFT) backboard in the large scale display screen that provides of first embodiment of the invention is lookedFigure;
Fig. 6 is the sectional view of the second structure of the large scale display screen that provides of first embodiment of the invention;
Fig. 7 is the sectional view of the third structure of the large scale display screen that provides of first embodiment of the invention;
Fig. 8 is the sectional view of the first structure of the large scale display screen that provides of second embodiment of the invention;
Fig. 9 is supporting substrate and the thin film transistor (TFT) back of the body in the large scale display screen that provides of second embodiment of the inventionThe stereogram of plate;
Figure 10 is the stereogram of supporting substrate in the large scale display screen that provides of second embodiment of the invention;
Figure 11 is the partial structurtes schematic diagram of the supporting substrate of a-quadrant in Figure 10;
Figure 12 is the sectional view of the second structure of the large scale display screen that provides of second embodiment of the invention;
Figure 13 is the method flow diagram of the manufacture large scale display screen that provides of third embodiment of the invention;
Figure 14 is the method flow diagram of the manufacture large scale display screen that provides of fourth embodiment of the invention.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and realityExecute example, the present invention is further elaborated. Only should be appreciated that specific embodiment described hereinOnly, in order to explain the present invention, be not intended to limit the present invention.
Below in conjunction with specific embodiment, specific implementation of the present invention is further described in more detail:
Embodiment mono-:
Fig. 1 shows the sectional view of the large scale display screen that first embodiment of the invention provides, and Fig. 2 showsThe stereogram of thin film transistor (TFT) backboard in this large scale display screen, Fig. 3 shows in this large scale display screen thinThe top view of film transistor backboard and pixel, for convenience of explanation, only shows the portion relevant to the present embodimentPoint.
As Fig. 1,3, this large scale display screen comprises display front plate 1 and thin film transistor (TFT) backboard 2, film crystalline substanceBody pipe backboard 2 is provided with horizontal scanning line 21 and the column scan line 22 for driving display front plate 1, Yi JichengThe thin film transistor (TFT) 23 that array distributes, display front plate 1 comprises pixel 11 and base plate for packaging 12. Film crystalline substanceBody pipe 23 is corresponding one by one with the pixel 11 in display front plate 1. And thin film transistor (TFT) backboard 2 is by multipleThin film transistor (TFT) backboard unit 20 is spliced.
Further combined with Fig. 2,3, seamless spliced in order to realize, the present embodiment is at each thin film transistor (TFT) backboardOn unit 20, (preferably near splicing edge place) offered multiple vias 24. Via 24 and its placeHorizontal scanning line 21 on thin film transistor (TFT) backboard unit 20 and column scan line 22 are corresponding one by one. And, leadingIn through hole 24, be filled with conducting medium, as the metal of high conductivity, every horizontal scanning line 21 and column scan line22 are all connected with the conducting medium in corresponding via 24, and then extend to thin by conducting mediumThe back of film transistor backboard unit 20, is electrically connected at back.
In conjunction with Fig. 4,5, in the time of splicing thin film transistor (TFT) backboard unit, be positioned at a thin film transistor (TFT) backboard listThe first row scan line in unit 211 and be positioned at the second horizontal scanning line on another thin film transistor (TFT) backboard unit212 are drawn by each self-corresponding the first via 241 and the second via 242 respectively, at thin film transistor (TFT)The back of backboard unit 20, the conducting medium in the first via 241 and the second via 242 is by flexibleWire 3(winding displacement) be connected, specifically can be at the backside anisotropy conductiving glue 4 of these two vias, soFrom the mode of be dynamically connected (TAB), the two ends of winding displacement 3 are connected respectively to two vias by flexible-belt afterwardsOn the anisotropy conductiving glue 4 at place. In this way, make the first row scan line 211 and the second line scanningLine 212 has been realized electrical connection, can will all need the horizontal scanning line 21 of electrical connection mutually in the same wayCouple together, the connected mode of column scan line 22 is identical. And then, each thin film transistor (TFT) backboard unit 20 itBetween realized seamless spliced.
It should be noted that, display front plate 1 can adopt the large scale display front plate of monolithic, as Fig. 7; AlsoCan with thin film transistor (TFT) backboard 2, be spliced by multi-disc display front plate unit 10, each display front plateUnit all has some pixels and a base plate for packaging, as Fig. 1,6. No matter adopt the display front plate of which kind of type,All can not produce significantly impact to the width in splicing gap, the present invention can select to show according to actual needsThe type of header board, the present embodiment needn't strictly limit. In the time adopting the display front plate of splicing construction, respectively showHeader board unit 10 is with forming a display unit body with the thin film transistor (TFT) backboard unit 20 of its contraposition, and this is largeSize display screen is considered as being spliced by multiple display unit bodies.
The large scale display screen that the present embodiment provides passes through via 24 by horizontal scanning line 21 and column scan line 22Guide the back of thin film transistor (TFT) backboard into, connect by flexible wire 3 at its back, therefore needn't take thinThe space in film transistor backboard front, has really realized the seamless spliced of large scale display screen. And this is largeSize display screen, compared with traditional mosaic screen, has only increased via, can not cause the complexity of manufacturing processChange; And compared with the display screen of covering splicing gap with traditional employing lens, can also be to a certain extentReduce costs, in addition, owing to having avoided the impact of lens aligning accuracy, can also effectively improve yields.
Further combined with accompanying drawing 1, the base plate for packaging 12 of display front plate 1 can pass through packaging plastic 5 and film crystalline substanceBody pipe backboard 2 carries out bonding, and via 24 can be positioned at the inner side of packaging plastic 5, as Fig. 1, also canTo be positioned at the outside of packaging plastic 5, as Fig. 6, the present embodiment needn't strictly limit.
Further, in the time that display front plate 1 adopts splicing construction, can also be outside the display screen having splicedSide covers a gripper shoe 6, and this gripper shoe 6 is mainly used in carrying multiple display unit bodies, ensures that large scale is aobviousShow the stable splicing of screen, make the entirety of large scale display screen more attractive in appearance simultaneously, and can be simultaneously as encapsulationSubstrate. This gripper shoe 6 can be positioned at the front (image output face) of display screen, also can be positioned at display screenThe back side. And in the time that display front plate 1 adopts single chip architecture, also can omit gripper shoe 6, reduce on the one handThe thickness of display screen, has saved manufacturing process and manufacturing cost on the other hand.
Be appreciated that horizontal scanning line 21 need be connected with driver module with column scan line 22, to control film crystalline substanceThe duty of body pipe 23. As a kind of implementation, for the first row scan line of any one group of electrical connection211 and the second horizontal scanning line 212(Fig. 4), can only establish a line scanning driver module, without at eachOn the thin film transistor (TFT) backboard unit 20 of individual splicing, all establish independent line scanning driver module. For any one groupThe column scan line of electrical connection, can only establish a column scan driver module, without the film in each splicingOn transistor backboard unit 20, all establish independent column scan driver module. Can reduce like this line scanning and drive mouldThe quantity of piece and column scan driver module is greatly simplified, and is fallen in circuit structure and type of driveLow cost.
Be appreciated that the display mode of display front plate 1 is to realizing the seamless spliced restrictive function that do not have, before demonstrationPlate 1 can be specifically liquid crystal panel, can be also oled panel etc. No matter adopt which kind of panel, it is logicalOften comprise a luminous component, also a configurable colored filter membrane (not shown, when adopting when oled panel,Can determine whether to configure colored filter membrane according to the emission type of OLED). For liquid crystal panel, luminous componentFor liquid crystal layer, for oled panel, luminous component is oled layer. Colored filter membrane can comprise arrayThe red, green, blue color-filter unit of formula, one of the luminous component of every group of red, green, blue color-filter unit and its contrapositionIndividual region has formed a pixel 11, and its luminance is controlled by corresponding thin film transistor (TFT) 23.
To sum up, the present embodiment is by convince through hole 24 by patient analysis on thin film transistor (TFT) backboard unit 20, by row, columnScan line is guided the back of thin film transistor (TFT) backboard into from via 24, undertaken by flexible wire 3 at its backElectrical connection, without the space that takies display screen front, has realized the seamless spliced of large scale display screen. Meanwhile,In the manufacturing process of display screen and yields, be all improved and optimize, and having saved manufacturing cost,Be applicable to batch production.
Embodiment bis-:
Fig. 8 shows the cross section of the first structure of the large scale display screen that second embodiment of the invention providesFigure, for convenience of explanation, only shows the part relevant to the present embodiment.
Similar with described in above-described embodiment one of the basic structure of the large scale display screen that the present embodiment provides, asFig. 3,8, includes display front plate 1 and the thin film transistor (TFT) that spliced by thin film transistor (TFT) backboard unit 20 is carried on the backPlate 2 is provided with horizontal scanning line 21 and column scan line 22, and is array distribution on thin film transistor (TFT) backboard 2Thin film transistor (TFT) 23, thin film transistor (TFT) 23 is corresponding one by one with the pixel 11 in display front plate 1. EachOn thin film transistor (TFT) backboard unit 20, be equipped with multiple vias 24, the film crystalline substance at via 24 and its placeHorizontal scanning line 21 on body pipe backboard unit 20 and column scan line 22 are corresponding one by one. Every horizontal scanning line 21All be connected with the conducting medium in corresponding via 24 with column scan line 22, and then be situated between by conductionMatter extends to the back of thin film transistor (TFT) backboard 2. Different from above-described embodiment one: in the present embodiment,The connected mode difference of horizontal scanning line 21, column scan line 22. Specifically with reference to figure 9,10, in the present embodimentLarge scale display screen also comprises a large scale supporting substrate 7 with pin configuration, and supporting substrate 7 is with drawingThe back of the face of line structure and thin film transistor (TFT) backboard 2 connects.
Concrete, pin configuration comprises line scanning lead-in wire 71 and column scan lead-in wire 72, line scanning lead-in wire 71 withWith corresponding corresponding setting of via 24 of horizontal scanning line 21, column scan lead-in wire 72 and same column scan line 22Corresponding corresponding setting of via 24. Preferably, can go between 71 and column scan lead-in wire 72 in line scanningUpper making and via 24 terminal of being convenient to be electrically connected of contraposition one by one, i.e. line scanning lead terminal 711 and rowScanning lead terminal 721, as Figure 11. Conducting medium in via 24 can with line scanning lead terminal711 721 contrapositions contact with column scan lead terminal. Like this, as long as by supporting substrate 7 and display screen monomerGood hyte is loaded, just can be by a line scanning lead-in wire 71 by the corresponding row on multiple display screen monomersScan line 21 is together in series one by one, according to same connected mode, will be many by a column scan lead-in wire 72Respective column scan line 22 on individual display screen monomer is together in series one by one. And then, draw by whole line scanningsLine 71 and column scan lead-in wire 72 have been realized the connection of all row, column scan lines, thereby have realized film crystalPipe backboard 2 seamless spliced.
Identical with embodiment mono-, display front plate 1 can adopt the large scale display front plate of single chip architecture, asFigure 12; Also can be spliced by multiple display front plates unit 10, as Fig. 8, the present embodiment needn't strictly be limitSystem.
In the present embodiment, the distributional pattern of line scanning lead-in wire 71 and column scan lead-in wire 72 can have multiple,Can be regular arranging in length and breadth as shown in figure 10, this be preferred distribution mode, is convenient to manufacture and showThe splicing of screen monomer. In addition, the shape of lead-in wire and arrangement mode can be also irregular, as long as can protectDemonstrate,prove the via corresponding with horizontal scanning line 21 24 and line scanning 71 contrapositions that go between, corresponding with column scan line 22Via 24 and column scan 72 contrapositions that go between, can realize effective connection of row, column scan line, forShape and the distribution form of lead-in wire needn't strictly limit.
Improve as the one of the present embodiment, for the first row scan line 211 of any one group of electrical connection and theTwo horizontal scanning line 212(Fig. 4), can only establish a line scanning driver module, without corresponding each splicingIndependent line scanning driver module is all established in unit. For the column scan line of any one group of electrical connection, can only establishA column scan driver module, all establishes independent column scan driver module without corresponding each concatenation unit.This line scanning driver module and column scan driver module can be arranged on supporting substrate 7, also can be arranged atOn display screen. Like this, spliced large scale display screen obtains very big letter in circuit structure and type of driveChange, and reduced accordingly cost.
Further, the structure of the display front plate 1 of the display screen monomer in the present embodiment can be with above-mentioned enforcementExample one is identical, can be liquid crystal display, can be also OLED demonstration etc., the driving of its display front plate 1Principle is also identical with above-described embodiment one, repeats no more herein.
In addition, the present embodiment is owing to having adopted with leaded supporting substrate 7, and therefore this supporting substrate 7 alsoCan there is the identical effect of gripper shoe 6 in same embodiment mono-, for carrying multiple display unit bodies,Ensure the stable splicing of large scale display screen. Certainly, another support also can be set on display front plate 1Plate, further to protect display screen. To sum up, the present embodiment is guided row, column scan line into by via 24The back of thin film transistor (TFT) backboard, the supporting substrate 7 with row, column scanning lead-in wire in this back docking simultaneously,Scan lead-in wire by row, column row, column scan line is together in series respectively, realized the seamless spliced of display screen.In addition, this large scale display screen, compared with traditional display screen, makes the complexity of manufacturing cost and manufacturing process equallyDegree is under control, and has improved yields, is applicable to batch production.
By specific embodiment, the manufacture method of above-mentioned large scale display screen is described below:
Embodiment tri-:
Figure 13 shows the manufacture method flow chart of the large scale display screen that third embodiment of the invention provides, forBe convenient to explanation, only show the part relevant to the present embodiment.
The method mainly comprises the steps:
In step S301, prepare the thin film transistor (TFT) backboard with horizontal scanning line and column scan line to be splicedUnit, offers corresponding with horizontal scanning line and column scan line at the splicing edge place of thin film transistor (TFT) backboard unitVia;
In step S302, guide horizontal scanning line and column scan line into thin film transistor (TFT) by corresponding viaThe back of backboard unit;
In step S303, horizontal scanning line and the column scan line of pre-splicing thin film transistor (TFT) backboard unit are dividedBe not electrically connected at the back of thin film transistor (TFT) backboard unit, obtain the thin film transistor (TFT) backboard of splicing;
In step S304, obtain the display front plate of monomer structure, by display front plate and thin film transistor (TFT) backboardAssemble, form large scale display screen.
In the present embodiment, in the time adopting OLED to show, display front plate 1 can directly be prepared in film crystalline substanceOn body pipe backboard 2.
Be appreciated that step S301 ~ 303 and the carrying out order of step S304 needn't strictly limit, and,(as prepared horizontal scanning line, column scan line on thin film transistor (TFT) backboard unit, preparation is aobvious for other preparation processShow header board etc.) can adopt the technique of prior art to carry out, the present embodiment does not strictly limit.
Further, as the preferred implementation of one of step S302, can in via, fill and leadDielectric, is connected horizontal scanning line and column scan line, by leading with the conducting medium in corresponding viaDielectric is guided horizontal scanning line and column scan line at the back of thin film transistor (TFT) backboard.
Further, as the preferred implementation of one of step S303, can realize like this:
First, choose a substrate, thin film transistor (TFT) backboard unit is placed on substrate and makes it back upwardPlace;
Then, adopt wire at back, horizontal scanning line to be connected to be connected respectively with column scan line, realize thinThe splicing of film transistor backboard unit.
Concrete, can be by adopting flexible wire by corresponding with horizontal scanning line and column scan line to be connectedVia in conducting medium be connected and realize the connection of horizontal scanning line or column scan line.
Further, after having spliced display screen, can also be in its front or back assemble another large scaleGripper shoe, for the large scale display screen further supporting and protection has been spliced.
Further, splicing after display screen, one group of line scanning driver module can be set and one group of row is sweptRetouch driver module, then the flexible wire being all connected with horizontal scanning line is all connected to line scanning driver moduleUpper, the flexible wire being all connected with column scan line is all connected on column scan driver module. Like this canAvoid, on each thin film transistor (TFT) backboard unit, turntable driving module is set, in circuit structure and type of driveOn all simplified, and can reduce costs.
As the preferred implementation of another kind of step S303, can realize like this:
First, preparation, with the supporting substrate of many line scanning lead-in wires and column scan lead-in wire, makes line scanning lead-in wireCorresponding with the via corresponding to horizontal scanning line, make column scan lead-in wire and the via corresponding to column scan lineCorresponding;
Then, the unit contraposition of thin film transistor (TFT) backboard is assembled on supporting substrate, makes the conduction in viaMedium and line scanning lead-in wire and the column scan contraposition one by one that goes between is connected, and realizes the spelling of thin film transistor (TFT) backboard unitConnect.
The structure of above-mentioned supporting substrate can be with reference to shown in Figure 10, but is not limited only to structure shown in Figure 10, as:The shape of line scanning lead-in wire and column scan lead-in wire needn't be as shown in figure 10 regular shape, as long as can ensure withThe via that horizontal scanning line is corresponding and the contraposition of line scanning lead-in wire, the via corresponding with column scan line and column scanLead-in wire contraposition.
Now, one group of line scanning driver module and one group of column scan driver module can be set on supporting substrate,Line scanning lead-in wire and column scan lead-in wire are connected to respectively to line scanning driver module and column scan driver module. WhenSo, this line scanning driver module and column scan driver module also can be arranged on thin film transistor (TFT) backboard. NothingOpinion line scanning driver module and column scan drive module setting, in where, all only need to arrange independent one group, at electricityIn line structure and type of drive, all simplified, and can be reduced costs.
The thin film transistor (TFT) backboard that can obtain splicing construction by the method for the present embodiment coordinates the aobvious of monomer structureShow the large scale display screen of header board, this preparation method is by offer via on thin film transistor (TFT) backboard unit,Guide horizontal scanning line and column scan line the back of thin film transistor (TFT) backboard into by via, and lead by flexibilityLine or supporting substrate are electrically connected, avoid taking the space in display screen front, have really realized display screenSeamless spliced. In addition, the method has been saved compared with eliminating the method for splicing gap with traditional employing lensCost, has simplified manufacturing process, and has improved yields, and then has significantly improved production efficiency,Be suitable for the batch production of large scale display screen.
Embodiment tetra-:
Figure 14 shows the manufacture method flow chart of the large scale display screen that fourth embodiment of the invention provides, forBe convenient to explanation, only show the part relevant to the present embodiment.
The method mainly comprises the steps:
In step S401, prepare the thin film transistor (TFT) backboard unit with horizontal scanning line and column scan line,The splicing edge place of thin film transistor (TFT) backboard unit offers the via corresponding with horizontal scanning line and column scan line;
In step S402, guide horizontal scanning line and column scan line into thin film transistor (TFT) by corresponding viaThe back of backboard unit;
In step S403, obtain display front plate unit, and by display front plate unit and thin film transistor (TFT) backboardUnit is assembled into display unit body;
In the present embodiment, the obtain manner of display front plate unit needn't strictly limit. In addition, work as employingWhen OLED shows, display front plate unit can directly be prepared on thin film transistor (TFT) backboard unit.
In step S404, by the horizontal scanning line of pre-splicing display unit body and column scan line respectively at filmThe back of transistor backboard unit is electrically connected, and forms large scale display screen.
Further, as the preferred implementation of one of step S402, can in via, fill and leadDielectric, is connected horizontal scanning line and column scan line, by leading with the conducting medium in corresponding viaDielectric is guided horizontal scanning line and column scan line at the back of thin film transistor (TFT) backboard. Further, as stepThe preferred implementation of one of rapid S404, can realize like this:
First, choose a substrate, pre-splicing display unit body is placed on substrate and makes it back upwardPlace;
Then, adopt wire that horizontal scanning line to be connected is connected respectively with column scan line, form large scale aobviousShow screen.
As the preferred implementation of another kind of step S404, can realize like this:
First, preparation, with the supporting substrate of many line scanning lead-in wires and column scan lead-in wire, makes line scanning lead-in wireCorresponding with the via corresponding to horizontal scanning line, make column scan lead-in wire and the via corresponding to column scan lineCorresponding;
Then, the contraposition of display unit body is assembled on supporting substrate, makes conducting medium and row in viaScanning lead-in wire and the column scan contraposition one by one that goes between is connected, formation large scale display screen.
In the present embodiment, the setting position of line scanning driver module and column scan driver module can be with above-mentioned realityExecute described in example three, repeat no more.
Can obtain the large scale display screen being spliced by display unit body, this system by the method for the present embodimentPreparation Method is guided horizontal scanning line and column scan line into thin film transistor (TFT) backboard by via by via equallyBack, and be electrically connected by flexible wire or supporting substrate, really realized the seamless spelling of display screenConnect. In addition, the method has been saved cost compared with eliminating the method for splicing gap with traditional employing lens,Improve production efficiency, be applicable to batch production.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, not all at thisAny amendment of doing within bright spirit and principle, be equal to and replace and improvement etc., all should be included in the present inventionProtection domain within.