CN103904553B - Surface mounting type laser - Google Patents
Surface mounting type laser Download PDFInfo
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- CN103904553B CN103904553B CN201410092133.6A CN201410092133A CN103904553B CN 103904553 B CN103904553 B CN 103904553B CN 201410092133 A CN201410092133 A CN 201410092133A CN 103904553 B CN103904553 B CN 103904553B
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- conductive block
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Abstract
The invention relates to a surface mounting type laser. The laser comprises a positive electrode conductive block, a negative electrode conductive block, a positioning groove, an internal positive electrode wire and an LD chip. According to the position and connection relation between all the components, the positive electrode conductive block and the negative electrode conductive block serve as two bottom layer conductive and heat dissipating blocks, the LD chip is glued to the upper surface of the negative electrode conductive block, and the internal positive electrode wire has the function of conductively connecting the LD chip and the positive electrode conductive block; the positive electrode conductive block, the negative electrode conductive block and the LD chip are wrapped in the positioning groove, and thus the surface mounting type laser is formed. When the laser is used, the laser is welded to a positive electrode bonding pad and a negative electrode bonding pad of a circuit board. The laser is extremely small in size, fundamental improvement is made to the welding method, a traditional machining mode is broken through, the design of many finished products can be optimized, and actual operation is facilitated better.
Description
Technical field
The present invention relates to SMD laser instrument, belongs to field of lasers.
Background technology
It is direct insertion that conventional laser instrument is substantially three feet, will punch on circuit boards, when product is miniature during use
After changing design, not in one plane spatially, in assembling processing, the form of this straight cutting seems very the mode of three feet
It is inconvenient；And after being changed to paster encapsulation, the encapsulation of volume ratio straight cutting is little, assembly cost is lower, and is sticked for matching with dress automatically.
The content of the invention
The present invention carries out improving improvement for the problems referred to above, the laser instrument of the invention using when be surface soldered, automatization
Degree is high, under same space, can put multiple laser instrument.
The present invention provides a kind of paster laser instrument, and the laser instrument includes following structure：
1) positive conductive block；
2) negative conductive block；
3) locating slot；
4) internal positive wire；
5) LD chips；
Position and annexation between each part is：Positive conductive block is conductive simultaneous as 2 bottoms with negative conductive block
Radiating block, LD chips are then adhesive in the upper surface of negative conductive block, and internal positive wire is between LD chips and positive conductive block
The effect of being conductively connected is connected；Locating slot wraps positive and negative electrode conducting block and LD chips, and thus composition one is SMD swashs
Light device；During use, the laser instrument is welded on circuit board positive and negative electrode pad.
Whole laser instrument is SMD cuboid framework, and its positive conductive block, negative conductive block and locating slot are used as one
Bottom liner body, LD chips are placed on negative conductive block top, and align negative pole conducting block outward flange, and positioned at locating slot indentation, there
Centre position, it is bonding with elargol between negative conductive block and LD chips, radiating is played with conductive effect；Finally internal positive
Wire two ends are welded between LD chips and positive conductive block respectively.
Paster laser instrument volume ratio tradition straight cutting individual laser package is much smaller, and can be in circuit board or aluminium base
Two-sided paster, without punching in the circuit board so that assembly cost is low, is sticked for matching with dress automatically.
Description of the drawings
By referring to accompanying drawing be more fully described the present invention exemplary embodiment, the present invention above and other aspect and
Advantage will become more easily clear, in the accompanying drawings：
Fig. 1 is the vertical section structure schematic diagram of the paster laser instrument of the present invention；
Fig. 2 be the present invention being completed of paster laser instrument after be powered design sketch.
Specific embodiment
Hereinafter, the present invention is more fully described now with reference to accompanying drawing, various embodiments is shown in the drawings.So
And, the present invention can be implemented in many different forms, and should not be construed as limited to embodiment set forth herein.Phase
Instead, there is provided it will thoroughly and completely, and fully convey the scope of the present invention to ability that these embodiments cause the disclosure
Field technique personnel.
Hereinafter, the exemplary embodiment of the present invention is more fully described with reference to the accompanying drawings.
Refer to the attached drawing 1, the main part of the design are as shown in Figure 1.
1) positive conductive block；
2) negative conductive block；
3) locating slot；
4) internal positive wire；
5) LD chips；
Position and annexation between each part is：Positive conductive block is conductive simultaneous as 2 bottoms with negative conductive block
Radiating block, LD chips are then adhesive in the upper surface of negative conductive block, and internal positive wire is between LD chips and positive conductive block
The effect of being conductively connected is connected；Locating slot wraps positive and negative electrode conducting block and LD chips, and thus composition one is SMD swashs
Light device；During use, the laser instrument is welded on circuit board positive and negative electrode pad.
Whole laser instrument is SMD cuboid framework, and its positive conductive block, negative conductive block and locating slot are used as one
Bottom liner body, LD chips are placed on negative conductive block top, and align negative pole conducting block outward flange, and positioned at locating slot indentation, there
Centre position, it is bonding with elargol between negative conductive block and LD chips, radiating is played with conductive effect；Finally internal positive
Wire two ends are welded between LD chips and positive conductive block respectively.
After being completed, energization effect is as shown in Figure 2.
In external form, size is similar to 2835LED encapsulation, and the design is with reference to ripe LED patch designs, easily small-sized, slim etc.
Advantage, radiating mode are better than the radiating effect of straight cutting.
Embodiments of the invention are the foregoing is only, the present invention is not limited to.The present invention can have various conjunctions
Suitable change and change.All any modification, equivalent substitution and improvements made within the spirit and principles in the present invention etc., all should
It is included within protection scope of the present invention.
Claims (2)
1. SMD laser instrument, it is characterised in that the laser instrument includes following structure：
1) positive conductive block；
2) negative conductive block；
3) locating slot；
4) internal positive wire；
5) LD chips；
Position and annexation between each part is：Positive conductive block is conductive as 2 bottoms with negative conductive block and radiates
Block, LD chips are then adhesive in the upper surface of negative conductive block, and internal positive wire connects between LD chips and positive conductive block
Act the effect of being conductively connected；Locating slot wraps positive and negative electrode conducting block and LD chips, thus constitutes a SMD laser
Device；During use, the laser instrument is welded on circuit board positive and negative electrode pad.
2. SMD laser instrument as claimed in claim 1, it is characterised in that：
Whole laser instrument is SMD cuboid framework, and its positive conductive block, negative conductive block and locating slot are used as a bottom
Liner body, LD chips are placed on negative conductive block top, and align negative pole conducting block outward flange, and positioned at the centre of locating slot indentation, there
Position, it is bonding with elargol between negative conductive block and LD chips, radiating is played with conductive effect；Finally internal positive wire
Two ends are welded between LD chips and positive conductive block respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410092133.6A CN103904553B (en) | 2014-03-13 | 2014-03-13 | Surface mounting type laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410092133.6A CN103904553B (en) | 2014-03-13 | 2014-03-13 | Surface mounting type laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103904553A CN103904553A (en) | 2014-07-02 |
| CN103904553B true CN103904553B (en) | 2017-05-03 |
Family
ID=50995757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410092133.6A Active CN103904553B (en) | 2014-03-13 | 2014-03-13 | Surface mounting type laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103904553B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000012950A (en) * | 1998-04-23 | 2000-01-14 | Matsushita Electron Corp | Semiconductor laser |
| CN2457763Y (en) * | 2000-11-17 | 2001-10-31 | 赵俊祥 | Packaging structure of semiconductor laser |
| US9018074B2 (en) * | 2009-10-01 | 2015-04-28 | Excelitas Canada, Inc. | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same |
| CN202957449U (en) * | 2012-10-30 | 2013-05-29 | 丽水市银星轻工电子有限公司 | Semiconductor pumping solid laser |
| CN103560197A (en) * | 2013-10-30 | 2014-02-05 | 山东明华光电科技有限公司 | Surface-mount-device type heat sink high-light-efficiency LED lamp bead |
| CN203871650U (en) * | 2014-03-13 | 2014-10-08 | 丽水市银星轻工电子有限公司 | Surface-mount laser |
-
2014
- 2014-03-13 CN CN201410092133.6A patent/CN103904553B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103904553A (en) | 2014-07-02 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20161219 Address after: 518000 Guangdong, Baoan District, Xixiang Street Crane Village Industrial Zone, village building, building, building, floor, 7 Applicant after: Shenzhen Grand Science and Technology Co., Ltd. Address before: 323903 Zhejiang city of Lishui province Qingtian County Wen Xi Zhen Sha Bu Industrial Zone Applicant before: LISHUI YINXING LIGHT INDUSTRY ELECTRONIC CO., LTD. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |